Optical sensing apparatus
Patent Information
- Application Number
- TW115120440
- Authority / Receiving Office
- TW · TW
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2021-09-09
- Filing Date
- 2021-11-24
- Publication Date
- 2026-10-11
- Estimated Expiration
- 2041-11-23
Smart Images

Figure TWG2TB001915940_001 
Figure TWG2TB001915940_002 
Figure TWG2TB001915940_003
Abstract
Claims
1. An optical sensing device comprising: a light emitter configured to emit an optical signal toward a target object; a first chip including a photodetector, wherein the photodetector is configured to detect a first optical signal having a first wavelength and a second optical signal having a second wavelength different from the first wavelength, wherein the photodetector includes a common area for detecting the first optical signal and the second optical signal at different times, wherein the first optical signal is a first portion of the optical signal reflected by the target object, and the second optical signal is a second portion of the optical signal reflected by the target object, wherein the first optical signal is detected by the photodetector at a first time, and the second optical signal is detected by the photodetector at a second time different from the first time; and a processing circuit system configured to receive a first output result associated with the first optical signal and a second output result associated with the second optical signal, and to perform a preset function based on the first output result and the second output result, wherein... This preset feature includes identifying the material type of the target object.
2. The optical sensing device as claimed in claim 1 further includes a circuit system coupled to the photodetector, the circuit system being configured to output the first output result associated with the first optical signal and to output the second output result associated with the second optical signal.
3. The optical sensing device as described in claim 2, wherein, The circuit system outputs the first output result and the second output result at different times.
4. The optical sensing device as described in claim 2, wherein, The circuit system is formed on a second die, and the first die is bonded to the second die to form a single wafer.
5. The optical sensing device as described in claim 1, wherein, The second wavelength is within the SWIR wavelength range.
6. The optical sensing device as described in claim 1, wherein, Identifying the material type of the target object further includes determining a difference between the first output and the second output.
7. The optical sensing device as claimed in claim 1 further includes a driver configured to generate a drive signal to the light emitter to generate the optical signal.
8. The optical sensing device as described in claim 1, wherein, The light emitter includes multiple light sources, each configured to emit different signals with different wavelengths.
9. The optical sensing device as described in claim 1, wherein, The photodetector includes a germanium-containing light-absorbing material, which is formed on a silicon substrate.
10. The optical sensing device as claimed in claim 1 further includes a first wavelength filter configured to allow light having the first wavelength to pass through.
11. The optical sensing device as claimed in claim 1 further includes a microlens formed on the photodetector.
12. An optical sensing device comprising: a substrate; a light emitter disposed on the substrate and configured to emit an optical signal toward a target object; and a chip disposed on the substrate, the chip comprising: a first die including a photodetector, wherein the photodetector is configured to detect a first optical signal having a first wavelength and a second optical signal having a second wavelength different from the first wavelength, wherein the first optical signal is a first portion of the optical signal reflected by the target object, and the second optical signal is a second portion of the optical signal reflected by the target object, wherein the photodetector includes a common area for detecting the first optical signal and the second optical signal at different times; and a second die bonded to the first die, the second die including a circuit system configured to perform a preset function based on the first optical signal and the second optical signal; wherein... This preset feature includes identifying the material type of the target object.
13. The optical sensing device as described in claim 12, wherein, The circuit system is configured to output a first output result associated with the first optical signal and a second output result associated with the second optical signal, and to perform the preset function further includes performing the preset function based on the first output result and the second output result.
14. The optical sensing device as described in claim 13, wherein, The circuit system outputs the first output result and the second output result at different times.
15. The optical sensing device as described in claim 13, wherein, Identifying the material type of the target object further includes determining a difference between the first output and the second output.
16. The optical sensing device as described in claim 12, wherein, The photodetector includes a germanium-containing light-absorbing material, which is formed on a silicon substrate.
17. The optical sensing device as described in claim 12, wherein, The second wavelength is within the SWIR wavelength range.
18. The optical sensing device as claimed in claim 12 further includes a first wavelength filter configured to allow light having the first wavelength to pass through.
19. The optical sensing device as claimed in claim 12 further includes a microlens formed on the photodetector.
20. The optical sensing device as claimed in claim 12, wherein, The light emitter includes multiple light sources, each configured to emit different signals with different wavelengths.
Citation Information
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