Probe unit manufacturing method, probe unit, probe mounting body, and electrical inspection device

Abstract

The purpose of this invention is to provide a method for manufacturing a probe unit that can precisely align the front end of a probe pin without requiring alignment on an electrical testing device. One embodiment of this invention provides a method for manufacturing a probe unit mounted on an electrical testing device for inspecting the electrical characteristics of an electronic circuit board, and comprising a probe pin 11 that can contact the surface of the electronic circuit board. Using a platform 10 having an alignment mechanism that defines the position in the electrical testing device, the relative position and orientation of the front end of the probe pin 11 relative to the platform 10 are adjusted, and the probe pin 11 is fixed to the platform 10 while maintaining the aforementioned relative position.

Description

[Technical Field]

[0001] This invention relates to a method for manufacturing a probe unit, a probe unit, a probe mounting body, and an electrical testing device. [Previous Technology]

[0002] An electrical inspection device can be used to inspect the electrical characteristics of a printed circuit board. As such an electrical inspection device, for example, it is known to have a probe pin that can contact the surface of an electronic circuit board and a microscope that can magnify and observe the vicinity of the tip of the probe pin (see Japanese Patent Application Publication No. 4-158541).

[0003] In the prior electrical inspection apparatus, after the probe pin is brought close to the surface of the electronic circuit board, alignment is performed by observing the tip of the probe pin under a microscope and appropriately connecting it to a specific electrode on the electronic circuit board. In the aforementioned electrical inspection apparatus, a two-wire probe is mounted on the front end of the locator responsible for alignment via an auxiliary device, which has a rotation mechanism for rotating the two-wire probe around a vertical line. The aforementioned electrical inspection apparatus can perform accurate and high-efficiency detection by means of this rotation mechanism. [Prior Art Documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 4-158541 [Summary of the Invention]

[0005] [Problem to be solved by the invention] In the aforementioned electrical testing device, since the alignment operation is performed directly on the actual electronic circuit board installed on the electrical testing device, there is a possibility that the probe pins are pressed onto the board, which may cause unnecessary damage to the board.

[0006] Furthermore, because the alignment is performed on the electrical testing device, the electrical testing device cannot perform its original purpose, namely electrical measurement, during this period, which may reduce the operating rate of the device.

[0007] This invention was made based on this situation. The object of this invention is to provide a method for manufacturing a probe unit, a probe unit, a probe mounting body, and an electrical testing device, wherein the front end of the probe pin can be precisely aligned without requiring alignment on an electrical testing device. [Technical Means for Solving the Problem]

[0008] The method for manufacturing a probe unit according to one embodiment of the present invention is a method for manufacturing a probe unit mounted on an electrical inspection device for inspecting the electrical characteristics of an electronic circuit board, and having a probe pin that can contact the surface of the electronic circuit board. The method uses a platform having an alignment mechanism that specifies the position in the electrical inspection device to adjust the relative position and posture of the front end of the probe pin relative to the platform, and fixes the probe pin to the platform while maintaining the relative position.

[0009] An adhesive can be used to fix the above-mentioned probe pins.

[0010] When adjusting the relative position and posture of the front end of the probe pin, an alignment fixture that can align and fix the base by means of the alignment mechanism can be used. The alignment fixture may have a position adjustment mark for adjusting the relative position and posture of the front end of the probe pin relative to the base.

[0011] The above-mentioned position adjustment mark has an electrical pattern with known impedance. When adjusting the relative position and posture of the front end of the above-mentioned probe pin, the above-mentioned relative position and posture can be adjusted by means that the impedance measured by the above-mentioned probe pin is close to the above-mentioned known value.

[0012] The aforementioned base has a position adjustment mechanism that can adjust the position and posture of the front end of the aforementioned probe pin, and a fixing mechanism that can fix the position and posture of the front end of the aforementioned probe pin at a desired position. The aforementioned alignment fixture has a micro-motion mechanism that controls the aforementioned position adjustment mechanism. When adjusting the relative position and posture of the front end of the aforementioned probe pin, the aforementioned position adjustment mechanism can be controlled by the aforementioned micro-motion mechanism.

[0013] Another embodiment of the present invention has a probe unit that can be mounted on an electrical testing device for inspecting the electrical characteristics of an electronic circuit board, and includes: a base having an alignment mechanism that defines the position in the electrical testing device; and a probe pin fixed to the base and capable of contacting the surface of the electronic circuit board; and the base has: a position adjustment mechanism that can adjust the position and orientation of the front end of the probe pin; and a fixing mechanism that can fix the position and orientation of the front end of the probe pin at a desired position.

[0014] A further embodiment of the probe mounting system of the present invention can be mounted on an electrical inspection device for inspecting the electrical characteristics of an electronic circuit board, and includes a probe unit and a probe mounting base for fixing the probe unit; the probe unit includes: a base having an alignment mechanism that defines the position in the electrical inspection device; and a probe pin fixed to the base and capable of contacting the surface of the electronic circuit board; and the probe mounting base has an alignment object of the alignment mechanism.

[0015] The alignment object may be a protrusion protruding from the surface of the probe mounting base, and the alignment mechanism may be a recess or a through hole fitted into the protrusion.

[0016] The above-mentioned base may have a position adjustment mechanism that can adjust the position and posture of the front end of the probe pin, and a fixing mechanism that can fix the position and posture of the front end of the probe pin in the desired position.

[0017] The probe unit described above may be configured to be detachable from the probe mounting substrate described above.

[0018] A further embodiment of the present invention provides an electrical testing apparatus for inspecting the electrical characteristics of an electronic circuit board, and includes a probe unit and a test head for fixing the probe unit; the probe unit includes: a base having an alignment mechanism that defines the position in the electrical testing apparatus; and a probe pin fixed to the base and capable of contacting the surface of the electronic circuit board; the test head includes an alignment object of the alignment mechanism.

[0019] The alignment object may be a protrusion protruding from the surface of the inspection head, and the alignment mechanism may be a recess or a through hole fitted into the protrusion.

[0020] The aforementioned base may have a position adjustment mechanism that can adjust the position and posture of the front end of the aforementioned probe pin, and a fixing mechanism that can fix the position and posture of the front end of the aforementioned probe pin in a desired position.

[0021] The probe unit described above can be configured to be attached to and detached from the inspection head described above. [Effects of the Invention]

[0022] In the manufacturing method of the probe unit of the present invention, since the platform has an alignment mechanism that specifies the position in the electrical inspection device, it is not easy for the position of the platform on the electrical inspection device to shift. Furthermore, in the manufacturing method of the probe unit, the relative position and orientation of the front end of the probe pin relative to the platform are adjusted and fixed. Therefore, if this manufacturing method of the probe unit is used, alignment can be pre-performed by simply mounting the platform on the electrical inspection device, so that the front end of the probe pin can contact the surface of the electronic circuit board, without the need for alignment of the front end of the probe pin on the electrical inspection device.

Implementation Method

[0024] Hereinafter, embodiments of the present invention will be described in detail with appropriate reference to the illustrations. Furthermore, regarding the numerical values ​​recorded in this specification, only one of the recorded upper and lower limits may be used, or any combination of the upper and lower limits may be used.

[0025] [First Embodiment] The method for manufacturing a probe unit according to one embodiment of the present invention is a method for manufacturing a probe unit mounted on an electrical inspection device for inspecting the electrical characteristics of an electronic circuit board. First, a probe unit manufactured by this method, which is itself another embodiment of the present invention, will be described.

[0026] [Probe Unit] The probe unit 1 shown in FIG1 is a probe unit of an electrical inspection device that can be mounted on an electronic circuit board to inspect its electrical characteristics. The probe unit 1 includes a base 10 and a probe pin 11.

[0027] As shown in FIG1, the pedestal 10 has: a rectangular and plate-shaped base 12 in plan view; a first block 13, which is laminated on the base 12; a second block 14, which is laminated on the first block 13; a third block 15, which is laminated on the second block 14; and a fourth block 16, which is laminated on the third block 15.

[0028] Furthermore, the probe pin 11 is fixed to the base 10, configured to contact the surface of the electronic circuit board. In this probe unit 1, the probe pin 11 is fixed to the fourth block 16 of the base 10. Also, as shown in FIG2, the probe pin 11 has a signal probe 11a at its front end and a pair of grounding probes 11b arranged to clamp the signal probe 11a. These three probes in total contact the surface of the electronic circuit board to check electrical characteristics. However, the number of probes is an example; in this invention, the number of probes is not limited to three.

[0029] In the probe unit 1, the base 10 has: an alignment mechanism that defines the position in the above-mentioned electrical inspection device; a position adjustment mechanism that can adjust the position and posture of the front end of the probe pin 11; and a fixing mechanism that can fix the position and posture of the front end of the probe pin 11 at the desired position.

[0030] (Alignment Mechanism) The alignment mechanism described above is formed on the base 12 of the platform 10. Specifically, as shown in FIG. 1, the alignment mechanism is formed by a pair of through holes 12a. These through holes 12a are configured to fit into the protrusion 21 in the probe mount 2 described later or the protrusion in the electrical testing device. Alternatively, the alignment mechanism may be formed by fitting into the recess of the protrusion instead of the through holes 12a.

[0031] The alignment mechanism described above can also be implemented with a single through hole 12a. However, when implemented with a single through hole 12a, there is a risk that the platform 10 may still rotate easily after alignment. Although the method of suppressing rotation by making the top view shape of the through hole 12a polygonal (e.g., triangular or rectangular) is also considered, it is preferable to provide a plurality of through holes 12a. By providing a plurality of through holes 12a, the rotation of the platform 10 can be suppressed more reliably. Among these, it is even more preferable to make the above alignment mechanism a pair of through holes 12a. If it is composed of three or more through holes 12a, the platform 10 becomes larger, which may reduce the operability of the probe unit 1.

[0032] Furthermore, if the base 10 is only fitted into the above-mentioned protrusion, there is a risk that the base 10 may fall off due to force majeure during the inspection. Therefore, the base 10 is preferably a mechanism that is fixed in such a way as by means of base fixing screw 12c so as not to fall off from the above-mentioned electrical inspection device.

[0033] (Position Adjustment Mechanism) The aforementioned position adjustment mechanism in the probe unit 1 is composed of a base 12 and a first block 13 to a fourth block 16. This configuration will be described below.

[0034] On the substrate 12, a first track portion 12b extending throughout the width direction is provided on the side of the first laminated block 13, and a first notch 13a fitting into the first track portion 12b is provided on the first block 13. Through this fitting, the first block 13 can move in the width direction of the substrate 12, allowing for positional adjustment in the width direction relative to the substrate 12. Since the second block 14 to the fourth block 16 are directly or indirectly laminated onto the first block 13, the entire first block 13 to the fourth block 16 can be positionally adjusted in the width direction relative to the substrate 12. Consequently, the probe pin 11 fixed to the fourth block 16 can also be positionally adjusted in the width direction relative to the substrate 12.

[0035] A second track portion 13b extending along the length of the substrate 12 is provided on the side of the second block 14 laminated to the first block 13. A second notch 14a is provided on the second block 14 that fits into the second track portion 13b. By fitting the two together, the second block 14 can move along the length of the substrate 12 and can be adjusted in position relative to the substrate 12 in the length direction. Since the third block 15 and the fourth block 16 are laminated directly or indirectly on the second block 14, the entire second block 14 to the fourth block 16 can be adjusted in position relative to the substrate 12 in the length direction. The probe pin 11 fixed to the fourth block 16 can also be adjusted in position relative to the substrate 12 in the length direction.

[0036] A protrusion 14b protruding along the length of the substrate 12 is provided on the second block 14. A third block 15 is laminated on the protrusion 14b. The lamination surface of the protrusion 14b on which the third block 15 is laminated is an arch shape with a central elevation relative to the width of the substrate 12. The third block 15 is configured to slide on the aforementioned lamination surface relative to the width of the substrate 12. If the third block 15 is slid, it can be tilted relative to the width of the substrate 12. This tilting causes the probe pin 11 to rotate around its central axis via the fourth block 16, thereby adjusting the contact state of one signal probe 11a and a pair of ground probes 11b with the surface (pin contact position) of the electronic circuit board.

[0037] The central axis of the aforementioned arch (the imaginary central axis of the aforementioned layer) is preferably located on a plane parallel to the bottom surface of the base 12, passing through the front end of the probe pin 11, and is arranged parallel to the track of the second track portion 13b. Because the aforementioned layer can be constructed in this way, the contact state of the probe pin 11 can be adjusted with the front end of the probe pin 11 as the center, thus reducing the variation in the coordinate position of the front end of the probe pin 11. That is, because the coordinate position and contact state of the front end of the probe pin 11 can be adjusted independently, the position adjustment of the probe pin 11 can be easily performed. Furthermore, "front end" includes not only the exact front end position but also its vicinity. Also, "parallel" includes not only exact parallelism but also, for example, a situation accompanied by an inclination of ±3 degrees or less.

[0038] With the above configuration, the probe pin 11 can be adjusted in the width and length directions relative to the substrate 12 and in the contact state with the surface of the electronic circuit board. Furthermore, when it is necessary to adjust the height direction relative to the substrate 12, for example, adjustment can be made by inserting a desired height adjustment plate between the third block 15 and the fourth block 16.

[0039] (Fixing Mechanism) The aforementioned fixing mechanism in the probe unit 1 is composed of fixing screws. Specifically, the aforementioned fixing mechanism is composed of the following: a first fixing screw 13c, which fixes the first block 13 to the base 12; a second fixing screw 14c, which fixes the second block 14 to the first block 13; a third fixing screw 15c, which fixes the third block 15 to the second block 14; and a fourth fixing screw 16c, which fixes the fourth block 16 to the third block 15.

[0040] For example, if the first fixing screw 13c is loosened, the first block 13 can be adjusted relative to the base 12. If the first fixing screw 13c is tightened, the first block 13 is fixed and cannot move relative to the base 12.

[0041] Multiple fixing screws may be provided depending on the size of the block to be fixed. In the probe unit 1 shown in Figure 1, two first fixing screws 13c are provided.

[0042] Since the position and posture of the front end of the probe pin 11 can be pre-adjusted, the probe unit 1 does not need to be readjusted after it is installed in the electrical inspection device.

[0043] [Probe Mounting Body] As shown in FIG3, the probe unit 1 can be mounted on an electrical testing device via the probe mounting body 2. The probe mounting body 2 is another embodiment of the present invention.

[0044] The probe mount 2 is a probe mount of an electrical testing device that can be installed on the electrical characteristics of an electronic circuit board Y. For example, as shown in FIG3, the probe mount 2 is installed on the probe mount mounting part X of the electrical testing device and can check the electrical characteristics of the electronic circuit board Y.

[0045] The probe mount 2 includes a probe unit 1 and a probe mounting base 20 for fixing the probe unit 1.

[0046] <Probe Unit> The probe unit 1 is the probe unit of the present invention as shown in FIG. 1 above. That is, the probe unit 1 includes: a base 10 having an alignment mechanism that defines the position in the above-mentioned electrical inspection device; and a probe pin 11 fixed to the base 10 and capable of contacting the surface of the electronic circuit board Y. Furthermore, the base 10 includes: a position adjustment mechanism that can adjust the position and orientation of the front end of the probe pin 11; and a fixing mechanism that can fix the position and orientation of the front end of the probe pin 11 at a desired position. Since the alignment mechanism, the position adjustment mechanism, and the fixing mechanism can be configured in the same way as the probe unit 1 shown in FIG. 1, detailed descriptions are omitted.

[0047] In the probe unit 1, since the position and posture of the front end of the probe pin 11 are relatively easy to be finely adjusted, the relative position and posture of the probe mounting body 2 or even the electrical inspection device can be adjusted with high precision and effectiveness.

[0048] The probe unit 1 is preferably configured to be detachable from the probe mounting substrate 20. For example, in the probe mounting body 2 shown in FIG. 3, a maximum of 12 probe units 1 can be mounted, and 6 of them are mounted in FIG. 3. If the probe unit 1 is detachable, the mounting position or number of probe units 1 can be changed while using the same probe mounting substrate 20, depending on the configuration of the electronic circuit board Y. Therefore, one probe mounting body 2 can be used for multiple types of electronic circuit boards Y.

[0049] <Probe Mounting Base> The probe mounting base 20 includes the alignment object of the alignment mechanism described above. When the alignment mechanism of the probe unit 1 shown in FIG. 1 is a through hole 12a, the alignment object, as shown in FIG. 3, is a protrusion 21 protruding from the surface of the probe mounting base 20, and the through hole 12a is fitted into the protrusion 21. By constructing the alignment mechanism and alignment object in this way, alignment can be easily performed, and the probe unit 1 can be mounted on the probe mounting base 20 with good accuracy.

[0050] Furthermore, the probe mounting base 20 has a screw hole 22 for fixing the probe unit 1. By fastening the base fixing screw 12c to the screw hole 22, the base 10 of the probe unit 1 is fixed to the probe mounting base 20, which can prevent the probe unit 1 from falling off the probe mounting base 20 due to force majeure or other reasons during the inspection.

[0051] As shown in FIG. 3, in the probe mount 2, the electronic circuit board Y is located on the side opposite to the surface on which the probe unit 1 is mounted on the probe mount base 20. Therefore, the probe mount base 20 is configured to have an access hole 23, through which the probe pin 11 passes and contacts the surface of the electronic circuit board Y. Furthermore, in the probe mount 2 shown in FIG. 3, although one access hole 23 is prepared for each probe unit 1, one access hole 23 can also be prepared for multiple probe units 1. In this case, the access hole 23 is prepared across multiple probe units 1, and multiple probe pins 11 pass through one access hole 23 in parallel.

[0052] When the probe unit 1 of the present invention is installed in an electrical inspection device, an alignment object with the above-mentioned alignment mechanism is required. However, by installing the probe unit 1 of the present invention in an electrical inspection device without an alignment object, the probe unit 1 of the present invention can also be mounted on an existing electrical inspection device that does not have an alignment object by means of the probe mounting body 2.

[0053] [Manufacturing method of probe unit] The manufacturing method of probe unit is a method of manufacturing probe unit having probe pin 11 that can contact the surface of electronic circuit board, and using a base 10 having an alignment mechanism that specifies the position in the above-mentioned electrical inspection device.

[0054] The manufacturing method of the probe unit is shown in FIG4. The relative position and posture of the front end of the probe pin 11 relative to the base 10 are adjusted (S1), and the probe pin 11 is fixed to the base 10 while maintaining the above relative position (S2).

[0055] <S1> In the manufacturing method of the probe unit, as shown in FIG5 and FIG6, when adjusting the relative position and posture of the front end of the probe pin 11, an alignment fixture 3 can be used to align and fix the base 10 by means of the above-mentioned alignment mechanism.

[0056] The alignment fixture 3 includes: a fixture base 30; an alignment object (protrusion 31) of the alignment mechanism of the probe unit 1; a micro-motion mechanism (first micrometer 33, second micrometer 34 and third micrometer 35) that controls the position adjustment mechanism of the probe unit 1; and a position adjustment mark 36 that is used to adjust the relative position and posture of the front end of the probe pin 11 relative to the base 10 (the alignment mechanism of the base 10).

[0057] (Alignment Object) The alignment object described above imitates the alignment object used when mounting the probe unit 1 on an electrical testing device. For example, when the probe unit 1 manufactured by the same method is mounted on the probe mounting body 2 shown in FIG3, the alignment object provided on the alignment fixture 3 has the same configuration as the alignment object provided on the probe mounting body 2. That is, the alignment object provided on the alignment fixture 3 is a protrusion 31 protruding from the surface of the fixture base 30, and the through hole 12a fits into the protrusion 31. Furthermore, since the probe mounting base 20 has a screw hole 22 for fixing the probe unit 1, a screw hole 32 for fixing the probe unit 1 is also provided on the fixture base 30.

[0058] (Micro-motion mechanism) The micro-motion mechanism described above in the alignment fixture 3 shown in Figures 5 and 6 comprises a first micrometer 33, a second micrometer 34, and a third micrometer 35. In the manufacturing method of this probe unit, when adjusting the relative position and orientation of the front end of the probe pin 11, the position adjustment mechanism is controlled by the micro-motion mechanism. By using the micro-motion mechanism in this way, it is easier to finely adjust the position and orientation of the front end of the probe pin 11, thus enabling high-precision and efficient adjustment of the relative position and orientation.

[0059] The front end of the first micrometer 33 is connected to the side of the first block 13 of the base 10 of the probe unit 1, and the first block 13 can be pressed towards the width direction of the base 12. This allows the front end of the probe pin 11 to move slightly in the width direction of the base 12.

[0060] The front end of the second micrometer 34 is connected to the rear surface of the second block 14 of the base 10 of the probe unit 1, and the second block 14 can be pressed along the length direction of the base 12. In this way, the front end of the probe pin 11 can be slightly moved along the length direction of the base 12.

[0061] The front end of the third micrometer 35 is in contact with the side of the third block 15 of the base 10 of the probe unit 1, and the third block 15 can be pressed in the width direction of the base 12. In the third block 15, as described above, the surface of the protrusion 14b for the third block 15 to be stacked is an arch shape that is raised in the center in the width direction of the base 12. Therefore, if the third block 15 is pressed by the third micrometer 35, the probe pin 11 can be rotated around its central axis.

[0062] As described above, the relative position of the front end of the probe pin 11 can be adjusted using the micro-motion mechanism described above, using the first micrometer 33 and the second micrometer 34, and the posture of the front end of the probe pin 11 can be adjusted using the third micrometer 35. Furthermore, in the embodiment shown in FIG1, although each micrometer is configured to be adjusted by pressing each block, each micrometer can also be constructed to be push-pullable. By adopting a push-pullable construction, position adjustment can be made easier.

[0063] (Position Adjustment Mark) The position adjustment mark 36 is configured such that its relative position as observed from the alignment object is the same as the pin contact position on the surface of the electronic circuit board as observed from the alignment object in the electrical inspection device. With this configuration, if the probe unit 1, whose relative position and orientation of the probe pin 11 has been adjusted by properly contacting the position adjustment mark 36 on the alignment fixture 3, is mounted on the electrical inspection device, it will not require further position or orientation adjustments and will properly contact the surface of the electronic circuit board. Therefore, by using the alignment fixture 3, the alignment of the probe pin 11's front end can be performed with high precision before mounting the probe unit 1 on the electrical inspection device.

[0064] Position adjustment marks 36, as shown in Figure 2, are prepared for each probe. The smaller the size of the position adjustment mark 36, the higher the adjustment accuracy; however, on the other hand, the smaller it is, the more difficult it is to adjust. Therefore, the position adjustment mark 36 adopts the smallest adjustable size, for example, the position adjustment mark 36 can be set to a rectangular shape with a width of 0.1 mm to 0.2 mm and a length of 0.3 mm to 0.5 mm.

[0065] In S1, although the relative position and posture of the front end of the probe pin 11 are adjusted by making the front end of the probe pin 11 appropriately contact the position adjustment mark 36, such adjustment can be made, for example, by visually inspecting the front end of the probe pin 11 with a microscope.

[0066] To achieve higher precision adjustment, an electrical pattern with a known impedance can be used as a position adjustment mark 36. In this case, when adjusting the relative position and orientation of the front end of the probe pin 11, the relative position and orientation can be adjusted by making the impedance measured by the probe pin 11 close to the aforementioned known value.

[0067] If a known impedance is measured by probe unit 1 with its relative position and orientation correctly adjusted, the measurement result should be a known value. It is believed that if the relative position and orientation are adjusted in a manner that makes the impedance close to the known value, high-precision adjustment can be achieved.

[0068] The above-mentioned electrical pattern can be set as one type, but multiple types can also be prepared. By sequentially replacing these multiple electrical patterns, the impedance measured by the probe pin 11 can be confirmed, and adjustments can be made with higher precision. When using multiple electrical patterns, the above-mentioned relative position and posture can be adjusted using the initial electrical pattern. The second and subsequent electrical patterns are used for verification of the probe unit 1 after the probe pin 11 is fixed to the base 10 (S2).

[0069] In addition, when adjusting the relative position and posture of the front end of the probe pin 11 relative to the base 10, the adjustment is performed with the fixing mechanism of the probe unit 1, namely the first fixing screw 13c to the fourth fixing screw 16c, loosened.

[0070] <S2> The probe pin 11 is fixed to the base 10 by tightening the fixing mechanism of the probe unit 1, namely the first fixing screw 13c to the fourth fixing screw 16c. By fixing the probe unit 1 to the base 10, even if the probe unit 1 is removed from the alignment fixture 3, changes in the relative position or posture of the probe pin 11 can be suppressed. Therefore, when the probe unit 1 is mounted on the electrical inspection device, the position or posture does not need to be adjusted again, and it can be properly contacted on the surface of the electronic circuit board.

[0071] As described above, a probe unit 1 can be manufactured after adjusting the relative position or orientation of the probe pin 11.

[0072] [Second Embodiment] Another embodiment of the present invention is a method for manufacturing a probe unit mounted on an electrical inspection device for inspecting the electrical characteristics of an electronic circuit board. The method is as follows: a probe unit having a probe pin 11 that can contact the surface of the electronic circuit board is used. As shown in FIG7 and FIG8, a base 17 having an alignment mechanism that specifies the position in the electrical inspection device is used. As shown in FIG4, the relative position and posture of the probe pin 11 relative to the base 17 are adjusted (S1), and the probe pin 11 is fixed to the base 17 while maintaining the relative position (S2).

[0073] <Probe Unit> The probe unit 4 shown in FIG7 is manufactured using the manufacturing method of the probe unit. The probe unit 4 is the same as the probe unit 1 of the first embodiment, and can be mounted on the electrical inspection device via a probe mount or directly.

[0074] In the probe unit 4 shown in FIG7, a base 17 is integrally formed. In addition, although it does not prevent the base 17 of the probe unit 4 from being composed of a plurality of blocks, the relative positions between the plurality of blocks are fixed.

[0075] As shown in FIG. 7, the alignment mechanism of the base 17 consists of a pair of through holes 12a. Furthermore, the base 17 has a mechanism for being fixed in a manner that prevents it from falling off the aforementioned electrical testing device by means of base fixing screws 12c. Since the through holes 12a and base fixing screws 12c can be configured in the same way as the probe unit 1 in the first embodiment, detailed descriptions are omitted.

[0076] As shown in FIG7, the probe unit 4 has a plurality of probe pins 11 (3 in FIG7), which are fixed to the base 17 by an adhesive layer 18.

[0077] <S1> In the manufacturing method of the probe unit, for example, a manipulator is used to position a plurality of probe pins 11 in such a way that the relative position of the front end of the probe pin 11 with respect to the alignment mechanism is the same as the pin contact position on the surface of the electronic circuit board observed by the alignment object in the self-electrical testing device.

[0078] For this alignment, an alignment fixture can be used in the same manner as in the first embodiment. The alignment fixture described above includes: a fixture base; an alignment object for the alignment mechanism of the probe unit 4; and position adjustment marks for adjusting the relative position and posture of the front ends of the probe pin 11. Furthermore, the alignment fixture described above does not require a micro-motion mechanism. Since other components are configured in the same way as the alignment fixture 3 of the first embodiment, detailed descriptions are omitted.

[0079] When using a manipulator, a method can be adopted to identify the coordinates of the alignment mechanism, such as the coordinates of the center of the through hole 12a, and control the probe pin 11 to the desired position and angle starting from those coordinates. In this case, no alignment fixture is required.

[0080] As shown in Figure 8, a guide rail 17a can be provided on the portion of the base 17 that holds the probe pin 11 to guide the probe pin 11. The number of guide rails 17a is the same as the number of probe pins 11. That is, one guide rail 17a is provided for each probe pin 11. By providing the guide rails 17a in this way, the relative position and posture of the front ends of multiple probe pins 11 can be adjusted simultaneously and with good precision.

[0081] <S2> In the manufacturing method of this probe unit, an adhesive is used to fix the probe pins 11. As shown in FIG7, when one probe unit 4 has a plurality of probe pins 11, the spacing between the probe pins 11 tends to become narrow. When the spacing between adjacent probe pins 11 is narrow, for example, if screw tightening is required, it may be difficult to securely fix each probe pin 11. In this regard, by using an adhesive, the probe pins 11 can be easily fixed even when the spacing between adjacent probe pins 11 is narrow.

[0082] Preferably, the adhesive used is a transient adhesive. By using a transient adhesive, the time required to maintain the relative position can be shortened, and the occurrence of positional deviation of the probe pin 11 can be suppressed. More preferably, the adhesive used is a UV-curing transient adhesive. Because the curing start of a UV-curing transient adhesive can be controlled by UV irradiation, the probe pin 11 can be quickly fixed after the relative position and posture of the front end of the probe pin 11 have been adjusted.

[0083] [Other Embodiments] The above embodiments are not intended to limit the composition of the present invention. Therefore, the above embodiments may omit, substitute, or add constituent elements of each part of the above embodiments based on the description in this specification and common technical knowledge, and all of such omissions and substitutions should be interpreted as falling within the scope of the present invention.

[0084] In the first embodiment described above, although it has been described that the base is composed of a rectangular, plate-shaped base in plan view and four blocks, the configuration and the shape of each component are not limited to the above configuration. Other configurations may also be adopted as long as the base has the following mechanisms: an alignment mechanism that specifies the position in the electrical testing device; a position adjustment mechanism that can adjust the position and posture of the front end of the probe pin; and a fixing mechanism that can fix the position and posture of the front end of the probe pin in the desired position.

[0085] In the above embodiments, although it has been described that the alignment object is a protrusion protruding from the surface of the probe mounting base or the electrical testing device, and the alignment mechanism of the probe unit is fitted into the recess or through hole of the protrusion, other configurations may also be adopted. For example, the alignment mechanism of the probe unit may be a protrusion, and the alignment object of the probe mounting base or the electrical testing device may be a recess.

[0086] In the above embodiments, although the case where the fixing mechanism is composed of a fixing screw has been described, the fixing mechanism is not limited to this. Other fixing mechanisms include, for example, a clamping fixing mechanism for an eccentric cam, a latch such as a pawl, and a latch that is pressed against by a spring.

[0087] In the above embodiments, although the case of mounting the probe unit of the present invention to the electrical testing device via a probe mount has been described, the probe unit of the present invention can also be directly mounted to the electrical testing device. An electrical testing device that directly mounts the probe unit of the present invention is another embodiment of the present invention. That is, the electrical testing device of another embodiment of the present invention is an electrical testing device for inspecting the electrical characteristics of an electronic circuit board, and includes a probe unit and a testing head for fixing the probe unit. The probe unit includes: a base having an alignment mechanism that defines the position in the electrical testing device; and a probe pin fixed to the base and capable of contacting the surface of the electronic circuit board; the testing head has an alignment object of the alignment mechanism.

[0088] In this electrical inspection device, by directly mounting the probe unit on the electrical inspection device without passing through the probe mounting base, the influence of the manufacturing tolerance of the probe mounting base can be eliminated, and therefore it is not easy for errors to occur in the relative position and posture of the probe pin after adjustment.

[0089] Preferably, the alignment object is a protrusion protruding from the surface of the inspection head, and the alignment mechanism is fitted into the recess or through hole of the protrusion. By configuring the alignment mechanism and alignment object in this way, alignment can be easily achieved, and the probe unit can be installed in the electrical inspection device with good accuracy.

[0090] Preferably, the aforementioned base has a position adjustment mechanism for adjusting the position and orientation of the tip of the probe pin, and a fixing mechanism for fixing the position and orientation of the tip of the probe pin at a desired position. That is, the aforementioned base is preferably configured the same as the probe unit 1 shown in FIG1. ​​In the probe unit 1 shown in FIG1, since the fine adjustment of the position and orientation of the tip of the probe pin 11 is relatively easy, the adjustment of the relative position and orientation in the electrical inspection device can be carried out with high precision and efficiency.

[0091] Preferably, the probe unit is configured to be detachable from the inspection head. If the probe unit is detachable, the mounting position or number of the probe units can be changed while using the same electrical inspection device, depending on the configuration of the electronic circuit board. Therefore, one electrical inspection device can be used for multiple types of electronic circuit boards. [Industrial Applicability]

[0092] As described above, in the manufacturing method of the probe unit, the probe unit, the probe mounting body and the electrical inspection device of one embodiment of the present invention, the front end of the probe pin can be aligned with high precision without the need for alignment on the electrical inspection device. [Simplified Explanation of the Diagram]

[0023] FIG1 is a schematic perspective view showing a probe unit according to one embodiment of the present invention. FIG2 is a schematic enlarged view showing the front end portion of the probe pin of FIG1. ​​FIG3 is a schematic perspective view showing a probe mount on which the probe unit of FIG1 is mounted. FIG4 is a flowchart showing a manufacturing method of the probe unit according to one embodiment of the present invention. FIG5 is a schematic perspective view showing the alignment fixture used in manufacturing the probe unit of FIG1. ​​FIG6 is a schematic perspective view showing the state in which the probe unit of FIG1 is mounted on the alignment fixture of FIG5. FIG7 is a schematic perspective view showing a probe unit according to an embodiment different from FIG1. ​​FIG8 is a schematic partial perspective view showing the state of the probe unit of FIG7 during manufacturing.

Claims

1. A method for manufacturing a probe unit comprising an electrical inspection device mounted on an electronic circuit board for inspecting its electrical characteristics, and a probe unit having a probe pin capable of contacting the surface of the electronic circuit board, wherein the method uses a platform having an alignment mechanism that defines the position in the electrical inspection device, adjusts the relative position and orientation of the tip of the probe pin relative to the platform, fixes the probe pin to the platform while maintaining the relative position, and, when adjusting the relative position and orientation of the tip of the probe pin, uses an alignment fixture capable of aligning and fixing the platform by the alignment mechanism, the alignment fixture having a position adjustment mark for adjusting the relative position and orientation of the tip of the probe pin relative to the platform, the position adjustment mark having an electrical pattern having a known impedance, and adjusting the relative position and orientation of the tip of the probe pin by adjusting the impedance measured by the probe pin in a manner close to the known value.

2. The method for manufacturing the probe unit as claimed in claim 1, wherein an adhesive is used to fix the probe pin.

3. A probe unit, which is an electrical inspection device for inspecting the electrical characteristics of an electronic circuit board, and comprises: a base having an alignment mechanism that defines the position in the electrical inspection device; and a probe pin fixed to the base and capable of contacting the surface of the electronic circuit board; and the base having: a position adjustment mechanism that can adjust the position and orientation of the tip of the probe pin; and a fixing mechanism that can fix the position and orientation of the tip of the probe pin at a desired position. When adjusting the relative position and orientation of the tip of the probe pin, an alignment fixture is used to align and fix the base by means of the alignment mechanism. The alignment fixture has a position adjustment mark for adjusting the relative position and orientation of the tip of the probe pin relative to the base. The position adjustment mark has an electrical pattern having a known impedance. When adjusting the relative position and orientation of the tip of the probe pin, the relative position and orientation are adjusted in such a way that the impedance measured by the probe pin is close to the known value.

4. A probe mount for use in an electrical testing apparatus for inspecting the electrical characteristics of an electronic circuit board, comprising: a probe unit; and a probe mounting base for fixing the probe unit; wherein the probe unit comprises: a base having an alignment mechanism defining a position in the electrical testing apparatus; and a probe pin fixed to the base and capable of contacting the surface of the electronic circuit board; wherein the probe mounting base has an alignment object for the alignment mechanism, and when adjusting the relative position and orientation of the tip of the probe pin, an alignment fixture is used to align and fix the base by means of the alignment mechanism, the alignment fixture having a position adjustment mark for adjusting the relative position and orientation of the tip of the probe pin relative to the base, the position adjustment mark having an electrical pattern having a known impedance, and when adjusting the relative position and orientation of the tip of the probe pin, the relative position and orientation are adjusted such that the impedance measured by the probe pin is close to the known value.

5. The probe mount as claimed in claim 4, wherein the alignment object is a protrusion protruding from the surface of the probe mount base, and the alignment mechanism is fitted into a recess or through hole of the protrusion.

6. The probe mount as claimed in claim 4, wherein the base has: a position adjustment mechanism that can adjust the position and orientation of the front end of the probe pin; and a fixing mechanism that can fix the position and orientation of the front end of the probe pin in a desired position.

7. The probe mount as claimed in claim 4, wherein the probe unit is configured to be detachable relative to the probe mount base.

8. An electrical testing apparatus for inspecting the electrical characteristics of an electronic circuit board, comprising: a probe unit; and a testing head for fixing the probe unit; wherein the probe unit comprises: a base having an alignment mechanism defining a position in the electrical testing apparatus; and a probe pin fixed to the base and capable of contacting the surface of the electronic circuit board; wherein the testing head has an alignment object of the alignment mechanism, and when adjusting the relative position and orientation of the tip of the probe pin, an alignment fixture is used to align and fix the base by means of the alignment mechanism, the alignment fixture having a position adjustment mark for adjusting the relative position and orientation of the tip of the probe pin relative to the base, the position adjustment mark having an electrical pattern having a known impedance, and when adjusting the relative position and orientation of the tip of the probe pin, the relative position and orientation are adjusted in such a way that the impedance measured by the probe pin is close to the known value.

9. The electrical testing device of claim 8, wherein the alignment object is a protrusion protruding from the surface of the testing head, and the alignment mechanism is fitted into a recess or through hole of the protrusion.

10. The electrical testing apparatus of claim 8, wherein the base has: a position adjustment mechanism for adjusting the position and orientation of the front end of the probe pin; and a fixing mechanism for fixing the position and orientation of the front end of the probe pin at a desired position.

11. The electrical testing apparatus of claim 8, wherein the probe unit is configured to be detachable relative to the testing head.

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