Gentle peelable composite material

Abstract

This invention discloses a gently peelable composite material, comprising a structural resin based on polyvinyl acetal resin; a bonding resin comprising phenolic resin and epoxy resin; and a chemical-resistant additive, said chemical-resistant additive comprising: a high-performance organic polymer containing aromatic rings and / or heterocyclic rings in the main chain; and an inorganic filler modified by at least one functional group from the group consisting of aniline groups, nitrogen-containing functional groups in the main chain or branches, double-bonded functional groups, and epoxy groups. The gently peelable composite material of this invention can simultaneously achieve both the protective performance and peel resistance of protective materials in circuit board manufacturing processes.

Claims

1. A gently peelable composite material, characterized in that it comprises: Structural resins based on polyvinyl acetal resins; adhesive resins containing phenolic resins and epoxy resins; The composite material also includes: a high-performance organic polymer with an aromatic ring and / or heterocyclic ring in its main chain, wherein the high-performance organic polymer is selected from at least one of polyimide, poly(p-phenylenebenzodioxazole), polybenzimidazole, benzoxazine, bismaleimide, and bismaleimide triazine; and an inorganic filler modified by at least one functional group from the group consisting of aniline groups, nitrogen-containing functional groups on the main chain or branches, double-bonded functional groups, and epoxy groups; wherein the component content of the composite material is: the weight percentage of the structural resin is between 40% and 90%; the weight percentage of the bonding resin is between 5% and 40%; the weight percentage of the high-performance organic polymer is between 5% and 50%; and the weight percentage of the inorganic filler is between 0.5% and 40%.

2. The gently peelable composite material as described in claim 1, wherein, The polyvinyl acetal resin is polyvinyl butyral resin.

3. The gently peelable composite material as described in claim 2, wherein, In the polyvinyl butyral resin, the weight percentage of polyvinyl alcohol is between 11% and 27%, and the weight percentage of polyvinyl acetate is between 0% and 8%.

4. The gently peelable composite material as described in claim 3, wherein, In the polyvinyl butyral resin, the weight percentage of polyvinyl alcohol is between 18% and 21%, and the weight percentage of polyvinyl acetate is between 1% and 6%.

5. The gently peelable composite material as claimed in any one of claims 1 to 4, wherein, The ratio of phenolic resin content to epoxy resin content in the bonding resin satisfies the following formula: Phenolic resin content = (hydroxyl equivalent of phenolic resin / epoxy equivalent of epoxy resin) × epoxy resin content.

6. The gently peelable composite material as claimed in any one of claims 1 to 4, wherein, The inorganic filler is selected from at least one of graphite, carbon black, graphene, silicon dioxide, aluminum oxide, aluminum hydroxide, calcium carbonate, magnesium carbonate, magnesium silicate, silicon carbide, titanium carbide, titanium oxide, magnesium oxide, calcium oxide, boron nitride, and aluminum nitride.

7. The gently peelable composite material as claimed in any one of claims 1 to 4, wherein, The composite material also includes at least one additive selected from leveling agents, dispersants, and defoamers.

8. The gently peelable composite material as claimed in any one of claims 1 to 4, wherein, The composite material is used in the manufacture of printed circuit boards or flexible circuit boards.