Temperature control system for electroplating process

TWI942405BActive Publication Date: 2026-10-11KNOWLEDGE CREATION INNOVATION HOLDINGS CO LTD
View PDF 3 Cites 0 Cited by

Patent Information

Application Number
TW114127718
Authority / Receiving Office
TW · TW
Patent Type
Patents
Current Assignee / Owner
Filing Date
2025-07-22
Publication Date
2026-10-11
Estimated Expiration
2045-07-21

Smart Images

  • Figure TWG2TB001915582_001
    Figure TWG2TB001915582_001
  • Figure TWG2TB001915582_002
    Figure TWG2TB001915582_002
  • Figure TWG2TB001915582_003
    Figure TWG2TB001915582_003
Patent Text Reader

Abstract

This invention provides a temperature control system for an electroplating process, comprising a control system and an electroplating tank. The electroplating tank system includes a main body, a plurality of perturbation motors, and a plurality of temperature sensors. Each temperature sensor is respectively disposed on the surface of each perturbation motor and transmits real-time temperature data back to the control system to determine whether it is normal. When the temperature is abnormal, the control system issues an alarm to monitor the temperature of the perturbation motors in real time, which can effectively prevent overheating damage and unannounced process interruptions, thereby improving yield and stability.
Need to check novelty before this filing date? Find Prior Art

Claims

1. A temperature control system for an electroplating process, signal-connected via a control system, comprising: an electroplating tank system, comprising: a body, which is tank-shaped, having an opening at one end; a perturbation motor, a perturbation part of which extends into the body through the opening and receives commands from the control system; and a plurality of temperature sensors disposed on one surface of the perturbation motor and signal-connected to the control system, wherein... The temperature sensor monitors the temperature of the perturbation motor in real time and provides temperature data to the control system; and a crane, movable and positioned adjacent to the electroplating tank system, is used to carry a wafer therein. After receiving the temperature data, the control system determines whether the temperature data exceeds a threshold and decides to issue a command to the motor or the crane; and when the temperature data does not exceed the threshold, the control system issues a command to start the crane to place the wafer into the body of the electroplating tank system.

2. The temperature control system for the electroplating process as described in claim 1, wherein the disturbance motor comprises: a motor portion, each of the motor portions being disposed outside the opening end of the body and evenly distributed near the side of the body, and signal-connected to the control system; and a disturbance portion extending from the disturbance motor toward the body and deeply disposed in the electroplating solution of the body, the disturbance portion being aligned with the motor portion on the same axis, and further, cooperating with the drive of the motor portion to rotate around the axis or reciprocate along the axis to promote the flow of the electroplating solution in the body.

3. The temperature control system for the electroplating process as described in claim 2, wherein the temperature sensor is aligned with one of the surfaces of the perturbation motor to detect the highest temperature generated by the perturbation motor due to the operation of the motor unit.

4. The temperature control system for the electroplating process as described in claim 2, wherein the disturbance part is a rod-shaped or sheet-shaped structure.

5. A temperature control system for the electroplating process as described in claim 1, wherein the control system signals are connected in series or in parallel to each of the temperature sensors of the body.

6. The temperature control system for the electroplating process as described in claim 1, wherein the signal connection method includes Modbus RS-485, Modbus RS-422, Modbus RS-232, TCP / IP, IO Link, CAN Bus, Ethernet UART, Bluetooth, Wi-Fi or LoRa.

7. A temperature control system for the electroplating process as described in claim 1, wherein the control system analyzes and converts the temperature data into temperature curves and historical records.

8. The temperature control system for the electroplating process as described in claim 1, which issues an alarm when it determines that the temperature data is abnormal.

9. A temperature control system for an electroplating process, signal-connected via a control system, comprising: an electroplating tank system, comprising: a plurality of bodies, each body having an opening at one end; each body being provided with at least one agitation motor, agitation portion of each agitation motor extending into its corresponding body through the opening and receiving commands from the control system; and at least one temperature sensor being respectively disposed on one surface of each agitation motor and signal-connected to the control system, wherein... Each temperature sensor monitors the temperature of each perturbation motor in real time and provides temperature data of each perturbation motor to the control system; and a crane, movable and positioned adjacent to a plurality of bodies, for carrying a wafer therein; After receiving the temperature data, the control system determines whether each temperature data exceeds a corresponding threshold and decides to issue a command to the motor or the overhead crane. When the temperature data does not exceed the threshold, the control system will issue a command to start the overhead crane to place the wafer into the body of the electroplating tank system.

10. A temperature control system for an electroplating process as described in claim 9, wherein the temperature sensor is connected in series or in parallel between the bodies.

11. The temperature control system for the electroplating process as described in claim 1 or 9, wherein the steps of using the temperature control system for the electroplating process include the following: the temperature sensor transmits the temperature data of the perturbation motor to the control system; the control system determines whether the temperature data is abnormal; when the control system determines that the temperature data is normal, it starts the electroplating process and places the crane carrying the wafer into the body; and the control system starts the perturbation motor to begin operation until the process is completed.

12. The temperature control system for the electroplating process as described in claim 9, which will issue an alarm when the control system determines that the temperature data is abnormal.

Citation Information

Patent Citations

  • Monitoring surface oxide on seed layers during electroplating

    CN110622288A

  • Methods of reducing or eliminating deposits in an electroplating system

    TW202442944A

  • Liquid treatment using thin liquid layer

    US20040065540A1