Manufacturing method of component array, component removal method, component array repair method, component removal device, and component array repair device.

Abstract

The object of the present invention is to provide a method for manufacturing a component array with excellent durability, a method for removing components for this manufacturing method, a method for repairing the component array, a component removal apparatus, and a component array repair apparatus. The solution is a method for manufacturing a component array, comprising the following steps: irradiating a specific component 37a to be removed with a first energy line according to a first condition; and irradiating the area where the specific component has been removed with a second energy line according to a second condition. The first condition is that the specific component 37a is removed from the surface of a substrate 34, leaving an insulating member 39 in contact with a substrate terminal 38a. The second condition differs from the first condition and is that the insulating member 39 is removed.

Description

[Technical Field]

[0001] This disclosure relates to a method for manufacturing an array of components, a method for removing components, a method for repairing an array of components, an apparatus for removing components, and an apparatus for repairing an array of components. [Previous Technology]

[0002] In recent years, the development of displays using micro-LEDs with chip sizes of less than 100μm has become popular. For example, Patent Document 1 shown below discloses a micro-LED mounting technology using a laser-decomposing adhesive. Displays using micro-LEDs assemble a large number of micro-LED elements, and therefore, sometimes poor light emission occurs due to defects in the micro-LED elements themselves in the display substrate, or defects during assembly.

[0003] On the other hand, in surface mount technology, a technique has been developed to remove components such as micro LEDs from a substrate using a laser (for example, Patent Document 2), and a method is considered to remove components such as micro LEDs assembled on a display substrate and reassemble new components on the removed component mounting area.

[0004] When mounting components onto a substrate, sometimes insulating components such as flux are placed around the terminals on the substrate side to connect the terminals on the component side to the terminals on the substrate side. In this case, if a specific component to be removed is irradiated with a laser, and the laser output power is high, the component and the insulating component can be removed simultaneously, but there is a risk of damaging the substrate itself or the components of the substrate.

[0005] Furthermore, when the laser output power is low, it may remain as part of the component, making it difficult to refit new components. Also, even if only specific components are removed, the insulating parts such as flux used when assembling the components may deteriorate due to the heat during laser irradiation, and the deteriorated insulating parts may sometimes remain on or near the terminals of the substrate.

[0006] If deteriorated insulating components are allowed to remain on or near the terminals of the substrate, a good connection may not be achieved when new components are added. Furthermore, even without adding new components, allowing deteriorated insulating components to remain on or near the terminals of the substrate may reduce the durability of the component array (e.g., a display). [Prior Art Documents] [Patent Documents]

[0007] [Patent Document 1] WO2019 / 207920 Publication No. [Patent Document 2] Japanese Patent Application Publication No. 2017-17230 [Summary of the Invention]

[0008] [Problem to be solved by the invention] In view of the present facts, the object of this disclosure is to provide a method for manufacturing an array of components with excellent durability, a method for removing components for this manufacturing method, a method for repairing the array of components, a device for removing components, and a device for repairing the array of components.

[0009] [Means for solving the problem] In order to achieve the above-mentioned objective, this disclosure discloses a method for manufacturing a component array related to the viewpoint. The method comprises a component array having a plurality of components electrically connected to substrate terminals provided on a substrate via component terminals, and includes the following steps: irradiating a specific component to be removed with a first energy line according to a first condition; and irradiating a second energy line with a second condition on the area where the specific component has been removed; wherein the first condition is a condition in which the specific component is removed from the surface of the substrate and an insulating component is left in contact with the substrate terminals; and the second condition is different from the first condition, and is a condition in which the insulating component is removed.

[0010] In this method of manufacturing the element array, a first energy line is first applied to a specific element to be removed under a first condition, thereby removing the specific element from the surface of the substrate. The first condition is an energy irradiation condition that removes only the specific element. At least a portion of the insulating component that has been disconnected from the element terminal of the substrate can remain along with the substrate terminal. Therefore, the possibility of damage to the substrate itself or the constituent components of the substrate by the first energy line is low.

[0011] Alternatively, as a method for removing a specific component, it is sufficient to sublimate the specific component by irradiating it with a first energy line, thereby removing it from a predetermined position on the substrate. Or, it is sufficient to irradiate the specific component with a first energy line, disconnect the component terminal from the substrate terminal, and bounce the component away from the predetermined position on the substrate.

[0012] Furthermore, under a second condition different from the first condition, the second energy line is irradiated onto an insulating component on the surface of a substrate at a predetermined location where the specific element has been removed, thereby removing the insulating component at that specific location. Therefore, the insulating component that has been degraded by heat during the irradiation of the first energy line can be removed by irradiation with the second energy line.

[0013] If degraded insulating components are left to remain on or near the terminals of the substrate, there is a risk that a good connection between the component terminals of the new component and the substrate terminals may not be achieved when a new component is installed. However, by removing the degraded insulating components, new insulating components can be formed at the removed location. Therefore, even without installing new components, the durability of the component array (e.g., a display) can still be improved. Furthermore, by installing new insulating components, the connection between the component terminals of the new component and the substrate terminals of the substrate is maintained in a good manner, which also improves the durability of the component array (e.g., a display).

[0014] Preferably, the output power of the first energy line is higher than the output power of the second energy line. For example, the output power of the first energy line may be more than 2 times, more than 5 times, or more than 10 times the output power of the second energy line.

[0015] Preferably, the second energy line is irradiated more times than the first energy line. Although dependent on the output power of the first energy line, the fewer the number of times the first energy line is irradiated, the better, such as less than 3 times, less than 2 times, or 1 time. It is preferable to remove only specific components with fewer irradiations.

[0016] Furthermore, the number of times the second energy line is irradiated is preferably, for example, 2 or more times, 3 or more times, or 4 or more times, and preferably the number of times that the insulating components around the substrate terminals on the surface corresponding to the position where the aforementioned specific element has been removed are sufficiently removed.

[0017] Preferably, the aforementioned first energy line irradiates the aforementioned specific element within a first irradiation range smaller than the planar area of ​​the aforementioned specific element. Under such irradiation range, the first energy line is less likely to cause deterioration of the substrate and its associated components (e.g., cavity frames) located around the specific element.

[0018] The aforementioned second energy line is a second irradiation range around the aforementioned insulating member that can be removed from the surface of the aforementioned substrate corresponding to the location where the aforementioned specific element has been removed. It can irradiate the aforementioned specific element, and the irradiation range is particularly limited. However, when the specific element and the insulating member are disposed in the cavity of the mold frame, it is preferable that the second irradiation range is a range that will not irradiate the mold frame. This is because it will not cause the mold frame to deteriorate.

[0019] The connection method between the aforementioned substrate terminal and the aforementioned element terminal is particularly limited, but the aforementioned method is particularly effective when the substrate terminal and the element terminal are metal-bonded.

[0020] The aforementioned components can also be disposed separately in each cavity of the cavity frame provided on the surface of the aforementioned substrate. It is preferable that the aforementioned insulating member is placed around the aforementioned component terminals and the aforementioned substrate terminals within the aforementioned cavity. With this configuration, it is easy to arrange regular components, and it is also easy to remove specific components. In addition, as a method of providing the cavity frame on the surface of the substrate, the cavity frame can be prepared separately from the substrate and the cavity frame can be mounted on the substrate, or the cavity frame can be integrally formed on the surface of the substrate itself.

[0021] The manufacturing method of the above-mentioned element array may further include the following steps: supplying a new insulating component to the surface portion of the aforementioned substrate after the aforementioned insulating component has been removed; and connecting the element terminals of the new element to the aforementioned substrate terminals located on the surface portion of the aforementioned substrate after the aforementioned new insulating component has been supplied.

[0022] The present disclosure discloses a method for removing an element related to a viewpoint, comprising the following steps: irradiating a specific element to be removed with a first energy line according to a first condition; and irradiating a second energy line with a second condition for the area where the specific element has been removed; wherein the first condition is a condition in which the specific element is removed from the surface of the substrate and an insulating component is left in contact with the terminal of the substrate; and the second condition is different from the first condition and is a condition in which the insulating component is removed.

[0023] The above-described method for manufacturing the element array can be easily realized by using this element removal method.

[0024] The present disclosure discloses a method for repairing an array of components, comprising the following steps: after removing the aforementioned specific component and the aforementioned insulating component by the component removal method described above, supplying a new insulating component to the surface portion of the aforementioned substrate after the aforementioned insulating component has been removed; transporting a new component to the surface portion of the aforementioned substrate after the aforementioned new insulating component has been supplied; and connecting the component terminals of the new component to the aforementioned substrate terminals located on the surface portion of the aforementioned substrate after the aforementioned new insulating component has been supplied.

[0025] The above-mentioned manufacturing method of the component array can be easily realized by using the repair method of this component array.

[0026] This disclosure discloses a component removal apparatus related to a viewpoint, comprising: a substrate support portion for holding a substrate; an energy irradiation device for irradiating energy lines; a first control portion for controlling the energy irradiation device to irradiate a specific component, which is the target of removal, among a plurality of components having component terminals, with the energy lines irradiating the specific component under a first condition, wherein the component terminals are connected to substrate terminals provided on the surface of the substrate; and a second control portion for controlling the energy lines irradiated from the energy irradiation device under a second condition for insulating members present on the surface of the substrate after the specific component has been removed; wherein the first condition is a condition for removing the specific component from the surface of the substrate and leaving an insulating member in contact with the substrate terminals; and the second condition is different from the first condition, being a condition for removing the insulating member.

[0027] The above-mentioned method for manufacturing the element array can be carried out efficiently using the removal device that uses this element.

[0028] The present disclosure discloses a component array repair apparatus, comprising: a component removal device as described above; an insulating component supply device for supplying new insulating components to the surface portion of the aforementioned substrate after the aforementioned insulating components have been removed; a transport device for transporting new components to the surface portion of the aforementioned substrate after the aforementioned new insulating components have been supplied; and a component connection device for connecting the component terminals of the new components to the aforementioned substrate terminals located on the surface portion of the aforementioned substrate after the aforementioned new insulating components have been supplied.

[0029] The above-mentioned manufacturing method of the component array can be carried out efficiently using the repair apparatus that uses this component array.

Implementation Method

[0031] [Forms for implementing the invention] The following describes the forms of implementation.

[0032] First, the element array 33 shown in Figures 1A and 2 will be described. The element array 33 of this embodiment is used, for example, as a display device, with a plurality of elements 37 arranged in rows and columns along the X and Y axes on the surface of the substrate 34. Furthermore, in the figures, the X, Y, and Z axes are perpendicular to each other; in this embodiment, the plane of the substrate 34 is parallel to the X and Y axes.

[0033] As element 37, it is not particularly limited, for example, it can be a display element. In addition, the display element is not limited to the element used to display images, but can also be the element used for illumination, such as light-emitting elements (micro-LEDs), fluorescent elements, etc.

[0034] In this embodiment, element 37 is, for example, a micro light-emitting element (micro LED) with a planar shape having dimensions of, for example, 5μm × 5μm to 200μm × 300μm. Furthermore, the spacing δ between elements 37 (or 37a / hereinafter unless otherwise specified) (refer to Figure 2) is, for example, about 5 to 500μm.

[0035] Each element 37 is housed inside a cavity 36a (refer to Figure 2) of a cavity frame 36 formed in a row on the surface of a substrate 34, and the element terminal 38b of the element 37 is electrically connected to a substrate terminal 38a formed on the surface of the substrate 34.

[0036] The substrate 34 is not particularly limited and may be a wiring substrate with wiring connected to the substrate terminals 38a. It may be transparent or semi-transparent and may also be flexible. The cavity frame 36 is preferably made of plastic, but may also be made of other insulating materials. The size of each cavity 36a formed in the cavity frame 36 is set to a size in which the element 37 can be inserted. The cavity frame 36 having cavities 36a may be formed by photolithography, for example, or may be made of UV resin.

[0037] As a substrate terminal 38a, it is not particularly limited, and the surface in contact with the component terminal 38b may also have a connection layer containing tin or a tin alloy (e.g., an alloy of tin containing silver and / or copper, or a tin-indium alloy). Furthermore, the substrate terminal 38a may also have a base layer made of a different metal (including an alloy) than the connection layer, for example, on the side close to the substrate 34. Examples of base layers include nickel or a nickel alloy layer, but other metals may also be used. Furthermore, the connection layer may also be made of a metal other than tin or a tin alloy.

[0038] As a component terminal 38b, it is not particularly restricted, for example, it is made of gold or a gold alloy.

[0039] Inside each cavity 36a, between the component 37 and the substrate 34, flux 39, serving as an insulating component, is filled. Flux 39 functions to prevent oxidation of the substrate terminals 38a before they come into contact with the component terminals 38b, and also functions to protect the substrate terminals 38a and component terminals 38b after they are connected. Furthermore, in its state before connecting the component terminals 38b to the substrate terminals 38a, flux 39 also functions to temporarily fix the component 37 to the substrate 34 inside the cavity 36a. The flux 39 is not particularly limited; examples include resin-based fluxes with resins such as rosin or modified rosin as the main component, organic fluxes, and inorganic fluxes.

[0040] Next, the repair device 1 for the component array 33 shown in Figure 1A will be described. The repair device 1 of this embodiment includes: a component removal device 2a shown in Figure 1, a control device 2b, a transport device 4 shown in Figure 1B, a flux supply device (e.g., a flux printing device 5 shown in Figure 1C) that serves as an insulating component supply device, and a component connection device (not shown).

[0041] A flux supply device can be used where a flux coating device is already installed on the conveyor head 42 of the conveyor device 4, replacing the stamp tool 44 installed on the conveyor head 42 of the conveyor device 4. It is preferable that the conveyor head 42 equipped with the flux coating device is different from the conveyor head holding the stamp tool 44. There are no particular limitations on the flux coating device; for example, a flux transfer device (pin transfer, etc.) or the flux printing device 5 shown in Figure 1C can also be used.

[0042] As shown in Figure 1C, the flux printing apparatus 5 includes: a metal mask 52 with holes 54 holding a predetermined pattern; a holding tool (not shown) holding the metal mask 52; and a squeegee 56. Holes 54 with predetermined patterns are formed in the metal mask 52. The X-axis and Y-axis positions of the metal mask 52 are controlled so that the holes 54 shown in Figure 1C are aligned with positions corresponding to specific cavities 36a shown in Figure 7. In this state, the squeegee 56 moves parallel to the metal mask 52 from one upper end to the other while abutting against flux 39. As a result, flux 39 is disposed through the holes 54 into specific cavities corresponding to the holes 54.

[0043] As shown in Figure 1A, the component removal device 2 has a substrate support portion 3 for holding the substrate 34. The substrate support portion 3 has a pedestal portion 32. The substrate 34 of the component array 33 is fixed in a freely detachable manner on the surface above the Z-axis of the pedestal portion 32. On the top of the substrate 34 of the component array 33 in this embodiment, a mold cavity frame 36 is provided and fixed (or may be integrally formed with the substrate 34), and components 37 are respectively disposed in the cavities 36a of the mold cavity frame 36. The manufacturing method of the component array 33 will be described later.

[0044] The laser irradiation device 2a, serving as a component removal device 2, is positioned above the Z-axis along the component array 33. The laser irradiation device 2a is configured to move freely relative to the pedestal portion 32 along the X-axis and Y-axis. Alternatively, the laser irradiation device 2a can be configured to move freely relative to the pedestal portion 32 along the Z-axis, as needed. Specifically, the laser irradiation device 2a can be a YAG laser, a carbon dioxide laser, an excimer laser, a UV laser, etc. Considering the laser wavelength and the energy required for removal, a YAG laser is preferred.

[0045] The control device 2b has a first control unit 2b1 and a second control unit 2b2 for controlling the laser output power and number of irradiations from the laser emission section 22 of the laser irradiation device 2a. The control device 2b can also control a movement mechanism that moves the laser irradiation device 2a relative to the platform 32, and can also control a movement mechanism that moves the transport head 42 of the transport device 4 shown in Figure 1B relative to the platform 32. The control device 2b can be located in the laser irradiation device 2a, or in a different position from the laser irradiation device 2a, and can be configured to communicate with the laser irradiation device 2a via wired or wireless means. Furthermore, the laser irradiation device 2a itself can also have the same laser irradiation condition setting function as the control device 2b; in this case, the control device 2b can be omitted.

[0046] A plurality of elements 37 and a specific element 37a each have element terminals 38b respectively connected to a plurality of substrate terminals 38a provided on the surface of the substrate 34 shown in Figure 2. The first control unit 2b1 controls the laser irradiation device 2a to irradiate the specific element 37a, which is the target of removal, with laser light Lt according to a first condition. The laser light Lt emitted from the laser emission unit 22 by the laser irradiation device 2a irradiates only the specific element 37a, as shown in Figure 3.

[0047] Preferably, the laser light Lt is controlled by the first control unit 2b1 and irradiates the specific element 37a within a first irradiation range (including the spot diameter or laser scanning range) covering the entire area of ​​the planar shape smaller than that of the specific element 37a. Under such irradiation range, the first energy line is less likely to degrade the substrate 34 surrounding the specific element 37a or its associated components (e.g., cavity frames 36). Additionally, the laser irradiation device 2a may have an irradiation mask for directly irradiating the surface of the specific element 37a with the laser light Lt within an irradiation range conforming to the planar shape of the specific element 37a.

[0048] Furthermore, the laser irradiation device 2a may also include a photographic device. Similarly, the component removal device 2 may also include a photographic device as another device. The photographic device is capable of photographing the components 37 or specific components 37a of the component array 33. The photographic device can also perform visual inspection of each component 37 and specific component 37a, and can also control the relative movement of the laser irradiation device 2a or the pedestal 32 so that the laser light Lt only irradiates the specific components 37a that are determined to be defective by this visual inspection. In order to miniaturize the device, the photographic device can be installed in the same drive system as the laser irradiation device 2a. In addition to determining component defects, the photographic device can be used to determine the presence or absence of components 37, position determination, etc., including cases where it is used for this purpose. The photographic device may also be supported and driven by a support mechanism, drive mechanism, etc., different from those of the laser irradiation device 2a. The processing of the images photographed by the photographic device can also be performed by the control device 2b shown in Figure 1A or another control device.

[0049] Furthermore, the second control unit 2b2 controls the laser irradiation device 2a to irradiate the flux 39, which is an insulating component existing on the surface of the substrate 34 corresponding to the position where the specific element 37a has been removed, under a second condition different from the first condition, as shown in Figure 4. Here, the control conditions include the output power of the laser light, the irradiation range (including the dot diameter or the laser scanning range), etc.

[0050] The first control unit 2b1 and the second control unit 2b2 shown in Figure 1A can be configured as dedicated circuits in the control device 2b or as programs that can be executed by a computer or the like. The other control units in the control device 2b can also be configured as dedicated circuits or as programs that can be executed by a computer or the like.

[0051] The conveying device 4 shown in Figure 1B has a conveying head 42, and a stamping tool 44 is detachably mounted at the lower end of the conveying head 42. In this embodiment, the stamping tool 44 has a stamping protrusion 46, on which a new element 37b is detachably mounted. The new element 37b is the same element as element 37, and is a newly mounted element on the portion from which the specific element 37a has been removed. It is conveyed to a predetermined position by the conveying device 4. A plurality of stamping protrusions may also be provided.

[0052] The material of the stamping protrusion 46 is not particularly limited, and examples include viscoelastic materials such as polydimethylsiloxane (PDMS), organosilicon compounds, and polyether rubber. The stamping protrusion 46 is formed on the surface (below) of the stamping layer, and this stamping layer can also be made of the same material as the stamping protrusion 46, but it is preferable that the surface of the stamping protrusion 46 layer other than the stamping protrusion 46 has no adhesive properties. Outside of the stamping protrusion 46, it is preferable that the picking element does not rely on adhesive force.

[0053] Next, the manufacturing method of the element array 33 will be described, with particular emphasis on the manufacturing method of the light-emitting element (micro LED element) array.

[0054] First, elements 37 of a specific light-emitting color, such as LED elements, are arranged in an array and carefully fabricated onto the surface of the element forming substrate. The element forming substrate varies depending on the type of element 37 (blue light-emitting element, red light-emitting element, green light-emitting element, etc.), and may be made of materials such as sapphire substrate, glass substrate, GaAs substrate, or SiC substrate.

[0055] After the arrangement of the elements 37 is formed on the substrate for forming the elements, the elements 37 are peeled off from the substrate for forming the elements 37 by means of means such as laser peeling and moved into the cavity 36a of the cavity frame 36 of the substrate 34 shown in Figure 1A (for assembly). These operations are repeated with elements 37 of different RGB light emission colors to form an array 33 of elements 37 with RGB.

[0056] Furthermore, each cavity 36a of the cavity frame 36 provided on the substrate 34 is pre-filled with flux 39 by means of a coating nozzle or the like, as shown in Figure 2. The area around the substrate terminals 38a of the substrate 34 is filled with flux 39. The connection between the component terminal 38b of the component 37 (specific component 37a) and the substrate terminal 38a is not particularly restricted. In this embodiment, it is a metal connection, which is achieved by a connection device not shown.

[0057] Thus, the component array 33 is formed. However, in the manufacturing method of the component array 33 of this embodiment, for example, an appearance inspection or light emission inspection is then performed on each component 37 (specific component 37a) arranged in an array as shown in Figure 1A to identify specific components 37a that should be removed for any reason, such as poor appearance or poor light emission. Furthermore, in the manufacturing method of the component array of this embodiment, after performing the removal method of the specific component 37a as described below, a repair method for the component array 33 is performed.

[0058] Specifically, firstly, as shown in Figure 1A, the control base 32 or the laser irradiation device 2a is moved relative to each other along the X and Y axes, so that the laser light Lt from the laser irradiation device 2a irradiates only a specific element 37a within a predetermined irradiation range. Furthermore, the relative distance between the control base 32 and the laser irradiation device 2a along the Z axis is adjusted as needed. These controls are performed by the control device 2b controlling the movement mechanism of either or both of the control base 32 or the laser irradiation device 2a.

[0059] Next, the first control unit 2b1 of the control device 2b controls the laser irradiation device 2a, causing the laser light Lt to irradiate the specific element 37a from the laser emission section 22 of the laser irradiation device 2a, thereby removing only the specific element 37a. That is, the laser light Lt is controlled by the first control unit 2b1 of the control device 2b under a first condition. As shown in Figures 3 and 4, the first condition is that the laser light Lt, which serves as the first energy line, irradiates the specific element 37a within a first irradiation range, removing the specific element 37a and the element terminal 38b together from the surface of the substrate 34. Furthermore, this first condition is also a condition that at least a portion of the flux 39 that is in contact with the substrate terminal 38a remains together with the substrate terminal 38a.

[0060] Specifically, under the first condition, although the wavelength of the laser light Lt emitted from the laser emission section 22 is not particularly limited, it is preferably 532 nm or less, and more preferably 266 nm or less. Under the first condition, the output power of the laser light Lt is preferably such that it can remove the specific element 37a by sublimation (including ablation) or by bounce within three irradiations, preferably one irradiation. While this depends on the size and material of the specific element 37a, it is preferably 10 to 100 mJ / cm². Fewer irradiations result in less damage to the substrate terminal 38a, and also reduce the likelihood of damage to the substrate 34, cavity frame 36, etc.

[0061] Furthermore, the irradiation range of the laser light Lt (including the dot diameter or laser scanning range) is preferably smaller than the dimensions of the specific element 37a along the X and Y axes, and preferably such that the cavity frame 36 is not irradiated by the laser light Lt. Thus, under the irradiation of the laser light Lt, as shown in Figure 4, only the specific element 37a is removed from the substrate 34, and at least a portion of the flux 39 that is in contact with the substrate terminal 38a is left together with the substrate terminal 38a.

[0062] As shown in Figure 4, after only the specific element 37a is removed from the substrate 34, the second control unit 2b2 of the control device 2b shown in Figure 1A controls the laser light Lt from the laser emission unit 22 of the laser irradiation device 2a under a second condition different from the first condition. As shown in Figures 4 to 5, the second condition is that the laser light Lt, which is a second energy line, is irradiated onto the flux present on the surface of the substrate 34 corresponding to the position where the specific element 37a has been removed, thereby removing the flux 39 from the specific cavity 36a. Furthermore, the specific cavity 36a refers to the cavity 36a where the specific element 37a has been removed.

[0063] Specifically, in the second condition, although the wavelength of the laser light Lt emitted from the laser emission section 22 is not particularly limited, it is preferably 532 nm or less, and more preferably 266 nm or less. The wavelength of the laser light Lt in the second condition may be the same as or different from the wavelength of the laser light Lt in the first condition. Furthermore, in the second condition, it is preferable that the output power of the laser light Lt is less than the output power of the laser light Lt in the first condition. Preferably, the output power of the laser light Lt in the second condition is 1 / 2 or less of the output power of the laser light Lt in the first condition, and more preferably 1 / 3 or less, 1 / 4 or less, 1 / 5 or less, or 1 / 10 or less.

[0064] The number of irradiations by the laser light Lt in the second condition is preferably more than the number of irradiations by the laser light Lt in the second condition, preferably 4 or more, 5 or more, or 10 or more. As shown in Figure 5, the number of irradiations by the laser light Lt in the second condition is preferably such that the flux 39 is almost completely removed within the specific cavity 36a. In addition, the flux 39 within the specific cavity 36a does not need to be completely removed, but it is preferable to remove at least the flux that is currently in contact with the substrate terminal 38a.

[0065] By irradiation with laser light Lt in the second condition, the flux 39 present in the specific cavity 36a is sublimated and removed. Furthermore, the heat from irradiation with laser light Lt in the second condition, as shown in Figure 5, causes the surface of the substrate terminal 38a (e.g., the surface of the tin layer) to become flattened or have a convex curvature without the unevenness caused by contact marks with the component terminal 38b shown in Figure 3 (refer to Figure 4).

[0066] Furthermore, the irradiation range of the laser light Lt in the second condition is preferably such that the laser light Lt irradiates the flux 39 shown in Figure 4 within a specific cavity 36a, but does not irradiate the cavity frame 36. Additionally, the laser light Lt may also irradiate the surface of the substrate terminal 38a.

[0067] Subsequently, for example, using the flux printing apparatus 5 shown in Figure 1C, new flux 39 is injected into a specific cavity 36a as shown in Figure 6. The new flux 39 is preferably of the same material as the flux 39 that was removed before it deteriorated due to heat such as laser irradiation; it does not necessarily have to be the same flux. With the new flux 39, the oxide coating formed on the surface of the substrate terminal 38a is removed, making bonding with the component terminal 38b easier.

[0068] Next, using the stamping tool 44 of the transport device 4 shown in Figure 1B, as shown in Figure 7, the new element 37b is installed inside the cavity 36a, and the element terminal 38b of the new element 37b contacts the substrate terminal 38a.

[0069] The connection between the component terminal 38b of the new component 37b and the substrate terminal 38a can be performed by a component connection device (not shown) or by a transport device 4. In any case, the new component 37b is pressed against the substrate 34 with a predetermined pressure to create at least a partial metal bond between the component terminal 38b and the substrate terminal 38a. Alternatively, the component terminal 38b can be inserted into the surface of the substrate terminal 38a while the substrate terminal 38a is heated (e.g., above 40°C). This is how the component array 33 is manufactured.

[0070] As explained above, in the manufacturing method of the component array 33 of this embodiment (the component removal method and the component array repair method are also the same), firstly, as shown in Figure 3, a laser light Lt is irradiated onto a specific component 37a to be removed under a first condition, and then, as shown in Figure 4, the specific component 37a is removed from the surface of the substrate 34. The first condition is an energy irradiation condition that removes only the specific component 37a, and at least a portion of the flux 39 that is in contact with the substrate terminal 38a, which has been disconnected from the component terminal 38b, can remain with the substrate terminal 38a. Therefore, the possibility of damaging the substrate 34 itself or the cavity frame 36 provided on the substrate 34 is low.

[0071] Furthermore, in this embodiment, the method involves irradiating the surface of the substrate 34 at the predetermined location after the removal of the specific element 37a with laser light under a second condition different from the first condition, thereby removing the flux 39 present at this predetermined location. Therefore, flux that has deteriorated due to heat or other factors when irradiated with laser light Lt under the first condition can be removed by irradiating with laser light under the second condition.

[0072] If degraded flux 39 is left to remain on or near the substrate terminal 38a, there is a risk that a good connection between the component terminal 38b of the new component 37b and the substrate terminal 38a may not be achieved when a new component 37b is installed. However, by removing the degraded flux 39, new flux 39 can be installed. Therefore, even without installing a new component 37b, the durability of the component array (e.g., a display) can be improved. Furthermore, after installing new flux 39, a good connection can be maintained between the component terminal 38b of the new component 37b and the substrate terminal 38a of the substrate 34, which also improves the durability of the component array (e.g., a display) 33.

[0073] In this embodiment, components 37 (including 37a and 37b) are respectively disposed in each cavity 36a of the cavity frame 36 provided on the surface of the substrate 34, and flux 39 is disposed around the component terminals 38b and the substrate terminals 38a in the cavity 36a. With this configuration, it is easy to arrange regularly shaped components 37 (including 37a and 37b), and it is also easy to remove specific components 37a.

[0074] Furthermore, in this embodiment, even if a new, good-quality element 37b is not repositioned at the location where the specific element 37a was removed, it can still function as a display device (including a lighting device) having an element array. For example, if the size of the element 37 is small, even if one specific element 37a is missing from two or more arranged elements 37, there is sometimes no problem as a whole for the display device (including a lighting device) having an element array.

[0075] Furthermore, in the element removal device 2 of this embodiment, even if the elements 37 are arranged side by side in a predetermined manner and are as small as about 5μm×5μm, it is still easy to remove only the specific element 37a, and it is easy to manufacture an array of elements in which the specific element 37a has been removed.

[0076] Furthermore, the present invention should not be limited to the above-described embodiments, and various changes can be made within the scope of the present invention.

[0077] For example, in the above embodiment, a cavity frame 36 is provided on the surface of the substrate 34, but the element array 33 does not necessarily have to have a cavity frame 36.

[0078] Furthermore, the specific component 37a to be removed may be a defective component, a component whose connection position is offset, or a component that is not needed in the layout.

[0079] Furthermore, in the above embodiment, the connection method between the substrate terminal 38a and the component terminal 38b is not particularly limited, but the method in the above embodiment is particularly effective when the substrate terminal 38a and the component terminal 38b are directly connected in a manner such as metal bonding. Other connection methods include connection by ACF (conductive adhesive), connection by soldering material, ball gate array (BGA), bonding by conductive paste, and bonding by curable insulating resin.

[0080] In the above-described embodiment, a laser irradiation device 2a is used as an energy line irradiation device, but the device used as an energy line irradiation device is not limited to the laser irradiation device 2a.

[0081] In addition to flux 39, other insulating components used for component array 33 include, for example, underfill, potting agent, filler, etc.

[0082] Furthermore, the component 37 is not limited to display components, but can also be various electronic components such as ceramic capacitors, chip inductors, piezoelectric components, magnetostrictors, chip resistors, tantalum electrolytic capacitors, ICs, or semiconductor components.

[0083] Furthermore, as a conveying device, in addition to a conveying device using a stamping tool 44, a conveying device having an adsorption conveying section may also be used. [Simplified Explanation of the Diagram]

[0030] Figure 1A is a schematic diagram showing the schematic configuration of an energy irradiation device used in a method for manufacturing a component array related to an embodiment of the present disclosure. Figure 1B is a schematic diagram showing a transport device used in a method for manufacturing a component array related to an embodiment of the present disclosure. Figure 1C is a schematic diagram showing a flux printing device used in a method for manufacturing a component array related to an embodiment of the present disclosure. Figure 2 is a partial cross-sectional view of a component array parallel to a plane including the X-axis and Y-axis shown in Figure 1A. Figure 3 is a partially enlarged cross-sectional view showing a method for removing a specific component from a portion of the component shown in Figure 2. Figure 4 is a partially enlarged cross-sectional view showing a follow-up step to the step shown in Figure 3. Figure 5 is a partially enlarged cross-sectional view showing a follow-up step to the step shown in Figure 4. Figure 6 is a partially enlarged cross-sectional view showing a follow-up step to the step shown in Figure 5. Figure 7 is a partially enlarged cross-sectional view showing a follow-up step to the step shown in Figure 6.

Claims

1. A method for manufacturing an array of components, comprising a plurality of components electrically connected to substrate terminals disposed on a substrate via component terminals, the method comprising the following steps: irradiating a specific component to be removed with a first energy line according to a first condition; and irradiating a portion of the portion to which the specific component has been removed with a second energy line according to a second condition; wherein the first condition is a condition in which the specific component is removed from the surface of the substrate, leaving an insulating component in contact with the substrate terminals; and the second condition is different from the first condition, being a condition in which the insulating component is removed.

2. The method for manufacturing the element array as described in claim 1, wherein the output power of the first energy line is higher than the output power of the second energy line.

3. The method for manufacturing the element array as described in claim 1, wherein the second energy line is irradiated more times than the first energy line.

4. The method of manufacturing an array of elements as described in claim 1, wherein the first energy line irradiates the specific element within a first irradiation range smaller than the planar area of ​​the specific element.

5. The method of manufacturing an array of elements as described in claim 1, wherein the aforementioned second energy line is a second irradiation range in which the insulating member is removed around the aforementioned substrate terminal located on the surface of the aforementioned substrate corresponding to the position where the aforementioned specific element has been removed, and irradiates the aforementioned specific element.

6. A method for manufacturing an array of components as described in any one of claims 1 to 5, wherein the aforementioned components are respectively disposed in each cavity of a cavity frame provided on the surface of the aforementioned substrate, and the aforementioned insulating member is disposed therein around the aforementioned component terminals and the aforementioned substrate terminals within the aforementioned cavity.

7. The method for manufacturing an array of elements as described in any one of claims 1 to 5 further comprises the following steps: supplying a new insulating component to the surface portion of the aforementioned substrate after the aforementioned insulating component has been removed; and connecting the element terminals of the new element to the aforementioned substrate terminals located on the surface portion of the aforementioned substrate after the aforementioned new insulating component has been supplied.

8. A method for removing an element, comprising removing at least one of a plurality of elements from an array of elements, wherein the elements are electrically connected to substrate terminals provided on a substrate, and comprising the following steps: irradiating a specific element to be removed with a first energy line according to a first condition; and irradiating a second energy line with a second condition for the area where the specific element has been removed; wherein the first condition is a condition in which the specific element is removed from the surface of the substrate and an insulating member is left in contact with the substrate terminals; and the second condition is different from the first condition and is a condition in which the insulating member is removed.

9. A method for repairing an array of components, comprising the following steps: after removing the aforementioned specific component and the aforementioned insulating component by means of the component removal method as described in claim 8, supplying a new insulating component to the surface portion of the aforementioned substrate after the aforementioned insulating component has been removed; transporting a new component to the surface portion of the aforementioned substrate after the aforementioned new insulating component has been supplied; and connecting the component terminals of the new component to the aforementioned substrate terminals located on the surface portion of the aforementioned substrate after the aforementioned new insulating component has been supplied.

10. An element removal apparatus comprising: a substrate support portion for holding a substrate; an energy irradiation device for irradiating energy lines; a first control portion for controlling the energy irradiation device to irradiate a specific element among a plurality of elements having element terminals, which is the target of removal, with the energy lines irradiating the specific element under a first condition, wherein the element terminals are connected to substrate terminals provided on the surface of the substrate; and a second control portion for controlling the energy lines irradiated from the energy irradiation device under a second condition for an insulating member present on the surface of the substrate after the specific element has been removed; wherein the first condition is a condition for removing the specific element from the surface of the substrate and leaving an insulating member in contact with the substrate terminals; and the second condition is different from the first condition and is a condition for removing the insulating member.

11. A component array repair apparatus comprising: a component removal device as described in claim 10; an insulating component supply device for supplying new insulating components to a surface portion of the substrate after the aforementioned insulating components have been removed; a transport device for transporting new components to the surface portion of the aforementioned substrate after the aforementioned new insulating components have been supplied; and a component connection device for connecting component terminals of the new components to the aforementioned substrate terminals located on the surface portion of the aforementioned substrate after the aforementioned new insulating components have been supplied.

Images