Substrate processing system carrier

Abstract

A carrier includes a rigid body and a plurality of fasteners. The rigid body forms a plurality of openings, and the plurality of fasteners are configured to be removably attached to the rigid body via the plurality of openings. A first set of fingers is configured to be removably attached to the rigid body via the plurality of fasteners and the plurality of openings. The first set of fingers is configured to support a first content during a first transport of the carrier within a substrate processing system. A second set of fingers is configured to be removably attached to the rigid body via the plurality of fasteners and the plurality of openings. The second set of fingers is configured to support a second content during a second transport of the carrier within the substrate processing system.

Description

Technical Field

[0001] Specific embodiments of this disclosure relate to apparatus and methods for transferring content, and more particularly to carriers for transferring content, such as processing kit rings in substrate processing systems. Prior Technology

[0002] In semiconductor processing and other electronic processing, platforms are frequently used that employ robotic arms to transport objects such as wafers between processing chambers from storage areas (e.g., front-open wafer transfer cassettes (FOUPs)) to processing chambers, from processing chambers to storage areas, and so on. Summary of the Invention

[0003] The following is a simplified summary of the disclosure to provide a basic understanding of some aspects of the disclosure. This summary is not a comprehensive overview of the disclosure. It is not intended to identify key or essential elements of the disclosure, nor is it intended to depict any scope of any particular embodiment of the disclosure or any claim. The sole purpose of this summary is to present some concepts of the disclosure in a simplified form as a prelude to the more detailed description that follows.

[0004] One embodiment of this disclosure is a carrier comprising a rigid body and a plurality of fasteners. The rigid body forms a plurality of openings, and the plurality of fasteners are configured to be removably attached to the rigid body via the plurality of openings. A first set of fingers is configured to be removably attached to the rigid body via the plurality of fasteners and the plurality of openings. The first set of fingers is configured to support a first content during a first transport of the carrier within a substrate processing system. A second set of fingers is configured to be removably attached to the rigid body via the plurality of fasteners and the plurality of openings. The second set of fingers is configured to support a second content during a second transport of the carrier within the substrate processing system.

[0005] Another embodiment of this disclosure is a finger configured to be removably attached to a carrier of a substrate processing system. The finger includes a first upper surface and a second upper surface, the first upper surface substantially disposed in a first plane, and the second upper surface substantially disposed in a second plane above the first plane. The first upper surface is configured to support contents during carrier transport. The finger further includes sidewalls disposed between the first and second upper surfaces. The finger further includes a lower surface. A first opening is formed through the finger from the second upper surface to the lower surface. The lower surface forms a recess to receive a portion of the carrier forming the second opening. The finger is attached to the carrier by fasteners inserted through the first opening of the finger and the second opening of the carrier.

[0006] Another aspect of this disclosure is a method comprising: determining a first condition associated with a first transport in a substrate processing system; and identifying a first set of fingers corresponding to the first condition. The method further comprises attaching the first set of fingers to a rigid body of a carrier via a plurality of fasteners, and placing a first content onto the first set of fingers for transport via the carrier in the substrate processing system. Simple Explanation of the Diagram

[0007] The present disclosure is illustrated by way of example and not limitation in the accompanying drawings, in which the same reference numerals indicate similar elements. It should be noted that different references to "a" or "an" specific embodiment in this disclosure do not necessarily refer to the same specific embodiment, and such references imply at least one specific embodiment.

[0008] Figure 1 illustrates a processing system according to certain specific embodiments.

[0009] Figures 2A-N show views of a carrier according to certain specific embodiments.

[0010] Figures 3A-B illustrate the fingers of a carrier according to certain specific embodiments.

[0011] Figures 4A-F illustrate the fingers and fasteners of the carrier according to certain specific embodiments.

[0012] Figure 5 illustrates a method of using a carrier according to certain specific embodiments. Implementation

[0013] The specific embodiments described herein relate to a substrate processing system carrier. A particular embodiment relates to a carrier configured to carry processing kit rings (e.g., edge rings) and / or other chamber components between stations in a substrate processing system. The carrier is picked up, moved, and placed by a robotic arm configured to pick up, move, and place substrates such as wafers. The carrier allows other types of objects (e.g., processing kit rings) to be handled by the robotic arm configured to process substrates.

[0014] A processing system, such as a wafer processing system, has one or more processing chambers for processing a substrate. Gas is used to etch the substrate within the processing chamber (e.g., etching the substrate while it is electrostatically held in the etching chamber). A substrate support assembly includes one or more processing sleeve rings that substantially surround the substrate (e.g., to protect one or more portions of the processing chamber, the substrate, etc.). For example, a circular portion, referred to as an edge ring or processing sleeve ring, lies directly outside the outer diameter of the substrate to protect the upper surface of a chuck (e.g., an electrostatic chuck) supporting the substrate from chemical etching. The processing sleeve rings are made of several different materials and can have different shapes, both of which affect the processing uniformity near the processing sleeve rings. During processing, over time, the processing sleeve rings and other components of the processing chamber are etched, resulting in shape changes and variations in processing uniformity.

[0015] To address variations in processing uniformity caused by deterioration of the processing kit ring and other components, the processing kit ring and other components must be replaced. Certain components (such as the processing kit ring) will be replaced according to a schedule. Conventionally, to replace a component (such as the processing kit ring), the operator opens the processing chamber to access the internal component, manually removes and replaces the component, and then closes the processing chamber. When the processing chamber is opened, the processing chamber and processing system may be contaminated with cells, hair, dust, etc. After being opened, the processing chamber and / or processing system undergo a requalification process, which renders the processing chamber and / or processing system inoperable for several days to several weeks. The requalification process affects production line output, scheduling, quality (e.g., in response to adding variables to the system), user time, energy consumption, etc.

[0016] The apparatus, systems, and methods disclosed herein provide a substrate processing system carrier (also referred to herein as a chamber component carrier, or simply a carrier). The carrier enables automatic replacement of different types of contents under different types of conditions (e.g., without opening the processing chamber while maintaining a sealed environment). The carrier includes a rigid body and fasteners, the rigid body forming an opening, and the fasteners configured to be removably attached to the rigid body via the opening. A first set of fingers (e.g., three fingers) is configured to be removably attached to the rigid body via the fasteners and the opening. The first set of fingers is configured to support a first content during a first transport of the carrier within the substrate processing system (e.g., via a robotic arm). A second set of fingers (e.g., three fingers) is configured to be removably attached to the rigid body via the fasteners and the opening. The second set of fingers is configured to support a second content during a second transport of the carrier within the substrate processing system (e.g., via a robotic arm). In some embodiments, the first and second contents are different types of contents. In some examples, the contents include one or more of a new processing kit ring, a used processing kit ring, a new chamber assembly of the substrate processing system, a used chamber assembly of the substrate processing system, etc.

[0017] In some embodiments, the first transport and the second transport are under different conditions. In some embodiments, each finger in the first set of fingers includes a first material configured for the first condition, and each finger in the second set of fingers includes a second material configured for a second condition different from the first condition. In some examples, the conditions include one or more of the following: corrosive conditions, clean conditions, electrostatic conditions, high temperature, high pressure, atmospheric pressure, vacuum, etc.

[0018] In some embodiments, each finger has a first upper surface, a second upper surface, a sidewall, and a lower surface. The first upper surface is generally disposed in a first plane and configured to support contents during transport of the carrier. The second upper surface is substantially disposed in a second plane above the first plane. The sidewall is disposed between the first and second upper surfaces. A first opening is formed through the finger from the second upper surface to the lower surface. The lower surface forms a recess to receive a portion of the carrier forming the second opening. The finger is removably attached to the carrier by fasteners inserted through the first opening of the finger and the second opening of the carrier. In some embodiments, the contents contact the group of fingers without contacting the rigid body during transport of the carrier. In some embodiments, the opening formed by the rigid body is a slot, and each finger is adjustablely positioned on the rigid body via the slot. In some examples, the position of the fingers is adjusted based on wear of the fingers. In some examples, the position of the fingers is adjusted based on the type (e.g., size) of the contents to be transported by the carrier.

[0019] In some embodiments, the sidewalls of the finger have upper and lower portions, the upper portion having an angle of approximately 100 to 110 degrees (e.g., approximately 15 degrees with respect to an orthogonal line) relative to the first upper surface, and the lower portion having an angle of approximately 90 to 100 degrees (e.g., approximately 5 degrees with respect to an orthogonal line). In some embodiments, the finger further includes a chamfer between the first upper surface and the sidewalls. In some embodiments, the finger is configured to dissipate static charge.

[0020] The carrier (e.g., a rigid body) includes one or more lower surfaces configured to dock with the end effector of the robotic arm. The carrier (e.g., a rigid body) includes one or more lower surfaces (e.g., a solid planar central region) configured to dock with a vacuum suction cup.

[0021] The apparatus, system, and method disclosed herein offer advantages over conventional solutions. The substrate processing system carrier can automatically replace different types of contents under varying conditions without opening the processing chamber and subsequently eliminating the need for a recertification process. The substrate processing system carrier is configured to dock with equipment used for wafer transfer (e.g., end effectors on robotic arms, vacuum chucks, lifting pins, etc.). Using the substrate processing system carrier enables wafer processing components of the wafer processing system (e.g., vacuum chucks, end effectors, robotic arms, slit valves, loading ports, etc.) to also handle processing sleeve rings and other components without adjustment or with minimal adjustment. Compared to conventional solutions, using the substrate processing system carrier to replace components has a smaller impact on production line output, schedule, substrate quality, user time, and energy consumption. Furthermore, the use of the substrate processing system carrier allows robots and / or stations configured to handle substrates to also handle other types of objects (e.g., chamber components) without reconfiguration. This reduces the total cost of ownership of the substrate processing system.

[0022] Although some parts of this specification relate to processing kit rings, this specification is applicable to different types of contents (e.g., to different types of chamber assemblies, such as edge rings, spray heads, masks, mask processors, half rings, etc., and processing kit rings). Although some parts of this specification relate to substrate processing systems, this specification can be applied to other types of systems.

[0023] Figure 1 illustrates a processing system 100 (e.g., a wafer processing system, a substrate processing system, a semiconductor processing system) according to certain specific embodiments. The processing system 100 includes a fab interface 101 and loading ports 128 (e.g., loading ports 128A-D). In some specific embodiments, loading ports 128A-D are directly mounted to the fab interface 101 (e.g., sealed). Enclosure systems 130 (e.g., cassettes, FOUPs, processing kit enclosure systems, etc.) are configured to be removably coupled (e.g., docked) to loading ports 128A-D. As shown in Figure 1, enclosure system 130A is coupled to loading port 128A, enclosure system 130B is coupled to loading port 128B, enclosure system 130C is coupled to loading port 128C, and enclosure system 130D is coupled to loading port 128D. In some specific embodiments, one or more enclosure systems 130 are coupled to loading ports 128 for transferring wafers and / or other substrates into and out of the processing system 100. Each enclosure system 130 is sealed relative to a corresponding loading port 128. In some embodiments, a first enclosed system 130A port is connected to a loading port 128A (e.g., for replacing a used processing kit ring). Once one or more of these operations have been performed, the first enclosed system 130A is then removed from the loading port 128A, and a second enclosed system 130 (e.g., a FOUP containing a wafer) port is connected to the same loading port 128A. In some embodiments, carriers (e.g., configured to use different types of fingers) are used to transfer different types of content between the enclosed system 130 and other parts of the processing system 100.

[0024] In some specific embodiments, the loading port 128 includes a front interface forming a vertical opening (or substantially a vertical opening). The loading port 128 also includes a horizontal surface for supporting a containment system 130 (e.g., a cassette, processing kit containment system). Each containment system 130 (e.g., a wafer FOUP, processing kit containment system) has a front interface forming a vertical opening. The front interface of the containment system 130 is sized to mat (e.g., seal to) the front interface of the loading port 128 (e.g., the vertical opening of the containment system 130 is substantially the same size as the vertical opening of the loading port 128). The containment system 130 is placed on the horizontal surface of the loading port 128, and the vertical opening of the containment system 130 is aligned with the vertical opening of the loading port 128. The front interface of the containment system 130 is interconnected with (e.g., clamped, secured, or sealed to) the front interface of the loading port 128. The base plate (e.g., substrate) of the enclosure system 130 may have features that engage with the horizontal surface of the loading port 128 (e.g., loading features such as recesses that engage with loading port motion pin features, device port datom pin gaps, and / or enclosure system docking tray latching features). The same loading port 128 is used for different types of enclosure systems 130 (e.g., process kit enclosure systems, wafer-containing cassettes, etc.).

[0025] In some embodiments, the enclosure system 130 (e.g., a processing kit enclosure system) includes one or more contents 110 (e.g., a processing kit ring, an empty processing kit ring carrier, a processing kit ring disposed on the processing kit ring carrier, a verification wafer, components of the processing system 100, etc.). In some examples, the processing kit enclosure system 130 is coupled to a factory interface 101 (e.g., a loading port 128) to enable the automatic transfer of a processing kit ring from the processing kit ring carrier into the processing system 100 to replace a used processing kit ring.

[0026] In some embodiments, the processing system 100 further includes first vacuum ports 103a, 103b that couple the fab interface 101 to corresponding degassing chambers 104a, 104b. Second vacuum ports 105a, 105b are coupled to corresponding degassing chambers 104a, 104b and are disposed between the degassing chambers 104a, 104b and the transfer chamber 106 to facilitate the transfer of wafers and contents 110 (e.g., processing kit rings) into the transfer chamber 106. In some embodiments, the processing system 100 includes and / or uses one or more degassing chambers 104 and a corresponding number of vacuum ports 103, 105 (e.g., the processing system 100 includes a single degassing chamber 104, a single first vacuum port 103, and a single second vacuum port 105). The transfer chamber 106 includes a plurality of processing chambers 107 (e.g., four processing chambers 107, six processing chambers 107, etc.) disposed around and coupled thereto. The processing chambers 107 are coupled to the transfer chamber 106 via corresponding ports 108, such as slit valves. In some embodiments, the plant interface 101 is at a higher pressure (e.g., atmospheric pressure), while the transfer chamber 106 is at a lower pressure (e.g., vacuum). Each degassing chamber 104 (e.g., loading gate, pressure chamber) has a first door (e.g., a first vacuum port 103) to seal the degassing chamber 104 relative to the plant interface 101, and a second door (e.g., a second vacuum port 105) to seal the degassing chamber 104 relative to the transfer chamber 106. When the first door is open and the second door is closed, contents are transferred from the plant interface 101 into the degassing chamber 104; when the first door is closed, the pressure in the degassing chamber 104 decreases to match the transfer chamber 106; when the second door is open, contents are removed from the degassing chamber 104. Use a local center finding (LCF) device to align the contents in transfer chamber 106 (e.g., before entering processing chamber 107, or after leaving processing chamber 107).

[0027] In some specific embodiments, the processing chamber 107 includes one or more of an etching chamber, a deposition chamber (including atomic layer deposition, chemical vapor deposition, physical vapor deposition or plasma-enhanced versions thereof), an annealing chamber, etc.

[0028] Factory interface 101 includes factory interface robot 111. Factory interface robot 111 includes a robotic arm, such as a Selective Compliance Assembly Robotic Arm (SCARA) robot. Examples of SCARA robots include 2-link SCARA robots, 3-link SCARA robots, 4-link SCARA robots, etc. Factory interface robot 111 includes an end effector at one end of the robotic arm. The end effector is configured to pick up and handle specific objects such as wafers. Alternatively or additionally, the end effector may be configured to handle objects such as carriers and / or handle kit loops (edge ​​loops). The robotic arm has one or more links or components (e.g., wrist component, upper arm component, forearm component, etc.) configured to move to move the end effector to different positions in different directions.

[0029] Factory interface robot 111 is configured to move objects between enclosed system 130 (e.g., a box, FOUP) and degassing chambers 104a, 104b (or loading ports). While conventional systems are associated with the opening (e.g., disassembly, breach of seals, or contamination) of processing systems (e.g., factory interface, transfer chamber, processing chamber) to replace different types of contents, processing system 100 is configured to facilitate the transfer and replacement of contents without requiring an operator to open (e.g., disassemble, breach of seals, or contamination) processing system 100. Thus, in some embodiments, a sealed environment is maintained during content replacement (e.g., via a carrier with replaceable fingers) including the internal spaces of enclosed system 130 and factory interface 101.

[0030] Transfer chamber 106 includes transfer chamber robot 112. Transfer chamber robot 112 includes a robotic arm with an end effector at one end. The end effector is configured to handle specific objects such as wafers. In some embodiments, transfer chamber robot 112 is a SCARA robot, but in some embodiments, it has fewer links and / or fewer degrees of freedom than factory interface robot 111.

[0031] Controller 109 controls various states of processing system 100. Controller 109 is and / or includes a computing device such as a personal computer, server computer, programmable logic controller (PLC), microcontroller, etc. Controller 109 includes one or more processing devices, which in some embodiments may be general-purpose processing devices such as microprocessors, central processing units, etc. More specifically, in some embodiments, the processing device is a Complex Instruction Set Computing (CISC) microprocessor, a Reduced Instruction Set Computing (RISC) microprocessor, a Very Long Instruction Word (VLIW) microprocessor, a processor implementing other instruction sets, or a processor implementing a combination of instruction sets. In some embodiments, the processing device is one or more special-purpose processing devices, such as application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), digital signal system processors (DSPs), network system processors, etc. In some embodiments, controller 109 includes data storage devices (e.g., one or more disk drives and / or solid-state drives), main memory, static memory, network interface, and / or other components. In some embodiments, controller 109 executes instructions to perform any one or more of the methods or processes described herein. Instructions are stored on a computer-readable storage medium, including main memory, static memory, auxiliary storage, and / or processing devices (during instruction execution). In some specific embodiments, the controller 109 receives signals from the factory interface robot 111 and the wafer transfer room robot 112, and sends control signals to the factory interface robot 111 and the wafer transfer room robot 112.

[0032] Figure 1 schematically illustrates the transfer of contents 110 (e.g., a processing sleeve ring coupled to a processing sleeve ring carrier) into processing chamber 107. According to one embodiment of this disclosure, contents 110 are removed from the closed system 130 via a factory interface robot 111 located in factory interface 101. Factory interface robot 111 transfers contents 110 to a corresponding degassing chamber 104a, 104b through one of first vacuum ports 103a, 103b. Transfer chamber robot 112, located in transfer chamber 106, removes contents 110 from one of degassing chambers 104a, 104b through a second vacuum port 105a or 105b. Transfer chamber robot 112 moves contents 110 into transfer chamber 106, where contents 110 are transferred to processing chamber 107 through a corresponding port 108. Although not shown for clarity, referring to FIG1, the transfer of contents 110 includes transferring a processing tool ring disposed on a processing sleeve ring carrier, transferring an empty processing sleeve ring carrier, transferring and placing a verification wafer, etc.

[0033] Figure 1 illustrates one example of the transfer of content 110; however, other examples are also conceivable. In some examples, the processing kit enclosure system 130 may be coupled to the transfer chamber 106 (e.g., via a loading port in the transfer chamber 106). Content 110 is loaded from the transfer chamber 106 into the processing chamber 107 by the transfer chamber robot 112. Alternatively, in some embodiments, content 110 may be loaded in a substrate support pedestal (SSP). In some embodiments, an additional SSP may be positioned to communicate with the factory interface 101, opposite to the illustrated SSP. The processed content 110 (e.g., a used processing kit ring) is removed from the processing system 100 in a manner contrary to any of the methods described herein. When multiple processing kit closure systems 130 or a combination of closure system 130 and SSP are used, in some specific embodiments, one SSP or closure system 130 is used for unprocessed content 110 (e.g., a new processing kit ring), while another SSP or closure system 130 is used to receive processed content 110 (e.g., a used processing kit ring).

[0034] Processing system 100 includes chambers, such as a factory interface 101 (e.g., a device front-end module (EFEM)) and adjacent chambers adjacent to the factory interface 101 (e.g., a loading port 128, a containment system 130, an SSP, a degassing chamber 104 (e.g., a loading lock), etc.). One or more chambers are sealed (e.g., each chamber is sealed). Adjacent chambers are sealed to the factory interface 101. In some embodiments, an inert gas (e.g., one or more of nitrogen, argon, neon, helium, krypton, or xenon) is provided to one or more chambers (e.g., the factory interface 101 and / or adjacent chambers) to provide one or more inert environments. In some examples, the factory interface 101 is an inert EFEM that maintains an inert environment within the factory interface 101 (e.g., an inert EFEM microenvironment) such that a user does not need to enter the factory interface 101 (e.g., the processing system 100 is configured to have no manual access to the factory interface 101).

[0035] In some embodiments, a gas stream (e.g., inert gas, nitrogen) is supplied to one or more chambers (e.g., plant interface 101) of the processing system 100. In some embodiments, the gas flow is greater than leakage through one or more chambers to maintain positive pressure within one or more chambers. In some embodiments, the inert gas within plant interface 101 is recirculated. In some embodiments, a portion of the inert gas is vented. In some embodiments, the flow rate of non-recirculated gas entering plant interface 101 is greater than the vented gas flow rate and gas leakage to maintain positive pressure of the inert gas within plant interface 101. In some embodiments, plant interface 101 is coupled to one or more valves and / or pumps to provide gas streams into and out of plant interface 101. A processing device (e.g., a device of controller 109) controls the gas streams into and out of plant interface 101. In some specific embodiments, the processing device receives sensor data from one or more sensors (e.g., oxygen sensor, humidity sensor, motion sensor, door actuation sensor, temperature sensor, pressure sensor, etc.) and determines the flow rate of the inert gas flowing into and / or out of the plant interface 101 based on the sensor data.

[0036] The enclosure system 130 allows for the transfer and replacement of different types of contents 110 (e.g., through a carrier with replaceable fingers) without opening the plant interface 101 and the sealed environment of the adjacent chamber. The enclosure system 130 seals to the loading port 128 in response to docking at the loading port 128. The enclosure system 130 provides a purge port passage so that the interior of the enclosure system 130 can be purged before opening to minimize interference from the inert environment in the plant interface 101.

[0037] Figures 2A-N show views of a carrier 200 according to certain specific embodiments.

[0038] Figures 2A-D and 2G-L show views of the carrier 200. Figure 2A shows a top perspective view of the carrier 200, including a rigid body 210, fasteners 230, and fingers 240, according to some embodiments. Figure 2B shows a bottom perspective view of the carrier 200, including a rigid body 210, fasteners 230, and fingers 240, according to some embodiments. Figure 2C shows a top view of the rigid body 210 of the carrier 200, according to some embodiments (e.g., without fasteners 230 and fingers 240). Figure 2D shows a bottom view of the rigid body 210 of the carrier 200, according to some embodiments (e.g., without fasteners 230 and fingers 240). Figure 2G shows a top view of the carrier 200, including a rigid body 210, fasteners 230, and fingers 240, according to some embodiments. Figure 2H shows a bottom view of the carrier 200, including a rigid body 210, fasteners 230, and fingers 240, according to some embodiments. Figure 2I shows a front view of a carrier 200 including a rigid body 210, fasteners 230, and fingers 240 according to certain embodiments. Figure 2J shows a rear view of a carrier 200 including a rigid body 210, fasteners 230, and fingers 240 according to certain embodiments. Figure 2K shows a left side view of a carrier 200 including a rigid body 210, fasteners 230, and fingers 240 according to certain embodiments. Figure 2L shows a right side view of a carrier 200 including a rigid body 210, fasteners 230, and fingers 240 according to certain embodiments.

[0039] The carrier 200 includes a rigid body 210 having an opening 220 (e.g., see Figures 2C-D). In some embodiments, the opening 220 is threaded to receive a threaded fastener 230. The carrier 200 also includes fasteners 230 (e.g., screws, bolts, rivets, etc.) configured to be removably attached to the rigid body 210 via the opening 220. In some embodiments, the fasteners 230 are threaded to secure to the threaded opening 220. In some embodiments, the fasteners 230 are threaded to secure to a threaded finger 240. In some embodiments, each fastener 230 includes a first portion and a second portion (e.g., bolts and nuts, etc.) configured to be secured to each other to secure the finger 240 to the rigid body 210.

[0040] The fingers 240 are configured to be removably attached to the rigid body 210 via fasteners 230 and openings 220. In some embodiments, each finger 240 forms an opening, and the fasteners 230 are configured to removably attach the fingers 240 to the rigid body 210 by being inserted through the openings of the fingers 240 and the openings 220 of the rigid body 210.

[0041] A set of fingers 240 (e.g., three fingers 240) is configured to be removably attached to a rigid body 210. The set of fingers 240 is configured to support contents (e.g., a processing kit ring) during transport of a carrier within the substrate processing system (e.g., via a robotic arm). In some embodiments, the contents contact the set of fingers 240 without contacting the rigid body 210 during transport within the substrate processing system.

[0042] In some specific embodiments, a first set of fingers 240 (e.g., three fingers) is configured to be removably attached to a rigid body 210 via fasteners 230 and openings 220 to support a first content during a first transport of the substrate processing system within the carrier 200 (e.g., via a robotic arm), and a second set of fingers 240 (e.g., three different fingers) is configured to be removably attached to the rigid body 210 (e.g., via the same fasteners 230 and openings 220 as the first set of fingers 240) to support a second content during a second transport of the substrate processing system within the carrier 200 (e.g., via the same robotic arm).

[0043] In some embodiments, different sets of fingers 240 are used for different types of contents. In some examples, different types of contents include new contents and used contents (e.g., a first set of fingers 240 is attached to a rigid body 210 to transfer used contents, and a second set of fingers 240 is attached to the same rigid body 210 to transfer new contents). In some examples, different types of contents include contents of different sizes and / or shapes (e.g., a first set of fingers 240 is attached to a rigid body 210 for transferring contents of a first size and / or shape, and a second set of fingers 240 is attached to the same rigid body 210 to transport contents of different sizes and / or shapes). In some examples, different types of contents include one or more of the following: a processing kit ring, a chamber assembly of a substrate processing system, a used chamber assembly of a substrate processing system, a spray head, and an assembly having a generally circular circumference (e.g., internal circumference, external circumference, etc.).

[0044] In some embodiments, different groups of fingers 240 are used for different conditions. In some embodiments, each finger 240 in the first group of fingers 240 includes a first material configured for a first condition, and each finger in the second group of fingers includes a second material configured for a second condition different from the first condition. In some examples, the material of the fingers 240 includes one or more of polyethylene terephthalate (PET), ceramic materials, polytetrafluoroethylene (PTFE) (e.g., Teflon™), ultra-high molecular weight (UHMW) polyethylene, absorbent materials, non-absorbent materials, coating materials, deformable materials, electrostatic dissipative materials, etc. In some embodiments, the fingers 240 have a specific conductivity (e.g., less than perfect conductivity, some conductivity to allow dissipation at a controlled rate, preventing conductive paths from high arc discharge, dissipation range from about 10⁵ to about 10⁹ ohms, etc.). In some examples, different conditions include one or more of the following: corrosive conditions, cleaning conditions, electrostatic conditions, specific processes (e.g., substrate manufacturing processes, atomic layer deposition, chemical vapor deposition, physical vapor deposition, plasma enhancement forms of the above), specific chemical substances (e.g., fluorine, acids, alkalis, etc.), specific temperature ranges (e.g., high temperatures), specific pressure ranges (e.g., high pressure), atmospheric pressure, vacuum pressure, etc.

[0045] In some specific embodiments, the carrier 200 is a custom mechanical connector to allow for automated handling of the processing kit ring, enabling its movement through tools designed for wafer processing. Replaceable fingers 240 allow for maintenance of the carrier 200 and replacement with different finger material types as needed for a particular processing kit ring. The carrier 200 with replaceable fingers 240 enables current processing kit rings and allows for future compatibility with processing kit rings of various sizes and material types.

[0046] In some embodiments, different rigid bodies 210 are used for different contents and / or different conditions. In some embodiments, each rigid body 210 is made of a different type of material. In some examples, the rigid body 210 is made of one or more of carbon fiber, aluminum, aluminum cast plate (e.g., MIC-6®), hard anodized aluminum, ceramic materials, titanium, etc. In some embodiments, the rigid body 210 is made of the same or similar material as a mechanical blade (e.g., an end effector). In some embodiments, the carrier 200 does not have any glued parts (e.g., no adhesive). In some embodiments, the carrier 200 does not have any thermo-pressed fitting components. In some embodiments, all features of the carrier 200 are mechanically joined (e.g., via fasteners 230) or machined into the rigid body 210.

[0047] In some embodiments, the carrier 200 has pads 250 (e.g., mushroom-shaped pads, perfluoroelastomer pads, Kalrez® 8475 friction pads, nine Kalrez mushroom-shaped pads, calibrated mushroom-shaped pads, pads integrated with the rigid body 210) for anti-slip interfaces (e.g., automation interfaces), and has end effectors for gas environments (e.g., the factory interface robot 111 of FIG. 1) and vacuum robots (e.g., the transfer chamber robot 112 of FIG. 1) with robot interfaces. In some embodiments, the pads 250 are used for anti-slip interfaces with one or more of LCF devices, alignment devices, etc.

[0048] In some specific embodiments, the carrier 200 has a pad 260 (e.g., an aluminum pad, a pad integral with the rigid body 210) for positioning the carrier 200 in a closed system (e.g., the closed system 130, FOUP of FIG1) and a loading gate (e.g., the degassing chamber 104 of FIG1).

[0049] In some embodiments, the rigid body 210 forms a window 270 (e.g., an opening, a slot, etc.). In some embodiments, the window 270 is used by automated tools (e.g., through an alignment device, through an LCF device) to observe through the carrier 200 (e.g., to observe an object on the other side of the carrier 200) to obtain placement accuracy. In some embodiments, the window 270 is used to reduce the mass of the carrier 200 (e.g., the rigid body 210).

[0050] In some embodiments, the rigid body 210 has a substantially planar (e.g., substantially flat) lower surface. In some embodiments, the lower surface of the rigid body 210 is substantially flat except for the pads 250 and 260 on the lower surface of the rigid body 210. In some embodiments, the carrier 200 (e.g., the rigid body 210) does not have kinematic positioning features (e.g., no kinematic positioning features on the lower surface of the rigid body 210). In some embodiments, the rigid body 210 and / or the fingers 240 have one or more coatings. In some examples, the fingers 240 have coatings configured for delivering contents under specific conditions (e.g., suitable for certain chemicals and / or processes). In some embodiments, the fingers 240 have one or more coatings that provide one or more coefficients of friction to allow the contents to align on the fingers. In some examples, the sidewalls of each finger 240 have a lower coefficient of friction than the first upper surface of each finger to allow the contents to slide down the sidewalls and stop at the first upper surface. In some examples, the upper portion of the sidewall of each finger 240 has a lower coefficient of friction than the lower portion of the sidewall of each finger 240, to allow the contents to slide down to the upper portion of each sidewall and slow down at the lower portion of each sidewall.

[0051] In some embodiments, the profile of the rigid body 210 differs from that shown in Figures 2A-D. In some embodiments, the size, shape, number, etc., of the opening 220 (e.g., for receiving fastener 230), pad 250, pad 260, and / or window 270 differ from those shown in Figures 2A-D.

[0052] In some embodiments, the fingers 240 are processed (e.g., after assembly onto the rigid body 210, or after being removably attached to the rigid body 210 via fasteners 230) such that the fingers 240 bear markings indicating positions on the carrier 200 (e.g., the rigid body 210). In some examples, a first finger 240 is processed to have a first marking (e.g., a first identifier) ​​indicating a first position on the rigid body 210, a second finger is processed to have a second marking (e.g., a second identifier) ​​indicating a second position on the rigid body 210, and a third finger is processed to have a third marking (e.g., a third identifier) ​​indicating a third position on the rigid body 210. In some embodiments, different positions on the rigid body 210 are processed to have markings (e.g., identifiers) similar to those processed onto different fingers 240. The markings on the rigid body 210 and / or the fingers 240 indicate the mounting pattern. In some examples, identifiers include one or more of code line markers (e.g., I, II, III), numbers, letters, colors, symbols, etc. By matching the identifiers on the rigid body 210 with the identifiers on the fingers 240, an opening 220 of the rigid body 210 corresponds to a specific finger 240 to avoid tolerance stacking (e.g., tolerances of bosses on the rigid body 210) caused by different fingers 240 for the same opening 220 of the rigid body 210. In some specific embodiments, any finger 240 in the group of fingers 240 can be used for any given opening 220 of the rigid body 210 (e.g., any boss).

[0053] In some embodiments, one or more fingers 240 are attached to the rigid body 210 to support the contents. In some embodiments, two or more fingers 240 are attached to the rigid body 210 to support the contents. In some embodiments, three or more fingers 240 are attached to the rigid body 210 to support the contents. In some embodiments, each finger 240 is substantially equally spaced around the rigid body 210 (e.g., approximately 120 degrees between each of the three fingers 240). In some embodiments, the first and second fingers 240 are symmetrically positioned on the rigid body 210, and the third finger 240 is equally spaced from the first and second fingers 240.

[0054] In some embodiments, the fingers 240 support the contents (e.g., the processing kit ring) near the inner periphery (e.g., the inner sidewall). In some embodiments, the fingers 240 support the contents (e.g., the processing kit ring) near the outer periphery (e.g., the outer sidewall).

[0055] In some embodiments, different fasteners 230 are used for one or more of different rigid bodies 210, openings 220, fingers 240, conditions, etc. In some embodiments, different fasteners 230 are one or more of different sizes, shapes, materials, etc. In some embodiments, the materials of fasteners 230 include one or more of aluminum, ceramic, stainless steel, electropolished (EP) stainless steel, etc.

[0056] In some embodiments, the finger 240 has a lip to support contents. In some embodiments, the finger 240 is disposed around the rigid body 210 to support contents with a circular perimeter, such as a treatment kit ring, a spray head, etc. In some embodiments, the finger 240 is replaceable to support contents of different perimeter sizes. In some embodiments, the finger 240 is attached to the rigid body 210 via a slot that allows the position of the finger 240 to be adjustable (e.g., radially adjustable from the central portion of the rigid body 210) to support contents of different perimeter sizes. In some embodiments, as the finger 240 wears down over time, the position of the finger 240 is adjustable (e.g., radially adjustable from the central region 280 of the rigid body 210) to continue supporting contents of the same perimeter size. In some embodiments, once the finger 240 is worn down and can no longer support contents of the same perimeter size, the worn finger 240 is replaced with a new finger 240.

[0057] The carrier 200 includes one or more lower surfaces (e.g., pad 250) configured to dock with the end effector of the robotic arm. The carrier 200 (e.g., rigid body 210) includes one or more lower surfaces (e.g., solid planar central region 280) configured to dock with a vacuum suction cup.

[0058] In some embodiments, the rigid body 210 forms a boss 222 around each opening 220. In some embodiments, the boss 222 is a protruding feature of the rigid body 210. In some embodiments, the boss 222 is used to position the finger 240 onto the rigid body 210. In some embodiments, the finger 240 has a recess that matches the protruding boss 222. In some embodiments, the boss 222 causes the finger 240 to attach to the rigid body 210 in the correct orientation.

[0059] Figures 2E-F and 2M show views of the carrier 200 of the support processing kit ring 290 according to certain embodiments. Figure 2E shows a top view of the carrier 200 of the support processing kit ring 290 according to certain embodiments. Figure 2F shows a side sectional view of the carrier 200 of the support processing kit ring 290 according to certain embodiments. Figure 2M shows a top perspective view of the carrier 200 of the support processing kit ring 290 according to certain embodiments.

[0060] The carrier 200 includes a rigid body 210 and fingers 240 attached to the rigid body 210 via fasteners 230. A processing kit ring 290 is disposed on the fingers 240.

[0061] In some embodiments, the carrier 200 is sized and shaped to provide one or more gaps between the processing kit ring 290 and one or more portions of the periphery of the carrier 200. In some embodiments, alignment devices and / or LCF devices use one or more gaps to align the carrier 200 and / or the processing kit ring 290. In some examples, one or more gaps allow a light beam to be used to detect flat inner sidewall features or other alignment features of the processing kit ring 290. In some embodiments, one or more gaps are used by lifting pins to enable the processing kit ring 290 to be lifted from the carrier 200 (e.g., within a processing chamber). In some embodiments, the periphery of the carrier 200 is configured to engage with the frame of a closed system (e.g., FOUP) of the substrate processing system.

[0062] Figure 2N illustrates a carrier 200 arranged on a shelf 294 in a closed system 292 (e.g., FOUP) according to certain embodiments. The closed system 292 includes one or more shelves 294. In some embodiments, each shelf 294 is configured to receive a carrier 200 and a processing kit ring 290 disposed on the carrier 200. In some embodiments, a robotic arm lowers the carrier 200, supporting the processing kit ring 290, onto the shelf 294 in the closed system 292. In some embodiments, as the robotic arm lowers the carrier 200, supporting the processing kit ring 290, onto the shelf 294, a first portion of the shelf 294 supports the processing kit ring 290, and then a second portion of the shelf 294 supports the carrier 200, so that the processing kit ring 290 is supported above the carrier 200 on the shelf 294 (e.g., the processing kit ring 290 does not contact the carrier 200).

[0063] Figures 3A-B illustrate fingers 340A-B (e.g., fingers 240 of Figures 2A-F) of a carrier (e.g., carrier 200 of Figures 2A-F) according to certain specific embodiments. In some specific embodiments, fingers 340A and 340B are configured to be removably attached to the same rigid body (e.g., rigid body 210 of Figures 2A-F). For example, finger 340A is configured to be removably attached to the rigid body to transfer a first content under a first condition, and finger 340B is configured to be removably attached to the same rigid body to transfer one or more second contents different from the first content and / or under a second condition different from the first condition.

[0064] In some embodiments, each finger 340 has a first upper surface 342A, a second upper surface 342B, a sidewall 350, and a lower surface 360. The first upper surface 342A is generally disposed in a first plane and configured to support contents during transport of the carrier. The second upper surface 342B is substantially disposed in a second plane above the first plane. The sidewall 350 is disposed between the first upper surface 342A and the second upper surface 342B. A first opening 362 is formed through the finger 340 from the second upper surface 342B to the lower surface 360. In some embodiments, the lower surface 360 ​​forms a recess (see, for example, FIG. 4A) to receive a portion of the carrier forming the second opening (e.g., to receive a protruding boss 222 arranged around the opening 220 of the rigid body 210 of FIG. 2A-F). The finger 340 is removably attached to the carrier by fasteners inserted through the first opening of the finger and the second opening of the carrier. In some embodiments, the contents contact the group of fingers but not the rigid body during transport of the carrier. In some embodiments, the opening formed by the rigid body is a slot, and each finger 340 is adjustablely positioned on the rigid body via the slot. In some examples, the position of the finger 340 is adjusted based on wear of the finger 340. In some examples, the position of the finger 340 is adjusted based on the type (e.g., size) of the content to be transported by the carrier.

[0065] In some embodiments, the sidewall 350 of the finger 340 has an upper portion 352A and a lower portion 352B. The upper portion 352A has a first angle 354A relative to the first upper surface 342A (e.g., approximately 100 to 110 degrees, about 15 degrees to the orthogonal line), and the lower portion has a second angle 354B relative to the first upper surface 342A (e.g., approximately 90 to 100 degrees, about 5 degrees to the orthogonal line). In some embodiments, the sidewall 350 also includes a substantially vertical portion 352C that is substantially orthogonal (e.g., approximately 85 to 95 degrees) to the first upper surface 342A. In some embodiments, the finger 340 further includes a chamfer 356 between the first upper surface 342A and the sidewall 350. In some embodiments, the chamfer 356 of the finger 340 matches (e.g., substantially the same size but not interfering with) the chamfer of contents (e.g., a processing kit ring) disposed on the finger 340. In some embodiments, the lower surface of the contents (e.g., a processing kit ring) disposed on the finger contacts a first upper surface 342A of the finger 340. In some embodiments, an angle 354 of the sidewalls 350 (e.g., upper portion 352A, lower portion 352B, and / or substantially vertical portion 352C) is configured to guide (e.g., align) the contents (e.g., the processing kit ring) onto the finger 340 for transport. Conventional carriers move contents in a misaligned direction and place contents within a substrate processing system. The angle 354 of the sidewalls 350 of the finger 340 prevents the contents from becoming misaligned, bent, non-parallel, unstable (e.g., falling off the carrier), etc., on the carrier.

[0066] In some specific embodiments, the first upper surface 342A has a first coefficient of friction that is greater than a second coefficient of friction of one or more portions of the sidewall 350 (e.g., to help secure the contents to the fingers 340, to help align the contents on the fingers 340, etc.).

[0067] Figures 4A-F illustrate a carrier 400 (e.g., carrier 200 of Figures 2A-F) including a rigid body 410 (e.g., rigid body 210 of Figures 2A-F) according to certain specific embodiments. Figure 4A is a cross-sectional side view of the carrier 400 including fingers 440 (e.g., fingers 240 of Figures 2A-F, fingers 340 of Figures 3A-B) disposed on a boss 422 (e.g., boss 222 of Figures 2A-F). Figure 4B is a perspective view of the carrier 400 including fingers 440 (e.g., fingers 240 of Figures 2A-F, fingers 340 of Figures 3A-B) removably attached to the rigid body 410. Figure 4C is a top view of the rigid body 410 of the carrier 400, which includes a boss 422 (e.g., boss 222 in Figures 2A-F) disposed around an opening 420 (e.g., opening 220 in Figures 2A-F). Figure 4D is a cross-sectional side view of the carrier 400 including fingers 440 (e.g., fingers 240 in Figures 2A-F, fingers 340 in Figures 3A-B) disposed on the boss 422 (e.g., boss 222 in Figures 2A-F) of the rigid body 410. Figure 4E is a cross-sectional side view of the carrier 400 including fingers 440 (e.g., fingers 240 in Figures 2A-F, fingers 340 in Figures 3A-B) disposed on the boss 422 (e.g., boss 222 in Figures 2A-F) of the rigid body 410. Figure 4F is a perspective view of a carrier 400 including fingers 440 (e.g., fingers 240 in Figures 2A-F, fingers 340 in Figures 3A-B) that are removably attached to a rigid body 410.

[0068] In some embodiments, features of the rigid body 410 (e.g., boss 422, protrusion 412, etc.) are configured to orient (e.g., align) the finger 440 onto the rigid body 410. In some embodiments, a recess is formed on the lower surface of the finger 440, the recess being configured to receive the boss 422. In some embodiments, the left, right, and / or rear sides of the finger 440 are disposed adjacent to (e.g., abutting) the protrusion 412 on the upper surface of the rigid body 410. In some embodiments, the protrusion 412 and / or boss 422 on the upper surface orient the finger 440 (e.g., to properly position the finger onto the rigid body 410, to properly align the opening in the finger 440 with the opening 420 of the rigid body 410 to receive the fastener 430, etc.).

[0069] In some embodiments, the fingers 440 of the carrier 400 support one or more processing kit rings 490 (e.g., processing kit ring 290 of Figures 2E, 2F, and / or 2M). Referring to Figures 4D-F, in some embodiments, the fingers 440 support a processing kit ring 490A, and a processing kit ring 490B is disposed on the processing kit ring 490A. The processing kit ring 490A may include a first upper surface, a second upper surface below the first upper surface, an inner sidewall, an outer sidewall, and a bottom surface. The first upper surface may be substantially parallel to the second upper surface. The outer sidewall may connect the first upper surface and the second upper surface. The inner sidewall may connect the first upper surface and the bottom surface. The inner sidewall may contact at least a portion of the sidewall of the fingers 440 (e.g., sidewall 350 of Figures 3A-B). The bottom surface of the processing kit ring 490A may contact the upper surface of the fingers 440 (e.g., the first upper surface 342A of Figures 3A-B).

[0070] The processing kit ring 490B may include an upper surface, a lower surface, an inner wall connecting the upper and lower surfaces, and an outer wall connecting the upper and lower surfaces. In some embodiments, the processing kit ring 490B is disposed on the lower surface of the second upper surface and the first upper surface of the processing kit ring 490A. In some embodiments, the inner wall of the processing kit ring 490B may contact the outer wall of the processing kit ring 490A. In some embodiments, the processing kit ring 490A is a support ring, and the processing kit ring 490B is an insertion ring.

[0071] As shown in Figure 4D, in some embodiments, the finger 440 extends below a portion of the processing kit ring 490A. Referring to Figures 4E-F, in some embodiments, the finger 440 extends below the processing kit rings 490A-B. The finger 440 may form a recess to receive one or more processing kit rings 490. The recess of the finger 440 may have a first sidewall (e.g., sidewall 350 of Figures 3A-B), an upper surface (e.g., first upper surface 342A of Figures 3A-B), and a second sidewall (e.g., opposite the first sidewall). The first sidewall of the finger 440 contacts the inner sidewall of the processing kit ring 490A, and the second sidewall of the finger 440 contacts the outer sidewall of the processing kit ring 490B.

[0072] In some embodiments, each finger 440 of the carrier 400 (e.g., three fingers 440) includes a recessed portion to receive one or more processing kit rings 490 (e.g., see Figures 4E-F). In some embodiments, one or more fingers 440 of the carrier 400 include a recessed portion to receive one or more processing kit rings 490 (e.g., see Figures 4E-F), and one or more fingers 440 of the carrier 400 are arranged partially below at least one of the one or more processing kit rings 490 (e.g., see Figure 4D).

[0073] In some embodiments, the carrier 400 can control the concentricity of the processing kit rings 490. The carrier 400 can maintain the concentricity of the stacked processing kit rings during movement (e.g., overhead transport (OHT) and manual FOUP loading and / or vibration). The carrier 400 can maintain the concentricity of the stacked processing kit rings during transport to the processing chamber by a robot (e.g., factory interface (FI), mainframe (MF), transfer chamber, etc.). In some embodiments, the carrier 400 supports one or more processing kit rings 490. In some embodiments, the carrier 400 supports two or more processing kit rings 490 that are stacked (e.g., ring stacking). In some embodiments, the carrier 400 supports two or three stacked processing kit rings 490. In some embodiments, when the processing kit rings 490 are transported via automation (e.g., FI, MF, transfer chamber, etc.), the carrier maintains the same clearance at all points (e.g., the clearance between the processing kit rings 490 and the carrier 400). In some specific embodiments, the lower surface of the carrier 400 is configured to dock FI blades, MF mechanical blades, FOUP (e.g., FOUP frame), loading gate fins, LCF, aligners (e.g., FI aligners), processing chamber lifting pins, etc.

[0074] In some embodiments, the fingers 440 of the carrier 400 are replaceable. In some embodiments, different sets of fingers 440 are made of different materials (e.g., configured for different temperatures, processes, chemical properties, thermal expansion, etc.). In some embodiments, one set of fingers 440 is made of one or more of ceramic, titanium, and / or the like. In some embodiments, the thermal expansion of this set of fingers 440 matches the thermal expansion of the rigid body 410, one or more processing kit rings 490, fasteners 430, etc. (e.g., at the temperature of the carrier 400).

[0075] Figure 5 illustrates a method 500 using a substrate processing system for a carrier according to certain specific embodiments. In some specific embodiments, one or more operations of method 500 are performed by a robotic arm (e.g., the robotic arm of the factory interface robot 111 of Figure 1) and / or by a controller (e.g., the controller 109 of Figure 1). Although shown in a specific order or sequence, the order of processes may be modified unless otherwise stated. Therefore, the specific embodiments shown should be understood as examples only, and the processes shown may be performed in different orders, and some processes may be performed in parallel. In addition, one or more processes may be omitted in various specific embodiments. Therefore, not all processes are required in every specific embodiment.

[0076] Referring to method 500 in Figure 5, in block 502, a first condition related to a first transport in the substrate processing system is determined. In some embodiments, the first condition includes one or more of the following: substrate processing operation, chemical properties, type of contents to be transferred, temperature, pressure, gap available for the carrier, etc. In some embodiments, the first condition is determined based on the formulation (e.g., the upcoming operation of the substrate processing system). In some embodiments, the first condition is determined based on the current conditions of one or more parts of the substrate processing system.

[0077] At frame 504, a first set of fingers corresponding to the first condition is identified. In some embodiments, the first set of fingers has one or more of the following characteristics that match the first condition: material, roughness, coating, size, sidewall height, sidewall angle, shape, number, etc.

[0078] In block 506, a first set of fingers is attached to a rigid body of the carrier via fasteners. In some embodiments, the first set of fingers is attached to the rigid body autonomously (e.g., via a robot). In some embodiments, the first set of fingers is manually attached to the rigid body. In some embodiments, the first set of fingers is attached to the rigid body externally to the substrate processing system. In some embodiments, the first set of fingers is attached to a rigid body internal to the substrate processing system. In some embodiments, the fingers, fasteners, and rigid body are stored within one or more of a closed system (e.g., FOUP), SSP, factory interface, etc. In some embodiments, fastening devices (e.g., fastening robots) are used to attach the fingers to the rigid body via fasteners. In some embodiments, a controller determines conditions in the substrate processing system, selects one or more of the fingers, fasteners, and / or rigid body based on the conditions, and causes the fastening device to grasp the fingers, fasteners, and / or rigid body, resulting in the fastening device using fasteners to attach the fingers to the rigid body. In some embodiments, the first set of fingers is attached to the rigid body based on a first condition. In some examples, the orientation, position, inverted placement, and number of these fingers are based on the first condition.

[0079] In frame 508, the position of the first set of fingers on the rigid body is adjusted via fasteners. In some embodiments, the fasteners attach the fingers to slots in the rigid body. In some embodiments, the position of the fingers is measured and adjusted. In some examples, a processing kit ring is placed on the fingers, and the gap width between the sidewalls of the fingers and the processing kit ring is measured (e.g., via feeler gauge, via imaging device, via visual inspection, via determining the radial play of the processing kit ring on the fingers, etc.). In response to a determined gap width being greater than a threshold width (e.g., in response to wear of the fingers), the position of the fingers is then adjusted. In some embodiments, to adjust the position of the fingers, the fingers are moved radially relative to the central region of the rigid body through the slots. In some embodiments, to adjust the position of the fingers, a retaining screw is adjusted to move the fingers radially.

[0080] At frame 510, a first content is placed on a first set of fingers for transfer via a carrier in a substrate processing system. In some embodiments, the first content includes one or more of a processing kit ring, an edge ring, a spray head, a mask, a masking processor, a half ring, a stack of two or more processing kit rings, etc.

[0081] At box 512, a second condition associated with a second transport in the substrate processing system is determined. In some embodiments, the second condition differs from the first condition. In some examples, the second condition is one or more of the following, which are different from the first condition: substrate processing operation, chemical properties, type of contents to be transferred, temperature, pressure, etc.

[0082] In box 514, a second set of fingers corresponding to the second condition is identified. In some embodiments, the second set of fingers differs from the first set of fingers. In some examples, the second set of fingers has one or more of the following characteristics: material, size, shape, quantity, etc., that match the second condition and differ from the first set of fingers.

[0083] At frame 516, a second set of fingers is attached to the rigid body of the carrier via fasteners. In some embodiments, frame 516 is similar to frame 506. In some embodiments, the rigid body is the same as the rigid body of frame 506. In some embodiments, the rigid body is different from the rigid body of frame 506. In some embodiments, the fasteners are the same as the fasteners of frame 506. In some embodiments, the rigid body is different from the rigid body of frame 506.

[0084] At frame 518, the position of the second set of fingers on the rigid body is adjusted by fasteners. In some embodiments, frame 516 is similar to frame 508.

[0085] At frame 520, a second content is placed on a second set of fingers for transport via a carrier in a substrate processing system. In some embodiments, frame 516 is similar to frame 510. In some embodiments, the second content differs from the content of frame 510.

[0086] In some specific embodiments, each operation of method 500 is performed while maintaining a sealed environment (e.g., without opening the factory interface or the closed system).

[0087] Unless otherwise explicitly stated, terms such as “determine,” “identify,” “attach,” “adjust,” “place,” “transport,” “move,” “reduce,” “make,” “remove,” “place,” and “located” refer to the operations and programs of a computer system or similar electronic computing device that manipulate and transform data represented as physical (electronic) quantities in the computer system’s registers and memory into other data or registers or other such information storage, transmission, or display devices that are similarly represented as physical quantities in the computer system’s memory. Furthermore, the terms “first,” “second,” “third,” and “fourth,” as used herein, are labels used to distinguish different elements and may not have ordinal meaning based on their numerical names.

[0088] The examples described herein also relate to an apparatus for performing the methods described herein. This apparatus is specifically configured to perform the methods described herein, or it comprises a general-purpose computer system selectively programmed by a computer program stored in a computer system. In some specific embodiments, such a computer program is stored in a computer-readable tangible storage medium.

[0089] The methods and illustrative examples described herein are not inherently related to any particular computer or other device. Various general-purpose systems can be used in accordance with the teachings described herein, or more specialized devices can be constructed to perform the methods described herein and / or the conveniences of each of their respective functions, routines, subroutines, or operations. Examples of the structures of various such systems are illustrated in the description above.

[0090] The foregoing description sets forth numerous specific details, such as examples of particular systems, components, methods, etc., to provide a good understanding of several specific embodiments of this disclosure. However, it will be apparent to those skilled in the art that at least some of the specific embodiments of this disclosure can be practiced without these specific details. In other instances, well-known components or methods have not been described in detail, or have been presented in a simple block diagram format to avoid unnecessarily obscuring this disclosure. Therefore, the specific details set forth are merely exemplary. Specific implementations may differ from these exemplary details and may still be contemplated within the scope of this disclosure.

[0091] References to "one particular embodiment" or "a particular embodiment" in this specification indicate that a specific feature, structure, or characteristic described in connection with that particular embodiment is included in at least one particular embodiment. Therefore, the phrases "in one particular embodiment" or "in a particular embodiment" appearing throughout the specification do not necessarily refer to the same particular embodiment. Furthermore, the term "or" is intended to indicate an inclusive "or" rather than an exclusive "or." When the terms "about" or "approximately" are used herein, this is intended to indicate that the given nominal value is accurate to within ±10%.

[0092] Although the operations of the methods described herein are shown and described in a specific order, the order of operations for each method can be changed to perform certain operations in reverse order, thereby performing at least some operations concurrently with other operations. In another specific embodiment, instructions or sub-operations of different operations are performed intermittently and / or alternately.

[0093] It should be understood that the above description is intended to illustrate rather than limit. Many other specific embodiments will become apparent to those skilled in the art after reading and understanding the foregoing description. Therefore, the scope of the disclosure should be determined with reference to the appended claims and covers the full and equivalent scope of those claims.

[0094] 100: Processing System 106: Transfer Room 107: Processing Room 108: Port 109: Controller 111: Factory Interface Robot 112: Wafer Transfer Room Robot 200: Carrier 210: Rigid Body 220: Opening 222: convex platform 230: Fasteners 240: Finger-like object 250: Pad 260: Pad 270: Window 280: Window 290: Processing kit ring 292: Closed System 294: shelf 350: Sidewall 356: Chamfer 360: Lower surface 400: Carrier 410: Rigid Body 412: Highlighting Features 420: Opening 422: Boss 430: Fasteners 440: Finger-like object 500: Methods 103a: Vacuum Port 103b: Vacuum Port 104a: Degassing chamber 104b: Degassing chamber 105a: Vacuum Port 105b: Vacuum Port 128A: Loading port 128B: Loading port 128C: Loading port 128D: Loading port 130A: Closed System 130B: Closed System 130C: Closed system 130D: Closed System 340A: Finger-like object 340B: Finger-like object 342A: First upper surface 342B: Second upper surface 352A: Upper part 352B: Lower part 352C: Vertical section 354A: First Angle 354B: Second Angle 490A: Processing Kit Ring 490B: Processing Kit Ring 502-520: Operation

Claims

1. A carrier for carrying a processing chamber component, comprising: A carrier body configured to be supported on a robot for transporting one or more processing kit rings within a substrate processing system; and a plurality of fingers extending from the carrier body, wherein the plurality of fingers are configured to support one or more processing kit rings, wherein a first finger of the plurality of fingers includes an upper surface that forms a recess to receive the one or more processing kit rings.

2. The carrier as claimed in claim 1, wherein the upper surface includes a first recessed side surface, a second recessed side surface opposite to the first recessed side surface, and a recessed lower surface disposed between the first recessed side surface and the second recessed side surface.

3. The carrier as described in claim 2, wherein: The first recessed side surface is configured to be located near one or more inner surfaces of the one or more processing kit rings; the second recessed side surface is configured to be located near one or more outer surfaces of the one or more processing kit rings; and the lower recessed surface is configured to be located below the one or more processing kit rings.

4. The carrier as claimed in claim 1, wherein the one or more processing kit rings include at least two processing kit rings, wherein the first finger is configured to control the concentricity of the at least two processing kit rings relative to each other during transport of the at least two processing kit rings.

5. The carrier as claimed in claim 1, wherein the one or more processing kit rings include at least two processing kit rings, wherein the first finger is configured to maintain a substantially equal gap between the at least two processing kit rings during transport of the one or more processing kit rings.

6. The carrier as described in claim 1, wherein the first finger comprises: A first upper surface, which is substantially disposed in a first plane, wherein the first upper surface is configured to receive the one or more processing kit rings; A second upper surface, which is substantially disposed in a second plane above the first plane; and a side wall disposed between the first upper surface and the second upper surface.

7. The carrier as claimed in claim 6, wherein the sidewall includes an upper portion and a lower portion, the upper portion having an angle of about 15 degrees relative to the first upper surface, and the lower portion having an angle of about 5 degrees.

8. The carrier as claimed in claim 6, wherein the first finger further includes a chamfer between the first upper surface and the sidewall.

9. The carrier as claimed in claim 6, wherein the sidewall has a first coefficient of friction and the first upper surface has a second coefficient of friction greater than the first coefficient of friction.

10. The carrier as claimed in claim 1, wherein the first finger is configured to dissipate static charge.

11. The carrier as claimed in claim 1, wherein the one or more processing kit rings contact the first finger but not the carrier body during transport of the carrier.

12. The carrier as claimed in claim 1, wherein the plurality of fingers further includes a second finger and a third finger, each of the second finger and the third finger forming a corresponding recess to receive the one or more processing kit rings.

13. The carrier as claimed in claim 1, wherein the carrier body forms an opening configured to receive a fastener, wherein the first finger is configured to be removably attached to the carrier body via the fastener and the opening.

14. The carrier as claimed in claim 13, wherein the opening is a slot, and the first finger is adjustablely positioned on the carrier body.

15. A finger configured to extend from a carrier body of a carrier in a substrate processing system, the finger comprising: A first recessed side surface, the first recessed side surface being configured to be disposed near one or more inner surfaces of one or more processing kit rings; A second recessed side surface, the second recessed side surface being relative to the first recessed side surface, wherein the second recessed side surface is configured to be disposed near one or more outer surfaces of the one or more processing kit rings; and a recessed lower surface disposed between the first recessed side surface and the second recessed side surface, wherein the recessed lower surface is configured to be disposed below the one or more processing kit rings.

16. The finger as described in claim 15, wherein the one or more processing kit rings include at least two processing kit rings, wherein the finger is configured to control the concentricity of the at least two processing kit rings relative to each other during transport of the at least two processing kit rings.

17. The finger as claimed in claim 15, wherein the one or more processing kit rings include at least two processing kit rings, wherein the finger is configured to maintain a substantially equal gap between the at least two processing kit rings during transport of the one or more processing kit rings.

18. The finger as described in claim 15, wherein the finger is configured to be removably attached to the carrier body via a fastener and an opening formed by the carrier body.

19. A carrier for carrying a processing chamber component, comprising: A carrier body configured to be supported on a robot for transporting two or more processing kit rings within a substrate processing system; and a plurality of fingers extending from the carrier body, wherein the plurality of fingers are configured to support the two or more processing kit rings, wherein a first finger of the plurality of fingers is configured to control the concentricity of the two or more processing kit rings relative to each other during transport of the two or more processing kit rings.

20. The carrier as claimed in claim 19, wherein the first finger is configured to maintain a substantially equal gap between the two or more processing kit rings during the transport of the two or more processing kit rings.

Images