System and method for aligning a movable cart to an assembly apparatus

Abstract

A system is provided for aligning a movable cart with an assembly device. The assembly device has at least one item among a plurality of items for replacement within the assembly device. The assembly device includes a docking station. The movable cart is configured to receive used items and / or provide new items to the assembly device. The movable cart includes an interface configured to dock within the docking station of the assembly device. The system includes a sensor associated with one of the assembly device and the movable cart, and a laser associated with the other of the assembly device and the movable cart. The sensor and laser are configured to align the movable cart with the assembly device after the movable cart has initially docked within the docking station of the assembly device.

Description

Technical Field

[0001] This case claims priority to co-provisional U.S. Patent Application No. 63 / 138,856, filed January 19, 2021, entitled “SYSTEM AND METHOD FOR ALIGNING A MOVABLE CART TO AN ASSEMBLY APRAATUS,” which is incorporated herein by reference for all purposes.

[0002] This case generally relates to stencil printing machines and related methods for printing adhesive materials (such as solder paste) on electronic substrates such as printed circuit boards (PCBs), and more specifically to systems and methods for fully automating such stencil printing machines and methods. Prior Technology

[0003] When manufacturing surface mount printed circuit boards, equipment such as stencil printers and / or dispensers can be used to deposit solder paste onto the circuit boards. Generally, circuit boards with pad patterns or other conductive surfaces on which solder paste is deposited are automatically fed into the equipment.

[0004] In a stencil printer, one or more small holes or marks (called "references") on the circuit board are used to properly align the circuit board with the stencil or screen of the stencil printer before solder paste is printed onto the board. In some systems, an optical alignment system implementing a vision system is used to align the circuit board with the stencil. Once the circuit board is properly aligned with the stencil in the printer, the circuit board is lifted onto the stencil, solder paste is dispensed onto the stencil, and then a squeegee (or scraper) crosses the stencil to force the solder paste through the openings in the stencil onto the circuit board. The stencil is then separated from the circuit board, and the adhesive force between the circuit board and the solder paste retains most of the material on the circuit board.

[0005] In a dispenser, very small amounts or dots of viscous material are deposited onto a circuit board. The viscous material may include liquid epoxy resin or solder paste, or some other related material. Before performing the dispensing operation, the circuit board is aligned or otherwise registered with the dispenser of the dispensing system. In one known method, this can be achieved by verifying the location of landmarks (also called reference points) using the dispensing system's vision system, or by locating known components on the circuit board. Once located, the dispenser's dispensing head dispenses the material onto the circuit board.

[0006] Current stencil printers and dispensers require manual intervention for routine operation. For example, during conversion, operators must perform numerous manual tasks, such as replacing stencils on the stencil printer, replacing solder paste cartridges on the stencil printer and dispenser, and replacing or replenishing other items. Each of these tasks requires manual operation by the operator. Summary of the Invention

[0007] One aspect of this application relates to a system for aligning a movable cart with an assembly device. In one embodiment, the assembly device has at least one of a plurality of items for replacement within the assembly device. The assembly device includes a docking station. The movable cart is configured to receive used items and / or provide new items to the assembly device. The movable cart includes an interface configured to dock within the docking station of the assembly device. In one embodiment, the system includes a sensor associated with one of the assembly device and the movable cart, and a laser associated with the other of the assembly device and the movable cart. The sensor and laser are configured to align the movable cart with the assembly device after the movable cart has initially docked within the docking station of the assembly device.

[0008] Embodiments of the system may further include mounting sensors on a support of an assembly apparatus and mounting a laser on a frame of a movable trolley. The assembly apparatus may include at least one sensor mounted on a support of the assembly apparatus. The sensors may be mounted on a template support configured to support a template within a template printing machine. The sensors may be mounted on a support configured to hold a substrate within a template printing machine. The laser on the frame of a movable trolley may be positioned at the same height as the sensor on the assembly apparatus. The laser may be a low-power laser. The sensor may be configured to generate an output signal that can be connected to a subsystem of the assembly apparatus. The subsystem may be a controller, and the sensor may be configured to generate an output signal processed by the controller. The controller may include software configured to convert the output signal into relative or absolute coordinates of the x, y, and z axes.

[0009] Another aspect of this application relates to a method for aligning a movable cart with an assembly device. The assembly device has at least one of a plurality of items for replacement within the assembly device. The assembly device includes a docking station. The movable cart is configured to receive used items and / or provide new items to the assembly device. The movable cart includes an interface configured to dock within the docking station of the assembly device. In one embodiment, the method includes: providing a sensor on one of the assembly device and the movable cart; and pointing a laser at the sensor, the laser being associated with the other of the assembly device and the movable cart. The sensor and the laser are configured to align the movable cart with the assembly device after the movable cart has initially docked within the docking station of the assembly device.

[0010] Embodiments of the method may further include configuring a sensor to generate an output signal that can be connected to a subsystem of the assembly equipment. The subsystem may be a controller, and the sensor may be configured to generate an output signal processed by the controller. The controller may include software configured to convert the output signal into relative or absolute coordinates of the x-axis, y-axis, and z-axis. The method may further include calibrating the laser. The laser is calibrated to one side of the mobile cart to a target, ensuring that the laser emits a beam aligned with the mobile cart's x-axis, y-axis, and z-axis coordinates. The sensor is mounted on the assembly equipment such that the beam emitted from the laser on the mobile cart is at a nominal position, which, when all axes of the assembly equipment are in their initial positions, will be interpreted as a 0,0 position for x-axis alignment and z-axis height. This information informs the assembly equipment that the mobile cart is in the correct or appropriate position relative to the assembly equipment and that its performance of a function is acceptable. If the detected reading is not 0,0, it is interpreted as misalignment, and the assembly equipment or the movable trolley can make the necessary adjustments to return to a 0,0 reading, so as to signal that the movable trolley is correctly aligned with the assembly equipment when docked. If the reading is not 0,0 during initialization, this will be interpreted as an offset from the original position, which can be compensated for by the assembly equipment's controller software, the movable trolley's controller, or both. Simple Explanation of the Diagram

[0011] The accompanying drawings are not to scale. In the drawings, every identical or nearly identical component shown in each figure is represented by the same numbers. For clarity, not every component is labeled in every figure. In the figures:

[0012] Figure 1 is a front view of an assembly apparatus for depositing assembly materials on an electronic substrate according to one embodiment;

[0013] Figure 2 is a front view of an assembly apparatus for depositing assembly materials on an electronic substrate, according to another embodiment.

[0014] Figure 3 is a front perspective view of the assembly equipment shown in Figure 1;

[0015] Figure 4 is a top view of the assembly equipment shown in Figure 3, with some parts removed;

[0016] Figure 5 is a schematic diagram of the assembly equipment shown in Figure 2;

[0017] Figure 6 is a front perspective view of a portion of the assembly equipment shown in Figure 2;

[0018] Figure 7 is a front perspective view of the assembly equipment shown in Figure 6, with a portion removed to view the assembly equipment's frame;

[0019] Figure 8 is a schematic front view of the assembly equipment and the movable trolley according to an embodiment of this case;

[0020] Figure 9 is a front perspective view of an assembly equipment with a system for aligning a movable trolley with the assembly equipment;

[0021] Figure 10 is an enlarged perspective view of a portion of the assembly equipment shown in Figure 9 before assembly;

[0022] Figure 11 is an enlarged perspective view of the assembly equipment shown in Figure 9 before assembly;

[0023] Figure 12 is a front view of the assembly equipment and the movable trolley, illustrating various configurations of the system aligning the movable trolley with the assembly equipment;

[0024] Figure 13 is an enlarged 3D view of the system, illustrating the system's sensors;

[0025] Figure 14 is another enlarged 3D view of the system, illustrating the laser of the system;

[0026] Figure 15 is another enlarged perspective view of the system, illustrating the installation of the sensor on the assembly equipment; and

[0027] Figure 16 is another enlarged three-dimensional view of the system, illustrating the installation of the laser on a movable cart. Implementation

[0028] This case broadly involves a material application machine (in this case referred to as a “template press,” a “screen press,” a “printing machine”, or a “printing machine”) used and configured in a surface mounting technology (SMT) process production line, and for the application of component materials (e.g., solder paste, conductive inks, or encapsulation materials material) is applied to a substrate (e.g., a printed circuit board, in this case referred to as an "electronic substrate", a "circuit board", a "board", a "PCB", a "PCB substrate", a "substrate", or a "PCB board") or to perform other operations such as inspecting, reworking, or other equipment placing electronic components on the substrate. Specifically, an embodiment of this case is described below with reference to a template press used to produce a printed circuit board.

[0029] For illustrative purposes only, and not to limit its generality, the present case will now be described in detail with reference to the accompanying figures. The application in this case is not limited to the construction details and the configuration of the components as articulated in the following description or shown in the accompanying drawings. The principles articulated in this case are capable of being used in other embodiments and are capable of being implemented or performed in various ways. Again, the wording and terms used in this case are for descriptive purposes and should not be considered restrictive. Any reference to an example, embodiment, part, element, or action of a system and method referred to in the singular form herein also includes an embodiment that includes the plural, and any reference to the plural form of any embodiment, part, element, or action in the present case also includes an embodiment that includes the singular only. References in singular or plural forms are not intended to limit the currently revealed systems or methods, their parts, actions, or components. The use of “includes,” “contains,” “has,” “contains,” “involves,” and variations thereof, in this case, is intended to cover the items listed thereafter and their equivalents as well as other items. References to “or” may be construed as inclusive, such that any term described by “or” may indicate a single, more than one, and any of all terms described. In addition, in the case of inconsistencies in the use of terms between the present case and the documents incorporated by reference in the present case, the use of terms incorporated into the present case by reference is complementary to the present case. For incompatible inconsistencies, the terms used in the present case shall prevail.

[0030] For illustrative purposes, embodiments of the present invention will now be described with reference to a stencil printer for printing assembly materials such as solder paste and a dispenser for depositing assembly materials onto a circuit board. However, those skilled in the art will understand that embodiments of the present invention are not limited to stencil printers and dispensers for printing solder paste onto circuit boards, but can be used in other applications requiring the dispensing of other viscous assembly materials (e.g., adhesives and sealants). For example, the apparatus can be used to print or deposit epoxy resin for use as an underfill for wafer-level packages. Furthermore, the stencil printers and dispensers according to embodiments of the present invention are not limited to printing and depositing component materials on circuit boards, but include stencil printers and dispensers for printing other materials on various substrates such as semiconductor wafers. In some embodiments, the stencil printer may include a stencil printer platform or series provided by ITW Electronic Assembly Equipment, Inc. In Figure 1, an exemplary stencil printer is generally indicated by 5. In this embodiment, stencil printer 5 is an Edison™ series stencil printer platform provided by ITW Electronic Assembly Equipment, Inc. Furthermore, in some embodiments, these dispensers may include Prodigy™ series dispensers provided by ITW Electronic Assembly Equipment. An exemplary dispenser is typically indicated by 7 in Figure 2. In this embodiment, dispenser 7 is a Prodigy™ dispenser platform provided by ITW Electronic Assembly Equipment.

[0031] Referring to FIG3, a stencil printer of an embodiment of the present invention is generally indicated by 10. As shown, the stencil printer 10 includes a frame 12 supporting components of the stencil printer. The components of the stencil printer may partially include a controller 14, a display 16, a stencil 18, and a printhead or printhead assembly, generally indicated by 20, configured to apply solder paste in a manner described in more detail below. In one embodiment, the controller 14 is conventionally located behind the panel of the stencil printer.

[0032] As shown in Figure 2 and described below, the template and printhead assembly may be suitably coupled or otherwise connected to the frame 12. In one embodiment, the printhead assembly 20 may be mounted on a printhead assembly stand 22, which may be mounted on the frame 12. The printhead assembly stand 22 enables the printhead assembly 20 to move along the y-axis under the control of the controller 14 and to apply pressure to the printhead assembly upon engagement with the template 18. In another embodiment, the printhead assembly 20 may be placed on the template 18 and may be lowered in the z-axis direction to contact and seal against the template.

[0033] The stencil printing machine 10 may also include a transport system having a track (not shown) for transporting printed circuit boards (sometimes referred to herein as "printed circuit boards," "substrates," or "electronic substrates") to a printing position within the stencil printing machine. The track, sometimes referred to herein as a "traction feeder mechanism," is configured to feed, load, or otherwise deliver the circuit boards to the working area of ​​the stencil printing machine, which may be referred to herein as a "printing nest," and to unload the circuit boards from the printing nest.

[0034] Referring also to Figure 4, the stencil printing machine 10 has a support assembly 28 to support the circuit board 29 (shown in dashed lines). The support assembly 28 raises and secures the circuit board, thereby stabilizing it during the printing operation. In some embodiments, the substrate support assembly 28 may also include a specific substrate support system, such as a support body, a plurality of pins, or a flexible tool, positioned below the circuit board when it is in the printing position. The substrate support system may be used in part to support internal areas of the circuit board to prevent flexing or warping of the circuit board during the printing operation.

[0035] In one embodiment, the printhead assembly 20 may be configured to receive solder paste from a source such as a dispenser (e.g., a solder paste container) that supplies solder paste to the printhead assembly during the printing operation. Other methods of supplying solder paste may be used instead of the container. For example, solder paste may be deposited manually between the blades or deposited from an external source. Additionally, in one embodiment, the controller 14 may be configured to use a personal computer with a suitable operating system, such as an operating system provided by Microsoft Corporation, and dedicated software to control the operation of the stencil printer 10. The controller 14 may be networked with a main controller used to control the production line for manufacturing circuit boards.

[0036] In one configuration, the stencil printer 10 operates as follows: A circuit board 29 is loaded into the stencil printer 10 using a conveyor track. A support assembly 28 is raised and secures the circuit board 29 to a printing position. The print head assembly 20 is then lowered along the z-axis until the blades of the print head assembly contact the stencil 18 under the required pressure. The print head assembly 20 is then moved across the stencil 18 in the y-axis direction via a print head assembly stand 22. The print head assembly 20 deposits solder paste onto the circuit board 29 through openings in the stencil 18. Once the print head assembly has completely crossed the openings across the stencil 18, the print head assembly is lifted off the stencil, and the circuit board 29 is returned to the conveyor track. The circuit board 29 is released from the stencil printer 10 and conveyed so that a second circuit board can be loaded into the stencil printer. To print on the second circuit board 29, the print head assembly is lowered along the z-axis to contact the stencil and moved across the stencil 18 in a direction opposite to that used for the first circuit board.

[0037] To align the stencil 18 with the circuit board 29 before printing and to inspect the circuit board after printing, an imaging system 30 can be provided. In one embodiment, the imaging system 30 may be positioned between the stencil 18 and the support assembly 28 supporting the circuit board. The imaging system 30 is coupled to an imaging stage 32 to move the imaging system. In one embodiment, the imaging stage 32 may be coupled to a frame 12 and includes a beam extending between side rails of the frame 12 to provide reciprocating movement of the imaging system 30 in the y-axis direction on the circuit board 29. The imaging stage 32 may also include a carriage arrangement that encloses the imaging system 30 and is configured to move in the x-axis direction along the length of the beam. The construction of the imaging stage 32 for moving the imaging system 30 is well known in the field of solder paste printing. This configuration allows the imaging system 30 to be positioned anywhere below the stencil 18 and above the circuit board 29 to capture images of predetermined areas of the circuit board or the stencil, respectively.

[0038] After one or more solder pastes are applied to the circuit board, excess solder paste may accumulate at the bottom of stencil 18 and the stencil wiper assembly (typically indicated as 34), and may move beneath the stencil to remove the excess solder paste. In other embodiments, stencil 18 may be movable on the stencil wiper assembly.

[0039] Referring to Figure 5, according to one embodiment of this invention, the dispensing system is generally indicated by 40. Dispensing system 40 is used to dispense viscous materials (e.g., adhesives, sealants, epoxy resins, solder paste, underfill materials, etc.) or semi-viscous materials (e.g., flux, etc.) onto an electronic substrate 42, such as a printed circuit board or semiconductor wafer. Dispensing system 40 can alternatively be used in other applications, such as for coating automotive liner materials, or in certain medical applications, or for coating conductive inks. It should be understood that references to viscous or semi-viscous materials used herein are exemplary and not intended to be limiting. In one embodiment, dispensing system 40 includes first and second dispensing units, respectively indicated by 44 and 46, and a controller 48 for controlling the operation of the dispensing system. It should be understood that dispensing units 44, 46 may also be referred to herein as dispensing pumps and / or dispensing heads. Although two dispensing units 44, 46 are illustrated, it should be understood that a single dispensing unit or multiple dispensing units (more than two) may be used.

[0040] The dispensing system 40 may further include a frame 50 having a base or support 52 for supporting the electronic substrate 42, a dispensing unit platform 54 movably coupled to the frame to support and move the dispensing units 44, 46, and a weight measuring device or weighing scale 56 for weighing the amount of viscous material dispensed (e.g., as part of a calibration procedure and to provide weight data to the controller 48). A conveying system (not shown) or other transport mechanism, such as a stepper beam, may be used in the dispensing system 40 to control the loading and unloading of the electronic substrate 42 into the dispensing system 40. A motor may be used to move the platform 54 under the control of the controller 48 to position the dispensing units 44, 46 at predetermined locations on the electronic substrate 42. The dispensing system 40 may include a display unit 58 coupled to the controller 48 for displaying various messages to the operator. An optional second controller may also be provided for controlling the dispensing units 44, 46. Furthermore, each dispensing unit 44, 46 may be configured with a z-axis sensor to detect a height at which the dispensing unit is positioned above the electronic substrate 42 or above a feature mounted on the electronic substrate. The z-axis sensor is connected to the controller 48 to transmit the information obtained by the sensor to the controller.

[0041] As described above, before performing the dispensing operation, the electronic substrate 42 (e.g., a printed circuit board) must be aligned, or otherwise aligned, with the dispensing units 44, 46 of the dispensing system. The dispensing system 40 also includes a vision system 60, which in one embodiment is coupled to a vision system stand 62, movably coupled to a frame 50 for supporting and moving the vision system. In another embodiment, the vision system 60 may be mounted on a dispensing unit stand 54. As described, the vision system 60 is used to verify the position of landmarks (referred to as references) or components on the electronic substrate 42. Once positioned, the controller 48 can be programmed to manipulate the movement of one or more of the dispensing units 44, 46 to dispense material onto the electronic substrate 42.

[0042] The systems and methods of this invention pertain to dispensing materials onto an electronic substrate, such as a printed circuit board. The description of the systems and methods provided in this invention refers to an exemplary electronic substrate (e.g., a printed circuit board) supported on a support 52 of a dispensing system 40. In one embodiment, the dispensing operation is controlled by a controller 48, which may include a computer system configured to control material dispensing units 44, 46. In another embodiment, the controller 48 may be operated by an operator. The controller 48 is configured to control the movement of a vision system stage 62 to move the vision system 60 to acquire one or more images of the electronic substrate 42. The controller 48 is also configured to control the movement of a dispensing unit stage 54 to move the dispensing units 44, 46 to perform the dispensing operation.

[0043] Referring to Figures 6 and 7, the dispensing system is generally indicated by 70. As shown, the dispensing system 70 includes a frame 72 configured to support the main sub-components of the dispensing system. The dispensing system 70 also includes a frame system, generally indicated by 74, configured to move in the x- and y-axis directions. The dispensing system 70 also includes a dispensing unit assembly, generally indicated by 76, which is supported by the frame system 74. Figure 6 illustrates the dispensing system 70 with the dispensing unit assembly 76, while Figure 7 illustrates the dispensing system without the dispensing unit assembly. As shown, the dispensing unit assembly includes a dispensing unit 78, which, as described below, is configured to deposit material onto a substrate, such as substrate 42. A transport system (not shown) may be used in the dispensing system 70 to control the loading and unloading of substrates (e.g., electronic substrates) from the support 80 of the dispensing system. The bench system 74 can use a motor under the control of a controller to move in the x and y directions in a manner similar to the controller 48 of the dispensing system 40, so as to position the dispensing unit assembly 76 at a predetermined position above the electronic substrate provided on the support 80.

[0044] In one embodiment, as shown in Figures 6 and 7, the bench system 74 may be configured to include a left side rail 82, a right side rail 84, and a beam 86 extending between the two side rails. The beam 86 is configured to move along the side rails 82 and 84 in the y-axis direction to achieve y-axis movement of the dispensing unit assembly 76. The bench system 74 also includes a trolley 88 coupled to the beam 86 and configured to move along the length of the beam to provide x-axis movement of the dispensing unit assembly 76. Specifically, the trolley 88 supports the dispensing unit 78 of the dispensing unit assembly 76 and is configured to move along the length of the beam 86 in the x-axis direction to move the dispensing unit to a desired position on the electronic substrate located on the support 80 of the dispensing system 70. In one embodiment, the movement of the bench system 74 in the xy-plane (i.e., the movement of the beam 86 and the trolley 88) may be achieved by employing a ball screw mechanism driven by a corresponding motor, as is known in the art.

[0045] The dispensing unit assembly 76 is configured to move the dispensing unit 78 in the z-axis direction via the z-axis drive mechanism 90, as shown in FIG. 7. The amount of z-axis movement can be determined by measuring the distance between the tip (not shown) of the dispensing unit 78 and the electronic substrate. During movement, the dispensing unit 78 can be positioned at a nominal gap height above the electronic substrate. This gap height can be maintained at a relatively consistent height above the electronic substrate when moving from one dispensing position to another. Upon reaching a predetermined dispensing position, the z-axis drive mechanism 90 lowers the dispensing unit 78 onto the electronic substrate, thereby enabling the dispensing of material onto the electronic substrate.

[0046] Referring again to Figures 6 and 7, the dispensing unit 78 moves above the electronic substrate in such a manner that a dispensing operation can be performed using the dispensing unit. However, prior to dispensing, the position of the electronic substrate relative to the dispensing unit 78 is determined so that accurate dispensing can be performed. Specifically, in one embodiment, the trolley 88 may be configured to include an optical element or camera designed to capture images of the electronic substrate. Although the camera is described as being mounted on the trolley 88, it should be understood that the camera may be mounted separately on the beam 86 or on a separate pedestal. The camera may be referred to herein as a "vision system" or an "imaging system". To align the electronic substrate with the dispensing unit 78 and the pedestal system 74 of the dispensing unit assembly 76, images of at least two reference points set on the electronic substrate are captured by the camera. If the electronic substrate is not positioned, the pedestal system may be manipulated to take into account the actual position of the electronic substrate. In one embodiment, the camera may be calibrated to determine the camera-to-needle offset distance of the dispensing unit.

[0047] In another embodiment, visual alignment and gap height sensing can be achieved via a laser or another calibrated distance measuring device provided within the dispensing system 70.

[0048] Both stencil printers and dispensers require manual intervention to perform replacement and / or replenishment of certain components. For example, in a stencil printer, a typical stencil needs to be replaced after a certain period of time (e.g., four hours). Additionally, stencils need to be replaced for individual production runs. Furthermore, for both stencil printers and dispensers, the solder paste cassettes supplying temperature-controlled solder paste to the stencil printer and dispenser need to be replaced over time, such as every four hours or less. Individual production runs may require different solder paste materials. For stencil printers, squeegees and tools wear down during use and need to be replaced periodically.

[0049] This embodiment relates to a conveying system configured to automate the conversion process of stencil printers and dispensers or any other type of assembly handling equipment, including but not limited to pick-and-place machines, waveform and selective soldering machines, reflow ovens, cleaning agents, and inspectors. In one embodiment, the conveying system includes a mobile trolley configured to engage the stencil printer and / or dispenser to supply and receive replacement and replenishment parts and materials to perform the conversion. For example, the stencil printer and dispenser may each include a docking station configured to receive the mobile trolley. The docking station may include an interface enabling the mobile trolley to communicate with the stencil printer and / or dispenser. A single mobile trolley may be configured to include a stencil conversion kit, a replacement stencil, a replacement solder paste cartridge, a replenishment solder paste cartridge, a replacement squeegee, a replenishment squeegee, and a replacement support tool. For example, during conversion, each of the stencil printer and / or dispenser must be reconfigured to produce different articles. Thus, for example, different types of solder paste may be used within the stencil printer and / or dispenser to produce different products.

[0050] The replacement process described in this application can be achieved via a single mobile cart configured to replace and / or replenish each item. In other embodiments, more than one mobile cart may be provided. For example, the mobile cart may be configured to support a predetermined number of solder paste tins selected for production runs expected on a specific date or during a specific time period. The mobile cart and / or stencil printer or dispenser may be configured to identify solder paste tins, store them in a suitable environment, transport them to the stencil printer and dispenser, inspect them, and engage them with the stencil printer. The mobile cart may also be configured to remove used components, such as solder paste tins, from the stencil printer and dispenser. Furthermore, the mobile cart may be configured for long-term storage of solder paste tins. In one embodiment, long-term storage of solder paste can be achieved by refrigeration at 0–10°C (32–50°F). The solder paste tins may be stored in a location within the mobile cart to maintain this temperature range. In another embodiment, the movable trolley can be configured to preheat the solder paste box before use to prepare it for use in a stencil printing machine.

[0051] Embodiments of this application also relate to a conveying system configured to automate the replenishment process of a stencil printer. In one embodiment, the conveying system includes a movable trolley configured to engage with the stencil printer to supply and receive replacement and replenishment parts and materials. For example, the stencil printer may include a docking station configured to receive the movable trolley. The docking station may include an interface enabling the movable trolley to communicate with the stencil printer. A single movable trolley may be configured to include stencil changing, stencil replacement, solder paste cartridge replacement, solder paste cartridge replenishment, squeegee blade replacement, squeegee blade replenishment, and support tool replacement. For example, during replenishment, critical consumables of the stencil printer must be replenished periodically. In one example, the solder paste cartridge needs to be replaced when it is depleted. Other items, such as paper and solvents used in stencil wipers, may also be replenished.

[0052] The replenishment process described in this application can be implemented via a single mobile cart configured to replenish all replenishable items. In other embodiments, more than one mobile cart may be provided. For example, for solder paste replenishment, the mobile cart is configured to support multiple replacement solder paste cartridges. The mobile cart and / or stencil printer may be configured to identify replacement solder paste cartridges, store the cartridges, transport the cartridges to and from the stencil printer, inspect the cartridges, and engage with the stencil printer. The mobile cart may also be configured to remove used items, such as solder paste cartridges, from the stencil printer.

[0053] Referring to Figure 8, in one embodiment, a movable trolley, generally indicated by 100, is illustrated in a docking position relative to assembly equipment (e.g., stencil printing machine 10 or dispensing system 70). As shown, the movable trolley 100 includes a frame or housing 102 configured to support replacement and / or replenishment items. As shown, the frame 102 of the movable trolley 100 is generally rectangular and supported on wheels or casters, each wheel or caster indicated by 104. In one embodiment, the movable trolley 100 is configured to be manually moved by an operator by pushing the housing 102 of the movable trolley. In this embodiment, the movable trolley 100 may be configured with a push rod or handle. In another embodiment, the movable trolley 100 is configured to be moved automatically via remote control or automated control associated with the movable trolley, assembly equipment 10, 70, production line, and / or some other dedicated controller. In this embodiment, the mobile cart 100 may include wheels 104 driven by a suitable motor and transmission system, and a controller 106 associated with the mobile cart. Alternatively, in other embodiments, the controller may be associated with assembly equipment 10, 70, a production line, and / or other dedicated controllers configured to control the mobile cart. The mobile cart 100 may also include one or more sensors and / or vision systems, such as cameras, to guide the mobile cart from, for example, a storage room to the assembly equipment 10, 70.

[0054] In one embodiment, the movable trolley 100 includes one or more shelves, each designated 108, configured to store items for use with the assembly equipment 10, 70. For example, shelves 108 may be specifically designed to support new and used / empty solder paste cartridges. One or more shelves 108 may be configured to move vertically within the housing 102 to a height suitable for operation with the assembly equipment 10, 70. Some shelves 108 may be designated as "clean shelves" to support clean or new items ready for use within the assembly equipment 10, 70. Some shelves 108 may be designated as "dirty shelves" to support used items removed from the assembly equipment 10, 70. Shelves 108 may be spaced apart to accommodate various items. For example, shelves 108 may be spaced 3 / 8 inch to 1.5 inches apart to accommodate template frame thickness.

[0055] The movable cart 100 may be configured with an interface designed to dock within a docking station provided on the assembly equipment 10, 70. In one embodiment, as shown in FIG8, the movable cart 100 includes an interface 110 configured to dock within a docking station 112 of the assembly equipment 10, 70 from both a mechanical interface and an electronic communication interface. In a particular embodiment, the movable cart 100 may be configured with a unique mechanical interface that mates with a unique mechanical docking station of the assembly equipment 10, 70. This unique mechanical interface / docking station may include geometric features. In another embodiment, the movable cart 100 may be configured with pins received within guides associated with the assembly equipment 10, 70 to align the movable cart with the assembly equipment before full docking. Other types of guides may be used, such as electrical / magnetic guides, visual guides, detectors, latches, etc. When the movable trolley 100 is docked in the docking station 112 of the assembly equipment 10 or 70, it can be physically engaged with the assembly equipment or separated from the assembly equipment.

[0056] Embodiments of this invention relate to a system and method for aligning a movable cart with an assembly equipment after the movable cart has been initially positioned within a docking station of the assembly equipment. In one embodiment, referring to Figures 9-11, the assembly equipment (e.g., a stencil printing machine 10) includes one or more sensors configured to detect light generated by one or more lasers disposed on the movable cart. As shown, in one embodiment, the system for aligning the movable cart with the assembly equipment includes two sensors, each indicated as 120, suitably mounted on a support structure of the assembly equipment 10. Although two sensors 120 are illustrated, the system may include only one sensor to align the movable cart with the assembly equipment. In one embodiment, as shown in Figures 9-11, the sensor 120 is mounted on a stencil support 122 configured to support a stencil, such as stencil 18. The sensor 120, positioned on the stencil support 122, positions the movable cart (once initially positioned in front of the assembly equipment) in the correct location. Once alignment is confirmed, the movable trolley can be moved to fully engage with the assembly equipment.

[0057] In a dispenser, one or two sensors (e.g., sensor 120) may be mounted on the dispenser's frame, close to the tool used to process the support circuit board. In another embodiment, the sensor may be mounted on a rack supporting the dispenser's dispensing head. As described above, although two sensors 120 are illustrated, it should be understood that only one sensor is required to accurately align the movable trolley with the assembly equipment. In one embodiment, sensor 120 is a position-sensing diode.

[0058] Referring to Figures 12-14, and especially Figure 14, the system also includes a laser 130, such as a low-power laser, mounted on the frame of the mobile cart. Although one laser 130 is illustrated in the figures, the system may include two lasers, one for each sensor 120, to align the mobile cart with the assembly equipment. As shown, the laser 130 is configured to generate a beam 132, which is guided to the sensor 120 disposed on the assembly equipment 10. The laser 130 on the frame 102 of the mobile cart 100 is positioned at the same height as the sensor 120 on the sensor support 122 of the assembly equipment 10. The laser 130 can be positioned at any suitable location on the frame 102 to align the mobile cart 100 with the assembly equipment 10.

[0059] Referring to Figures 15 and 16, Figure 15 illustrates how sensor 120 is attached to assembly equipment 10. As shown, sensor 120 includes a PCB substrate with mounting holes configured to receive a support, which is fixed to the frame of device 10. Figure 16 illustrates how laser 130 is attached to movable trolley 100. As shown, laser 130 is attached to frame 102 of movable trolley 100 via an antistatic plastic housing 131, which is secured to the frame by suitable fasteners.

[0060] During operation, once the movable trolley is initially positioned in front of the assembly equipment, laser 130 emits a beam 132 toward the assembly equipment, which is guided to and received by sensor 120. Once aligned, the movable trolley can be fully docked within the assembly equipment.

[0061] In one embodiment, sensor 120 is configured to generate output signals that can be connected to a subsystem, such as the controller of the assembly equipment and / or the controller 106 of the movable cart 100. For a stencil system, sensor 120 may be coupled to the controller 14 of the stencil printing machine 10 and generate output signals processed by the controller 14. For a dispenser, sensor 120 may be coupled to the controller 48 of the dispensing system 40 and generate output signals processed by the controller 48. The assembly equipment subsystem, such as suitable software associated with the assembly equipment controller, is configured to convert the output signals into relative or absolute coordinates of the x, y, and z axes. As described above, this subsystem may be additionally associated with or alternative to the movable cart 100.

[0062] Furthermore, in one embodiment, laser 130 is calibrated to one side of the movable cart 100, such as the shelf 108 of the movable cart, to ensure that the laser emits a beam 132 aligned with the x, y, and z coordinates of the movable cart. This calibration ensures that beam 132 is properly aligned during installation, which is important for ensuring that the system operates with all types of assembly equipment that use sensors 120 and laser 130 to align the movable cart 100 with the assembly equipment.

[0063] During operation, the sensor 120 is mounted on the assembly equipment such that the beam 132 emitted from the laser 130 on the movable trolley will be interpreted by the assembly equipment's subsystem as a nominal position of 0,0 for x-axis alignment and z-axis height, for example, the height of the template relative to the assembly equipment when all axes in the assembly equipment are in their initial positions. This information informs the assembly equipment that the movable trolley is in the correct or appropriate position relative to the assembly equipment and allows for the execution of functions such as transferring the template from the movable trolley to the assembly equipment. In this case, the y-axis system is used for light intensity measurement during calibration. If a reading other than 0,0 is detected, it is interpreted as misalignment, and the assembly equipment or the movable trolley can make the necessary adjustments to return to a 0,0 reading to signal that the movable trolley is correctly aligned with the assembly equipment when docked.

[0064] If the reading is not 0,0 during initialization, this will be interpreted as an offset from the original position, which can be compensated for by the controller software of the assembly equipment, the controller of the mobile cart, or both. In one embodiment, the controller of the mobile cart (including a laser) communicates with the controller of the assembly equipment (including sensors) via a CAN bus system.

[0065] In one embodiment, the sensor is a DL100-7 PCBA3 sensing diode supplied by First Sensor AG of Berlin, Germany. The sensor is configured as a dual-sided position sensing module consisting of a 10mm x 10mm effective area position sensing photodiode and related circuitry. The sensing diode is configured to sense the position of a light spot on the photodiode surface and provide voltage analog across two axes and laser spot intensity across two axes.

[0066] In one embodiment, the laser is a VLM-635 / 650-02 series supplied by Infiniter Laser in Diamond Bar, California. This laser is an industrial red dot laser with an adjustable focus range, for example, from 100mm to infinity.

[0067] In one embodiment, the mobile cart may be configured with one or more means for transporting items from the mobile cart to the assembly equipment and from the assembly equipment to the mobile cart. For example, the means may include clamps for engaging items such as substrate tool trays to move tool trays from the assembly equipment to the trays of the mobile cart, and to move different tool trays from the mobile cart to the assembly equipment.

[0068] In one embodiment, the mobile cart includes wheels driven by a suitable motor and transmission system, and a controller configured to control the movement of the mobile cart. The mobile cart also includes a power source, such as a battery, to provide power for the movement of the mobile cart via the motor and transmission system.

[0069] In some embodiments, the mobile cart includes a controller adapted to control the operation of the mobile cart based on operating parameters obtained from the controller. The controller may be configured to communicate with a controller of the assembly equipment and / or a controller associated with the production line. In one embodiment having multiple mobile carts, the controller may be implemented as a plurality of controllers located in each mobile cart, communicating with each other via a Controller Area Network (CAN) bus or other type of network. In other embodiments, a master controller may be provided to control the operation of the controllers of the mobile carts. Each mobile cart may be provided with a display operatively coupled to the controller. The display is adapted to display operating parameters of the mobile cart, such as, but not limited to, the number of full and empty / used solder paste trays. A suitable monitor may be provided to acquire this information. Alternatively, or in addition to the foregoing embodiments, the operating parameters may be displayed on a display provided within the assembly equipment and / or on a display associated with the production line.

[0070] In other embodiments, the controller may be a controller dedicated to one or more movable carts.

[0071] In some embodiments, material identification of items on a mobile cart may include means of manipulating the item and a scanner to scan and identify the item. For example, for solder paste tins, the mobile cart may be configured to include clamping wheels to rotate the solder paste tin so that a code or predetermined identification mark provided on the solder paste tin is aligned with a scanner provided on the mobile cart. The system is configured to associate material identification associated with the solder paste tin with a formulation, production time, etc., for assembly equipment. In one embodiment, a barcode may be used to identify the item. For example, the barcode may include a one-dimensional scanner for UPC codes, a two-dimensional scanner for QRC codes, a printed label applied to the item, or a laser-etched label etched onto the item. In another embodiment, an RFID system may be used to identify the item. For example, the RFID system may include an RFID tag applied to the item and an RFID reader associated with the mobile cart. When using an RFID system, no field line needs to be established between the reader and the item. Moreover, scanning is not required to identify all items within the mobile cart. In another embodiment, an imaging or vision system may be used to identify the item. The vision system can be an imaging system, similar to an imaging system associated with a stencil printer or dispenser, or on a mobile cart.

[0072] In some embodiments, a database is provided to track items inventoryed on a mobile cart. In one embodiment, the database may include an open application (App) architecture and be configured to push data to assembly equipment. The mobile cart may be configured to communicate with the assembly equipment to push / pull data to the assembly equipment and / or production line, or to communicate directly with the production line. The database may include job information or material information. The database may also communicate with a manufacturing execution system (MES) associated with the production line, the assembly equipment, or both. The MES system may be configured to know which materials are needed for production operations. The mobile cart may be configured to communicate with the MES system to adjust the delivery of items to the assembly equipment.

[0073] The database can also be configured to retrieve information about items based on identification, such as barcode numbers. In one embodiment, a central management system can be provided, in which assembly equipment and / or mobile carts are programmed to accept materials from the mobile carts. The mobile carts are programmed to update the database to identify the materials on the mobile carts, loading information from a network into a database associated with the mobile carts and / or assembly equipment, the network being linked to the MES system.

[0074] The database can be further configured to store additional information, such as usage and consumption. It can be configured to store information locally or remotely, and can be configured to store data associated with one or more production operations. For example, the database can be configured to acquire and store data, including but not limited to traceability of stencils, solder paste spools, squeegees, tools, solder paste usage, and cycle times.

[0075] This database can be configured to share predictive data when replacement / replenishment is needed. For example, regarding storing information related to solder paste tins, the database can be configured to perform one or more of the following operations: store information on when solder paste tins need to be replenished; perform certain functions if solder paste tins are low; trigger alarms and / or report low solder paste tin levels; send signals to inventory control systems related to assembly equipment and / or production lines; analyze consumable usage based on operating parameters and actual usage as well as upstream / downstream equipment activity; predict replacement or maintenance (on assembly equipment and / or on mobile carts); and associate multiple stations to predict when solder paste tins should be replaced. The database can also be configured to share predictive data for other modifiable / consumable items, such as stencils, solder paste tins, scrapers, and tools.

[0076] This database can be configured to store data related to batch traceability. Additionally, RFID or mechanical keying of a template or template frame is provided to ensure correct alignment / orientation / direction / backward / upward / downward when inserting these items into assembly equipment. This information can be used to verify correct orientation and / or fit before items are transported from the warehouse and / or before they are installed in assembly equipment. A low-cost reader can perform this function.

[0077] In one embodiment, the remote controller can be configured to communicate with the database via the cloud or ISP to provide the aforementioned functions. In another embodiment, the database may be part of a computer control system for assembly equipment, mobile carts, or production lines.

[0078] In some embodiments, the mobile trolley can be configured to store materials. The mobile trolley can be configured to be flexible, receiving materials from and to where they are going. Additionally, the mobile trolley can be configured to identify the location of specific materials on the mobile trolley. In some embodiments, whether via automated or manual conveying, this location is remote, local, on the mobile trolley, and / or on the assembly equipment. As described above, the mobile trolley can be configured to control environmental parameters. For example, the mobile trolley can be configured to control the temperature of the solder paste contained in the solder paste cassettes by cooling stored solder paste cassettes, heating solder paste cassettes ready for use, and cooling solder paste cassettes that have been used but still contain solder paste. In one embodiment, the housing may be insulated, and a cooling / heating unit may be provided to cool or heat the interior of the housing, thereby cooling or heating the solder paste cassettes. The mobile trolley can also be configured to predict when to begin heating / cooling the solder paste cassettes, track shelf-life times, and individually control each solder paste cassette at the appropriate temperature and time based on upcoming production. In other embodiments, the mobile cart may include a tray emitter to move the solder paste tray. The mobile cart may also be configured to control humidity to prevent condensation. The mobile cart may also be configured to operate in clean environments, such as Standard Mechanical Interface (SMIF) environments.

[0079] In some embodiments, the mobile cart can be configured to perform inventory control. Specifically, the mobile cart can be configured to identify where materials are located, how much material is used, how material is used, and when material is used, link materials and related material information to the customer's inventory control system, and track the types of materials consumed for each or multiple boards.

[0080] In some embodiments, a mobile trolley can be configured to arrange items stored on the mobile trolley. As described above, in one embodiment, a mobile trolley can be provided to store, transport, and deliver various resources, including but not limited to solder paste trays. In another embodiment, a mobile trolley can be configured to store, transport, and deliver a single resource or item to an assembly device. A mobile trolley can be configured to serve multiple production lines. In another embodiment, a mobile trolley can be configured to repair an assembly device.

[0081] In some embodiments, the mobile cart can be configured to transport items from the mobile cart to the assembly equipment and from the assembly equipment to the mobile cart, taking into account the height difference between the mobile cart and the assembly equipment. This transport can be automatic or manual. In one embodiment, the mobile cart can be moved or remotely controlled via Automated Guided Vehicle (AVG) technology associated with the mobile cart. In another embodiment, the mobile cart can be configured to move automatically. In another embodiment, the mobile cart can be configured to move manually. In yet another embodiment, the mobile cart can be configured to move items stored on the mobile cart automatically and / or manually. For example, the mobile cart can be configured to move items automatically and can provide the ability to interrupt a predetermined activity in which items are manually moved.

[0082] In some embodiments, the time associated with performing the transport function of the mobile cart can be programmed to accommodate shift changes, such as personnel shifts, schedule maintenance, on-demand activities, such as recipe changes, and predictive events (instant replacement). Time can be programmed to use one or more mobile carts to meet multiple production line balancing control requirements and to meet the real-time on-demand material supply needs on the production line.

[0083] In some embodiments, the mobile cart is configured to perform inspections. For example, the mobile cart can inspect items on and outside the cart, including stencils, solder paste containers, scrapers, and tools. In one embodiment, a vision system associated with the mobile cart can be configured to acquire images of the items. The vision system, together with a controller, can be configured to inspect cleanliness, damage, wear, and readability, such as whether barcode labels are worn, dirty, or torn. The vision system can include any type of 2D, 3D, or color camera.

[0084] In some embodiments, the movable cart is configured to interface with the assembly equipment from both a mechanical interface and an electronic communication interface. In one embodiment, the movable cart may be configured with a unique mechanical interface that mates with a unique mechanical interface of the assembly equipment. This unique mechanical interface may be a geometric feature. In another embodiment, the movable cart may be configured with pins received within guides associated with the assembly equipment to align the movable cart with the assembly equipment before full docking. The pins and guides may be reversed, with the pins positioned on the assembly equipment and the guides positioned on the movable cart. Other types of guides may be used, such as electrical / magnetic guides, visual guides, detectors, latches, etc.

[0085] In some embodiments, the interface and docking station may be configured with a clamping system to hold the movable trolley in place relative to the assembly equipment. For example, a magnetic clamping system may be used.

[0086] In some embodiments, the assembly equipment may be configured with multiple docking stations, such as five docking stations. The docking stations may be located at the front or rear of the assembly equipment.

[0087] The mobile trolley and / or assembly equipment can be configured to verify whether the mobile trolley can dock and engage with the assembly equipment. In one embodiment, verification can be provided to confirm that the mobile trolley is in place and ready to engage with the assembly equipment. This verification process can further determine whether the correct materials are on the mobile trolley, and whether material information of the mobile trolley can be received from the MES system or identified locally. If incorrect, the mobile trolley can be configured to trigger an alarm and / or warn the operator if the materials on the mobile trolley are incorrect or damaged.

[0088] In some embodiments, the mobile cart may be configured with an actuator or actuator to move items into or out of the mobile cart when it is docked with the assembly equipment. Embodiments of the actuator may be applied to the mobile cart, the assembly equipment, or both. In another embodiment, items may be loaded and unloaded from the mobile cart manually.

[0089] In some embodiments, the movable trolley can be configured to engage with a production line. Using this embodiment, the production line operator can confirm the correct location and the availability of the movable trolley received on the assembly equipment.

[0090] In some embodiments, the mobile cart may be configured to communicate with the assembly equipment, the production line, and / or selected machines within the production line via an open platform. The communication system may include wired systems, wireless systems (via general network, mesh network, Bluetooth, Wi-Fi, Zigbee, WAN, node, Li-Fi, etc.), combinations of wired and wireless systems, and infrared (IR) systems.

[0091] In some embodiments, the mobile cart may be configured with a dedicated power supply. In one embodiment, the mobile cart includes a battery configured to power automated components provided within the mobile cart, such as mechanisms for moving stencils in and out of the mobile cart, mechanisms for moving solder paste stencils in and out of the mobile cart, mechanisms for moving squeegees in and out of the mobile cart, and mechanisms for moving tools in and out of the mobile cart. In other embodiments, the mobile cart may be configured with an uninterruptible power supply. The power supply may be configured to support actuation during "docking" (high voltage from the assembly equipment during docking, and low voltage otherwise when not docked). The power supply may be configured to recharge autonomous operation, for example, by recharging the battery from power supplied by the assembly equipment.

[0092] In some embodiments, a mobile cart may be configured to work with assembly equipment. For example, the mobile cart may be configured to provide handshake communication with the assembly equipment before transferring items, such as "Please give me solder paste container #1234". The mobile cart and the assembly equipment may be configured with a communication protocol and / or a reference library regarding what is available for consumption. The mobile cart may be configured to determine whether the mobile cart has the correct items. Handshake communication may be configured to ensure correct item transfer, such as "Here is solder paste container #1234", and / or to ensure subsequent item transfer, such as "I now have solder paste container #1234". In one embodiment, a moving device may be configured to scan and identify items in the mobile cart and determine, for example, whether the items are ready for use, require cleaning, etc.

[0093] In some embodiments, the mobile cart may be configured to address errors related to the handling and retrieval of items in the mobile cart. For example, the mobile cart may be configured to detect incomplete actions by one party, incomplete transport of items (e.g., stuck or jammed items), dropped transport (e.g., “I’m delivering solder paste box #1234 to you, have you received it?”), and manual intervention or substitution (e.g., “Let me assist you.”). In one embodiment, a controller associated with the mobile cart may be configured to perform electrostatic discharge control, data recovery, and / or safety.

[0094] In some embodiments, the mobile cart can be configured to have a higher level of capability. In addition to indexing all equipment to the correct height, the mobile cart also needs to pull in / out all equipment for connection to the machine platform.

[0095] In some embodiments, the existing machine frame, guide rails, and printhead of the assembly equipment can be configured to insert and remove items.

[0096] In some embodiments, the movable trolley may be configured with a solder paste cartridge indexer for loading / unloading paste cartridges.

[0097] In some embodiments, the mobile cart may be configured to communicate with assembly equipment, production lines, and warehouses associated with those production lines.

[0098] In some embodiments, the mobile cart may be configured with an electric / pneumatic interface.

[0099] In some embodiments, the mobile cart can be configured to track consumables—new and used consumables (such as solder paste boxes) on the mobile cart—including location, temperature, and other data.

[0100] In some embodiments, the mobile cart may be configured to scan all consumables using a suitable scanning device, such as a barcode reader or an RFID reader.

[0101] In some embodiments, the movable trolley may be configured with an indexing mechanism to properly position consumables.

[0102] In some embodiments, the mobile cart may be configured with a bypass switch to disconnect the mobile cart from the assembly equipment in the event of a problem with the mobile cart.

[0103] In some embodiments, the mobile cart may be configured to be actively or passively subject to climate control.

[0104] In some embodiments, the mobile cart can be configured to be controlled by an application (App) for smartphone integration.

[0105] The "automated" or "fully automatic" replacement used in this case describes replacing or replenishing items without manual intervention.

[0106] The "partially automated" replacement, as used in this case, describes replacing or supplementing items with some or limited manual intervention.

[0107] As used in this article, "transportation" or "transportation steps" describes the movement of items from one location to another, either manually or using machines.

[0108] As used in this case, "installation" or "installation steps" describes the process of placing an item in a location ready for use.

[0109] The concepts disclosed in this case can be applied to other types of equipment used in the manufacture of electronic substrates, including dispensers, pick-and-place machines, reflow ovens, wave soldering machines, selective soldering machines, inspection stations, and cleaning stations. For example, the concept of replacement tools can be used in pick-and-place machines used to mount electronic components onto electronic substrates. In another example, the concept of replacement items can be used to replace solder in wave soldering and selective soldering machines, and cleaning products in cleaning stations.

[0110] Various variations, modifications, and alterations will be readily apparent to those skilled in the art to which this application pertains. Such variations, modifications, and alterations are incorporated into this application and are intended to be covered by its scope. Therefore, the above description and accompanying drawings are merely illustrative.

[0111] 5: Template printing machine 7: Distributor 10: Template printing machine 12: Framework 14: Controller 16: Monitor 18: Template 20: Printhead Assembly 22: Printhead Assembly Stand 28: Support components 29: Circuit Board 30: Imaging System 32: Imaging stage 34: Template Wiper Assembly 40: Distribution System 42: Electronic substrate 44: Allocation Unit 46: Allocation Unit 48: Controller 50: Framework 52: Support component 54: Distribution Unit Stand 56: Weighing scale 58: Display Unit 60: Visual System 62: Vision System Stand 70: Distribution System 72: Framework 74: Bench System 76: Allocation Unit Component 78: Allocation Unit 80: Support component 82: Side rail 84: Side rail 86: Liang 88: trolley 90: Z-axis drive mechanism 100: Portable trolley 102: Outer shell 104: Casters 106: Controller 108: Shelves 110: Interface 112: Docking Station 120: Sensor 122: Template support components 130: Laser 131: Antistatic plastic casing 132: Beam

[0112] Domestic storage information (please note in order of storage institution, date, and number) none

[0113] Overseas storage information (please note in the order of storage country, institution, date, and number) none

Claims

1. A system for aligning a movable trolley with an assembly apparatus having at least one of a plurality of items for replacement within the assembly apparatus, the assembly apparatus including a docking station, the movable trolley being configured to receive a used item and / or provide a new item to the assembly apparatus, the movable trolley including an interface configured to dock within the docking station of the assembly apparatus, the system comprising: A sensor associated with one of the assembly equipment and the mobile cart; and a laser associated with the other of the assembly equipment and the mobile cart, wherein the sensor and the laser are configured to align the mobile cart with the assembly equipment after an initial docking of the mobile cart within the docking station of the assembly equipment, and wherein the laser is calibrated to one side of the mobile cart to ensure that the laser emits a beam aligned with the x-axis, y-axis, and z-axis coordinates of the mobile cart.

2. The system as claimed in claim 1, wherein the sensor is mounted on a support of the assembly equipment and the laser is mounted on a frame of the movable trolley.

3. The system as claimed in claim 2, wherein the assembly equipment includes at least one component mounted on the support of the assembly equipment.

4. The system as claimed in claim 3, wherein the sensors are mounted on a template support configured to support a template within a template printing machine.

5. The system as claimed in claim 3, wherein the sensor is mounted on a support configured to hold a substrate within a dispenser.

6. The system as claimed in claim 2, wherein the laser is positioned on the frame of the movable trolley at the same height as the sensor of the assembly equipment.

7. The system as claimed in claim 1, wherein the laser is a low-power laser.

8. The system as claimed in claim 1, wherein the sensor is configured to generate an output signal that can be connected to a subsystem of the assembly equipment.

9. The system as claimed in claim 8, wherein the subsystem is a controller and the sensor generates an output signal, the output signal being processed by the controller.

10. The system of claim 9, wherein the controller includes software configured to convert the output signal into relative or absolute coordinates of the x-axis and z-axis.

11. A method for aligning a movable cart with an assembly apparatus having at least one of a plurality of items for replacement within the assembly apparatus, the assembly apparatus including a docking station, the movable cart being configured to receive a used item and / or provide a new item to the assembly apparatus, the movable cart including an interface configured to dock within the docking station of the assembly apparatus, the method comprising the steps of: providing a sensor on one of the assembly apparatus and the movable cart; directing a laser toward the sensor, the laser being associated with the other of the assembly apparatus and the movable cart, wherein the sensor and the laser are configured to align the movable cart with the assembly apparatus after an initial docking of the movable cart within the docking station of the assembly apparatus; and calibrating the laser to one side of the movable cart to a target, which will ensure that the laser emits a beam aligned with the x-axis, y-axis, and z-axis coordinates of the movable cart.

12. The method of claim 11, wherein the sensor is configured to generate an output signal that can be connected to a subsystem of the assembly equipment.

13. The method of claim 12, wherein the subsystem is a controller and the sensor generates an output signal, the output signal being processed by the controller.

14. The method of claim 13, wherein the controller includes software configured to convert the output signal into relative or absolute coordinates of the x-axis and z-axis.

15. The method of claim 11, wherein the sensor is mounted on the assembly equipment in such a manner that the beam emitted from the laser on the movable trolley is at a nominal position, which, when all axes of the assembly equipment are in their initial positions, will be interpreted as a 0,0 position for x-axis alignment and z-axis height.

16. The method as described in claim 15, wherein the information of the nominal position informs the assembly equipment that the movable trolley is in the correct or appropriate position relative to the assembly equipment and that it is acceptable for it to perform a function.

17. The method as described in claim 16, wherein, If the detected reading is not 0,0, it is interpreted as misalignment, and the assembly equipment or the movable trolley can make the necessary adjustments to return to a 0,0 reading so as to signal that the movable trolley is correctly aligned with the assembly equipment when it docks.

18. The method of claim 17, wherein if the reading is not 0,0 at initialization, it will be interpreted as an offset from an original position, which may be compensated by a controller software of the assembly equipment, or by the controller of the movable trolley, or by the controller software of the assembly equipment and the controller of the movable trolley.

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