Electronic package

Abstract

An electronic package includes a carrier and electronic components and a heat sink disposed on the carrier. The carrier has a ground layer exposed on the side of the carrier and the ground layer is in direct contact with the heat sink to dissipate heat from the carrier and provide shielding space for the electronic components.

Claims

1. An electronic package, comprising: A carrier has a first surface and a second surface opposite to each other and a side surface adjacent to the first surface and the second surface, and includes an insulating layer and a metal layer bonded to the insulating layer, wherein a contact portion is formed adjacent to the first surface on the side surface, and the metal layer includes a ground layer exposed to the contact portion; an electronic component is disposed on the first surface of the carrier and electrically connected to the carrier; and a heat sink is disposed on the contact portion of the carrier and connected to the ground layer.

2. The electronic package as described in claim 1, wherein, The carrier is a substrate with or without a core layer.

3. The electronic package as described in claim 1, wherein, The receiving part is a recessed part formed by the inward reduction of the side.

4. The electronic package as described in claim 1, wherein, The metal layer includes a ground layer and a wiring layer, with the wiring layer used to transmit circuit signals and the ground layer used to provide circuit grounding and heat dissipation path.

5. The electronic package as described in claim 1, wherein, The electronic component has an active surface and a non-active surface, and the active surface is disposed on the first surface of the carrier through a plurality of conductive bumps.

6. The electronic package as described in claim 1, wherein, The heat sink includes a main body and a support extending outward from the main body, so that the heat sink is mounted on the mounting portion via the support.

7. The electronic package as described in claim 6, wherein, The main body is attached to the electronic component via a thermally conductive interface material.

8. The electronic package as described in claim 6, wherein, The support portion is bonded to the mounting portion on the side of the carrier member through a metal thermally conductive adhesive, so that the grounding layer of the carrier member exposed at the mounting portion is electrically and thermally connected to the support portion of the heat sink through the metal thermally conductive adhesive.

9. The electronic package as claimed in claim 1 further includes a plurality of conductive elements disposed on a second surface of the carrier, some of the plurality of conductive elements being used to transmit circuit signals and some of the plurality of conductive elements being used to transmit heat.

10. The electronic package as described in claim 1, wherein, The electronic component is not in contact with the heat sink.

11. The electronic package as described in claim 10, wherein, The grounding layer is electrically connected to the heat sink through a metal thermally conductive adhesive to form a shielding space that protects the electronic components.

Images