Optical transceiver module socket cage, optical transceiver module, and optical transceiver module set

Abstract

An optical transceiver module socket housing includes a housing body and a liquid cooling component. The housing body forms a module slot. The liquid cooling component has a flow channel structure for the flow of working fluid. The liquid cooling component is fixedly disposed within the housing body and protrudes from the module slot. An optical transceiver module includes a module housing and a plate edge connector protruding from one side of the module housing. The module housing includes a main housing and two vertical plates. The main housing has a flat thermally conductive surface, and the two vertical plates protrude from opposite sides of the flat thermally conductive surface. An unstructured space is formed between the two vertical plates and the flat thermally conductive surface. An optical transceiver module assembly includes an optical transceiver module socket having the aforementioned optical transceiver module socket housing, and an optical transceiver module mating with the optical transceiver module socket.

Description

Technical Field

[0001] This invention relates to an optical transceiver module and an optical transceiver module socket, and more particularly to a heat dissipation structure for the optical transceiver module and the optical transceiver module socket. Prior Technology

[0002] In the field of optical communication, the transmission rate of optical transceiver modules is constantly increasing, and the power consumption during operation is also increasing, causing optical transceiver modules to operate at higher temperatures. To avoid overheating, some optical transceiver modules or their sockets are equipped with heat sinks to effectively dissipate the heat generated inside the module during operation. However, simple heat sinks are gradually becoming insufficient to meet the needs of applications with ever-increasing transmission rates, creating a design bottleneck for optical transceiver modules or their sockets. Summary of the Invention

[0003] In view of the problems in the prior art, the object of the present invention is to provide an optical transceiver module socket housing that uses a liquid cooling component to efficiently absorb heat.

[0004] According to one embodiment of the present invention, an optical transceiver module socket housing includes a housing body and a liquid cooling component. The housing body forms a module slot. The liquid cooling component has a flow channel structure and an inlet and an outlet communicating with the flow channel structure. The liquid cooling component is fixedly disposed within the housing body and protrudes into the first module slot. Thus, when an optical transceiver module is inserted into the module slot, the liquid cooling component can contact the optical transceiver module to absorb the heat generated by the optical transceiver module during operation. In practice, a working fluid flows through the liquid cooling component via the inlet and the outlet to carry away the heat absorbed by the liquid cooling component, thereby achieving the effect of heat dissipation for the optical transceiver module.

[0005] Another object of the present invention is to provide an optical transceiver module having a flat thermally conductive surface and using this thermally conductive surface to conduct heat generated during operation to the outside.

[0006] According to one embodiment of the present invention, an optical transceiver module includes a module housing and a plate edge connector. The module housing has a longitudinal direction and includes a main housing and two vertical plates. The main housing has a flat, heat-conducting surface. The two vertical plates protrude from the flat, heat-conducting surface, extend parallel to the longitudinal direction, and are located on opposite sides of the main housing. A structureless space is formed between the two vertical plates and the flat, heat-conducting surface. The plate edge connector protrudes from one side of the module housing in the longitudinal direction. Therefore, when the optical transceiver module is inserted into an optical transceiver module socket, the flat, heat-conducting surface of the optical transceiver module is thermally coupled to the heat exchanger of the optical transceiver module socket, allowing the optical transceiver module to conduct heat generated during operation to the heat exchanger via the flat, heat-conducting surface, thereby achieving a heat dissipation effect.

[0007] Another object of the present invention is to provide an optical transceiver module assembly comprising an optical transceiver module socket having the aforementioned optical transceiver module socket housing, and an optical transceiver module mating with the optical transceiver module socket. Therefore, when the optical transceiver module is inserted into the optical transceiver module socket, the optical transceiver module socket can utilize a liquid cooling component to efficiently absorb the heat generated by the optical transceiver module during operation.

[0008] An optical transceiver module assembly according to one embodiment of the present invention includes an optical transceiver module socket and an optical transceiver module. The optical transceiver module socket includes a connector socket and the aforementioned optical transceiver module socket housing. The connector socket is disposed in the module slot. The optical transceiver module includes a module housing and a board edge connector. The module housing includes a main housing having a flat thermally conductive surface. The optical transceiver module is inserted into the module slot such that the board edge connector is inserted into the connector socket, and the flat thermally conductive surface contacts the liquid cooler within the module slot. Thus, the heat generated by the optical transceiver module during operation can be conducted to the liquid cooler via the flat thermally conductive surface. Furthermore, in practice, a working fluid flows through the liquid cooler via the inlet and outlet to carry away the heat absorbed by the liquid cooler, thereby achieving the effect of heat dissipation for the optical transceiver module.

[0009] The advantages and spirit of the present invention can be further understood through the following detailed description of the invention and the accompanying drawings. Simple Explanation of the Diagram

[0010] Figure 1 is a schematic diagram of an optical transceiver module assembly according to a first embodiment. Figure 2 is a partial exploded view of the optical transceiver module socket in Figure 1. Figure 3 is a schematic diagram of Figure 2 from another perspective. Figure 4 is an exploded view of the liquid cooling component of the optical transceiver module socket housing in Figure 2. Figure 5 is a top view of the base of the liquid-cooled component in Figure 4. Figure 6 is a schematic diagram of the housing body of the optical transceiver module socket in Figure 2 from another perspective. Figure 7 is a schematic diagram of Figure 6 from another perspective. Figure 8 is a schematic diagram of the combination of the liquid cooling component and the housing body. Figure 9 is a schematic diagram of the liquid cooling component and the shell body combined in Figure 8. Figure 10 is a schematic diagram of the combination of the liquid cooling component and the shell body from another side view. Figure 11 is a schematic diagram of the liquid cooling component and the shell body in Figure 10. Figure 12 is a schematic diagram of the liquid cooling component of the optical transceiver module assembly in Figure 1, installed with a 180-degree rotation. Figure 13 is a schematic diagram of the combination of the liquid cooling component and the shell body in Figure 12. Figure 14 is a schematic diagram of the liquid cooling component and the shell body combined in Figure 13. Figure 15 is a schematic diagram of the combination of the liquid cooling component and the shell body in Figure 12 from another side view. Figure 16 is a schematic diagram of the liquid cooling component and the shell body assembled in Figure 15. Figure 17 is a schematic diagram of an optical transceiver module socket according to a second embodiment. Figure 18 is a schematic diagram of an optical transceiver module socket according to a third embodiment. Figure 19 is a schematic diagram of Figure 18 from another perspective. Figure 20 is a schematic diagram of an optical transceiver module assembly according to a fourth embodiment. Figure 21 is a partial exploded view of the optical transceiver module socket in Figure 20. Figure 22 is a schematic diagram of Figure 21 from another perspective. Figure 23 is an exploded view of the liquid cooling component of the optical transceiver module socket housing in Figure 21. Figure 24 is a schematic diagram of an optical transceiver module socket according to a fifth embodiment. Figure 25 is a partial exploded view of the optical transceiver module socket in Figure 24. Figure 26 is a schematic diagram of the liquid cooling component in Figure 25 from another perspective. Figure 27 is an exploded view of the liquid cooling component in Figure 25. Figure 28 is a top view of the base of the liquid cooling component in Figure 27. Figure 29 is a schematic diagram of an optical transceiver module socket according to a sixth embodiment. Figure 30 is a partial exploded view of the optical transceiver module socket in Figure 29. Figure 31 is a partial exploded view of an optical transceiver module socket according to a sixth embodiment. Implementation

[0011] The directional terms mentioned in the following embodiments, such as up, down, left, right, front, or back, are only for reference to the accompanying diagrams. Prefixes for component names, such as first, second, etc., are only for distinguishing components and facilitating description, and do not impose any other limitations on the components; furthermore, components with the same prefix in different embodiments do not necessarily correspond. The correspondence of components in each embodiment should still be determined according to the specific structure described in each embodiment.

[0012] Please refer to Figures 1 to 3. An optical transceiver module assembly 1 according to a first embodiment includes an optical transceiver module 12 and an optical transceiver module socket 14. The optical transceiver module socket 14 includes an optical transceiver module socket housing 142, a connector socket 144, and a circuit board 146. The optical transceiver module socket housing 142 includes a housing body 1422 and a liquid cooling component 1424. The housing body 1422 forms a module slot 1422a, which has a length direction 1422b (indicated by a double-headed arrow in the figure) and an insertion opening 1422c in the length direction 1422b. The liquid cooling component 1424 is fixedly disposed within the housing body 1422 and protrudes from the module slot 1422a. The connector socket 144 is electrically fixed to the circuit board 146. The housing body 1422 is fixed to the circuit board 146 such that the connector socket 144 is located in the module slot 1422a. The optical transceiver module 12 can be inserted into the module slot 1422a through the insertion port 1422c parallel to the length direction 1422b, so as to connect with the connector socket 144 and contact the liquid cooling component 1424; thereby, the heat generated by the optical transceiver module 12 during operation can be conducted to the liquid cooling component 1424 (i.e., equivalent to a heat exchanger) to achieve a heat dissipation effect.

[0013] Please refer to Figures 4 and 5. The liquid cooling component 1424 includes a base 1424a and a top cover 1424b. The base 1424a forms a flow channel structure 1424c and an inlet 1424d and an outlet 1424e communicating with the flow channel structure 1424c. The top cover 1424b is fixed to the base 1424a (by means of, but not limited to, tight fitting and / or soldering) to cover the flow channel structure 1424c. The working fluid (not shown in the figures) flows through the flow channel structure 1424c via the inlet 1424d and the outlet 1424e to remove the heat absorbed by the base 1424a. The flow channel structure 1424c includes a first flow channel portion 1424f and a second flow channel portion 1424g (both indicated by dashed boxes in the figures), both extending parallel to the length direction 1422b. The inlet 1424d, the first flow channel section 1424f, the second flow channel section 1424g, and the outlet 1424e are connected sequentially. Furthermore, the first flow channel section 1424f includes two sub-flow channels 1424h, extending parallel to the length direction 1422b and connected in parallel; the second flow channel section 1424g is similar, and will not be described further. This structural configuration facilitates the smooth flow of the working fluid through the flow channel structure 1424c, thereby suppressing the generation of local hot spots in the liquid cooling plate 1424.

[0014] Furthermore, the optical transceiver module socket housing 142 also includes two transmission pipes 1426a and 1426b, which are fixedly connected to the inlet 1424d and the outlet 1424e, respectively, facilitating connection to the manifold of an external cooling system. For example, a device with an optical transceiver module socket 14 is installed in a cabinet equipped with a cooling system, and the manifold of the cooling system is fixed to the bracket of the cabinet and connected to the transmission pipes 1426a and 1426b (for example, a flexible hose connecting the manifold is fitted onto the transmission pipes 1426a and 1426b). In the first embodiment, there are two oppositely arranged grooves 1424i on the inner wall of the inlet 1424d, and the corresponding transmission pipe 1426a is tightly fitted into these two grooves 1424i. Similarly, there are also two oppositely arranged grooves 1424j on the inner wall of the outlet 1424e, and the corresponding transmission pipe 1426b is tightly fitted into these two grooves 1424j.

[0015] As shown in Figures 6 and 7, the shell body 1422 includes a first sliding hook 1422d and a second sliding hook 1422e within the module slot 1422a, located on both sides of the shell body 1422 relative to the length direction 1422b. In the first embodiment, both the first sliding hook 1422d and the second sliding hook 1422e are formed by bending and extending from the upper sidewall of the shell body 1422, but this is not a limitation in practice. For example, if the actual product structure allows, the first sliding hook 1422d and the second sliding hook 1422e can also be formed by bending and extending from the opposite sidewall of the shell body 1422, respectively. As shown in Figures 3 and 4, a first sliding groove 1424k and a second sliding groove 1424m are formed on both sides of the liquid cooling component 1424 (base 1424a). The liquid cooling component 1424 slides into and hooks the first slide groove 1424k and the second slide groove 1424m through the first slide hook 1422d and the second slide hook 1422e respectively to fix it in the shell body 1422.

[0016] Furthermore, the connection between the first sliding hook 1422d and the first sliding groove 1424k is shown in Figure 8 (which is a side view of the liquid cooling component 1424, where the outline of the first sliding hook 1422d is drawn with dashed lines, and the insertion port 1422c is located on the left). The first sliding groove 1424k is a T-shaped groove, which has a first inlet end 1425a, a first closed end 1425b, and a second closed end 1425c. During the assembly of the liquid cooling component 1424 and the shell body 1422, the liquid cooling component 1424 is moved so that the first sliding hook 1422d enters the first sliding groove 1424k from the first inlet end 1425a and slides to the first closed end 1425b in a sliding direction D1 (indicated by an arrow in the figure). The connection between the first sliding hook 1422d and the first sliding groove 1424k is shown in Figure 9. Furthermore, the connection between the second sliding hook 1422e and the second sliding groove 1424m is shown in Figure 10 (which is another side view of the liquid cooling component 1424, where the outline of the second sliding hook 1422e is drawn with dashed lines, and the insertion port 1422c is located on the right side). The second sliding groove 1424m is a T-shaped groove, which has a second inlet end 1425d, a third closed end 1425e, and a fourth closed end 1425f. During the assembly of the liquid cooling component 1424 and the housing body 1422, the liquid cooling component 1424 is moved so that the second sliding hook 1422e enters the second sliding groove 1424m from the second inlet end 1425d and slides to the third closed end 1425e in the sliding direction D1. The connection between the second sliding hook 1422e and the second sliding groove 1424m is shown in Figure 11. At this time, the liquid cooling component 1424 reaches the installation position (relative to the housing body 1422).

[0017] Furthermore, in the first embodiment, as shown in FIG6, the shell body 1422 also includes a stop spring 1422f (e.g., but not limited to, implemented with an elastic cantilever structure) within the module slot 1422a; as shown in FIG4, the liquid cooling component 1424 (the base 1424a) also forms a slot 1424n. As shown in FIG9, after the liquid cooling component 1424 reaches the installation position, the stop spring 1422f is engaged in the slot 1424n to prevent the liquid cooling component 1424 from sliding relative to the shell body 1422 in a direction opposite to the sliding direction D1 (through the free end of the stop spring 1422f abutting against the side wall of the slot 1424n). At this time, the liquid cooling component 1424 remains fixed on the shell body 1422.

[0018] As shown in Figures 1 and 3, the liquid cooling component 1424 has a first flat thermally conductive surface 1424p (implemented as the bottom surface of the base 1424a), which protrudes into the module slot 1422a. The optical transceiver module 12 includes a module housing 122 and a board edge connector 124. The module housing 122 includes a main housing 1222 and two vertical plates 1224. The main housing 1222 has a third flat thermally conductive surface 1222a, from which the two vertical plates 1224 protrude. The two vertical plates 1224 extend parallel to the length direction of the module housing 122 (the same as the length direction 1422b) and are located on opposite sides of the main housing 1222. An unstructured space 1226 (represented by a dashed square in Figure 1) is formed between the two vertical plates 1224 and the third flat thermally conductive surface 1222a. The edge connector 124 protrudes from one side of the module housing 122 along its length. The optical transceiver module 12 is inserted into the module slot 1422a, allowing the liquid cooler 1424 to enter the unstructured space 1226 between the two vertical plates 1224. The edge connector 124 is inserted into the connector socket 144 of the optical transceiver module socket 14, and the third flat thermally conductive surface 1222a contacts the first flat thermally conductive surface 1424p of the liquid cooler 1424 within the module slot 1422a. This large-area surface contact improves the efficiency of heat absorption by the liquid cooler 1424 from the optical transceiver module 12. Alternatively, in practice, the module housing 122 may not have the vertical plates 1224.

[0019] Furthermore, as shown in Figures 1 and 4, the inlet 1424d and outlet 1424e of the flow channel structure 1424c of the liquid cooler 1424 are both located on one side of the liquid cooler 1424 along the length direction 1422b, near the insertion port 1422c; in other words, the inlet 1424d and outlet 1424e are located on the front side of the optical transceiver module socket 14 (defined as the side near the insertion port 1422c). In the first embodiment, the housing body 1422 has an opening 1422g on the other side opposite to the insertion port 1422c. The liquid cooler 1424 can be rotated 180 degrees as needed and installed into the housing body 1422, as shown in Figure 12 (wherein, the transmission pipes 1426a' and 1426b' in the figure are lengthened (relative to the transmission pipes 1426a and 1426b) to accommodate this configuration, that is, lengthened to be able to protrude from the housing body 1422 through the opening 1422g, so as to facilitate connection with the manifold of the external cooling system). The installation method is explained below.

[0020] Please refer to Figures 3 and 4. The liquid cooling component 1424 (base 1424a) also forms a slot 1424q. As shown in Figure 13 (which is a side view of the liquid cooling component 1424, in which the outline of the first sliding hook 1422d is drawn with dashed lines; the insertion port 1422c is located on the left side but is not shown), during the assembly of the liquid cooling component 1424 and the housing body 1422, the liquid cooling component 1424 is moved so that the first sliding hook 1422d enters the second sliding groove 1424m from the second inlet end 1425d, and slides in the sliding direction D1 to the fourth closed end 1425f, and the stop spring 1422f is engaged in the slot 1424q. The first sliding hook 1422d and the second sliding groove 1424m are connected as shown in Figure 14. Furthermore, as shown in Figure 15 (which is another side view of the liquid cooling component 1424, where the outline of the second sliding hook 1422e is drawn with dashed lines; the insertion port 1422c is located on the right side but is not shown), during the assembly of the liquid cooling component 1424 and the shell body 1422, the liquid cooling component 1424 is moved so that the second sliding hook 1422e enters the first sliding groove 1424k from the first inlet end 1425a and slides to the second closed end 1425c in the sliding direction D1. The connection between the second sliding hook 1422e and the first sliding groove 1424k is shown in Figure 16. At this point, the liquid cooling component 1424 reaches its installation position (relative to the housing body 1422). The inlet 1424d and outlet 1424e of the flow channel structure 1424c of the liquid cooling component 1424 are both located on the side of the liquid cooling component 1424 away from the insertion port 1422c in the length direction 1422b; in other words, the inlet 1424d and outlet 1424e are located on the rear side of the optical transceiver module socket 14 (defined as the side away from the insertion port 1422c). Therefore, at least the liquid cooling component 1424 itself can be used for installation in different directions (to the housing body 1422), increasing the versatility of the liquid cooling component 1424 and reducing manufacturing costs.

[0021] In addition, in the first embodiment, the first sliding hook 1422d and the second sliding hook 1422e are disposed on the shell body 1422, while the first sliding groove 1424k and the second sliding groove 1424m are disposed on the liquid cooling component 1424; however, this is not a limitation in practice. For example, the aforementioned structural arrangements can be interchanged to achieve the same effect, which will not be elaborated further. Similarly, the structures of the stop spring 1422f and the slots 1424n and 1424q in the first embodiment can also be interchanged to achieve the same effect, which will not be elaborated further.

[0022] In addition, in the first embodiment, the optical transceiver module socket 14 is described as providing a single slot (i.e., module slot 1422a); however, it is not limited to this in practice. For example, please refer to FIG17. According to a second embodiment, the optical transceiver module socket 24 is a 2×4 socket, providing a total of 8 module slots 2422a (one of which is indicated in the figure). Structurally, the optical transceiver module socket 24 is equivalent to a combination of 8 optical transceiver module sockets 14 (arranged in two rows, upper and lower). Therefore, for other descriptions of the optical transceiver module socket 24, please refer directly to the relevant descriptions of the optical transceiver module socket 14 and its variations above. In short, the optical transceiver module socket 24 includes an optical transceiver module socket housing 242, 8 connector sockets 244, and a circuit board 246. The eight connector sockets 244 are electrically fixed to the circuit board 246; each pair of connector sockets 244 (arranged vertically adjacent) are structurally integrated into a single connector housing, for example, the outline of one connector housing is shown in the figure (drawn in dashed lines). The optical transceiver module socket housing 242 includes a housing body 2422 and eight liquid cooling components 2424 (selectively labeled in the figure). The housing body 2422 forms the eight module slots 2422a and is fixed to the circuit board 246, such that the eight connector sockets 244 are located inside the optical transceiver module socket housing 242 and are exposed within the eight module slots 2422a respectively. The eight liquid cooling components 2424 are fixedly disposed within the housing body 2422 and are exposed within the eight module slots 2422a respectively. In practical applications, each of the eight module slots 2422a can accommodate an optical transceiver module (e.g., the optical transceiver module 12 mentioned above), which will not be described further.

[0023] Furthermore, in the optical transceiver module socket 24 (from the perspective of Figure 17), since the circuit board 246 is located on the lower side of the housing body 2422, the upper row of connector sockets 244 structurally passes through the lower row of module slots 2422a, making it generally difficult for the inlet and outlet of the flow channel structure of the lower row of liquid cooling components 2424 to be set rearward. In the second embodiment, the inlet and outlet of the flow channel structure of both the upper and lower rows of liquid cooling components 2424 are set forward, but this is not a limitation in practice. For example, the inlet and outlet of the flow channel structure of the upper row of liquid cooling components 2424 can be set rearward; in this case, an opening structure needs to be formed at the corresponding rear side of the housing body 2422 to allow it to pass through. In addition, in practice, the flow channel structures of adjacent liquid cooling components 2424 in the same row can be designed in series.

[0024] For example, please refer to Figures 18 and 19. According to a third embodiment, the optical transceiver module socket 34 is an 8×2 socket, providing a total of 16 module slots 3422a (selectively labeled in the figures). Structurally, the optical transceiver module socket 24 is equivalent to a combination of 16 optical transceiver module sockets 14 (vertically arranged in four rows, two per row). Therefore, for further descriptions of the optical transceiver module socket 34, please refer directly to the preceding descriptions of the optical transceiver module socket 14 and its variations. In simple terms, the optical transceiver module socket 34 includes an optical transceiver module socket housing 342, 16 connector sockets 344 (selectively shown in dashed lines in the figures), and a circuit board 346. The 16 connector sockets 344 are individually electrically fixed to the circuit board 346. The optical transceiver module socket housing 342 includes a housing body 3422 and 16 liquid cooling components 3424 (selectively labeled in the figures). The housing body 3422 forms the 16 module slots 3422a and is fixed to the circuit board 346, so that the 16 connector sockets 344 are located inside the optical transceiver module socket housing 342 and are exposed in the 16 module slots 3422a respectively. In practical applications, each of the 16 module slots 3422a can be used to insert an optical transceiver module (such as the optical transceiver module 12 mentioned above), which will not be described further.

[0025] Furthermore, in the optical transceiver module socket 34, (from the perspective of Figure 18) the circuit board 346 is located on the rear side of the housing body 3422, so that all 16 module slots 3422a can be directly fixed to the circuit board 346 without passing through other module slots 3422a. Therefore, the inlets and outlets of the flow channel structure of the 16 liquid cooling components 3424 can be changed to face rearward; at this time, an opening structure needs to be formed on the rear side of the housing body 3422 and the corresponding position of the circuit board 346 (as shown in Figure 19) to allow them to pass through. In addition, in practice, the flow channel structure of adjacent liquid cooling components 3424 in the same row can be designed in series. Also, the flow channel structure of adjacent liquid cooling components 3424 vertically can also be designed in series as needed.

[0026] Please refer to Figures 20 to 22. An optical transceiver module assembly 5 according to a fourth embodiment includes an optical transceiver module 52 and an optical transceiver module socket 54. The optical transceiver module socket 54 includes an optical transceiver module socket housing 542, a connector socket 544, and a circuit board 546. The optical transceiver module socket housing 542 includes a housing body 5422 and a liquid cooling component 5424. The housing body 5422 forms a module slot 5422a, which has a length direction 5422b (indicated by a double-headed arrow in the figure) and an insertion opening 5422c in the length direction 5422b. The liquid cooling component 5424 is fixedly disposed within the housing body 5422 and protrudes from the module slot 5422a. The connector socket 544 is electrically fixed to the circuit board 546. The housing body 5422 is fixed to the circuit board 546 such that the connector socket 544 is located in the module slot 5422a. The optical transceiver module 52 can be inserted into the module slot 5422a through the insertion port 5422c parallel to the length direction 5422b, so as to connect with the connector socket 544 and contact the liquid cooling component 5424; thereby, the heat generated by the optical transceiver module 52 during operation can be conducted to the liquid cooling component 5424 (i.e., equivalent to a heat exchanger) to achieve a heat dissipation effect.

[0027] Please refer to Figure 23. The liquid cooler 5424 includes a base 5424a and a top cover 5424b. The base 5424a forms a flow channel structure 5424c and an inlet 5424d and an outlet 5424e communicating with the flow channel structure 5424c. The top cover 5424b is fixed to the base 5424a (by means of, but not limited to, tight fitting and / or soldering) to cover the flow channel structure 5424c. The working fluid (not shown in the figure) flows through the flow channel structure 5424c via the inlet 5424d and the outlet 5424e to remove the heat absorbed by the base 5424a. Compared with the liquid cooler 1424 in the first embodiment, the liquid cooler 5424 in this embodiment is structurally basically the same as the liquid cooler 1424 in the first embodiment, except for the different positions of the inlet 5424d and the outlet 5424e. Therefore, for other descriptions of the liquid cooling component 5424 itself, please refer directly to the relevant descriptions of the liquid cooling component 1424 above, and they will not be repeated here. In this embodiment, the inlet 5424d and the outlet 5424e are located on opposite sides of the liquid cooling component 5424 perpendicular to the length direction 5422b; the shell body 5422 forms openings in the sidewalls corresponding to the inlet 5424d and the outlet 5424e to allow them to pass through.

[0028] In addition, in this embodiment, the combination of liquid cooling component 5424 and shell body 5422 is in principle the same as the combination of liquid cooling component 1424 and shell body 1422 in the previous embodiment (the first embodiment), so it will not be described again.

[0029] Furthermore, in this embodiment, as shown in Figures 20 to 22, the liquid cooling component 5424 has a first flat thermally conductive surface 5424f (implemented as the bottom surface of the base 5424a), which protrudes into the module slot 5422a. The optical transceiver module 52 includes a module housing 522 and a board edge connector 524. The module housing 522 has a third flat thermally conductive surface 522a, above which there are no other structures, forming a structureless space 522b (shown as a dashed square in Figure 20). The board edge connector 524 protrudes from one side of the module housing 522 along its length direction (parallel to the length direction 5422b of the module slot 5422a). The optical transceiver module 52 is inserted into the module slot 5422a, allowing the liquid cooler 5424 to enter the unstructured space 522b above the third flat thermally conductive surface 522a. The edge connector 524 is inserted into the connector socket 544 of the optical transceiver module socket 54, and the third flat thermally conductive surface 522a contacts the first flat thermally conductive surface 5424f of the liquid cooler 5424 within the module slot 5422a. This large-area surface contact improves the efficiency of the liquid cooler 5424 in absorbing heat from the optical transceiver module 52. Alternatively, in practice, if structural conditions permit (e.g., sufficient space exists between the liquid cooler 5424 and the housing body 5422), the module housing 522 may also have a vertical plate, making the overall appearance similar to the module housing 122 (in the first embodiment).

[0030] Please refer to Figures 24 to 26. According to a fifth embodiment, the optical transceiver module socket 64 is an 8×2 socket, providing a total of 16 module slots 6422a (selectively labeled in the figures). The optical transceiver module socket 64 includes an optical transceiver module socket housing 642, 16 connector sockets 644 (selectively labeled in the figures), and a circuit board 646. The optical transceiver module socket housing 642 includes a housing body 6422 and eight liquid cooling components 6424. The housing body 6422 forms the aforementioned 16 module slots 6422a. Module slots 6422a have a length direction 6422b (indicated by a double-headed arrow in the figures) and an insertion port 6422c in the length direction 6422b. Each liquid cooling component 6424 corresponds to two module slots 6422a (e.g., a first module slot 6423a and a second module slot 6423b arranged parallel and adjacent to each other). The liquid cooling component 6424 is fixedly disposed within the housing body 6422 and exposed within the corresponding module slot 6422a. The connector socket 644 is electrically fixed to the circuit board 646. The housing body 6422 is fixed to the circuit board 646 such that the connector socket 644 is located in the module slot 6422a. An optical transceiver module (e.g., the optical transceiver module 52 in the fourth embodiment) can be inserted into the module slot 6422a from the insertion port 6422c parallel to the length direction 6422b, so as to connect with the corresponding connector socket 644 and contact the corresponding liquid cooling component 6424; thereby, the heat generated by the optical transceiver module during operation can be conducted to the corresponding liquid cooling component 6424 (i.e., equivalent to a heat exchanger), achieving a heat dissipation effect.

[0031] Please refer to Figures 25 to 28. Further, the liquid cooler 6424 includes a base 6424a and a top cover 6424b. The base 6424a forms a flow channel structure 6424c and an inlet 6424d and an outlet 6424e communicating with the flow channel structure 6424c. The top cover 6424b is fixed to the base 6424a (by means of, but not limited to, tight fitting and / or soldering) to cover the flow channel structure 6424c. Working fluid (not shown in the figures) flows through the flow channel structure 6424c via the inlet 6424d and the outlet 6424e to remove heat absorbed by the base 6424a. The liquid cooler 6424 as a whole includes a first structural portion 6425a, a second structural portion 6425b, and a structural connection portion 6425c (the approximate extent of which is indicated by dashed squares in Figures 25 and 26). The first structural portion 6425a and the second structural portion 6425b are separate and connected via a structural connection portion 6425c. The first structural portion 6425a, the second structural portion 6425b, and the structural connection portion 6425c together form a flow channel structure 6424c. The first flat thermally conductive surface 6425d of the first structural portion 6425a is exposed in the first module slot 6423a, and the second flat thermally conductive surface 6425e of the second structural portion 6425b is exposed in the second module slot 6423b (see FIG. 24), so that the third flat thermally conductive surface 522a (see FIG. 20) of the optical transceiver module 52 inserted into the first module slot 6423a or the second module slot 6423b can correspondingly contact the first flat thermally conductive surface 6425d or the second flat thermally conductive surface 6425e.

[0032] Furthermore, the flow channel structure 6424c includes a first flow channel portion 6424f, a second flow channel portion 6424g, a third flow channel portion 6424h, and a fourth flow channel portion 6424i (all indicated by dashed boxes in Figure 28), all extending parallel to the length direction 6422b. Specifically, the first structural portion 6425a forms the first flow channel portion 6424f and the second flow channel portion 6424g, corresponding to the first module slot 6423a; the second structural portion 6425b forms the third flow channel portion 6424h and the fourth flow channel portion 6424i, corresponding to the second module slot 6423b. The second flow channel portion 6424g and the third flow channel portion 6424h are connected via the structural connection portion 6425c. The inlet 6424d, the first flow channel section 6424f, the second flow channel section 6424g, the third flow channel section 6424h, the fourth flow channel section 6424i, and the outlet 6424e are connected sequentially. (Similar to the flow channel structure 1424c in the first embodiment above.) The first flow channel section 6424f, the second flow channel section 6424g, the third flow channel section 6424h, and the fourth flow channel section 6424i each include two sub-flow channels (not shown). For related descriptions, please refer directly to the previous description of the sub-flow channel 1424h of the flow channel structure 1424c; further details will not be repeated here. Additionally, the flow channel structures of adjacent liquid cooling components 6424 can also be designed in series as required.

[0033] Furthermore, the liquid cooling component 6424 is logically equivalent to the structural integration of two liquid cooling components 5424 (in the fourth embodiment) (refer to Figures 21 and 23). For further explanation of the liquid cooling component 6424 itself, please refer directly to the relevant explanation of the liquid cooling component 5424 above; it will not be repeated here. Additionally, the combination of the liquid cooling component 6424 and the shell body 6422 is in principle roughly the same as the combination of the liquid cooling component 5424 and the shell body 5422 above. Therefore, for further explanation of the combination of the liquid cooling component 6424 and the shell body 6422, please refer directly to the relevant explanation of the combination of the liquid cooling component 5424 and the shell body 5422 above; it will not be repeated here. In this embodiment, as shown in Figure 25, the shell body 6422 has a partition wall 6422d (implemented in this embodiment as two parallel plates), which is located between the first module slot 6423a and the second module slot 6423b and has a notch 6422e. The structural connection part 6425c is inserted into this notch 6422e. In practice, the partition wall 6422d can provide a certain degree of (vertical) support for the liquid cooling component 6424 through the notch 6422e.

[0034] Please refer to Figures 29 and 30. The optical transceiver module socket 74 according to the sixth embodiment is structurally similar to the optical transceiver module socket 64 of the fifth embodiment; therefore, the optical transceiver module socket 74 generally uses the same component symbols as the optical transceiver module socket 64. For further descriptions of the optical transceiver module socket 74, please refer directly to the preceding descriptions of the optical transceiver module socket 64; further details will not be repeated here. The main difference is that in the optical transceiver module socket housing 742 of the optical transceiver module socket 74, the combination of the liquid cooling component 7424 and the housing body 7422 does not use structures such as hooks or grooves (e.g., the first hook 1422d and the first groove 1424k in the first embodiment). Compared to the liquid cooling component 6424 of the fifth embodiment, the liquid cooling component 7424 also includes an intermediate connecting portion 6425f. The first structural portion 6425a is separate from the second structural portion 6425b and connected via a structural connecting portion 6425c and an intermediate connecting portion 6425f, with the structural connecting portion 6425c and the intermediate connecting portion 6425f being separate. The partition wall 6422d' of the shell body 7422 also includes another notch 6422f, into which the intermediate connecting portion 6425f is inserted. In this embodiment, the notches 6422e and 6422f and the opening 6422g on the side wall (for the inlet 6424d and outlet 6424e of the liquid cooling component 7424 to pass) are not collinearly arranged, thus providing effective (vertical) support for the liquid cooling component 7424; furthermore, the notches 6422e and 6422f also limit the liquid cooling component 7424 to an upper limit (i.e., horizontal limit) parallel to the length direction 6422b. In this way, the liquid cooling component 7424 can be securely fixed inside the housing body 7422.

[0035] Please refer to Figure 31. According to a seventh embodiment, the optical transceiver module socket 84 is an 8×4 socket. The housing body 8422 of the optical transceiver module socket 84 forms 32 module slots 8422a (selectively labeled in the figure) and is fixed to the circuit board 846. Each module slot 8422a corresponds to a connector socket (electrically fixed to the circuit board 846; not shown in the figure). The optical transceiver module socket 84 is structurally and logically similar to the optical transceiver module socket 74 (of the sixth embodiment). Therefore, for other descriptions of the optical transceiver module socket 84, please refer directly to the relevant descriptions of the optical transceiver module socket 74 above, and will not be repeated here. The main difference is that each liquid cooling component 8424 of the optical transceiver module socket housing 842 provides heat exchange function for the four module slots 8422a simultaneously (wherein, the original setting position of the liquid cooling component 8424 exploded in the figure is indicated by a dashed line), and the liquid cooling component 8424 still provides the internal flow channel structure for the working fluid to flow through a single inlet 8424a and a single outlet 8424b. Furthermore, within the module slot 8422a, the housing body 8422 also includes a plurality of spring tabs 8422b (disposed on the lower sidewall of the module slot 8422a relative to the liquid cooling component 8424), such that the optical transceiver module (e.g., the optical transceiver module 52 in FIG. 20) inserted into the module slot 8422a is pushed toward the liquid cooling component 8424 by the plurality of spring tabs 8422b, so that the flat thermally conductive surface of the optical transceiver module (e.g., the third flat thermally conductive surface 522a of the optical transceiver module 52) remains tightly against the flat thermally conductive surface 8424c of the liquid cooling component 8424 (bottom), ensuring heat exchange between the optical transceiver module and the liquid cooling component 8424.

[0036] In addition, in the foregoing embodiments, the structural designs of the optical transceiver modules 12 and 52 and the optical transceiver module sockets 14, 24, 34, 54, 64, 74, and 84 can be referenced from each other in practice and are also applicable, without further details. The above description is only a preferred embodiment of the present invention. All equivalent changes and modifications made in accordance with the scope of the claims of the present invention shall be covered by the present invention.

[0037] 1,5: Optical transceiver module combination 12,52: Optical transceiver module 122,522: Module housing 1222: Main shell 1222a, 522a: Third flat thermally conductive surface 1224: Vertical Board 1226,522b: Unstructured space 124,524: Board Edge Connector 14,24,34,54,64,74,84: Optical transceiver module socket 142,242,342,542,642,742,842: Optical transceiver module socket housing 1422,2422,3422,5422,6422,7422,8422: Shell body 1422a, 2422a, 3422a, 5422a, 6422a, 8422a: Module slots 1422b, 5422b, 6422b: Length direction 1422c, 5422c, 6422c: Insertion port 1422d: First slide hook 1422e: Second slide hook 1422f: Stopping shrapnel 1422g, 6422g: Open 1424, 2424, 3424, 5424, 6424, 7424, 8424: Liquid cooling components 1424a, 5424a, 6424a: Base 1424b, 5424b, 6424b: Top cover 1424c, 5424c, 6424c: Flow channel structure 1424d, 5424d, 6424d, 8424a: Entry Point 1424e, 5424e, 6424e, 8424b: Exports 1424f, 6424f: First flow channel section 1424g, 6424g: Second flow channel section 1424h: Sub-channel 1424i, 1424j: Groove 1424k: First Slide 1424m: Second chute 1424n, 1424q: Card slot 1424p, 5424f, 6425d: First flat thermally conductive surface 1425a: First entry point 1425b: First closed end 1425c: Second closed end 1425d: Second entry point 1425e: Third closed end 1425f: Fourth closed end 1426a, 1426b, 1426a', 1426b': Transmission tubes 144, 244, 344, 544, 644: Connector socket 146, 246, 346, 546, 646, 846: Circuit Board 6422d,6422d': Spacer 6422e, 6422f: Notch 6423a: First module slot 6423b: Second module slot 6424h: Third flow channel section 6424i: Fourth flow channel section 6425a: First structural part 6425b: Second structural part 6425c: Structural connection part 6425e: Second flat thermally conductive surface 6425f: Intermediate connecting part 8422b: Shrapnel 8424c: Flat thermally conductive surface D1: Sliding direction

Claims

1. A housing for an optical transceiver module socket, comprising: a housing body forming a first module slot, the housing body including a plurality of spring contacts; and a liquid cooling component having a flow channel structure and an inlet and an outlet communicating with the flow channel structure, the liquid cooling component being fixedly disposed within the housing body and exposed within the first module slot, the plurality of spring contacts being disposed within the first module slot relative to the liquid cooling component.

2. The optical transceiver module socket housing as claimed in claim 1, wherein the liquid cooler has a first flat thermally conductive surface exposed within the first module slot.

3. The optical transceiver module socket housing as described in claim 1, wherein one of the liquid cooling component and the housing body includes a sliding hook, and the other of the liquid cooling component and the housing body includes a sliding groove, wherein the liquid cooling component slides into the sliding hook and hooks the sliding groove to be fixed to the housing body.

4. The optical transceiver module socket housing as described in claim 3, wherein the sliding hook slides into the sliding groove in a sliding direction, one of the liquid cooling component and the housing body includes a stop spring, and the other of the liquid cooling component and the housing body includes a slot, wherein the stop spring is engaged in the slot to prevent the liquid cooling component from sliding relative to the housing body in a direction opposite to the sliding direction.

5. The optical transceiver module socket housing as described in claim 1, wherein the first module slot has a length direction, the flow channel structure includes a first flow channel portion and a second flow channel portion, the first flow channel portion and the second flow channel portion extending parallel to the length direction, and the inlet, the first flow channel portion, the second flow channel portion and the outlet are connected in sequence.

6. The optical transceiver module socket housing as claimed in claim 5, wherein the first flow channel portion or the second flow channel portion includes two sub-flow channels that extend parallel to the length direction and are connected in parallel.

7. The optical transceiver module socket housing as described in claim 5, wherein the housing body forms a second module slot, the first module slot and the second module slot are arranged parallel to each other, the liquid cooling component is also exposed in the second module slot, the flow channel structure includes a third flow channel portion and a fourth flow channel portion, the first flow channel portion and the second flow channel portion correspond to the first module slot, the third flow channel portion and the fourth flow channel portion extend parallel to the length direction and correspond to the second module slot, and the inlet, the first flow channel portion, the second flow channel portion, the third flow channel portion, the fourth flow channel portion and the outlet are connected in sequence.

8. The optical transceiver module socket housing as claimed in claim 1, wherein the first module slot has a length direction and an insertion port in the length direction, the inlet and the outlet being located on one side of the liquid cooler in the length direction near or away from the insertion port.

9. The optical transceiver module socket housing as described in claim 8, wherein the housing body includes a sliding hook, and the liquid cooling component includes a first sliding groove and a second sliding groove, wherein when the liquid cooling component slides in through the sliding hook and hooks the first sliding groove to be fixed to the housing body, the inlet and the outlet are relatively close to the insertion port, and when the liquid cooling component slides in through the sliding hook and hooks the second sliding groove to be fixed to the housing body, the inlet and the outlet are relatively far away from the insertion port.

10. The optical transceiver module socket housing as claimed in claim 1, wherein the first module slot has a length direction, and the inlet and the outlet are located on opposite sides of the liquid cooler perpendicular to the length direction.

11. The optical transceiver module socket housing as described in claim 10, wherein the housing body forms a second module slot, the first module slot and the second module slot are arranged parallel to each other, the housing body has a partition wall located between the first module slot and the second module slot and has a notch, the liquid cooling component includes a first structural portion, a second structural portion, a structural connecting portion and an intermediate connecting portion, the first structural portion and the second structural portion are separate and connected via the structural connecting portion and the intermediate connecting portion, the structural connecting portion and the intermediate connecting portion are separate, the first structural portion, the second structural portion and the structural connecting portion together form the flow channel structure, the first structural portion is exposed in the first module slot, the second structural portion is exposed in the second module slot, and the intermediate connecting portion is engaged in the notch.

12. The optical transceiver module socket housing as claimed in claim 1, wherein the liquid cooling component includes a base and a top cover, the base forming the flow channel structure, and the top cover being fixed to the base to cover the flow channel structure.

13. The optical transceiver module socket housing as described in claim 1 further includes two transmission tubes, which are fixedly connected to the inlet and the outlet, respectively.

14. The optical transceiver module socket housing as described in claim 13, wherein there are two grooves on the inner sidewall of the outlet or the inlet, the two grooves being arranged opposite each other and extending parallel to each other, and the corresponding transmission tube being tightly fitted into the two grooves.

15. An optical transceiver module, comprising: a module housing having a length direction, the module housing including a main housing and two vertical plates, the main housing having a third flat thermally conductive surface, the two vertical plates protruding from the third flat thermally conductive surface, the two vertical plates extending parallel to the length direction and located on opposite sides of the main housing, a structureless space forming between the two vertical plates and the third flat thermally conductive surface; and a plate edge connector exposed on one side of the module housing in the length direction.

16. An optical transceiver module assembly, comprising: an optical transceiver module socket, the optical transceiver module socket including a connector socket and an optical transceiver module socket housing, the optical transceiver module socket housing including a housing body and a liquid cooling component, the housing body forming a first module slot, the liquid cooling component having a flow channel structure and an inlet and an outlet communicating with the flow channel structure, the liquid cooling component being fixedly disposed within the housing body and exposed within the first module slot, the connector socket being disposed within the first module slot; and an optical transceiver module, the optical transceiver module including a module housing and a board edge connector, the module housing including a main housing, the main housing having a third flat thermally conductive surface; wherein... The optical transceiver module is inserted into the first module slot, such that the board edge connector is inserted into the connector socket, and the third flat thermally conductive surface contacts the liquid cooler within the first module slot.

17. The optical transceiver module assembly as claimed in claim 16, wherein the module housing has two vertical plates protruding from the third flat thermally conductive surface, the module housing has a length direction, the two vertical plates extend parallel to the length direction of the module housing and are located on opposite sides of the main housing, and an unstructured space is formed between the two vertical plates and the third flat thermally conductive surface, wherein... The optical transceiver module is inserted into the first module slot, allowing the liquid-cooled component to enter the unstructured space between the two vertical plates.

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