Robot and method for process tool tending

Abstract

Apparatus and methods for tooling maintenance in a semiconductor manufacturing plant are disclosed. In some embodiments, a robot includes a robotic arm and a turntable that rotates relative to the robotic arm. The turntable holds at least one batch box containing a wafer cassette of semiconductor wafers, and the robotic arm includes a terminal effector operable to manipulate the batch box. Thus, the robot handles the wafer batch box to improve semiconductor manufacturing plant throughput by automating conventionally manually performed unloading and loading processes. For example, the robot may transport a wafer batch box to a point of use, remove the wafer cassette from the batch box, load the wafer cassette into a tool at the point of use, remove the wafer cassette from the tool after processing, reload the wafer cassette into the batch box, and transport the wafer cassette to the next point of use.

Description

Technical Field

[0001] The technology disclosed in this invention relates to semiconductor processing, and more particularly to robots used to maintain the processing tools used in semiconductor wafer manufacturing. Prior Technology

[0002] A robot is typically a reprogrammable, multi-functional manipulator, usually designed to move through procedural motions to perform various tasks or functions. A robot can be a physically anchored manipulator (e.g., an industrial robotic arm) or a mobile robot that navigates its environment autonomously or semi-autonomously (e.g., using legs, wheels, or traction-based mechanisms). Robots can utilize sensors to help complete tasks without colliding with obstacles and / or getting stuck or trapped.

[0003] Some robots have articulated arms that perform various tasks by manipulating the motorized connectors of the articulated arms. Such articulated arms may have a device at the end of the articulated arm called an end effector, which allows the arm to move around in the environment. Examples of end effectors include grippers, such as jaws, claws, or mechanical fingers.

[0004] Robots are used in a variety of industries, including manufacturing, warehousing and logistics, transportation, hazardous environments, exploration, and healthcare. Summary of the Invention

[0005] An apparatus and method for tooling maintenance in a semiconductor manufacturing plant are disclosed. In some embodiments, a robot includes a robotic arm and a turntable that rotates relative to the robotic arm. The turntable holds at least one batch box containing a wafer cassette storing semiconductor wafers, and the robotic arm includes a terminal effector operable to manipulate the batch box. Thus, the robot manipulates the wafer batch box to automate the manual unloading and loading processes in the prior art, thereby improving semiconductor manufacturing plant throughput. For example, the robot can transport a wafer batch box to a point of use, remove the wafer cassette from the batch box, load the wafer cassette into a tool at the point of use, remove the wafer cassette from the tool after processing, reload the wafer cassette into the batch box, and transport the batch box to the next point of use. Therefore, the robot allows one or more people to be completely removed from tooling maintenance in semiconductor manufacturing plants (such as conventional semiconductor manufacturing plants for 6-inch / 8-inch wafers).

[0006] In one embodiment, a robot for tooling maintenance in a semiconductor manufacturing plant is disclosed. The robot includes a robotic arm and a turntable configured to rotate relative to the robotic arm. The turntable is configured to hold at least one batch box of a wafer cassette storing semiconductor wafers, and the robotic arm includes a terminal effector configured to manipulate the at least one batch box.

[0007] In another embodiment, a method for maintaining machining tools in a semiconductor manufacturing plant is disclosed. The method includes controlling the rotation of a turntable of a robot relative to a robotic arm of the robot, the turntable holding at least one batch box of wafer cassettes storing semiconductor wafers. The method further includes controlling the position of the robotic arm relative to one of the at least one batch box and manipulating the at least one batch box using an end effector of the robot. Simple Explanation of the Diagram

[0008] Figure 1A is a perspective view of a robot according to one embodiment. Figure 1B is a perspective view of a portion of the robot in Figure 1A, which includes a turntable and a robotic arm on a base. Figure 1C is a perspective view of the robot in Figure 1A, focusing on one of the robots, the box opener. Figure 1D is a perspective view of the robot of Figure 1A, focused on one of the closed batch boxes on a turntable. Figure 1E is a perspective view of the robot of Figure 1A focused on one of the open batch boxes on the turntable. Figure 1F is a top view of the robot in Figure 1A. Figure 1G is a top view of the robot in Figure 1A, in which the robotic arm is omitted and the turntable is rotated to a first position. Figure 1H is a top view of the robot in Figure 1A, in which the robotic arm is omitted and the turntable is rotated to a second position. Figure 1I is a side view of the robot in Figure 1A, focused on the robot's box opener. Figure 2A is a side view of a robot being disassembled from a base according to another embodiment. Figure 2B is a perspective view of the robot in Figure 2A. Figure 2C is a perspective view of the robot in Figure 2A, in which one of the outer shell covers is open. Figure 2D is a side view of the robot in Figure 2A, in which one of the outer shell covers has been removed. Figure 2E is a perspective view of the robot in Figure 2A, focused on a closed batch box on a turntable of the robot. Figure 2F is a perspective view of the robot of Figure 2A focused on one of the open batch boxes on the robot's turntable. Figure 2G is a side view of the robot of Figure 2A attached to a mobile base. Figure 3A is a front perspective view of the terminal effector according to one embodiment. Figure 3B is a perspective view of the terminal effector in Figure 3A. Figure 3C is a side view of the terminal effector of Figure 3A being handed over to a closed batch box. Figure 3D is a side view of the terminal effector and an open batch box of Figure 3A. Figure 3E is a perspective view of an example of a wafer cassette used in a batch box. Implementation

[0009] The following detailed description of embodiments presents various descriptions of specific embodiments of the present invention. However, the present invention can be implemented in many different ways. In this description, reference is made to the accompanying drawings. It should be understood that the elements depicted in the drawings are not necessarily drawn to scale. Furthermore, it should be understood that some embodiments may include more elements than depicted in the drawings and / or a subset of the elements depicted in the drawings. In addition, some embodiments may combine any suitable combination of features from two or more drawings.

[0010] Some conventional processing tools used in semiconductor wafer manufacturing are incompatible with modern automated material handling systems (AMHS) used in semiconductor processing. For example, some processing tools used to handle 6-inch (150 mm) and / or 8-inch (200 mm) silicon wafers are incompatible with AMHS.

[0011] Therefore, it is desirable to fully automate the maintenance of traditional machining tools and the manual handling of wafers. For example, automating maintenance in this way allows for the removal of personnel from the machining tool maintenance process, thereby eliminating human variability and / or high labor costs.

[0012] Apparatus and methods for tooling maintenance in a semiconductor manufacturing plant are disclosed. In some embodiments, a robot (such as an automated mobile robot (AMR)) includes a robotic arm and a turntable that rotates relative to the robotic arm. The turntable holds at least one batch box of a wafer cassette storing semiconductor wafers, and the robotic arm includes a terminal effector operable to manipulate a batch box.

[0013] Therefore, robots handle wafer batch boxes to improve semiconductor manufacturing throughput by automating the manual unloading and loading processes in conventional technologies. For example, a robot can transport a wafer batch box to a point of use, remove the wafer cassette from the batch box, load the wafer cassette into a tool at the point of use, remove the wafer cassette from the tool after processing, reload the wafer cassette into the batch box, and transport the batch box to the next point of use.

[0014] Therefore, robots enable one or more people to be completely removed from tooling maintenance in semiconductor manufacturing plants (such as traditional semiconductor manufacturing plants for 6-inch / 8-inch wafers).

[0015] In some implementations, the robotic arm operates in conjunction with a termination effector that operates without actuation. For example, the termination effector can be completely passive or stationary, thereby reducing cost, particle generation, points of failure, and / or programming complexity. Such a termination effector can be implemented to manipulate batch bins and wafer casks stored within them.

[0016] For example, a passive terminal effector can be used to move a batch bin, unlock / lock a batch bin, remove a wafer cassette from a batch bin, load a wafer cassette into a processing tool, remove a wafer cassette from a processing tool, insert a wafer cassette into a batch bin, and / or otherwise interact with the batch bin and wafer cassette.

[0017] In some implementations, the robotic arm is a 6-axis articulated robotic arm that operates on six axes of freedom, while a turntable provides a seventh axis of freedom. Although a 6-axis articulated robotic arm itself has highly controllable movement, the turntable eliminates several additional movements of the robotic arm without increasing the robot's overall footprint. In contrast, robots in the prior art require additional movement steps, which affects throughput, cost, and / or ease of integration into a semiconductor manufacturing plant.

[0018] Therefore, the turntable provides additional axes of motion to reduce the total movement of the robotic arm. Furthermore, the turntable allows the robotic arm to interact with multiple batch bins, enabling the same robot to simultaneously transport and maintain multiple wafer batches. For example, two or more batch bins can be stored on the turntable, and the turntable can rotate a specific batch bin to a desired position for interaction with the robotic arm.

[0019] In some implementations, a base for the robotic arm passes through the center of a turntable, thereby positioning the robotic arm above and around the turntable in a configuration similar to that of an excavator. Therefore, the turntable can rotate relative to the robotic arm and the base to place the batch box in a desired position.

[0020] The robot may also include a box opener, such as a box-opening suction arm, for opening batch boxes. For example, the box opener may be fixed to a base or other desired location on the robot, and a turntable may rotate a specific batch box to align with the box opener. Once the batch box is unlocked by the robotic arm and opened by the box opener, the robotic arm can interact with the wafer cassette stored within.

[0021] In some implementations, the robotic arm and turntable are part of an application layer of a fully customizable robot. For example, the application layer can add additional motion axes, a robotic arm, sensors, and / or other automated or semi-automated functions. Furthermore, the application layer can be compatible with various implementations of the robotic arm, sensors, or other components, thereby providing modularity and flexibility.

[0022] For example, the application layer can rest on a shell of the robot, which in turn can be attached to any base. For ease of widespread deployment, the application layer can be implemented to be completely independent of the shell and / or base. In one instance, the robot includes a mobility base, such as a modular all-wheeled base providing both stability and mobility. In another instance, the robot is mounted on a workbench for stationary tool maintenance. Therefore, the robot can be highly modular.

[0023] Figures 1A to 1I depict various views of a robot 50 according to one embodiment. The robot 50 includes a robotic arm 1, a robotic arm base 2, a turntable 3, a housing 4, and a motion base 5. An end effector 11 is attached to one end of the robotic arm 1. Additionally, a box opener (in this example, corresponding to a box-opening suction arm 15) is attached to the robotic arm base 2.

[0024] In the illustrated embodiment, the housing 4 is situated on the motion base 5, and one of the components, the application layer, is situated on the housing 4. Therefore, the robot 50 typically comprises three layers: (i) the motion base 5 for navigating the robot 50 around an surrounding environment; (ii) the housing 4 for housing various electrical and mechanical components for controlling the operation of the robot 50; and (iii) the application layer for interacting with the batch bin 41, wafer casks stored in the batch bin 41, processing tools, and / or other objects in the surrounding environment.

[0025] In this embodiment, the application layer includes a robotic arm 1, a robotic arm base 2, a turntable 3, and an unpacking suction arm 15. However, the application layer of the robot 50 can be adapted to perform a specific function or set of functions by which the robot 50 is implemented. For example, the application layer is fully customizable to add additional motion axes, sensors, and / or other desired functions.

[0026] The motion base 5 of Figures 1A to 1I includes wheels 38 for moving the robot 50 around its environment. However, the robot 50 can be implemented using other motion-based structures, such as pedals, legs, and / or other structures. Furthermore, the teachings herein apply to robots that are physically constrained in one or more dimensions, such as robots mounted in a suitable location or configured to operate along tracks or rails. Therefore, the robot can be implemented according to the needs of a specific application.

[0027] Referring again to Figures 1A through 1I, robot 50 in this example is mobile and thus acts as an automated mobile robot (AMR). Therefore, robot 50 is able to navigate around a semiconductor manufacturing plant to maintain the processing tools used to process semiconductor wafers stored in wafer casks in batch bins 41.

[0028] For example, a robot can transport batch bin 41 to a point of use, remove the wafer cassette from batch bin 41, and load the wafer cassette into a tool at the point of use. This tool can be any semiconductor processing equipment used for tandem or parallel processing of one or more wafer cassettes. Examples of tools include, but are not limited to, lithography machines, wafer thinning equipment, deposition chambers, diffusion furnaces, etchers, and / or testing equipment. After processing by the tool, robot 50 can remove the wafer cassette from the tool and reload it into batch bin 41 for transport to the next point of use.

[0029] In the illustrated embodiment, robot 50 includes a robotic arm 1, which functions as a mechanical manipulator. An end effector 11 is attached to one end of the robotic arm 1 (e.g., a tool flange), and the robotic arm 1 is configured to move with multiple degrees of freedom, thereby allowing the end effector 11 to interact with objects in the environment. The robotic arm 1 can be implemented by various components coupled to connectors to allow the robotic arm 1 to pivot about the connectors. In the illustrated example, the robotic arm 1 is a 6-axis articulated robotic arm.

[0030] In this embodiment, the termination effector 11 is completely passive. Therefore, the termination effector 11 is completely passive or stationary, and does not include a moving fixture or suction mechanism. By implementing the termination effector 11 as completely passive, particle generation is reduced, thereby reducing semiconductor wafer contamination and improving manufacturing yield. Furthermore, including a passive termination effector can reduce costs, decrease the number of points of failure, and / or reduce programming complexity.

[0031] Referring again to Figures 1A through 1I, the robotic arm 1 is attached to the robotic arm base 2. In some embodiments, the robotic arm 1 is fitted into a socket in the robotic arm base 2 and secured in any suitable manner (such as using a locking pin or bolt 16). However, other embodiments are also possible.

[0032] In the illustrated embodiment, the robotic arm base 2 passes through an opening 17 at the center of one of the turntables 3. In this example, the robotic arm base 2 is fixed to the housing 4. In addition to structurally supporting the robotic arm 1, the robotic arm base 2 can also be used for other functions, such as carrying wires (e.g., for power and / or data) between the housing 4 and the robotic arm 1.

[0033] The turntable 3 rotates relative to other fixed components (such as the robotic arm base 2 and housing 4). Therefore, the turntable 3 provides an additional axis of freedom to help the robotic arm 1 interact with the target with fewer movements or maneuvers. Furthermore, the turntable 3 adds an axis for movement without increasing the robot's overall footprint. For example, when used in conjunction with a 6-axis articulated robotic arm 1, the turntable 3 provides a seventh axis of freedom. A turntable is also referred to herein as a rotary rack or batch rotary rack.

[0034] Referring again to Figures 1A through 1I, the turntable 3 is implemented with various batch box holders 18 for securing batch boxes 41. In this example, the turntable 3 includes four batch box holders 18 that are radially symmetrical with respect to one of the centers of the turntable 3. The robotic arm 1 uses an end effector 11 to insert or remove each batch box 41 into or from a corresponding batch box holder 18. The batch box holders 18 help secure the batch boxes 41 as the robot 50 navigates around the environment and / or as the turntable 3 rotates. In this example, each of the batch box holders 18 includes four corner segments for securing the bottom of each batch box 41 at the four corners. However, other implementations are also possible.

[0035] Each of the batch bins 41 can hold one wafer cassette used for transporting wafers. The batch bins 41 can be locked or unlocked by manipulating them with a terminal effector 11 using a robotic arm 1. Locking the batch bins 41 helps secure the wafer cassette during transport, while the batch bins 41 can be unlocked to allow a particular batch bin to be opened, so that a wafer cassette can be inserted, removed, or otherwise interacted with.

[0036] In the illustrated embodiment, the unpacking suction arm 15 is attached to the robotic arm base 2. The unpacking suction arm 15 includes a suction mechanism 19 for applying a suction force to the lid of the batch box. This suction force allows the batch box 41 to be opened by actuation of the unpacking suction arm 15. Therefore, the turntable 3 can be used to rotate a specific batch box 41 to align it with the suction mechanism 19 and apply a suction force to the lid of the batch box. Thereafter, the unpacking suction arm 15 is actuated, and the batch box is opened.

[0037] For example, the turntable 3 depicted in Figure 1D radially aligns the unpacking suction arm 15 to the batch box 41. In Figure 1D, the terminal effector 11 has been used to unlock the batch box 41, and the suction mechanism 19 has engaged with the lid of the batch box. Subsequently, as shown in Figure 1E, the suction mechanism 19 can apply a suction force, and the unpacking suction arm 15 is actuated to open the batch box 41.

[0038] Once the batch bin is opened, robotic arm 1 can be used to insert or remove a wafer cassette from the opened batch bin, or otherwise interact with the wafers stored in batch bin 41.

[0039] Therefore, the robots 50 of Figures 1A to 1I are suitable for navigating around a semiconductor manufacturing plant to maintain various processing tools as needed. The robot 50 can be used to load wafer cassettes into or outside the processing tools. These wafer cassettes are stored in batch bins 41, which can be inserted into or removed from corresponding batch bin holders 18 on the turntable 3 of the robot 50. Thus, the robot 50 can be used to fully automate the maintenance of processing tools, eliminating the need for traditional manually driven processes and allowing the removal of personnel from the processing tool maintenance workflow.

[0040] The housing 4 houses various mechanical and electrical components 21 used to control the robot 50. Examples of components 21 include motors, pumps, and / or gearboxes for controlling various components of the robot 4. For example, components 21 can be used to control the rotation of the turntable 3, selectively activate the suction mechanism 19, and / or activate the unpacking suction arm 15 as needed. Examples of components 21 further include power supplies, battery packs / chargers, sensors, and / or circuit boards, including electronic circuitry systems for processing data (e.g., sensor data) and controlling the robot 50.

[0041] Examples of sensors include vision / image sensors (e.g., a camera, a time-of-flight sensor, a scanning light detection and ranging (LADAR) sensor, and / or a scanning laser detection and ranging (LADAR) sensor), inertial sensors (e.g., an inertial measurement unit (IMU)), force sensors, and / or kinematic sensors. Such sensors may be integrated into the housing 4 or, if necessary, mounted on the robot 50, and communicate with the electronic circuitry using wired, wireless, optical, and / or other communication links. In some embodiments, precision sensors are used to control the rotation of the turntable 3 with precise angular phase, velocity, and / or acceleration.

[0042] Furthermore, the mechanical and electrical components 21 can be implemented using a computing system for processing sensor data to control various operations of the robot 50. For example, the computing system may include memory hardware that operates in conjunction with data processing hardware to perform various functions (such as processing sensor data, controlling the robotic arm 1, rotating the turntable 3, and controlling the motion base 5) to navigate the robot 50 around the semiconductor manufacturing plant and / or perform any other desired functions of the robot 50.

[0043] These memory hardware storage instructions, when executed by data processing hardware, cause the data processing hardware to perform various operations. These instructions (also known as computer programs, software, software applications, or code) can be implemented using a high-level program and / or a target-oriented programming language and / or assembly / machine language.

[0044] Data processing hardware may include one or more central processing units (CPUs), configurable computing units (e.g., field-programmable gate arrays (FPGAs)), digital signal processors (DSPs), neural processing units (NPUs), application-specific integrated circuits (ASICs), and / or any other hardware processing components. Memory hardware stores information non-transitorily within the computing system. Memory hardware may include a computer-readable medium, one or more volatile memory cells, and / or one or more non-volatile memory cells. Memory hardware may include physical devices for temporarily or permanently storing programs (e.g., instruction sequences) or data (e.g., program state information) for use by the computing system. Examples of non-volatile memory include, but are not limited to, flash memory and read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), and electronically erasable programmable read-only memory (EEPROM) (for example, commonly used in firmware, such as bootloaders). Examples of volatile memory include, but are not limited to, random access memory (RAM), dynamic random-access memory (DRAM), static random-access memory (SRAM), phase-change memory (PCM), and magnetic disks or magnetic tapes.

[0045] Figures 2A to 2G depict various views of a robot 100 according to one embodiment. The robot 100 includes a robotic arm 51, a robotic arm base 52, a turntable 53 (including a batch box holder 58), a housing 54, and a motion base 5. An end effector 61 is attached to one end of the robotic arm 51. Additionally, a box-opening suction arm 15 is attached to the robotic arm base 52.

[0046] The robots 100 in Figures 2A to 2G are similar to the robots 50 in Figures 1A to 1I, except that robot 100 is implemented using variations of components of robot 50. The robots disclosed herein are highly modular and / or configurable, and therefore can be implemented with different application layers, bases, and / or housings as needed. Compared to the robots 50 in Figures 1A to 1I, the robots 100 in Figures 2A to 2G include additional sensors and components.

[0047] For example, robot 100 includes a wireless charger 59 attached to one of the housings 54 and one of the covers 58. Additionally, robot 100 includes a three-dimensional (3D) time-of-flight sensor 57 for advanced obstacle avoidance. Furthermore, it includes one or more laser radar safety scanners 56 to help prevent accidental collisions between robot 100 and other objects or people.

[0048] Robot 100 also includes a terminal effector 61, which will now be discussed in detail with reference to Figures 3A to 3D.

[0049] Figure 3A is a front perspective view of the terminal effector 61. Figure 3B is a rear perspective view of the terminal effector 61 of Figure 3A. Figure 3C is a side view of the terminal effector 61 of Figure 3A in conjunction with a closed batch box. Figure 3D is a side view of the terminal effector 61 of Figure 3A and an open batch box.

[0050] Referring to Figures 3A to 3D, the terminal effector 61 includes a base 71, an offset link 77, a connector 78, a first arm 72a, 73a and 74a, a second arm 72b, 73b and 74b, a housing joint 79, an upper unlocking finger 75 and a lower unlocking finger 76.

[0051] In the illustrated embodiment, connector 78 is used to connect to the end effector of a robotic arm, such as to a tool flange of a 6-axis articulated robotic arm. Connector 78 is biased from the base 71 of end effector 61 by a biasing link 77. The biasing link 77 helps provide additional clearance and maneuverability to facilitate interaction between end effector 61 and batch box 41. For example, the biasing link 77 provides sufficient passage for operation within a tight work package.

[0052] As shown in Figures 3A to 3D, the terminal effector 61 includes two arms for providing fixed batch bin holding and / or serving as a bin interface for interaction with a wafer cassette (e.g., wafer cassette 210 in Figure 3E). Each arm includes a first extension 72a / 72b extending away from the base 71 for raising an angled portion 73a / 73b of the arm relative to the base 71, and a second extension 74a / 74b extending away from the angled portion. This arm configuration facilitates the manipulation of the batch bin and / or wafer cassette.

[0053] In the illustrated embodiment, the upper unlocking finger 75 and the lower unlocking finger 76 are used to unlock the batch box (e.g., release one or more batch box latches).

[0054] In Figures 3C and 3D, the terminal effector 61 is depicted manipulating a batch box 41, which includes a base 42, a lid 43, and one or more batch box latches 83. The terminal effector 61 can unlock or pick up the batch box 41. The batch box 41 can then be opened (e.g., by a robotic box opener), after which the terminal effector 61 can interact with a wafer cassette stored inside. For clarity, the wafer cassette is not shown in Figures 3A through 3D. The terminal effector 61 can also be used to load the wafer cassette back into the batch box 41, which can then be closed (and in some embodiments, locked) for transport.

[0055] Figure 3E is a perspective view of an example of a wafer cassette 210 used in batch bin 41. As shown in Figure 3E, the wafer cassette 210 holds and stores semiconductor wafers 211, such as 6-inch or 8-inch wafers. A wafer cassette is also referred to herein as work-in-process (WIP). Although an example of a wafer cassette is shown, the batch bins described herein can store various types of wafer cassettes.

[0056] in conclusion

[0057] The foregoing description may refer to elements or features as "connected" or "coupled" together. As used herein, unless explicitly stated otherwise, "connected" means that one element / feature is directly or indirectly connected to another element / feature, and not necessarily mechanically connected. Similarly, unless explicitly stated otherwise, "coupled" means that one element / feature is directly or indirectly coupled to another element / feature, and not necessarily mechanically coupled. Therefore, although the various schematic diagrams shown in the figures depict example arrangements of elements and components, additional intermediate elements, devices, features, or components may be present in a practical embodiment (assuming that the function of the depicted circuit is not adversely affected).

[0058] Although certain embodiments have been described, these embodiments are presented by way of example only and are not intended to limit the scope of this disclosure. In fact, the novel apparatus, methods, and systems described herein can be implemented in various other forms; furthermore, various omissions, substitutions, and changes can be made to the form of the methods and systems described herein without departing from the spirit of this disclosure. For example, although the disclosed embodiments are presented in a given arrangement, alternative embodiments may perform similar functions with different components and / or circuit topologies, and some elements may be deleted, moved, added, subdivided, combined, and / or modified. Each of these elements can be implemented in various different ways. Any suitable combination of elements and actions of the various embodiments described above can be combined to provide further embodiments. Therefore, the scope of the invention is limited only by the appended claims.

[0059] Although the requests presented herein are submitted to the USPTO in a single dependent form, it should be understood that any request may depend on any prior request of the same type, unless this is clearly not technically feasible.

[0060] 1,51: Robotic Arm 2,52: Robotic arm base 3,53: Turntable 4,54: Outer shell 5: Action Base 11,61: Terminal effector 15,65: Unboxing and suction arm 16: Locking pin or bolt 17: Opening 18,68: Batch box retainer 19: Suction Mechanism 21: Components 38: Wheel 41: Batch Box 42,71: Base 43: Cover 50, 100: Robots 56: Laser Radar Security Scanner 57: Three-dimensional (3D) time-of-flight sensor 58: Cover 59: Wireless Charger 72a, 72b: First extension 73a, 73b: Angled portion 74a, 74b: Second extension 75: Upper unlocking finger 76: Lower part unlocking finger 77: Offset Link 78: Connector 79: Box joint 83: Batch box latch 210: Wafer Casket 211: Semiconductor wafers

Claims

1. A robot for tool maintenance in a semiconductor manufacturing plant, the robot comprising: A robotic arm; And a turntable configured to rotate relative to the robotic arm, wherein the turntable is configured to hold at least one batch box storing one wafer cassette of a plurality of semiconductor wafers, wherein the robotic arm includes a terminal effector configured to manipulate one of the at least one batch box, wherein the robotic arm is attached to a base that lifts the robotic arm onto the turntable, wherein the base passes through a center of the turntable such that the robotic arm is centered on the turntable.

2. The robot for tool maintenance as claimed in claim 1, wherein the robotic arm is a 6-axis articulated robotic arm having one of six axes of freedom, and the turntable is operable to rotate to provide a seventh axis of freedom.

3. As in Request 1, a robot for maintaining machining tools, wherein the terminal effector is completely passive.

4. The robot for tool maintenance as claimed in claim 3, wherein the end effector includes a pair of arms configured to interact with the at least one batch box.

5. The robot for tool maintenance as claimed in claim 4, wherein the pair of arms includes one or more unlocking fingers configured to unlock the at least one batch box.

6. The robot for tool maintenance as claimed in claim 4, wherein the pair of arms are connected by a base, and wherein the terminal effector further includes one or more joints attached to the base and operable to interact with the wafer cassette.

7. The robot for tool maintenance as claimed in claim 4, wherein the pair of arms are connected by a base, and wherein the end effector further includes an offset link connecting the base to one end of one of the robotic arms.

8. The robot for tool maintenance as claimed in claim 4, wherein each of the pairs of arms includes a first extension, an angled portion, and a second extension.

9. The robot for tool maintenance as claimed in claim 1 further includes a box opener configured to open the lid of one of the at least one batch boxes.

10. The robot for tool maintenance as claimed in claim 9, wherein the box opener includes a suction mechanism configured to apply a suction force to the lid, and an arm configured to be actuated to open the lid.

11. The robot for tool maintenance as claimed in claim 1 further includes a housing that supports the turntable and includes one or more components configured to control the rotation of the turntable and multiple movements of the robotic arm.

12. The robot for tool maintenance as claimed in claim 1 further includes a motion base operable to navigate the robot to a point of use associated with at least one semiconductor processing tool.

13. The robot for tool maintenance as claimed in claim 1 further includes at least one of a time-of-flight sensor and a laser radar sensor, configured to detect one or more obstacles in one of the robot's environments.

14. The robot for tool maintenance as claimed in claim 1 further includes a plurality of batch box holders arranged on the turntable, and each of the batch box holders is configured to hold a batch box separately.

15. A method for maintaining machining tools in a semiconductor manufacturing plant, the method comprising: The robot controls the rotation of a turntable relative to a robotic arm, the turntable holding at least one batch box storing a wafer cassette of a plurality of semiconductor wafers; controls the position of the robotic arm relative to one of the at least one batch box; and manipulates the at least one batch box using a terminal effector of the robot, wherein the robotic arm is attached to a base that lifts the robotic arm onto the turntable, wherein the base passes through a center of the turntable such that the robotic arm is centered on the turntable.

16. The method for tool maintenance as claimed in claim 15, wherein the terminal effector is completely passive, the method further comprising using one of the terminal effector pairs of arms to transfer the terminal effector to the at least one batch box.

17. The method for maintaining machining tools as described in claim 16 further includes using one or more latching fingers of the pair of arms to unlock at least one batch box.

18. The method for tooling maintenance as described in claim 16 further includes using the terminal effector to manipulate the wafer cassette.

19. The method for maintaining machining tools as described in claim 15 further includes using one of the box openers of the robot to open one of the lids of the at least one batch box.

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