Coil components, manufacturing methods of coil components, and electronic and electrical machinery

Abstract

The coil component 100 of the present invention, which has a high degree of design freedom in coil shape and less quality deviation, includes a first coil conductor portion 201 having a first spiral portion 11 that is spiral-shaped around an axis O along a first direction. The coil of the low winding portion 11L located in the first spiral portion 11 has a wide portion 11w with a coil width Wt that is wider than the coil of the high winding portion 11h. At least a portion of the first coil conductor portion 201 includes a first conductor portion 11A containing plating precipitates. The straightness of the wide portion section line L1w formed by the first conductor portion 11A in the wide portion section section Sw obtained by cutting the wide portion 11w is higher than that of the high winding portion section line L1h formed by the first conductor portion 11A in the high winding portion section section Sh obtained by cutting the high winding portion 11h.

Description

Coil component, method for manufacturing coil component, and electronic and electrical equipment The present invention relates to a coil component, a method for manufacturing the same, and an electronic or electrical machine equipped with the coil component. Patent Document 1 discloses a multilayer seed pattern inductor comprising: a magnetic body comprising a magnetic material; and an internal coil portion embedded within the magnetic body and formed by connecting coil conductors disposed on one side and the other side of an insulating substrate; the coil conductor comprising a seed pattern formed of two or more layers, a surface plating layer covering the seed pattern, and an upper plating layer formed on an upper surface of the surface plating layer. Patent Document 2 discloses a power inductor comprising: a main body comprising metal powder and an insulator; at least one substrate disposed within the main body; at least one coil pattern formed on at least one side of the substrate; and external electrodes formed on at least two side surfaces of the main body; wherein the coil pattern comprises: a first plating film formed on the substrate; and a second plating film formed so as to cover the first plating film, with side surfaces having a shape different from that of the first plating film; the side surfaces of the first plating film are etched so as to have a predetermined inclination from the outer substrate; the ratio of the width of the lower surface of the first plating film to the height of the first plating film is 1:1 to 1:2, and the ratio of the width of the lower surface of the first plating film to the width of the lower surface of the second plating film is 1:1.2 to 1:2. [Prior Art Document] [Patent Document] [Patent Document 1] Japanese Patent Application Publication No. 2016-213443 [Patent Document 2] Japanese Patent Application Publication No. 2021-103796 [Problem to be Solved by the Invention] By forming the coil conductor portion from plating deposits, as in the inductors disclosed in Patent Documents 1 and 2, a high degree of freedom in the shape of the coil conductor portion when viewed from above can be achieved while also achieving high productivity. However, there are inherent technical limitations associated with plating processes. The aforementioned patent documents address some of these limitations by performing multiple plating processes. The present invention is based on a different perspective from Patent Documents 1 and 2, and aims to provide a coil component that overcomes the inherent technical limitations of plating, has a high degree of freedom in shape, and can respond to demands for miniaturization. Furthermore, the present invention aims to provide a method for manufacturing the coil component and an electronic or electrical device incorporating the coil component. [Technical Means for Solving the Problem] One aspect of the present invention provided to solve the above-mentioned problem is a coil component, characterized in that it comprises: a first coil conductor portion, which has a first vortex portion that is spirally swirled around an axis along a first direction, from a first inner peripheral side end portion toward a first outer peripheral side end portion away from the above-mentioned axis; a first terminal portion, which is electrically connected to the above-mentioned first outer peripheral side end portion; and a second terminal portion, which is electrically connected to the above-mentioned first inner peripheral side end portion; and the above-mentioned first vortex portion has a high winding portion with a number of turns of 2 or more and a low winding portion with a number of turns less than the above-mentioned high winding portion, and the turns located in the above-mentioned low winding portion have the same winding number as the first terminal portion. The turn width when viewed in the first direction is greater than the turn width of the wide portion located in the high winding portion; at least a portion of the first coil conductor portion includes a first conductor portion containing plating deposits; and in a cross-section of the wide portion obtained by cutting the wide portion along a plane including the first direction, the linearity of a cross-section line of the wide portion formed by one end of the first conductor portion in the first direction is greater than a cross-section line of the high winding portion obtained by cutting the high winding portion along a plane including the first direction. In this case, one end of the first conductor portion located in the wide portion is flatter than one end of the first conductor portion located in the high winding portion. As for the coil component mentioned above, there is a preferred situation as follows: the average length (height H1w) of the above-mentioned first conductor part in the above-mentioned wide part cross-section in the above-mentioned first direction and the average length (height H1h) of the above-mentioned first conductor part in the above-mentioned high winding part cross-section in the above-mentioned first direction satisfy 0.8≦H1w / H1h≦1.2. By satisfying the above relationship, the uniformity of the average length (height) of the first scroll portion in the first direction becomes higher. This makes it easier to improve the uniformity of the height of the coil component in the first direction and the uniformity of the thickness of the magnetic material in the first direction when magnetic material is arranged around the first scroll portion, thereby meeting the demand for miniaturization and improving the characteristics of the coil component. As in the above-mentioned coil component, the above-mentioned first coil conductor portion may have a conductive second conductor portion arranged in a manner connected to the above-mentioned one end portion in the above-mentioned first direction of the above-mentioned first conductor portion, and the above-mentioned wide-width portion cross-sectional line and the above-mentioned high-winding portion cross-sectional line include the boundary line between the above-mentioned first conductor portion and the above-mentioned second conductor portion. In the coil component described above, it is preferred that the linearity of the wide portion end line formed by the first end of the wide portion cross section in the first direction is higher than the linearity of the high winding portion end line formed by the first end of the high winding portion cross section in the first direction. In this case, one end of the wide portion is flatter than one end of the high winding portion. In the coil component, the first coil conductor portion may include a third conductive conductor portion disposed in contact with the other end portion of the first conductor portion in the first direction. In one example, the third conductive portion serves as a seed layer in the plating process for forming the first conductive portion. As for the coil component mentioned above, there is a preferred situation as follows: the above-mentioned first coil conductor portion has a conductive first lead-out portion between the above-mentioned first peripheral side end portion and the above-mentioned first terminal portion; and at least a portion of the above-mentioned first lead-out portion includes the above-mentioned first conductor portion; in the lead-out portion cross-section obtained by cutting the above-mentioned first lead-out portion by a plane including the above-mentioned first direction, the linearity of the lead-out portion cross-section line formed by the above-mentioned one end portion of the above-mentioned first conductor portion in the above-mentioned first direction is higher than the above-mentioned high winding portion cross-section line. In the aforementioned coil component, the average length (height H1d) of the first conductor portion in the first direction in the cross-section of the lead portion and the average length (height H1h) of the first conductor portion in the first direction in the cross-section of the high winding portion preferably satisfy 0.8 ≤ H1d / H1h ≤ 1.2. In this case, the average length (height) of the first coil conductor portion, including the first scroll portion and the first lead portion, in the first direction is more uniform, thereby more stably achieving improved characteristics of the coil component. As in the coil component described above, the first lead portion may be provided with a conductive second conductor portion in contact with the one end portion in the first direction of the first lead portion, and the lead portion cross section may include a boundary line between the first conductor portion and the second conductor portion. As in the coil component described above, the first lead portion may include a conductive third conductor portion provided so as to be in contact with the other end portion of the first conductor portion in the first direction. The coil component may include a main body comprising a magnetic material and enclosing at least a portion of the first coil conductor. In this case, the magnetic material may comprise magnetic powder, and the main body may include a binder for retaining the magnetic powder. The coil component described above may further include a second coil conductor portion having a second spiral portion spiraling around the axis along the first direction, from a second inner peripheral end portion toward a second outer peripheral end portion away from the axis. In this case, the second inner peripheral end portion may be electrically connected to the first inner peripheral end portion via a conductive through-hole portion; the second outer peripheral end portion may be electrically connected to the second terminal portion; the first coil conductor portion and the second coil conductor portion may be arranged in the first direction, with the second coil conductor portion located on the other end side of the first coil conductor portion in the first direction. As in the above-mentioned coil component, the above-mentioned second vortex portion may have the above-mentioned high winding portion and the above-mentioned low winding portion, and the turns located in the above-mentioned low winding portion may have the above-mentioned wide-width portion; at least a portion of the above-mentioned second coil conductor portion includes the above-mentioned first conductor portion; and the linearity of the cross-section line of the above-mentioned wide-width portion is higher than that of the cross-section line of the above-mentioned high winding portion. Since the second scroll portion also has the same shape characteristics as the first scroll portion, the characteristics of the coil component can be improved more stably. As another aspect, the present invention provides a method for manufacturing a coil component having a first coil conductor portion having a first vortex portion having a vortex shape when viewed in a first direction. The first vortex portion has a high winding portion having more than 2 turns and a low winding portion having fewer turns than the high winding portion, and the turns located in the low winding portion have a wider portion than the turns located in the high winding portion when viewed in the first direction. The coil component is manufactured by comprising the following steps: a pattern forming step, which forms an insulating first pattern on a portion of a conductive layer provided on a main surface of an insulating sheet-like substrate; and a first plating treatment step, which performs an electroplating treatment on the conductive layer to form a first conductor portion including a plating precipitate and constituting at least a portion of the first vortex portion on an exposed surface of the conductive layer that is not in contact with the first pattern. The first pattern comprises, in a wide region corresponding to at least a portion of the wide portion, a sidewall portion having a surface extending from the exposed surface of the conductive layer in the first direction; and a bridge portion connecting the tops of two sidewall portions spaced apart and facing each other in a direction intersecting the first direction. In the wide region, the sidewall portions, the bridge portion, and the exposed portion of the conductive layer close the first direction and define a vortex cavity that opens in a direction intersecting the first direction. During the first plating step, the vortex cavity is filled with the first conductor portion. When forming the first conductor portion in the first plating step, if a vortex cavity is not provided, the height (average length in the first direction) of the first conductor portion formed in the wide portion tends to be higher than the height of the first conductor portion formed in the high winding portion, which can easily cause variations in the height of the first vortex portion. By providing a vortex cavity, variations in the height of the first conductor portion formed in the first plating step can be suppressed. Therefore, by adopting this manufacturing method, it is easy to form a coil component that can meet the demand for miniaturization and has high characteristics. As in the above manufacturing method, the vortex cavity may be completely sealed on the bridge portion side in the first direction, thereby more stably improving the uniformity of the height of the wide portion. In the above-described manufacturing method, the first coil conductor portion may include a first lead portion extending from the outer peripheral end of the first vortex portion. In this case, the first pattern may include a lead region corresponding to the first lead portion; the sidewall portion and the bridge portion may be provided in the lead region to close the first direction and define a lead portion cavity having an opening in a direction intersecting the first direction; and in the first plating step, the lead portion cavity is filled with the first conductor portion. Furthermore, the vortex portion cavity and the lead portion cavity may be continuous. In the manufacturing method described above, the lead portion cavity may be completely sealed on the bridge portion side in the first direction, thereby more stably improving the uniformity of the height of the first lead portion. As another aspect, the present invention provides an electronic or electrical device incorporating the aforementioned coil component, wherein the coil component is connected to a substrate via the aforementioned first terminal portion and the aforementioned second terminal portion. Examples of such electronic or electrical devices include power supply devices equipped with power switching circuits, voltage step-up and step-down circuits, smoothing circuits, and the like, or small portable communication devices. The electronic or electrical device of the present invention, incorporating the aforementioned coil component, exhibits excellent overall characteristics as an inductor element. [Effects of the Invention] According to the present invention, the shape freedom of the conductor part of the coil can be improved. In addition, according to a specific example of the present invention, the uniformity of the height of the conductor part of the coil in the first direction can be improved. When a main body part containing a magnetic material is arranged around the conductor part of the coil, it is easy to improve the uniformity of the thickness of the magnetic material located outside the first direction of the coil, so a high-performance coil part can be stably provided. When the coil part is installed in an electronic or electrical machine, the performance of the electronic or electrical machine can be improved or the size of the electronic or electrical machine can be reduced. In addition, according to the present invention, an electronic or electrical machine equipped with a coil part is provided. Furthermore, a method for manufacturing the above-mentioned coil part is also provided. Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG1 is a three-dimensional diagram conceptually showing the shape of a coil part according to one embodiment of the present invention. FIG2 is a diagram illustrating the structure of a coil conductor portion of a coil part according to one embodiment of the present invention. In FIG2, for the sake of convenience of explanation, the coil conductor portion is depicted with a solid line, the main body portion is depicted with a dotted line, and the display of other components is omitted. FIG3 is an XY top view illustrating the structure of a first coil conductor portion of a coil part according to one embodiment of the present invention. In FIG3, the coil conductor portion as viewed from the Z1 side in the Z1-Z2 direction is depicted with a solid line, and the main body portion is depicted with a dotted line. FIG4 is an XY top view illustrating the structure of a second coil conductor portion of a coil part according to one embodiment of the present invention. In FIG4, only the coil conductor portion as viewed from the Z2 side in the Z1-Z2 direction is depicted. (Overall Structure) A coil component 100 according to one embodiment of the present invention includes a coil portion 10 having a coil conductor portion 20 , a body portion 30 , a first external electrode 41 (first terminal portion), a second external electrode 42 (second terminal portion), and exterior coatings 50 and 60 . (Coil) As shown in Figures 2 and 3, the coil portion 10 includes a coil conductor portion 20, which includes a first coil conductor portion 201 having a first scroll portion 11 having a spiral shape that spirals around an axis O along a first direction (Z1-Z2 direction) from the first inner end 12 of the first scroll portion 11 toward the first outer end 13 of the first scroll portion 11, away from the axis O. In Figure 2, when viewed from the Z1 side in the Z1-Z2 direction, the first scroll portion 11 has a conductor arranged in a spiral shape that spirals clockwise away from the axis O from the first inner end 12 toward the first outer end 13. In this specification, the "spiral direction" of the scroll portion refers to the direction from the inner end toward the outer end. The conductor (conductive material) constituting the coil conductor portion 20 is not limited as long as it has appropriate conductivity. Metals such as copper, copper alloy, aluminum, and aluminum alloy are taken as specific examples of the conductor constituting the coil conductor portion 20. In this embodiment, the coil conductor portion 20 is manufactured by a manufacturing method including a plating process. The coil portion 10 has an insulating coil insulation portion (not shown in Figures 1 to 4) on the surface of the coil conductor portion 20. By means of the coil insulation portion, insulation between adjacent conductors (between the surfaces of conductors facing each other) is ensured in the coil conductor portion 20. The coil insulation portion is made of, for example, a resin material. The coil insulation portion is not provided at the ends (the first lead portion end face 14E and the second lead portion end face 24E) of the two end portions (the first lead portion 14 and the second lead portion 24) of the coil conductor portion 20, and the coil portion 10 can be electrically connected to other components at the ends. As shown in FIG3 , the first scroll portion 11 includes a high-winding portion 11h having at least two turns, and a low-winding portion 11L having fewer turns than the high-winding portion 11h. In the example shown in FIG3 , the high-winding portion 11h includes the innermost turns, namely the first inner-circumference turns 111h; the outermost turns, namely the first outer-circumference turns 113h; and the turns located between these, namely the first central turns 112h. Furthermore, in FIG3 , the low-winding portion 11L is shown as being located within the range indicated by the double-pointed arrow. The turns in the low winding portion 11L have a wider portion 11w whose turn width Wt, when viewed in the first direction, is greater than that of the turns in the high winding portion 11h. Specifically, the two turns in the low winding portion 11L have a first inner circumferential wide portion 111w of the turns located on the inner circumference of the first scroll portion 11, and a first outer circumferential wide portion 113w of the turns located on the outer circumference of the first scroll portion 11. Here, in this specification, "turn width Wt" means the distance between any one point on the side surface of the inner periphery of the turns constituting the first vortex portion 11 and the point where the normal line (orthogonal to the first direction) to that point intersects the side surface constituting the outer periphery of the turns, when observing the first vortex portion 11 in the first direction (Z1-Z2 direction). Furthermore, the definition of turn width Wt of the first vortex portion 11 also applies to the second vortex portion 21 described later, and furthermore, it also applies to the width of the turns of the vortex shape (e.g., the pattern of the conductive layer 55) that appear during the process of manufacturing the first vortex portion 11, etc. The maximum value of the turn width Wt of the wide portion 11w can be, for example, within a range of 1.5 to 3.0 times the turn width Wt of the region adjacent to the wide portion 11w. Alternatively, the upper limit of this range can be 2.5 times. Because the turn width Wt is relatively wide in the wide portion 11w, the resistance value is easily reduced. Therefore, the DC resistance (DCR) of the coil component 100 having the first scroll portion 11 with the wide portion 11w is easily reduced. As shown in Figures 2 and 4, the coil conductor portion 20 includes a second coil conductor portion 202 having a second vortex portion 21 arranged in alignment with the first vortex portion 11 in the first direction. Specifically, the second coil conductor portion 202 is located on the other end side of the first direction (the Z2 side in the Z1-Z2 direction) of the first coil conductor portion 201. The second vortex portion 21 has a spiral shape that spirals away from the axis O along the first direction (the Z1-Z2 direction) from the inner end of the second vortex portion 21, i.e., the second inner end 22, toward the outer end of the second vortex portion 21, i.e., the second outer end 23. Within the second vortex portion 21, when viewed from the Z1 side in the Z1-Z2 direction, the conductor is arranged in a spiral shape that spirals away from the axis O in the opposite direction (counterclockwise in Figure 2) relative to the first vortex portion 11. In this embodiment, the shape of the second scroll portion 21 when viewed from the Z2 side in the Z1-Z2 direction is identical to the shape of the first scroll portion 11 when viewed from the Z1 side in the Z1-Z2 direction. Therefore, the second scroll portion 21, like the first scroll portion 11, also has a high winding portion 21h and a low winding portion 21L. The high winding portion 21h includes, from the inner circumference, a second inner circumference turn 211h, a second center turn 212h, and a second outer circumference turn 213h. The low winding portion 21L includes a wide portion 21w including a second inner circumference wide portion 211w and a second outer circumference wide portion 213w. As shown in Figure 2 , the axis O serving as the vortex center of each of the first vortex portion 11 and the second vortex portion 21 coincides. Therefore, as shown in Figures 3 and 4 , the turns of the first vortex portion 11 and the turns of the second vortex portion 21 are positioned so as to be aligned in the first direction (Z1-Z2 direction). The average value of the separation distance between the first vortex portion 11 and the second vortex portion 21 in the first direction (Z1-Z2 direction) is not particularly limited. The smaller the separation distance, the easier it is for the height of the coil component 100 (the dimension in the Z1-Z2 direction) to become lower. However, when it is too small, the insulation between the first vortex portion 11 and the second vortex portion 21 is likely to decrease. Based on the viewpoint of taking into account both the low height (height) of the coil component 100 and the high insulation between the first vortex portion 11 and the second vortex portion 21, the separation distance is preferably not less than 0.4 μm and not more than 20 μm. In order to reduce the deviation of the separation distance on the manufacturing surface, or to more reliably support the coil on the same surface, the separation distance is preferably not less than 1.0 μm, and further preferably not less than 5.0 μm. The first inner circumferential end portion 12 of the first vortex portion 11 and the second inner circumferential end portion 22 of the second vortex portion 21 are electrically connected via the through-hole portion VP. If the connection portion to the through-hole portion VP is used as a starting point, the first vortex portion 11 and the second vortex portion 21 swirl in opposite directions to each other. The through-hole portion VP can also be composed of the same conductor as the coil conductor portion 20. In a specific example, the through-hole portion VP is manufactured together with the process of manufacturing the first vortex portion 11 and the second vortex portion 21. In this case, the through-hole portion VP is integrated with the first inner circumferential end portion 12 of the first vortex portion 11 and the second inner circumferential end portion 22 of the second vortex portion 21. The first lead portion 14, as part of the first coil conductor portion 201, is connected to the first outer peripheral end 13 of the first scroll portion 11. The second lead portion 24, as part of the second coil conductor portion 202, is connected to the second outer peripheral end 23 of the second scroll portion 21. Therefore, the first outer peripheral end 13 of the first scroll portion 11 is substantially the interface with the first lead portion 14 in the first scroll portion 11, and the second outer peripheral end 23 of the second scroll portion 21 is substantially the interface with the second lead portion 24 in the second scroll portion 21. In a specific example, the first lead portion 14 and the second lead portion 24 are manufactured together during the manufacturing process of the first scroll portion 11 and the second scroll portion 21. In this case, the first lead-out portion 14 has a portion integrally connected to the first outer peripheral end portion 13 of the first scroll portion 11 without any boundary, and the second lead-out portion 24 has a portion integrally connected to the second outer peripheral end portion 23 of the second scroll portion 21 without any boundary. That is, in this embodiment, the coil conductor portion 20 has a first coil conductor portion 201 having a first vortex portion 11 and a first lead-out portion 14, a second coil conductor portion 202 having a second vortex portion 21 and a second lead-out portion 24, and a through-hole portion VP, which are manufactured in a manner having parts (specifically, parts composed of a first conductive material) integrated by a common manufacturing process. (First Conductor Portion, Second Conductor Portion, Third Conductor Portion) Figure 5 is a cross-sectional view taken along line AA' of Figure 3 and in the Z1-Z2 direction (first direction). Figure 6 is a cross-sectional view taken along line BB' of Figure 4 and in the Z1-Z2 direction (first direction). Line AA' of Figure 3 intersects the wide portion 11w and the high winding portion 21h on line L1 on the X2 side in the X1-X2 direction, and intersects the high winding portion 11h and the second lead portion 24 on line L2 on the X1 side in the X1-X2 direction. Therefore, Figure 5 depicts a cross-sectional view of the wide portion 11w, the high winding portion 21h, the high winding portion 11h, and the second lead portion 24. Line BB' in Figure 4 intersects the wide portion 21w and the high-wound portion 11h on the straight line L3 on the X1 side in the X1-X2 direction, and intersects the high-wound portion 21h and the first lead portion 14 on the straight line L4 on the X2 side in the X1-X2 direction. Therefore, Figure 6 depicts a cross-section of the wide portion 21w, the high-wound portion 11h, the high-wound portion 21h, and the first lead portion 14. A cross section obtained by cutting the wide portion 11w along a plane including the straight line L1 and the first direction, or a cross section obtained by cutting the wide portion 21w along a plane including the straight line L3 and the first direction is referred to as wide portion cross section Sw. A cross section obtained by cutting the high-wound portion 11h or the high-wound portion 21h along a plane including any of the straight lines L1 to L4 and the first direction is referred to as high-wound portion cross section Sh. A cross section obtained by cutting the second lead portion 24 along a plane including the straight line L2 and the first direction, or a cross section obtained by cutting the first lead portion 14 along a plane including the straight line L4 and the first direction is referred to as lead portion cross section Sd. As shown in FIG5 , the first vortex portion 11 includes a first conductor portion 11A extending from its first inner peripheral end portion 12 to its first outer peripheral end portion 13 in the vortex direction and comprising a first conductive material, and a second conductor portion 11B electrically connected to the first conductor portion 11A at a first interface IF1 and comprising a second conductive material. As described later, in one example, the first conductor portion 11A and the second conductor portion 11B are manufactured by different manufacturing processes. In this case, even if they are homogeneous materials (e.g., materials containing Cu, such as Cu, Cu alloys, etc.), they can be identified by cross-sectional observation due to different histological characteristics such as crystal structure, crystal orientation, and crystal growth direction. In a specific example, the first conductor portion 11A includes an electroplated deposit (electrolytically plated deposit) with a third conductor portion 11C containing a conductive material as a seed layer, and the second conductor portion 11B includes a plated deposit. In this case, the plating deposit constituting the second conductor portion 11B may be an electroplating deposit or an electroless plating deposit. In order to reduce the thickness of the second conductor portion 11B, the plating deposit may be preferably an electroplating deposit. Although not shown in Figures 5 and 6 , the first inner circumferential end portion 12 includes a first conductor portion 12A, and the second inner circumferential end portion 22 includes a first conductor portion 22A. As shown in Figure 6 , the first lead portion 14, like the first scroll portion 11, includes a first conductor portion 14A, a second conductor portion 14B, and a third conductor portion 14C. The second coil conductor portion 202 shares the same basic structure as the first coil conductor portion 201. As shown in Figures 5 and 6 , the second scroll portion 21 includes a first conductor portion 21A, a second conductor portion 21B, and a third conductor portion 21C, while the second lead portion 24 includes a first conductor portion 24A, a second conductor portion 24B, and a third conductor portion 24C. (Characteristics of Cross-Sectional Shapes) Figure 7 is a partially enlarged view of the area encompassing the first inner circumferential wide portion 111w in Figure 5 (a portion of the wide portion cross section). Figure 8 is a partially enlarged view of the area encompassing the first outer circumferential turn in Figure 5 (a portion of the high winding portion cross section). Figure 10 is a partially enlarged view of the area encompassing the first lead portion in Figure 6 (a portion of the lead portion cross section). Figure 10 uses the same coordinates as Figure 5, with the Z2 side in the Z1-Z2 direction being the lower side of the paper. The wide portion cross section Sw shown in FIG7 shows the first inner circumference wide portion 111w. In this wide portion cross section Sw, a cross section formed by one end of the first conductor portion 111wA of the first inner circumference wide portion 111w in the first direction, that is, the end on the Z1 side in the Z1-Z2 direction, is referred to as wide portion cross section line L1w. Because the second conductor portion 111wB is provided on the Z1 side in the Z1-Z2 direction of the first conductor portion 111wA, wide portion cross section line L1w also forms a portion of the boundary line (first interface IF1) formed between the first conductor portion 111wA and the second conductor portion 111wB in the wide portion cross section Sw. The high winding section cross section Sh shown in FIG8 illustrates the first outer peripheral turn 113h. In this high winding section cross section Sh, a cross section formed by one end of the first conductor portion 113hA of the first outer peripheral turn 113h in the first direction, that is, the end on the Z1 side in the Z1-Z2 direction, is referred to as the high winding section cross section line L1h. Because the second conductor portion 113hB is provided on the Z1 side in the Z1-Z2 direction of the first conductor portion 113hA, the high winding section cross section line L1h also forms a portion of the boundary line (first interface IF1) formed between the first conductor portion 113hA and the second conductor portion 113hB in the high winding section cross section Sh. In the coil component 100 of this embodiment, the linearity of the cross-section line L1w of the wide portion is higher than that of the cross-section line L1h of the high winding portion. In this specification, "higher linearity" means that when the cross-section line is discretely sampled and an approximate straight line including a line perpendicular to the first direction is obtained from the sampled data, the coefficient of determination (R 2) is relatively high. Therefore, the determination coefficient (R 2 ) is greater than the coefficient of determination (R 2 In addition, due to the coefficient of determination (R 2 ) where 1 is the maximum value, so based on the viewpoint of improving the characteristics of the coil component 100 (such as DCR (Directive Current Resistance)), the coefficient of determination (R 2 ) is close to 1. Furthermore, in cases where the shape of the first conductor portion 11wA depicted in the wide portion cross section Sw or the shape of the first conductor portion 11hA depicted in the high-winding portion cross section Sh is a sharply convex shape on one side in the first direction (the Z1 side in the Z1-Z2 direction) throughout the width Wt direction, it may be difficult to define the boundary between a line formed by one end portion of the first conductor portion in the first direction (the end portion on the Z1 side in the Z1-Z2 direction) and a line formed by a surface (side surface) intersecting the width Wt direction. In such cases, a region of the line formed by one end portion of the first conductor portion in the first direction (the end portion on the Z1 side in the Z1-Z2 direction) is set on both sides of the width Wt direction, with a length of 30% of the length of the first conductor portion in the width Wt direction from the center. The linearity of the region of 60% of this length may be evaluated. An example of the result of such evaluation is shown in FIG9. FIG9 is a diagram showing an example of a cross section of the first conductor portion 11wA located in the wide portion 11w and an example of a cross section of the first conductor portion 11hA located in the high winding portion 11h. These figures show the cross sections of the first conductor portions 11wA and 11hA obtained in the process of the manufacturing method described later. The figure shown on the left side of FIG9 is a cross-sectional view corresponding to the wide portion cross section Sw, in which an area L1wm is set to include 60% of the central portion of the wide portion cross section line L1w of the first conductor portion 11wA. The determination coefficient (R 2 ) is 0.272. In contrast, the determination coefficient (R) of the approximate straight line associated with the area L1hm of the central 60% portion of the high winding section line L1h of the first conductor portion 11hA in the cross-sectional view corresponding to the high winding section Sh shown on the right side of FIG9 is 2 ) is 0.092. Therefore, it is confirmed that the linearity of the wide portion cross-section line L1w is higher than the linearity of the high-winding portion cross-section line L1h. When the line formed by one end in the first direction (the end on the Z1 side in the Z1-Z2 direction) of the cross section of the first coil conductor portion 201, i.e., the wide portion cross section Sw, is defined as the wide portion end line Lw, and the line formed by one end in the first direction (the end on the Z1 side in the Z1-Z2 direction) of the cross section of the high winding portion Sh, i.e., the high winding portion end line Lh, in the coil component 100 of this embodiment, the wide portion end line Lw has a higher linearity than the high winding portion end line Lh. That is, the determination coefficient (R) of the approximate straight line Lwa of the wide portion end line Lw is 2 ) is greater than the coefficient of determination (R 2 ). In addition, when it is difficult to set the boundary of the line formed by the end line Lw of the wide portion or the end line Lh of the high winding portion, and the surface (side surface) intersecting the width Wt direction, as in the case of the first conductor portion, an area of ​​the end line whose length from the center in the width Wt direction is 30% of the length of the coil conductor portion in the width Wt direction is set on both sides of the width Wt direction, and the linearity of the area of ​​60% of the length of the thus set area can be evaluated. In this embodiment, as shown in Figures 7 and 8 , the second conductor portions 111wB and 113hB are provided on the first conductor portions 111wA and 113hA. As described later, in one specific example, these are electroplated deposits. Therefore, the deposit thickness of the second conductor portions 111wB and 113hB is substantially uniform. Therefore, when the linearity of the wide portion cross-section line L1w is higher than that of the high-winding portion cross-section line L1h, the linearity of the wide portion end line Lw is likely to be higher than that of the high-winding portion end line Lh. Based on this shape feature, as shown in Figures 2 and 3, the end of the wide portion 11w on one side of the first direction in the first coil conductor portion 201 of the coil component 100 of this embodiment, that is, the end on the Z2 side in the Z1-Z2 direction, becomes a plane having a normal along the first direction. In a preferred specific example, the average length (height H1w) of the first conductor portion 111wA in the wide portion cross section Sw in the first direction (Z1-Z2 direction) and the average length (height H1h) of the first conductor portion 113hA in the high winding portion cross section Sh in the first direction (Z1-Z2 direction) satisfy 0.8≦H1w / H1h≦1.2. By satisfying the above relationship, the uniformity of the average length (height) of the first scroll portion 11 in the first direction (Z1-Z2 direction) is increased. Consequently, when magnetic material is arranged around the first scroll portion 11, as in the present embodiment, i.e., when the main body 30 is positioned there, the uniformity of the height of the coil component 100 in the first direction (Z1-Z2 direction) and the uniformity of the thickness of the magnetic material in the first direction (Z1-Z2 direction) (the thickness in the first direction of the main body 30 that contacts the first coil conductor portion 201) are easily improved, thereby meeting the demand for miniaturization and improving the characteristics of the coil component 100. Based on the viewpoint of obtaining the above-mentioned effects more stably, it is preferred that the average length (height Hw) of the wide portion 11w (the first inner peripheral wide portion 111w) in the wide portion cross-section Sw in the first direction (Z1-Z2 direction) and the average length (height Hh) of the high winding portion 11h (the first outer peripheral side turn 113h) in the high winding portion cross-section Sh in the first direction (Z1-Z2 direction) satisfy 0.8≦Hw / Hh≦1.2. 7 and 8 , since the wide portion 11w (first inner circumference wide portion 111w) has the third conductor portion 111wC and the high winding portion 11h (first outer circumference turn 113h) has the third conductor portion 113hC, the length of the wide portion 11w (first inner circumference wide portion 111w) in the first direction includes the length of the third conductor portion 111wC in the first direction, and the length of the high winding portion 11h (first outer circumference turn 113h) in the first direction includes the length of the third conductor portion in the third direction. The cross section of the first coil conductor portion 201 shown in FIG10 , or lead section cross section Sd, shows the first lead portion 14. In this lead section cross section Sd, the cross section formed by one end of the first conductor portion 14A of the first lead portion 14 in the first direction, i.e., the end on the Z1 side in the Z1-Z2 direction, is referred to as lead section cross section line L1d. Because the second conductor portion 14B is provided on the Z1 side in the Z1-Z2 direction of the first conductor portion 14A, lead section cross section line L1d also forms part of the boundary line (first interface IF1) formed between the first conductor portion 14A and the second conductor portion 14B in the lead section cross section Sd. Furthermore, the line formed by one end in the first direction (the end on the Z1 side in the Z1-Z2 direction) of the lead section cross section Sd shown in FIG10 is referred to as lead end line Ld. In the coil component 100 of this embodiment, the linearity of the lead section L1d is higher than that of the high winding section L1h. In a preferred embodiment, the linearity of the lead end line Ld is higher than that of the high winding section Lh. That is, the coefficient of determination (R 2 ) is greater than the coefficient of determination (R 2 ), in a preferred embodiment, the determination coefficient (R 2 ) is greater than the coefficient of determination (R 2 ). In addition, in the coil component 100 of this embodiment, as a preferred specific example, the linearity of the lead-out end line Ld is higher than that of the high winding end line Lh. That is, the determination coefficient (R 2 ) is greater than the coefficient of determination (R 2 ). In the coil component 100 of the present embodiment, as another preferred specific example, the average length (height H1d) of the first conductor portion 14A in the first direction (Z1-Z2 direction) in the lead portion cross section Sd associated with the first lead portion 14 and the average length (height H1h) of the first conductor portion 113hA in the first direction (Z1-Z2 direction) in the high winding portion cross section Sh satisfy 0.8≦H1d / H1h≦1.2, and the average length (height Hd) of the first conductor portion 14A in the first direction (Z1-Z2 direction) in the lead portion cross section Sd associated with the first lead portion 14 and the average length (height Hh) of the high winding portion 11h in the high winding portion cross section Sh satisfy 0.8≦Hd / Hh≦1.2. In addition, in the coil part 100 of the present embodiment, although not shown in the figure, with respect to the wide portion cross-section line L1w and the high winding portion cross-section line L1h defined for the second coil conductor portion 202 located on the other end side of the first direction (Z2 side in the Z1-Z2 direction) of the first coil conductor portion 201, the linearity of the wide portion cross-section line L1w is greater than the linearity of the high winding portion cross-section line L1h, and with respect to the wide portion end line Lw and the high winding portion end line Lh, the linearity of the wide portion end line Lw is greater than the linearity of the high winding portion end line Lh. Furthermore, it is preferred that the height H1w of the first conductor portion 21wA of the wide portion 21w in the wide portion cross-section line L1w, the height H1h of the first conductor portion 21hA of the high winding portion 21h in the high winding portion cross-section line L1h, and the height H1d of the first conductor portion 24A of the second lead portion 24 in the lead portion cross-section line L1d in the first direction satisfy 0.8≦H1w / H1h≦1.2 and 0.8≦H1d / H1h≦1.2. Furthermore, it is preferred that the height Hw of the wide portion 21w in the first direction in the wide portion section line L1w, the height Hh of the high winding portion 21h in the first direction in the high winding portion section line L1h, and the height Hd of the second lead portion 24 in the first direction in the lead portion section line L1d satisfy 0.8≦Hw / Hh≦1.2 and 0.8≦Hd / Hh≦1.2. (First Insulating Portion) As shown in Figures 5 and 6, the coil insulating portion includes a first insulating portion 90 that contacts at least a portion of one of the ends of the first scroll portion 11 on the first direction side, specifically, the end on the side opposite to the second scroll portion 21 (Z2 side in the Z1-Z2 direction). The first insulating portion 90 shown in Figures 5 and 6 contacts at least a portion of one of the ends of the second scroll portion 21 on the first direction side, specifically, the end on the side opposite to the first scroll portion 11 (Z1 side in the Z1-Z2 direction) on the side opposite to the side in contact with the first scroll portion 11 (Z1 side in the Z1-Z2 direction). That is, the first insulating portion 90 is interposed between the first scroll portion 11 and the second scroll portion 21 arranged in the first direction, and contacts both. In this manner, the first insulating portion 90 is in contact with the first scroll portion 11, thereby reliably insulating the first scroll portion 11. Furthermore, as shown in FIG5 and FIG6 , the first insulating portion 90 is in contact with both the first scroll portion 11 and the second scroll portion 21, thereby stably preventing a short circuit between the first scroll portion 11 and the second scroll portion 21. The material constituting the first insulating portion 90 is not limited as long as it has appropriate insulation properties. The first insulating portion 90 preferably has a volume resistivity of 1.0×10 14 Ωcm or more. The volume resistivity is more preferably 1.0×10 15 Ωcm or more, more preferably 1.0×10 16 Ωcm or more. The upper limit of the volume resistivity is not particularly limited. The volume resistivity may also be 1.0×10 20 Ωcm or less. In addition, the first insulating portion 90 preferably has excellent dielectric properties. Specifically, the relative dielectric constant at 60 Hz obtained by ASTM D150 is preferably 4.0 or less. The relative dielectric constant is more preferably 3.5 or less, and further preferably 3.0 or less. There is no particular upper limit to the relative dielectric constant. The relative dielectric constant may also be 1.0 or more. The method for measuring the volume resistivity and relative dielectric constant of the first insulating portion 90 is not limited as long as it is foreseeable that the results obtained by the above-mentioned ASDM D257 and D150 are equivalent. For example, the following method can be cited: separately prepare a measuring sample equivalent to the first insulating portion 90, which is obtained by modulating the material into the size required for the measurement, and use the measuring sample to identify the constituent material through analysis methods such as component analysis or FT-IR (Fourier Transform Infrared Spectroscopy), and evaluate the properties of the material such as volume resistivity. The material constituting the first insulating portion 90 may be composed of an organic material, an inorganic material, or a composite material of an organic material and an inorganic material. When the first insulating portion 90 comprises a composite material, the inorganic material may be in the form of particles dispersed in a matrix comprising an organic material. Specific examples of organic materials include polyimide resins, polyethylene resins, polypropylene resins, polyamide resins, polyester resins, polyamide-imide resins, polysulfide resins, polycarbonate resins, liquid crystal polymer resins, polyvinylidene fluoride resins, and polytetrafluoroethylene resins. Specific examples of inorganic materials, especially inorganic materials in composite materials, include inorganic materials such as oxides, carbides, nitrides, and inorganic salts. For example, oxides include silicon dioxide, aluminum oxide, and zirconium oxide. Furthermore, for example, carbides and nitrides include inorganic materials such as silicon carbide and boron nitride, respectively. Examples of inorganic salts include minerals such as wollastonite, kaolin, and mica. Among these, oxide-based materials such as oxides, silicates, and phosphates are preferred due to their cost and insulation properties. For example, the inorganic material preferably includes at least one selected from the group consisting of silicon (Si), phosphorus (P), boron (B), and calcium (Ca). (Second Insulating Portion) The coil insulating portion includes a second insulating portion 80 . As shown in FIG. 5 and FIG. 6 , the second insulating portion 80 is provided on at least a portion of the surface of the first coil conductor portion 201 and the surface of the second coil conductor portion 202 . In this embodiment, the second insulating portion 80 is thermoplastic and contains a thermoplastic resin including a paraxylene-based polymer. Other examples of thermoplastic resins include polyethylene, polypropylene, polyamide, polyester, polyamide imide, polyimide, polysulfone, polycarbonate, liquid crystal polymer, polyvinylidene fluoride, and polytetrafluoroethylene. The second insulating portion 80 only needs to be thermoplastic as a whole and may contain, for example, inorganic insulating particles in addition to the aforementioned thermoplastic resins. The second insulating portion 80 preferably has excellent insulation properties. Specifically, the volume resistivity obtained according to ASTM D257 is preferably 1.0×10 14 Ωcm or more. The volume resistivity is more preferably 1.0×10 15 Ωcm or more, more preferably 1.0×10 16 Ωcm or more. The upper limit of the volume resistivity is not particularly limited. The volume resistivity may also be 1.0×10 20 Ωcm or less. In addition, the second insulating portion 80 preferably has excellent dielectric properties. Specifically, the relative dielectric constant at 60 Hz obtained by ASTM D150 is preferably 4.0 or less. The relative dielectric constant is more preferably 3.5 or less, and further preferably 3.0 or less. There is no particular limit to the upper limit of the relative dielectric constant. The relative dielectric constant may also be greater than 1.0. For the measurement of volume resistivity and relative dielectric constant, a separately prepared material corresponding to the second insulating portion 80 is modulated into the size required for measurement and used. The material corresponding to the second insulating portion 80 is the same as that of the first insulating portion 90, and can be identified, for example, by analytical methods such as component analysis or FT-IR. In order to ensure good insulation performance of the second insulating portion 80, the average thickness of the second insulating portion 80 may be preferably not less than 0.2 μm and not more than 10 μm. In order to ensure more stable insulation performance, the average thickness may be more preferably not less than 1.0 μm. From the perspective of more stably achieving short-circuit prevention within the coil conductor portion 20, the second insulating portion 80 in contact with the first vortex portion 11 preferably has all turns of the first vortex portion 11 in continuous contact with the portion facing the second vortex portion 21, the portion facing the opposite-facing portion relative to the second vortex portion 21, and the portion contacting the side surface, with no connected boundaries. Similarly, the second insulating portion 80 in contact with the second vortex portion 21 preferably has all turns of the second vortex portion 21 in continuous contact with the portion facing the first vortex portion 11, the portion facing the opposite-facing portion relative to the first vortex portion 11, and the portion contacting the side surface, with no connected boundaries. (Main Body) Main body 30 is made of magnetic material and partially encloses coil 10. In this embodiment, main body 30 has a substantially rectangular parallelepiped shape and encloses the portion of coil 10 except for first lead end face 14E and second lead end face 24E. A specific example of a magnetic material is a magnetic powder, and the structure of the magnetic powder is not limited. The structure may include a crystalline phase or an amorphous phase. Here, a crystalline material is defined as a material including a crystalline phase, an amorphous material is defined as a material including an amorphous phase, and a composite material is defined as a material including a crystalline phase and an amorphous material. When the diffraction spectrum obtained by a general X-ray diffraction method includes a sharp diffraction peak that can specify the type of crystalline phase, the material includes a crystalline phase. In addition, when the diffraction spectrum obtained by a general X-ray diffraction method includes a broad peak showing an amorphous phase, the material includes an amorphous phase. When the DSC (Differential Scanning Calorimetry) curve obtained by differential thermal analysis includes a peak showing crystallization, that is, when heat is generated as the phase transition from the amorphous phase to the crystalline phase occurs, the material also includes an amorphous phase. The material system of the magnetic powder is not limited. Specific examples of crystalline materials include Fe-Si-Cr alloys, Fe-Ni alloys, Fe-Co alloys, Fe-V alloys, Fe-Al alloys, Fe-Si alloys, Fe-Si-Al alloys, pure iron, and ferrite. Pure iron powder is preferably carbonyl iron powder. Specific examples of amorphous materials include Fe-Si-B alloys, Fe-PC alloys, and Co-Fe-Si-B alloys. Specific examples of composite materials include Fe-Zr alloys, Fe-Zr-B alloys, Fe-Si-B-Nb-Cu alloys, and Fe-Si-BP-Cu alloys. If the magnetic powder is a metal powder containing Fe, the synergistic effect of improving the magnetic properties is particularly significant. The chemical composition of the magnetic powder is not limited. For example, an Fe-Si-Cr alloy may contain 1.0-10.0 mass% Si, 1.0-10.0 mass% Cr, and the remainder consisting of Fe and impurities. Alternatively, an Fe-Ni alloy may contain 1.0-99.0 mass% Ni, and the remainder consisting of Fe and impurities. Furthermore, an Fe-PC alloy may contain 1.0-13.0 atomic% P, 1.0-13.0 atomic% C, Fe, and impurities. The Fe-PC alloy may contain one or more elements selected from the group consisting of Ni, Sn, Cr, B, and Si as arbitrary elements. In this case, for example, the amount of Ni is 0-10.0 atomic%, the amount of Sn is 0-3.0 atomic%, the amount of Cr is 0-6.0 atomic%, the amount of B is 0-9.0 atomic%, and the amount of Si may be 0-7.0 atomic%. The amount of Fe is preferably 65 atomic% or more. For example, an Fe-Si-B-Nb-Cu alloy may include 1.0-16.0 atomic % Si, 1.0-15.0 atomic % B, 0.50-5.0 atomic % Nb, 0.50-5.0 atomic % Cu, and the remainder consisting of Fe and impurities. In this case, the Fe content is preferably 65 atomic % or greater. The shape of the magnetic powder is not limited. The magnetic powder can be spherical, elliptical, flaky, or of irregular shape. The manufacturing method used to obtain these shapes is also not limited. The particle size distribution of the magnetic powder is not limited. The particle size distribution of the magnetic powder can be determined, for example, by analyzing an image (secondary electron image) obtained by scanning electron microscopy of a cross-section of the main body 30. For example, the average circular equivalent diameter of the magnetic powder can be 0.50 to 50.0 μm. The distribution of the circular equivalent diameter can include multiple peaks. The magnetic powder may also be subjected to a surface insulation treatment. When this treatment is applied, the insulation resistance of the main body 30 is improved. The type of surface insulation treatment applied to the magnetic powder is not limited. Examples include phosphoric acid treatment, phosphate treatment, and oxidation treatment. The magnetic powder may have an insulating coating on the surface of the magnetic particles. This insulating coating may include at least one selected from the group consisting of Si, P, and B, and O (oxygen). The magnetic powder can also be a mixed material obtained by mixing a plurality of powder materials. The magnetic powder is preferably a ferromagnetic material, more preferably a soft magnetic material. The main body 30 may further include any auxiliary materials. These auxiliary materials include, for example, a binder or a modifier. The binder binds and holds the particles of magnetic powder, etc., contained in the main body 30. To provide insulation resistance to the main body 30, the binder is preferably an insulating material. The binder can be an organic or inorganic material. The organic material can also be a resin material. Examples of resin materials include acrylic resins, organosilicone resins, epoxy resins, phenolic resins, urea resins, melamine resins, and polyester resins. The inorganic material can be a glass-based material such as water glass. The binder can be a reaction product such as thermal decomposition, or a mixture of multiple materials. Modifiers can, for example, increase the fluidity of powders or adjust the curing speed of adhesive raw materials. Modifiers can also be glass-based materials. The size of the main body 30 is not limited. For example, the maximum size of the main body 30 can be less than 3.2 mm. (External Electrodes) As shown in FIG2 , the first lead portion end face 14E and the second lead portion end face 24E located at the ends of the coil portion 10 are exposed from the main body portion 30 on the side surfaces aligned in the X1-X2 direction within the main body portion 30. A first external electrode 41 is provided as one of a pair of external electrodes for electrical contact with the first lead portion end face 14E, and a second external electrode 42 is provided as the other of the pair of external electrodes for electrical contact with the second lead portion end face 24E. The first external electrode 41 includes a side surface portion 41a covering the side surface of the main body 30 on the X2 side in the X1-X2 direction, and a bottom surface portion 41b provided to cover a portion of the bottom surface (the surface on the Z2 side in the Z1-Z2 direction) of the main body 30. The bottom surface portion 41b is the portion facing the substrate during use. The second external electrode 42 includes a side surface portion 42a covering the side surface of the main body 30 on the X1 side in the X1-X2 direction, and a bottom surface portion 42b provided on the bottom surface of the main body 30, spaced apart from the bottom surface portion 41b, and covering a portion of the bottom surface. The bottom surface portion 42b also faces the substrate during use. The positions of the first external electrode 41 and the second external electrode 42 are not limited to the positions described above. The first external electrode 41 and the second external electrode 42 can be formed so as to cover a portion of the upper surface of the main body 30 (the surface on the Z1 side in the Z1-Z2 direction). Alternatively, the first external electrode 41 and the second external electrode 42 can be provided only on a portion of the bottom surface of the main body 30 (the surface on the Z2 side in the Z1-Z2 direction). In this case, the coil conductor portion 20 can include a connecting conductor portion (not shown) that connects from the two ends of the coil portion 10 (the first lead portion end surface 14E and the second lead portion end surface 24E) through the interior of the main body 30 to the bottom surface of the main body 30. In this case, instead of exposing the two ends of the coil portion 10 (the first lead portion end surface 14E and the second lead portion end surface 24E) to the side surface of the main body 30, the connecting conductor portion can be exposed on the bottom surface of the main body 30. The materials and structures of the first and second external electrodes 41, 42 are not limited as long as they have appropriate conductivity. As an example of non-limiting examples of the first and second external electrodes 41, 42, a layer having a Cu-plated / Ni-plated / Sn-plated structure from the surface near the main body 30 can be cited. The first and second external electrodes 41, 42 can also be formed of coated electrodes in which a conductive material such as silver is dispersed in a resin or the like. Furthermore, the first and second external electrodes 41, 42 can also be a combination of plated and coated electrodes. (External Coating) Insulating external coatings 50 and 60 are provided on the upper surface (the surface on the Z1 side in the Z1-Z2 direction) and the side surfaces aligned in the Y1-Y2 direction of the main body 30, respectively. Alternatively, an insulating external coating may be provided on the bottom surface of the main body 30, where the bottom portions 41b and 42b are not provided with external electrodes. Furthermore, the coil component 100 may not include the external coatings 50 and 60. The external coatings 50 and 60 may be formed at any location on the surface of the main body 30, depending on the intended purpose. (Manufacturing Method) The manufacturing method of the coil component 100 of this embodiment is not particularly limited. As an example of the manufacturing method, which is not limited, the following manufacturing method includes forming the first conductor portion 11A by electroplating (electrolytic plating). 11 to 20 are explanatory diagrams (No. 1 to No. 10) of an example of a method for manufacturing a coil component according to an embodiment of the present invention. The method for manufacturing a coil component 100 according to this embodiment includes a pattern forming step and a first plating step, which will be described below. (a) Preparing a Sheet-Shaped Substrate First, as shown in FIG11(a), a sheet-shaped substrate 91 having substrate through-holes 91H provided at positions corresponding to the through-hole portions VP is prepared. The material of the sheet-shaped substrate 91 is not restricted, as long as it possesses mechanical properties sufficient to function as a support for forming the first scroll portion 11 and the second scroll portion 21. As in this example, the sheet-shaped substrate 91 preferably has suitable insulating properties when serving as the raw material for the first insulating portion 90. Furthermore, when performing the removal process of the sheet-shaped substrate 91 described later, it preferably has suitable removal properties in at least a portion. The thickness of the sheet substrate 91 is determined to ensure that it functions appropriately as a support member when forming the first scroll portion 11 and the second scroll portion 21, and to take into account the insulation properties of the first insulating portion 90 from the sheet substrate 91 or the removal characteristics of the sheet substrate 91 as needed. As a non-limiting example, the thickness of the sheet substrate 91 is set to be between 0.4 μm and 20 μm. The thickness of the sheet substrate 91 may be greater than 1.0 μm or greater than 5.0 μm. Furthermore, to further reduce the size of the coil component 100, the thickness of the sheet substrate 91 may be less than 14.0 μm. Examples of materials constituting sheet-like substrate 91 include organic materials, inorganic materials, and composite materials thereof. Specific examples of organic materials include thermoplastic resins such as polyimide resins and polyethylene resins, thermosetting resins such as epoxy resins and phenolic resins, and cellulose. Specific examples of inorganic materials include oxide-based materials such as glass and aluminum oxide, metal-based materials such as aluminum and magnesium, and inorganic salt-based materials such as calcium carbonate. Specific examples of composite materials include a structure in which inorganic material powder is dispersed in a matrix of an organic material. (b) Forming a Conductive Layer Next, the prepared sheet substrate 91 is arranged so that the normal of its main surface is facing the first direction (Z1-Z2 direction), and a pattern 11CP of the third conductor portion 11C corresponding to the first conductor portion 11A is formed on one of the main surfaces (the surface on the Z1 side in the Z1-Z2 direction), and a pattern 21CP of the third conductor portion 21C corresponding to the first conductor portion 21A is formed on the other main surface of the sheet substrate 91 (the surface on the Z2 side in the Z1-Z2 direction). There is no specific limitation on the method for forming the pattern 11CP of the third conductor portion 11C and the pattern 21CP of the third conductor portion 21C. For example, the method shown in Figures 11(b) to 12(d) is illustrated. First, as shown in Figure 11(b), a conductive layer 55 including the third conductor portion 11C and the same material as the third conductor portion 21C is formed on both sides of the main surface of the sheet substrate 91 (the surfaces on both sides in the Z1-Z2 direction). There is no limitation on the method for forming the conductive layer 55. The conductive layer 55 can be formed by a dry process such as sputtering, or by a wet process such as electroless plating. From the perspective of reducing the thickness of the conductive layer 55, it is preferred to form the conductive layer 55 by sputtering. In this example, as shown in FIG11( b ), a conductive layer 55H is also formed on the inner side of substrate through-hole 91H. Alternatively, a member having conductive layers 55 pre-formed on both main surfaces of sheet substrate 91, such as a copper-clad laminate, can be prepared, and substrate through-hole 91H can be formed therein. In this case, the inner side of substrate through-hole 91H can expose the material of sheet substrate 91, and the process of forming conductive layer 55H can be performed separately. (c) Formation of Insulating Layer Next, as shown in FIG11(c), an insulating layer 56 made of a patternable material such as a dry film resist is laminated on each of the conductive layer 55 provided on one main surface and the conductive layer 55 provided on the other main surface of the sheet-like substrate 91. By forming the insulating layer 56 thicker than the height of the first conductive portion 11A and the height of the first conductive portion 21A, respectively, the shape controllability of the first conductive portion 11A and the first conductive portion 21A can be improved. (d) Forming a Pattern of the Conductive Layer: Next, the insulating layer 56 on both sides in the Z1-Z2 direction is exposed and developed, partially removing the insulating layer 56 to form a negative pattern 56P as the first pattern, having the inverse shape of the pattern 11CP of the third conductor portion 11C corresponding to the first conductor portion 11A and the pattern 21CP of the third conductor portion 21C corresponding to the first conductor portion 21A. This exposes a portion of the conductive layer 55 on both sides in the Z1-Z2 direction, forming the pattern 11CP of the third conductor portion 11C and the pattern 21CP of the third conductor portion 21C, as shown in FIG. 12(d). In the manufacturing method of the coil part 100 of the present embodiment, the negative pattern 56P (first pattern) located on the Z1 side of the Z1-Z2 direction of the sheet substrate 91 has, in a wide region Rw corresponding to at least a portion of the wide portion 11w (shown as a dotted line in the lower top view in FIG. 12 ), a side wall portion 561 having a surface standing along the first direction (Z1-Z2 direction) from the exposed surface of the conductive layer 55; and a bridge portion 562 connecting the tops of two side wall portions 561 that are separated and face each other in a direction intersecting the first direction (Z1-Z2 direction) (specifically, the XY plane direction). Thus, in the wide area Rw, the first direction (Z1-Z2 direction) is closed by the side wall portion 561, the bridge portion 562 and the exposed portion of the conductive layer 55, and a vortex portion cavity 563 having an opening 564 in a direction intersecting the first direction (specifically, the direction in the XY plane) is divided. In addition, the negative pattern 56P (first pattern) located on the Z2 side of the Z1-Z2 direction of the sheet substrate 91 also has a side wall portion 561 and a bridge portion 562 in the wide area Rw (not shown in Figure 12) corresponding to at least a portion of the wide portion 21w. The first direction (Z1-Z2 direction) is closed and divided into a vortex portion cavity 563 having an opening 564 in a direction intersecting the first direction (Z1-Z2 direction) (specifically, the direction in the XY plane) by the side wall portion 561, the bridge portion 562 and the exposed portion of the conductive layer 55. As shown in FIG12 , the vortex cavity 563 may be completely closed on the bridge portion 562 side in the first direction, i.e., on the Z1 side in the Z1-Z2 direction. Alternatively, a through hole penetrating the bridge portion 562 along the first direction may be provided on the bridge portion 562 side in the first direction. There is no limitation on the method for forming the bridge portion 562 in the negative pattern 56P (first pattern). When the raw material of the insulating layer 56 forming the negative pattern 56P is a photosensitive material, when exposing the photosensitive material, the exposure amount is reduced for a portion of the surface side farther from the sheet substrate 91, thereby forming the bridge portion 562. The exposure amount can be reduced by using defocusing or a semi-transparent mask. Alternatively, multiple exposures can be performed using multiple masks of different shapes, or the insulating layer 56 can be formed as a laminate of multiple layers and subjected to multiple lamination, exposure, and development processes. When forming the negative pattern 56P by nanoimprinting, the bridge portion 562 can be formed by forming a relatively shallow recess corresponding to the bridge portion 562 using a master mold with different protrusion heights, and then attaching the product formed by nanoimprinting to the sheet substrate 91. When forming the negative pattern 56P on both sides of the insulating layer 56 in the Z1-Z2 direction, by removing portions corresponding to the third conductor portion 14C of the first lead portion 14 and the third conductor portion 24C of the second lead portion 24, the negative pattern 56P (first pattern) on the Z1 side in the Z1-Z2 direction forms the pattern 14CP of the third conductor portion 14C, while the negative pattern 56P (first pattern) on the Z2 side in the Z1-Z2 direction forms the pattern 24CP of the third conductor portion 24C. As shown in FIG. 12 , the pattern 14CP of the third conductor portion 14C corresponding to the first conductor portion 14A is formed continuously with the pattern 11CP of the third conductor portion 11C corresponding to the first conductor portion 11A, and the pattern 24CP of the third conductor portion 24C corresponding to the first conductor portion 24A is formed continuously with the pattern 21CP of the third conductor portion 21C corresponding to the first conductor portion 21A. In the manufacturing method of coil component 100 of this embodiment, negative pattern 56P (first pattern) located on the Z1 side of sheet substrate 91 in the Z1-Z2 direction is provided with sidewalls 561 and bridges 562 in lead region Rd (shown by dashed lines in FIG. 12 ) corresponding to first lead portion 14. These wall portions 561 and bridges 562 block the lead region 14 in the first direction (Z1-Z2) and define a lead region cavity 565 having an opening 564 in a direction intersecting the first direction (specifically, in the XY plane). While the scroll cavity 563 and lead region cavity 565 are separate in this example, they may be continuous. Similar to the scroll cavity 563, lead region cavity 565 may also be completely sealed on the bridge portion 562 side in the first direction, i.e., on the Z1 side in the Z1-Z2 direction. Alternatively, a through hole penetrating the bridge portion 562 along the first direction may be provided on the bridge portion 562 side in the first direction. The negative pattern 56P (first pattern) located on the Z2 side of the Z1-Z2 direction of the sheet substrate 91 is provided with a sidewall portion 561 and a bridge portion 562 in the lead region Rd (not shown in FIG. 12 ) corresponding to the second lead portion 24. These sidewalls 561 and a bridge portion 562 are closed in the first direction (Z1-Z2 direction) and define a lead portion cavity 565 having an opening 564 in a direction intersecting the first direction (specifically, the in-plane XY direction). Although the vortex portion cavity 563 and the lead portion cavity 565 are separate in this embodiment, they may be continuous. The lead portion cavity 565, like the vortex portion cavity 563, may also be completely closed on the bridge portion 562 side in the first direction, i.e., on the Z2 side in the Z1-Z2 direction. Alternatively, a through hole penetrating the bridge portion 562 along the first direction may be provided on the bridge portion 562 side in the first direction. (e) Formation of the First Conductor Portion: After forming the pattern 11CP of the third conductor portion 11C and the pattern 14CP of the third conductor portion 14C, as well as the pattern 21CP of the third conductor portion 21C and the pattern 24CP of the third conductor portion 24C, each including the exposed conductive layer 55, a first plating process is performed. In the first plating process, current is applied to the conductive layer 55 provided on both main surfaces of the sheet-like substrate 91. By electroplating, as shown in FIG. 13 , the first conductor portions 11A, 12A, 14A, 21A, 22A (not shown in FIG. 13 ), and 24A are formed on the pattern of the conductive layer 55. As described above, since negative pattern 56P (first pattern) formed from insulating layer 56 is disposed around the periphery of patterns 11CP, 14CP, 21CP, and 24CP of conductive layer 55, during the first plating process, electroplating is performed using negative pattern 56P as a masking material. This allows first conductor portion 11A and first conductor portion 14A, and first conductor portion 21A and first conductor portion 24A to be integrally formed corresponding to patterns 11CP, 14CP, 21CP, and 24CP of conductive layer 55. Furthermore, during the first plating process, through-hole conductor portion 11H is formed by filling substrate through-hole 91H. Because through-hole conductor portion 11H constitutes through-hole portion VP, through-hole portion VP is integrally formed with both first scroll portion 11 and second scroll portion 21 during the first plating process. Plating deposits are deposited in the pattern of the conductive layer 55 that is not covered by the bridge portion 562 and is visible when viewed in the first direction. These plating deposits constitute the first conductive portions 11hA and 21hA. As described above, in this example, the negative pattern 56P (first pattern) has a swirl portion cavity 563 in the wide region Rw and an extension portion cavity 565 in the extension region Rd. The conductive layer 55 exposed in these cavities also forms plating deposits. These plating deposits constitute the first conductive portions 11wA, 21wA, 14A, and 24A. Here, the width Wt of the pattern of the conductive layer 55 within the vortex cavity 563 forming the first conductor portion 11wA and the vortex cavity 563 forming the first conductor portion 21wA is wider than the width Wt of the pattern of the conductive layer 55 forming the first conductor portions 11hA and 21hA. Therefore, if the bridge portion 562 is not provided, the degree of circulation of the plating solution flowing through the pattern of the conductive layer 55 located in the wide region Rw is higher than the degree of circulation of the plating solution flowing through the pattern of the conductive layer 55 forming the first conductor portions 11hA and 21hA. As a result, the deposition thickness (height in the first direction) of the first conductor portions 11wA and 21wA formed in the pattern of the conductive layer 55 located in the wide region Rw is greater than the deposition thickness (height in the first direction) of the first conductor portions 11hA and 21hA. Thus, when the height of the first conductor portion 20 deviates in the first direction (Z1-Z2 direction) corresponding to the pattern shape of the conductive layer 55, the height of the coil conductor portion 20 also deviates. To meet the requirements of miniaturization, the main body 30 is essentially a three-dimensional body with high flatness, and the flatness of the surface with a normal line along the first direction is also high. Therefore, the height deviation of the coil conductor portion 20 is directly related to the deviation in the amount of magnetic material located on the side of the coil conductor portion 20 in the first direction (Z1-Z2 direction). The deviation in the amount of magnetic material leads to deviation in the magnetic properties of the coil component 100, and consequently, to deviation in the characteristics of the coil component 100, thereby affecting the quality stability of the coil component 100. In the coil component 100 of this embodiment, as described above, since the bridge portion 562 is provided in the wide region Rw, the plating deposits deposited on the vortex cavity 563 and the pattern of the conductive layer 55 exposed within the vortex cavity 563 are formed to fill these cavities. Therefore, the average length (height) in the first direction of the first conductor portions 11wA and 21wA formed in the wide region Rw is limited to the distance between the conductive layer 55 and the bridge portion 562, preventing the first conductor portions 11wA and 21wA from being excessively taller than the first conductor portions 11hA and 21hA. Furthermore, the extent to which the plating deposits fill these cavities need not be such that the entire vortex cavity 563 is completely filled with the plating deposits; the plating deposits may be formed so as to contact at least a portion of the surface of the bridge portion 562 that faces the conductive layer 55. When the amount of plating deposits formed inside the vortex cavity 563 increases, the plating deposition rate decreases because the amount of plating solution flowing through the vortex cavity 563 decreases. Therefore, from the perspective of productivity, it is sometimes preferable not to completely fill the vortex cavity 563 with plating deposits, but to leave some gaps. When a plating deposit is formed inside the vortex portion cavity 563 in a manner that contacts at least a portion of the surface of the bridge portion 562 on the side opposite to the conductive layer 55, the flatness of the surface of the first conductor portion 11wA, 21wA on the side opposite to the bridge portion 562 is higher than the surface on the same side of the first conductor portion 11hA, 21hA. The average length (height) in the first direction of the first conductor portions 14A and 24A formed in the lead-out region Rd is limited to the spacing distance between the conductive layer 55 and the bridge portion 562, similarly to the first conductor portions 11wA and 21wA, to prevent the first conductor portions 14A and 24A from being excessively higher than the first conductor portions 11hA and 21hA. The plating deposit formed by electroplating is not limited as long as it has appropriate conductivity. As mentioned above, materials containing Cu, such as Cu alloys, are examples without limitation. (f) Removal of Negative Pattern: After forming first conductor portions 11wA, 11hA, 12A, 14A, 21wA (not shown in FIG. 14 , the same applies hereinafter), 21hA, 22A, and 24A on both main surfaces of sheet substrate 91, a stripping process is performed to remove negative pattern 56P comprising insulating layer 56. As a result, as shown in FIG. 14 , conductive layer 55 is positioned over the entire surface of sheet substrate 91, excluding substrate through-hole 91H. This results in a structure in which first conductor portions 11wA, 11hA, 12A, 14A, 21wA, 21hA, 22A, and 24A are disposed on conductive layer 55. Furthermore, as described above, first conductor portion 12A, formed continuously from first conductor portion 11A, and first conductor portion 22A, formed continuously from first conductor portion 21A, are electrically connected via through-hole conductor portion 11H, which constitutes through-hole portion VP. Furthermore, because the first conductor portions 11wA and 21wA are formed to fill the vortex cavity 563, the ends of the first conductor portions 11wA and 21wA on the side opposite to the sheet substrate 91 have a shape that is a transfer of the shape of the surface of the bridge portion 562 facing the sheet substrate 91. Therefore, by appropriately selecting the method for forming the bridge portion 562, the surface of the first conductor portions 11wA and 21wA on the side opposite to the sheet substrate 91 can be made flat. In contrast, in the pattern of the conductive layer 55 that is not covered by the bridge portion 562 and is visible when viewed in the first direction before the first plating process, the degree of circulation of the plating solution varies along the width Wt direction of the pattern, and plating deposits are more likely to form closer to the center in the width Wt direction. Therefore, when the first conductor portions 11hA and 21hA containing the plating deposits are cut along a plane including the first direction and the width Wt direction, they have a convex shape with a higher center portion. Therefore, when comparing the shapes of the first conductor portions 11wA, 21wA and the first conductor portions 11hA, 21hA on the side opposite to the sheet-like substrate 91, the first conductor portions 11wA, 21wA have a higher flatness. Furthermore, when comparing a wide portion cross-section line L1w formed at one end in the first direction (on the Z1 side in the Z1-Z2 direction) of a wide portion cross-section Sw obtained by cutting the first conductor portion 11wA along a plane including the first direction, and a high-winding portion cross-section line L1h formed at one end in the first direction (on the Z1 side in the Z1-Z2 direction) of a high-winding portion cross-section Sh obtained by cutting the first conductor portion 11hA along a plane including the first direction, the wide portion cross-section line L1w has a higher linearity than the high-winding portion cross-section line L1h. Similarly, the surface of the first conductor portions 14A and 24A opposite to the sheet substrate 91 can be made flat. In this case, when the shapes of the surfaces of the first conductor portions 14A and 24A opposite to the sheet substrate 91 are compared with those of the first conductor portions 11hA and 21hA, the first conductor portions 14A and 24A have a higher degree of flatness. Furthermore, when a lead section cross-section line L1d formed at one end in the first direction (on the Z1 side in the Z1-Z2 direction) of a lead section cross-section Sd obtained by cutting the first conductor portion 14A along a plane including the first direction is compared with the high winding section cross-section line L1h, the lead section cross-section line L1d has a higher linearity than the high winding section cross-section line L1h. (g) Removal of Conductive Layer: Next, as part of the stripping process, the portion of the conductive layer 55 on the sheet substrate 91 that is exposed in the first direction (Z1-Z2 direction), specifically, the portion not covered by the first conductor portions 11A, 12A, 14A, 21A, 22A, and 24A, is removed. As shown in FIG. 15 , the conductive layer 55 remaining on the sheet substrate 91 becomes the third conductor portions 11C, 14C, 21C, and 24C that constitute the coil portion 10. The method for removing the conductive layer 55 is not limited. A suitable process can be selected that removes the material forming the conductive layer 55 and minimizes the effect on the first conductive portions 11A, 12A, 14A, 21A, 22A, and 24A. For example, if the first conductive portions 11A, 12A, 14A, 21A, 22A, and 24A are made of Cu and the conductive layer 55 is made of Ni, the portions of the conductive layer 55 not covered by the first conductive portions 11A, 12A, 14A, 21A, 22A, and 24A can be etched with high selectivity. In addition, when the constituent material of the conductive layer 55 is the same as that of the first conductor parts 11A, 12A, 14A, 21A, 22A, and 24A, a portion of the first conductor parts 11A, 12A, 14A, 21A, 22A, and 24A is also removed through a process that can remove the material constituting the conductive layer 55, but it is sufficient to set the shape of the electroplated deposit formed in the first plating treatment to take into account the shape of the removed portion. (h) Forming the Second Conductor Portion: After the conductive layer 55 is removed as described above, the only conductive members exposed in the sheet-like substrate 91 are essentially the first conductor portions 11A, 12A, 14A, 21A, 22A, and 24A. In this state, a second plating process is performed, and as shown in FIG16 , second conductor portions 11B, 12B, and 14B are formed on the surfaces of the first conductor portions 11A, 12A, and 14A, and second conductor portions 21B, 22B, and 24B are formed on the surfaces of the first conductor portions 21A, 22A, and 24A. The second plating process can be either electroplating (electrolytic plating) or electroless plating. By forming the second conductor portions 11B, 12B, 14B, 21B, 22B, and 24B, the first coil conductor portion 201 including the first vortex portion 11 and the first lead-out portion 14 and the second coil conductor portion 202 including the second vortex portion 21 and the second lead-out portion 24 are formed, and the coil conductor portion 20 including the first coil conductor portion 201 and the second coil conductor portion 202 and the through-hole portion VP is also formed. (i) Removal of Sheet Base Material Next, a removal process is performed to remove the exposed portions of sheet base material 91 where no conductive member is provided. Specifically, as shown in FIG17 , sheet base material 91 is removed so as to include the region of sheet base material 91 surrounded by the inner edge of first scroll portion 11 when viewed in the first direction (Z1-Z2 direction). In FIG17 , the portions of sheet base material 91 on both sides of the first conductive portion in the first direction remain after removal, forming first insulating portions 90. The specific removal process for sheet substrate 91 is appropriately determined based on the material of sheet substrate 91. Removal processes are broadly categorized as dry processes, such as plasma etching, or wet processes, such as wet etching. Wet processes are sometimes preferred for isotropic removal or to improve the removal efficiency of sheet substrate 91. While a portion of sheet substrate 91 is removed by the removal process, some portions may remain unremoved. For example, if sheet substrate 91 comprises a composite material of organic and inorganic materials, only the organic material may be removed during the removal process. (j) Formation of the Second Insulating Part After removing the sheet-like base material 91, the second insulating part 80 comprising an insulating material is formed so as to cover at least a portion of the exposed portion of the coil conductor part 20 ( FIG. 18 ). The forming process of the second insulating part 80 is appropriately set according to the constituent material of the second insulating part 80. For example, when the second insulating part 80 comprises a paraxylene-based polymer, it is formed by a dry process (evaporation). When the second insulating part 80 comprises a curable resin material such as an epoxy resin, it is formed by allowing a powder or liquid comprising the constituent material of the second insulating part 80 to adhere to the exposed surface and then solidifying the adhered material by heating or the like. (k) Forming the main body When the coil portion 10 is formed by the above process, as shown in FIG19 , the coil portion 10 is sealed with a material containing magnetic powder to form the main body 30. The method for forming the main body 30 is not limited, and the forming process is exemplified. As a specific example of the forming process, the product shown in FIG18 can be arranged in a mold and formed by compression molding of a material containing magnetic powder, or the material containing magnetic powder or a component that becomes the raw material of the material is die-cast. When the product shown in FIG18 is arranged in a mold and compression molded to obtain the product shown in FIG19 , based on the viewpoint of improving the forming quality (the quality of the product shown in FIG19 , specifically, the uniformity of its thickness), it is preferred to improve the uniformity of the height of the vortex conductor portion (the first vortex portion 11, the second vortex portion 21) in the first direction in the product shown in FIG18 . Regarding this point, in the manufacturing method of the coil component 100 of this embodiment, as described above, in a specific example, since the uniformity of the height (average length in the first direction) of the first coil conductor portion 201 and the second coil conductor portion 202 is high, it is easy to improve the forming quality. There is no limitation on the method for forming the main body 30 so that the first lead portion end face 14E and the second lead portion end face 24E are exposed from the main body 30. For example, the first lead portion 14 and the second lead portion 24 can be cut along a plane including the first direction and the Y1-Y2 direction for each portion of the main body 30, thereby exposing the first lead portion end face 14E and the second lead portion end face 24E. In FIG. 19 , a two-dot chain line indicates a cut line CL based on the cut surface. (1) Forming an External Coating: Next, an external coating 50 is applied to a portion of the exposed portion of the main body 30 to protect the main body 30. In the diagram shown in FIG20(1), the external coating 50 is applied to the portions of the upper surface (the surface on the Z1 side in the Z1-Z2 direction) and the lower surface (the surface on the Z2 side in the Z1-Z2 direction) of the main body 30 where neither the first external electrode 41 nor the second external electrode 42 is formed. Although not shown in FIG20(1), an external coating 60 is also applied along with the external coating 50 (see FIG1). The main body 30 can remain unchanged, but if external forces are applied due to collisions with other components, the insulating coating on the surface of the magnetic powder constituting the main body 30 may be removed, and the surface resistance of the main body 30 may decrease. Because a decrease in surface insulation may reduce the reliability of the coil component 100, it is preferable to provide external coatings 50 and 60 composed of an insulating material. There is no limitation on the method for forming the exterior coatings 50 and 60. Well-known methods such as printing and coating can be used. The constituent materials of the exterior coatings 50 and 60 can be well-known materials such as epoxy resin. From the perspective of improving impact resistance, it is preferable to use a composite material in which an inorganic material such as glass fiber is dispersed in an organic material such as epoxy resin. In addition, in addition to improving insulation reliability or impact resistance, the exterior coatings 50 and 60 can also be formed to improve the appearance quality or to improve the position accuracy of the external electrodes in the next process (for example, to prevent plating stretching). In addition, the process of forming the exterior coating can be repeated multiple times. In this case, the exterior coating 50 and the exterior coating 60 can also be formed by different processes. (m) Forming External Electrodes: Finally, a portion of the first lead portion 14 (first lead portion end surface 14E) that was not sealed with the material containing magnetic powder during the formation of the main body 30 is electrically connected to one of the two terminal portions (first external electrode 41). A portion of the second lead portion 24 (second lead portion end surface 24E) is electrically connected to the other of the two terminal portions (second external electrode 42). The method for forming the first external electrode 41 and the second external electrode 42 is not limited, and plating or printing processes can be used as examples. In the diagram shown in (m) of Figure 20, the first external electrode 41 and the second external electrode 42 are formed so as to extend not only along the side surface of the main body 30 (the surface facing the X1-X2 direction) but also along a portion of the bottom surface of the main body 30 (the surface facing the Z2 side in the Z1-Z2 direction). As described above, by forming the external electrodes (first external electrode 41 and second external electrode 42) after forming the outer coating layer 50, it is possible to prevent the formation of plating deposits in unintended areas of the exposed surface of the main body 30, which could lead to defects such as reduced shape accuracy of the external electrodes or increased risk of short circuits in the external electrodes (plating stretching). Based on this perspective, as in this embodiment, during the outer coating layer formation process, it is preferred that the outer coating layer 50 is also formed on the lower surface (Z2 side in the Z1-Z2 direction) that will serve as the mounting surface. (Electronic or Electrical Equipment) An electronic or electrical equipment according to one embodiment of the present invention incorporates the coil component 100 according to one embodiment of the present invention. Coil component 100 is connected to a substrate via first external electrode 41 and second external electrode 42. Because the electronic or electrical equipment according to one embodiment of the present invention incorporates coil component 100 according to one embodiment of the present invention, the equipment can be easily miniaturized. Furthermore, even when high currents flow through the equipment or high-frequency waves are applied, coil component 100 is unlikely to experience degradation in function or malfunctions due to heat generation. The embodiments and examples described above are provided to facilitate understanding of the present invention and are not intended to limit the present invention. Therefore, it is intended that the various elements disclosed in the embodiments described above also include all design modifications or equivalents that fall within the technical scope of the present invention. 10: Coil portion 11: First scroll portion 11A, 11hA, 11wA, 12A, 14A, 21A, 21hA, 21wA, 22A, 111wA, 113hA, 24A: First conductor portion 11B, 12B, 14B, 21B, 22B, 24B, 111wB, 113hB: Second conductor portion 11C, 14C, 21C, 24C, 111wC, 113hC: Third conductor portion 11CP: Pattern 11H: Through-hole conductor portion 11L, 21L: Low-wound portion 11h, 21h: High-wound portion 11w: Wide portion 12: First inner peripheral end portion 13: First outer peripheral end portion 14: First lead portion 14CP, 21CP, 24CP: Pattern 14E: First lead portion end surface 20: Coil conductor portion 21: Second scroll portion 21w: Wide portion 22: Second inner peripheral end portion 23: Second outer peripheral end portion 24: Second lead portion 24E: Second lead portion end surface 30: Main body 41: First external electrode (first terminal portion) 41a, 42a: Side portions 41b, 42b: Bottom portion 42: Second external electrode (second terminal portion) 50: External coating 55, 55H: Conductive layer 56: Insulating layer 56P: Negative pattern (first pattern) 60: Exterior coating 80: Second insulating portion 90: First insulating portion 91: Sheet-shaped base material 91H: Base material through-hole 100: Coil component 111h: First inner circumferential turn 111w: First inner circumferential wide portion 112h: First center turn 113h: First outer circumferential turn 113w: First outer circumferential wide portion 201: First coil conductor portion 202: Second coil conductor portion 211h: Second inner circumferential turn 211w: Second inner circumferential wide portion 212h: Second center turn 213h: Second outer circumferential turn 213w: Second outer circumferential wide portion 561: Sidewall portion 562: Bridge portion 563: Vortex portion cavity 564: Opening 565: Lead portion cavity CL: Cutting lines Hd, H1d, Hh, H1h, Hw, H1w: Height IF1: First interface L1~L4: Straight line L1d: Lead-out section line L1da, L1ha, L1wa, Lda, Lha, Lwa: Approximate straight line L1h: High winding section line L1w: Wide section line L1hm, L1wm: Area Ld: Lead-out end line Lh: High winding end line Lw: Wide end line O: Axis Rd: Lead-out area Rw: Wide area Sd: Lead-out section Sh: High winding section Sw: Wide section VP: Through hole Wt: Turn width X1-X2: Direction Y1-Y2: Direction Z1-Z2: Direction FIG1 is a perspective view conceptually showing the shape of a coil component according to an embodiment of the present invention. FIG2 is a view illustrating the structure of a coil conductor portion of a coil component according to an embodiment of the present invention. FIG3 is an XY top view illustrating the structure of a first coil conductor portion of a coil component according to an embodiment of the present invention. FIG4 is an XY top view illustrating the structure of a second coil conductor portion of a coil component according to an embodiment of the present invention. FIG5 is a cross-sectional view taken along line AA' and along the Z1-Z2 direction of FIG3. FIG6 is a cross-sectional view taken along line BB' and along the Z1-Z2 direction of FIG4. FIG7 is a partially enlarged view of an area including the first inner circumferential wide portion of FIG5 (a portion of the cross-section of the wide portion). FIG8 is a partially enlarged view of an area including the first outer circumferential turns of FIG5 (a portion of the cross-section of the high winding portion). FIG9 is a view showing an example of a cross-section of the first conductor portion located in the wide portion and an example of a cross-section of the first conductor portion located in the high winding portion. FIG10 is a partially enlarged view of the region including the first lead portion in FIG6 (a portion of a cross-section of the lead portion). FIG11 is an explanatory diagram (Part 1) of an example of a method for manufacturing a coil component according to an embodiment of the present invention. FIG12 is an explanatory diagram (Part 2) of an example of a method for manufacturing a coil component according to an embodiment of the present invention. FIG13 is an explanatory diagram (Part 3) of an example of a method for manufacturing a coil component according to an embodiment of the present invention. FIG14 is an explanatory diagram (Part 4) of an example of a method for manufacturing a coil component according to an embodiment of the present invention. FIG15 is an explanatory diagram (Part 5) of an example of a method for manufacturing a coil component according to an embodiment of the present invention. FIG16 is an explanatory diagram (Part 6) of an example of a method for manufacturing a coil component according to an embodiment of the present invention. FIG17 is an explanatory diagram (Part 7) of an example of a method for manufacturing a coil component according to an embodiment of the present invention. FIG18 is an explanatory diagram (Part 8) of an example of a method for manufacturing a coil component according to an embodiment of the present invention. FIG19 is an explanatory diagram (Part 9) of an example of a method for manufacturing a coil component according to an embodiment of the present invention. FIG. 20 is an explanatory diagram (No. 10) of an example of a method for manufacturing a coil component according to an embodiment of the present invention. 10: Coil 11: 1st vortex 12: 1st inner peripheral side end 13: 1st outer peripheral side end 14: First lead 14E: End face of the first lead portion 20: Coil conductor part 21: Second vortex 22: 2nd inner peripheral side end 23: 2nd outer peripheral side end 24: Second lead 24E: End face of the second lead portion 30: Ontology part 100: Coil parts 201: 1st coil conductor part 202: Second coil conductor portion O:Axis VP:Through hole X1-X2: Direction Y1-Y2: direction Z1-Z2: Direction

Claims

1. A coil component, characterized by comprising: a first coil conductor portion having a first spiral portion in the shape of a spiral extending from a first inner peripheral end toward a first outer peripheral end along an axis in a first direction; a first terminal portion electrically connected to the first outer peripheral end; and a second terminal portion electrically connected to the first inner peripheral end; wherein the first spiral portion has a high-winding portion with two or more turns and a low-winding portion with fewer turns than the high-winding portion, and the turns in the low-winding portion have a wider portion in which the turn width when viewed in the first direction is greater than the turn width in the high-winding portion; at least a portion of the first coil conductor portion includes a first conductor portion containing plating precipitates. The straightness of the wide portion section line formed by the end of the first conductor portion in the first direction of the wide portion obtained by cutting the wide portion with a surface including the first direction is higher than the high winding portion section line formed by the end of the first conductor portion in the first direction of the high winding portion obtained by cutting the high winding portion with a surface including the first direction.

2. The coil component of claim 1, wherein the average length H1w of the first conductor portion in the first direction in the wide section and the average length H1h of the first conductor portion in the first direction in the high winding section satisfy 0.8≦H1w / H1h≦1.

2.

3. The coil component of claim 1, wherein the first coil conductor portion has a conductive second conductor portion disposed in such a manner as to be connected to one end of the first conductor portion in the first direction, and the wide portion profile line and the high winding portion profile line include the boundary line of the first conductor portion and the second conductor portion.

4. The coil component of claim 3, wherein the straightness of the end line of the wide portion formed at the end of the first direction of the wide portion cross section is higher than that of the end line of the high winding portion formed at the end of the first direction of the high winding portion cross section.

5. The coil component of claim 1, wherein the first coil conductor portion has a third conductor portion that is conductive and is disposed in such a manner as to be connected to the other end of the first conductor portion in the first direction.

6. The coil component of claim 1, wherein the first coil conductor portion has a conductive first lead-out portion between the first outer peripheral end and the first terminal portion; and at least a portion of the first lead-out portion includes the first conductor portion; the straightness of the lead-out portion section line formed by the first end of the first conductor portion in the first direction in the lead-out portion section obtained by cutting the first lead-out portion with a surface including the first direction is higher than the high-winding portion section line.

7. The coil component of claim 6, wherein the average length H1d of the first conductor portion in the first direction in the cross-section of the lead-out portion and the average length H1h of the first conductor portion in the first direction in the cross-section of the high-winding portion satisfy 0.8≦H1d / H1h≦1.

2.

8. The coil component of claim 6, wherein the first lead is provided with a conductive second conductor portion in such a manner as to be connected to one end of the first lead in the first direction, and the cross-sectional line of the lead includes the boundary line between the first conductor portion and the second conductor portion.

9. The coil component of claim 6, wherein the first lead-out portion has a conductive third conductor portion disposed in such a manner as to be connected to the other end of the first conductor portion in the first direction.

10. The coil component of claim 1, comprising: a body portion containing magnetic material, and enclosing at least a portion of the first coil conductor portion.

11. The coil component of claim 10, wherein the magnetic material comprises magnetic powder, and the body portion comprises an adhesive for retaining the magnetic powder.

12. The coil component of claim 1 further comprises: a second coil conductor portion having a vortex-shaped second spiral portion extending from a second inner peripheral end toward a second outer peripheral end away from the axis along the first direction; and the second inner peripheral end being electrically connected to the first inner peripheral end via a conductive through-hole portion; the second outer peripheral end being electrically connected to the second terminal portion; the first coil conductor portion and the second coil conductor portion being arranged in the first direction, and the second coil conductor portion being located at the other end of the first coil conductor portion in the first direction.

13. The coil component of claim 12, wherein the second vortex portion has the high winding portion and the low winding portion, the coil turns located in the low winding portion have the wide portion; and at least a portion of the second coil conductor portion includes the first conductor portion; the straightness of the cross-sectional line of the wide portion is higher than that of the cross-sectional line of the high winding portion.

14. A method for manufacturing a coil component, characterized in that it comprises a coil conductor portion having a first vortex portion having a vortex shape when viewed in a first direction; and the first vortex portion having a high winding portion having 2 or more turns and a low winding portion having fewer turns than the high winding portion, wherein the turns in the low winding portion have a wider portion whose turn width when viewed in the first direction is greater than the turn width in the high winding portion; the coil component is manufactured by comprising the following steps: a pattern forming step, which forms an insulating first pattern on a portion of a conductive layer disposed on the main surface of an insulating sheet substrate; and a first plating process step, which performs an electroplating process by energizing the conductive layer, and forms a first conductor portion comprising plating precipitates and constituting at least a portion of the first vortex portion on an exposed surface of the conductive layer that is not in contact with the first pattern. The first pattern described above has, in a wide region corresponding to at least a portion of the wide portion, the following: a sidewall portion having a surface erected along the first direction from the exposed surface of the conductive layer; and a bridge portion connecting the tops of two sidewall portions that are spaced apart and face to face in a direction intersecting the first direction; in the wide region, the first direction is closed and a vortex cavity with an opening in a direction intersecting the first direction is defined by the sidewall portion, the bridge portion, and the exposed portion of the conductive layer; in the first plating process step, the vortex cavity is filled with the first conductor portion.

15. The method of manufacturing the coil part as claimed in claim 14, wherein the vortex cavity is completely closed on the bridge portion side in the first direction.

16. A method for manufacturing a coil component as claimed in claim 14, wherein the first coil conductor portion has a first lead-out portion connected to the peripheral end of the first vortex portion; the first pattern has a lead-out area corresponding to the first lead-out portion; the sidewall portion and the bridge portion are provided in the lead-out area, thereby closing the first direction and dividing a lead-out cavity with an opening in a direction intersecting the first direction; in the first plating process step, the lead-out cavity is filled with the first conductor portion.

17. A method for manufacturing a coil component as claimed in claim 16, wherein the aforementioned lead-out cavity is completely closed on the bridge portion side in the first direction.

18. An electronic or electrical machine, the like being an electronic or electrical machine having a coil component as claimed in claim 1, wherein the coil component is connected to a substrate by the first terminal portion and the second terminal portion.

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