Heat dissipation housing, heat dissipation device and power supply equipment
Patent Information
- Application Number
- TW115132118
- Authority / Receiving Office
- TW · TW
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2026-08-12
- Publication Date
- 2026-10-11
- Estimated Expiration
- 2046-08-11
Smart Images

Figure TWG2TB001915945_001 
Figure TWG2TB001915945_002 
Figure TWG2TB001915945_003
Abstract
Claims
1. A heat sink housing suitable for supporting a heat-generating element, the heat sink housing comprising: A metal housing has a thermally conductive baffle and an outer peripheral wall extending from the thermally conductive baffle. The thermally conductive baffle and the outer peripheral wall together define an accommodating space for housing a heating element. The thermally conductive baffle is used to thermally connect to the heating element.
2. The heat sink as described in claim 1, wherein, The thermally conductive partition has a first plate surface facing the accommodating space and a second plate surface opposite to the first plate surface. The heat dissipation shell also includes a first thermally conductive pad disposed on the first plate surface for contacting the heat-generating element and a second thermally conductive pad disposed on the second plate surface.
3. The heat sink as described in claim 1, wherein, The metal casing also has multiple heat dissipation fins disposed on the outer peripheral wall.
4. The heat sink as described in claim 1, wherein, The outer peripheral wall has a lower splicing plate connected to the bottom end of the heat-conducting partition, and two side splicing plates respectively connected to two opposite sides of the heat-conducting partition. The lower splicing plate is used to support the heating element. The side splicing plates are respectively spaced apart on two opposite sides of the lower splicing plate and are respectively used to block the two opposite sides of the heating element. The lower splicing plate and the side splicing plates together define one side opening of the accommodating space. The side opening is located on the side of the outer peripheral wall opposite to the heat-conducting partition. The side opening is used to allow the heating element to pass through and be accommodated in the accommodating space. The side splicing plates and the heat-conducting partition together define an upper opening of the accommodating space. The upper opening is used to allow the heating element to pass through so that a part of the heating element is exposed outside the accommodating space.
5. The heat sink as described in claim 4, wherein, The lower splicing panel and the other side splicing panels each have an inner overlapping surface facing the accommodating space and an outer overlapping surface opposite to the inner overlapping surface.
6. The heat sink as described in claim 4, wherein, The lower splicing plate and the other side splicing plates each have a near-lap spring connected to the heat-conducting partition, an oblique extension piece extending outward from one end of the near-lap spring opposite to the heat-conducting partition, and a far-lap spring piece extending from one end of the oblique extension piece opposite to the near-lap spring piece. The near-lap spring piece and the far-lap spring piece are each wavy. The near-lap spring piece has a plurality of external positioning grooves arranged together, and the far-lap spring piece has a plurality of snap-fit pieces arranged together.
7. The heat sink as described in claim 4, wherein, The metal housing also has a stop plate attached to the top of the heat-conducting partition to block the heating element.
8. The heat sink as described in claim 7, wherein, The stop plate has a bottom surface for blocking the heating element, a top surface opposite to the bottom surface, and a hook protruding from the bottom surface and away from the heat-conducting partition. The stop plate has a groove recessed from the top surface toward the bottom surface and adjacent to the heat-conducting partition.
9. A heat dissipation device suitable for supporting multiple heat-generating elements, the heat dissipation device comprising: multiple heat dissipation shells spliced together and arranged along a splicing direction, each heat dissipation shell including a metal shell member having a thermally conductive partition and an outer peripheral wall extending from the thermally conductive partition, the thermally conductive partition and the outer peripheral wall jointly defining an accommodating space for accommodating a corresponding heat-generating element, the thermally conductive partition being thermally connected to the corresponding heat-generating element, each heat dissipation shell being spliced to the outer peripheral wall of an adjacent heat dissipation shell through the outer peripheral wall, and the corresponding two heat-generating elements accommodating the accommodating spaces of every two spliced heat dissipation shells being separated by the corresponding thermally conductive partition.
10. The heat dissipation device as claimed in claim 9, wherein, The thermally conductive partition has a first plate surface facing the accommodating space and a second plate surface opposite to the first plate surface. The heat sink also includes a first thermally conductive pad disposed on the first plate surface and a second thermally conductive pad disposed on the second plate surface. The first thermally conductive pad is used to contact the heating element contained in the accommodating space, and the second thermally conductive pad is used to contact the heating element contained in the accommodating space of the adjacent heat sink.
11. The heat dissipation device as claimed in claim 9, wherein, The metal casing also has multiple heat dissipation fins disposed on the outer peripheral wall.
12. The heat dissipation device as claimed in claim 9, wherein, The outer peripheral wall has a lower splicing plate connected to the bottom end of the heat-conducting baffle, and two side splicing plates respectively connected to two opposite sides of the heat-conducting baffle. The lower splicing plate is used to support the corresponding heating element. The side splicing plates are respectively spaced apart on two opposite sides of the lower splicing plate. The side splicing plates are respectively used to block the two opposite sides of the corresponding heating element. The lower splicing plate and the side splicing plates of each heat sink are respectively spliced to the lower splicing plate and the side splicing plates of the adjacent heat sink. The lower splicing plate and the side splicing plates together define one side opening of the accommodating space. The side opening is on the side of the outer peripheral wall opposite to the heat-conducting baffle. The side opening is used for the corresponding heating element to pass through and be accommodated in the accommodating space. The side splicing plates and the heat-conducting baffle together define an upper opening of the accommodating space. The upper opening is used for the corresponding heating element to pass through so that a part of the heating element is exposed outside the accommodating space.
13. The heat dissipation device as claimed in claim 12, wherein, Each heat sink's side opening is also used to allow adjacent heat sinks to pass through so that a portion of the heat sink is accommodated in the accommodating space. The lower splicing plate and the other side splicing plates each have an inner overlapping surface facing the accommodating space and an outer overlapping surface opposite to the inner overlapping surface. The inner overlapping surface of the lower splicing plate of each heat sink and the inner overlapping surface of each side splicing plate are respectively overlapped with the outer overlapping surface of the lower splicing plate of the adjacent heat sink and the outer overlapping surface of each side splicing plate in a surface contact manner.
14. The heat dissipation device as claimed in claim 12, wherein, Each heat sink's side opening is also used to allow adjacent heat sinks to pass through, so that a portion of the heat sink is accommodated in the accommodating space. The lower splicing plate and each of the other side splicing plates have a near-lap spring connected to the thermally conductive partition, an oblique extension extending outward from one end of the near-lap spring opposite to the thermally conductive partition, and a far-lap spring extending from one end of the oblique extension opposite to the near-lap spring. The far-lap spring, the oblique extension, and the near-lap spring... Arranged along the splicing direction, the near-overlapping spring and the far-overlapping spring are each wavy. The near-overlapping spring has multiple outer positioning grooves arranged together, and the far-overlapping spring has multiple snap-fit pieces arranged together. Each far-overlapping spring of the heat sink overlaps with the near-overlapping spring of the adjacent heat sink through surface contact, and the snap-fit piece of each far-overlapping spring of the heat sink snaps into the corresponding outer positioning groove of the near-overlapping spring of the adjacent heat sink.
15. The heat dissipation device as claimed in claim 12, wherein, The metal housing also has a stop plate connected to the top of the heat-conducting partition to block the corresponding heating element.
16. The heat dissipation device as claimed in claim 15, wherein, The stop plate has a bottom surface for blocking the corresponding heating element, a top surface opposite to the bottom surface, and a hook protruding from the bottom surface and away from the heat-conducting partition. The stop plate is formed with a groove recessed from the top surface toward the bottom surface and adjacent to the heat-conducting partition. The hook of the stop plate of each heat sink housing is engaged with the groove of the stop plate of the adjacent heat sink housing.
17. The heat dissipation device as claimed in claim 12 further includes a back cover assembled into the receiving space of the most distal heat dissipation shell and used to press against the corresponding heat-generating element.
18. The heat dissipation device as claimed in claim 17, wherein, The back cover includes a metal cover plate and a thermal pad disposed on the metal cover plate for contacting the corresponding heating element.
19. The heat dissipation device as claimed in claim 17 further includes a first binding member and a second binding member, the first binding member and the second binding member binding the heat dissipation shell and the back cover together in a cross configuration.
20. A power supply device, comprising: Multiple heating elements, each of which is a pouch battery; And a heat dissipation device as described in any one of claims 9 to 19.
Citation Information
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