Compositions, membranes, filters, optical sensors, image display devices, and structures

Abstract

The present invention provides a composition, a membrane using the aforementioned composition, a filter, an optical sensor, an image display device, and a structure. The aforementioned composition contains a curable compound, a polysiloxane surfactant A, and a solvent. When the polysiloxane surfactant A is dissolved in propylene glycol monomethyl ether acetate to prepare a solution with a solid content concentration of 1000 ppm by mass, the surface tension of the solution at 25°C is 26 mN / m or higher.

Description

Technical Field

[0001] This invention relates to a composition containing a polysiloxane surfactant. Furthermore, this invention relates to a membrane, a filter, an optical sensor, an image display device, and a structure. Prior Technology

[0002] The composition of filters used to manufacture optical sensors with filters such as color filters uses a composition containing surfactants.

[0003] Patent document 1 discloses an invention relating to a coloring resin composition, wherein the aforementioned coloring resin composition contains (A) a colorant, (B) a dispersant, (C) a solvent, (D) a binder resin and (E) a photopolymerization initiator, wherein (B) the dispersant contains a dispersant (b) having a defined repeating unit, and furthermore, the coloring resin composition contains at least 0.01% by mass of (F) a surfactant in the total solids content.

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2018-132554

[0005] Filters used in optical sensors or image display devices typically have multiple types of pixels. Such filters are manufactured by forming a first type of pixel using a first type of pixel forming component, and then sequentially forming a second and subsequent type of pixel using a second and subsequent pixel forming component.

[0006] Furthermore, in recent years, attempts have been made to arrange pixels of different colors in a filter within spaces divided by partitions. For example, after forming partitions that divide each pixel on a support, various types of pixels are sequentially formed between the partitions to create such a filter.

[0007] In the manufacturing process of filters and the like, it is required to suppress color mixing. Therefore, there is a need for compositions that can form films that are difficult to mix colors, and in recent years, there has been a demand for further improvements in these properties. Summary of the Invention

[0008] Therefore, the object of the present invention is to provide a composition capable of forming a film that suppresses color mixing. Furthermore, the object of the present invention is to provide a film, a filter, an optical sensor, an image display device, and a structure.

[0009] The present invention provides the following. <1> A composition comprising: Hardening compounds; Polysiloxane surfactant A; and Solvent, In the above-mentioned polysiloxane surfactant A, when the above-mentioned polysiloxane surfactant A is dissolved in propylene glycol monomethyl ether acetate to prepare a solution with a solid component concentration of 1000 ppm by mass, the surface tension of the above solution at 25°C is 26 mN / m or higher. <2> like <1> The components, wherein The aforementioned curing compounds contain resins and polymerizable monomers. The above-mentioned components also contain a photopolymerization initiator. <3> like <1> or <2> The composition also contains coloring materials. <4> A composition comprising: Inorganic particles; Polysiloxane surfactant A; and Solvent, In the above-mentioned polysiloxane surfactant A, when the above-mentioned polysiloxane surfactant A is dissolved in propylene glycol monomethyl ether acetate to prepare a solution with a solid component concentration of 1000 ppm by mass, the surface tension of the above solution at 25°C is 26 mN / m or higher. <5> like <4> The components, wherein The aforementioned inorganic particles include silicon dioxide particles. <6> like <5> The components, wherein The aforementioned silica particles include at least one of the following: silica particles in the shape of a plurality of spherical silica particles connected in a bead-like manner, silica particles in the shape of a plurality of spherical silica particles connected in a planar manner, and silica particles with a hollow structure. <7> like <4> to <6> The composition of any one of the following, wherein The content of the aforementioned inorganic particles in the total solids of the above-mentioned composition is 20% by mass or more. <8> like <1> to <7> The composition of any one of the following, wherein The hydroxyl value of the aforementioned polysiloxane surfactant A is above 80 mgKOH / g. <9> like <1> to <8> The composition of any one of the following, wherein The dynamic viscosity of the aforementioned polysiloxane surfactant A at 25°C is below 40 mm² / s. <10> like <1> to <9> The composition of any one of the following, wherein The aforementioned polysiloxane surfactant A is a methanol-modified dialkyl polysiloxane. <11> like <1> to <10> The composition of any one of the following, wherein The aforementioned polysiloxane surfactant A is a dimethyl polysiloxane containing alkoxy and hydroxyl groups. <12> like <1> to <11> The composition of any one of the following, wherein The content of the polysiloxane surfactant A in the above composition is 1 to 1000 ppm by mass. <13> A membrane, which is used <1> to <12> It is obtained by any of the components described in any one of them. <14> A filter having <13> The membrane mentioned above. <15> An optical sensor having <13> The membrane mentioned above. <16> An image display device having <13> The membrane mentioned above. <17> A structure having: Support structure; Next door, using the support structure mentioned above. <4> To obtain from the aforementioned components; and Pixels are set in the area divided by the aforementioned partitions. [Invention Effects]

[0010] According to the present invention, a composition, a membrane, a filter, an optical sensor, an image display device, and a structure capable of forming a film that suppresses color mixing can be provided. Simple Explanation of the Diagram

[0011] Figure 1 is a magnified view schematically showing a plurality of spherical silicon dioxide particles connected in a bead-like shape. Figure 2 is a side cross-sectional view of one embodiment of the structure of the present invention. Figure 3 is a top view taken from directly above the support in the same structure. Implementation

[0012] The present invention will now be described in detail. In this specification, "~" is used to indicate that the values ​​recorded before and after it are included as lower and upper limits. In this specification, the designations of groups (atomic groups) without indicating substitution or unsubstituent include both unsubstituent and substituent groups (atomic groups). For example, "alkyl" includes not only unsubstituent alkyl groups (unsubstituted alkyl groups) but also substituent alkyl groups (substituted alkyl groups). In this specification, unless otherwise specified, "exposure" includes not only exposure using light, but also the depiction using particle beams such as electron beams and ion beams. Furthermore, examples of light used in exposure include the bright-line spectrum of mercury lamps, far-ultraviolet light represented by excimer lasers, extreme ultraviolet light (EUV light), X-rays, electron beams, and other photochemical rays or radiation. In this specification, "(meth)acrylate" means either or both of acrylate and methacrylate, "(meth)acrylic acid" means either or both of acrylic acid and methacrylic acid, and "(meth)acrylyl" means either or both of acrylyl and methacrylyl. In this specification, near-infrared light refers to light with a wavelength of 700~2500nm. In this specification, Me represents methyl, Et represents ethyl, Bu represents butyl, and Ph represents phenyl in the structural formula. In this specification, the weight-average molecular weight and number-average molecular weight are converted values ​​of polystyrene measured by GPC (gel permeation chromatography). In this specification, total solids content refers to the total mass of the components after removing the solvent from all components of the composition. In this specification, pigment refers to colorant that is not easily soluble in solvents. In this specification, the term "step" includes not only independent steps, but also steps that perform the expected function, even if they cannot be clearly distinguished from other steps.

[0013] <Composition> The composition of the first state sample of the present invention is characterized by containing: Hardening compounds; Polysiloxane surfactant A; and Solvent, In the above-mentioned polysiloxane surfactant A, when polysiloxane surfactant A is dissolved in propylene glycol monomethyl ether acetate to prepare a solution with a solid component concentration of 1000 ppm by mass, the surface tension of the solution at 25°C is above 26 mN / m.

[0014] Furthermore, the composition of the second state sample of the present invention is characterized by containing: Inorganic particles; Polysiloxane surfactant A; and Solvent, In the above-mentioned polysiloxane surfactant A, when polysiloxane surfactant A is dissolved in propylene glycol monomethyl ether acetate to prepare a solution with a solid component concentration of 1000 ppm by mass, the surface tension of the solution at 25°C is above 26 mN / m.

[0015] According to the composition of the present invention, a film that suppresses color mixing can be formed. The reason for this effect can be presumed as follows: It can be presumed that the composition of the present invention, by containing the aforementioned polysiloxane surfactant A, can improve the affinity of the obtained film surface for water. Therefore, for example, after forming a patterned film using the composition of the present invention, if other pixels are formed in a position adjacent to the film using other pixel-forming compositions, the adhering substances of the other pixel-forming compositions can be easily removed from the film surface by the developing solution or rinsing solution. As a result, it can be presumed that it is difficult for residues of other pixel-forming compositions to form on the film surface. Therefore, it can be presumed that the composition of the present invention can form a film that suppresses color mixing.

[0016] The composition of the present invention is preferably used for optical sensors or image display devices, and more preferably for optical sensors. More specifically, the composition of the present invention can be preferably used as a composition for forming filters or partitions used in optical sensors or image display devices. For example, the composition of the first state sample can be preferably used as a composition for filter formation. Furthermore, the composition of the second state is preferably used as a composition for forming spacers. In particular, when silicon dioxide particles are used as inorganic particles, a film with a low refractive index can be formed, thus it is preferably used as a composition for forming spacers.

[0017] Examples of light filters include color filters, near-infrared transmission filters, and near-infrared cutoff filters, with color filters being the preferred choice.

[0018] As a color filter, an example is a filter having colored pixels that allow light of a specific wavelength to pass through, and it is preferable to have a filter having at least one colored pixel selected from red pixels, blue pigment, green pixels, yellow pixels, cyan pixels, and magenta pixels. The color filter can be formed using a composition containing colored pigments.

[0019] As a near-infrared cutoff filter, a filter whose maximum absorption wavelength exists in the wavelength range of 700 to 1800 nm can be cited as an example. It is preferable that the maximum absorption wavelength of the near-infrared cutoff filter exists in the wavelength range of 700 to 1300 nm, and even more preferably in the wavelength range of 700 to 1100 nm. Furthermore, it is preferable that the transmittance of the near-infrared cutoff filter is 70% or more in all wavelength ranges from 400 to 650 nm, even more preferably 80% or more, and even more preferably 90% or more. Furthermore, it is preferable that the transmittance at at least one point in the wavelength range of 700 to 1800 nm is 20% or less. Furthermore, for the near-infrared cutoff filter, the ratio of absorbance Amax at the maximum absorption wavelength to absorbance A550 at 550 nm (i.e., absorbance Amax / absorbance A550) is preferably 20-500, more preferably 50-500, further preferably 70-450, and exceptionally preferably 100-400. The near-infrared cutoff filter can be formed using a composition containing near-infrared absorbing colorants.

[0020] A near-infrared transmission filter is a filter that transmits at least a portion of near-infrared light. Preferably, a near-infrared transmission filter is a filter that blocks at least a portion of visible light while allowing at least a portion of near-infrared light to pass through. As a near-infrared transmission filter, a filter that satisfies the following spectral characteristics is a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400-640 nm and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 1100-1300 nm. A near-infrared transmission filter is preferably a filter that satisfies any one of the following spectral characteristics (1) to (5). (1): A filter with a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10%) in the wavelength range of 400 to 640 nm and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 800 to 1500 nm. (2): A filter with a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10%) in the wavelength range of 400 to 750 nm and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 900 to 1500 nm. (3): A filter with a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10%) in the wavelength range of 400 to 830 nm and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 1000 to 1500 nm. (4): A filter with a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10%) in the wavelength range of 400 to 950 nm and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 1100 to 1500 nm. (5): A filter with a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10%) in the wavelength range of 400 to 1050 nm and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 1200 to 1500 nm.

[0021] Examples of partitions include those used to separate adjacent pixels when forming pixels on the imaging area of ​​a solid-state imaging element. Examples of pixels include colored pixels, transparent pixels, pixels in near-infrared transmission filter layers, and pixels in near-infrared cutoff filter layers. As an example, partitions used to form a grid structure that separates pixels can be used. Examples of such structures include those described in Japanese Patent Application Publication Nos. 2012-227478, 2010-232537, 2009-111225, 2017-028241 (Figure 1), and 2016-201524 (Figure 4D). Furthermore, examples of partitions used to form a border structure around filters such as color filters, near-infrared transmission filters, and near-infrared cutoff filters can be used. As an example, the structure described in Japanese Patent Application Publication No. 2014-048596 can be cited, the content of which is incorporated into this specification.

[0022] The composition of the present invention can also be used as a composition for forming a light-shielding film. When the composition of the present invention is used as a composition for forming a light-shielding film, it is preferable that the composition of the present invention contains a black colorant, and it is even more preferable that it contains a black pigment.

[0023] When the composition of the present invention is used as a composition for forming a light-shielding film, it is preferable that the optical density (OD) of the film formed using the composition of the present invention is 2.5 or more per 1.5 μm film thickness in the wavelength region of 400 to 1100 nm, and more preferably 3.0 or more. Furthermore, there is no particular limitation on the upper limit, but it is generally preferred to be 10 or less. Moreover, in this specification, an optical density of 2.5 or more per 1.5 μm film thickness in the wavelength region of 400 to 1100 nm means that the optical density is 2.5 or more per 1.5 μm film thickness throughout the entire wavelength region of 400 to 1100 nm.

[0024] Furthermore, it is preferable for the reflectivity of the aforementioned film to be less than 8%, even better to be less than 6%, and further preferably less than 4%. A lower limit of 0% or higher is preferred. Regarding reflectivity, light with wavelengths of 400–1100 nm was incident at an angle of 5° using a JASCO Corporation V7200 (product name) VAR unit, and the reflectivity was determined from the obtained reflectivity spectrum. Specifically, the reflectivity of the light at the wavelength exhibiting the highest reflectivity within the 400–1100 nm wavelength range was defined as the reflectivity of the film.

[0025] The composition of the present invention is preferably a composition for pattern formation by photolithography. According to this configuration, pixels of very fine size can be easily formed. For example, a composition containing a component having groups containing vinyl unsaturated bonds (e.g., a resin having groups containing vinyl unsaturated bonds or a monomer having groups containing vinyl unsaturated bonds) and a photopolymerization initiator is preferably used as a composition for pattern formation by photolithography. It is also preferable that the composition for pattern formation by photolithography further contains an alkali-soluble resin.

[0026] The concentration of solid components in the composition is preferably 5-30% by mass. The lower limit is preferably 7.5% by mass or more, and more preferably 10% by mass or more. The upper limit is preferably 25% by mass or less, and more preferably 20% by mass or less.

[0027] The components used in the composition of the present invention will be described below. [The components of the first state] <<Hardening Compounds>> The composition of the first state sample contains a curing compound. Examples of curing compounds include polymeric compounds and resins. The resin can be a non-polymeric resin (a resin without a polymeric group) or a polymeric resin (a resin with a polymeric group). Examples of polymeric groups include groups containing vinyl unsaturated bonds and cyclic ether groups. Examples of groups containing vinyl unsaturated bonds include vinyl, (methyl)allyl, and (meth)acrylic acid. Examples of cyclic ether groups include epoxy groups and oxobutyl groups, with epoxy groups being preferred. Epoxy groups can be alicyclic epoxy groups. Furthermore, alicyclic epoxy groups refer to monovalent functional groups having a cyclic structure formed by the condensation of an epoxy ring and a saturated hydrocarbon ring.

[0028] As a curing compound, it is preferable to use one that contains at least a resin. Furthermore, when the composition of the present invention is used as a composition for photolithography, it is preferable to use a resin (preferably a resin having acid groups) and a polymerizable monomer (monomer-type polymerizable compound) as the curing compound; it is even more preferable to use a resin (preferably a resin having acid groups) and a polymerizable monomer (monomer-type polymerizable compound) having groups containing ethylene unsaturated bonds.

[0029] (polymeric compounds) Examples of polymerizable compounds include compounds with groups containing vinyl unsaturated bonds and compounds with cyclic ether groups. Compounds with groups containing vinyl unsaturated bonds are preferred as free radical polymerizable compounds. Furthermore, compounds with cyclic ether groups are preferred as cationic polymerizable compounds.

[0030] Examples of resin-type polymeric compounds include resins containing repeating units with polymeric groups.

[0031] For monomer-type polymeric compounds (polymeric monomers), a molecular weight of less than 2000 is preferred, and less than 1500 is even better. A lower limit for the molecular weight of polymeric monomers is preferably 100 or higher, and more preferably 200 or higher. For resin-type polymeric compounds, a weight-average molecular weight (Mw) of 2000-2000000 is preferred. An upper limit for the weight-average molecular weight is preferably less than 1000000, and more preferably less than 500000. A lower limit for the weight-average molecular weight is preferably 3000 or higher, and more preferably 5000 or higher.

[0032] The polymerizable monomer is preferably a (meth)acrylate compound with a group containing an ethylene-containing unsaturated bond, and more preferably a (meth)acrylate compound with a function of 3 to 15. Specific examples include the compounds described in Japanese Patent Application Publication No. 2009-288705 (paragraphs 0095-0108), Japanese Patent Application Publication No. 2013-029760 (paragraph 0227), Japanese Patent Application Publication No. 2008-292970 (paragraphs 0254-0257), Japanese Patent Application Publication No. 2013-253224 (paragraphs 0034-0038), Japanese Patent Application Publication No. 2012-208494 (paragraph 0477), Japanese Patent Application Publication No. 2017-048367, Japanese Patent No. 6057891, Japanese Patent No. 6031807, and Japanese Patent Application Publication No. 2017-194662, the contents of which are incorporated herein by reference.

[0033] Examples of compounds containing vinyl unsaturated groups include dinepentylenetetroxide tri(meth)acrylate (commercially available as KAYARAD D-330; manufactured by Nippon Kayaku Co., Ltd.), dinepentylenetetroxide tetra(meth)acrylate (commercially available as KAYARAD D-320; manufactured by Nippon Kayaku Co., Ltd.), dinepentylenetetroxide penta(meth)acrylate (commercially available as KAYARAD D-310; manufactured by Nippon Kayaku Co., Ltd.), dinepentylenetetroxide hexa(meth)acrylate (commercially available as KAYARAD DPHA; manufactured by Nippon Kayaku Co., Ltd., NK ESTER A-DPH-12E; Shin-Nakamura Chemical). (manufactured by Co., Ltd.) and compounds with a (meth)acrylic acid group structure of the compounds bonded via ethylene glycol and / or propylene glycol residues (e.g., SR454 and SR499 commercially available from SARTOMER Company, Inc.). Furthermore, as compounds containing ethylene-containing unsaturated bonds, they can also be modified with diglycerol EO (ethylene oxide) to produce (meth)acrylates (commercially available, M-460; manufactured by TOAGOSEI CO., Ltd.), neopentyl terephthalate tetraacrylate (manufactured by Shin Nakamura Chemical Co., Ltd., NK Ester A-TMMT), 1,6-hexanediol diacrylate (manufactured by Nippon Kayaku Co., Ltd., KAYARAD HDDA), RP-1040 (manufactured by Nippon Kayaku Co., Ltd.), ARONIX TO-2349 (manufactured by TOAGOSEI CO., Ltd.), NK Oligo UA-7200 (manufactured by Shin Nakamura Chemical Co., Ltd.), 8UH-1006, 8UH-1012 (manufactured by Taisei Fine Chemical Co., Ltd.), and LIGHT ACRYLATE POB-A0 (KYOEISHA CHEMICAL). Co.,LTD. (manufactured by Co.,LTD., etc.)

[0034] Furthermore, as compounds containing ethylene-containing unsaturated groups, trifunctional (meth)acrylate compounds such as trimethylolpropane tri(meth)acrylate, trimethylolpropane propylene oxide modified tri(meth)acrylate, trimethylolpropane ethylene oxide modified tri(meth)acrylate, ethylene oxide isocyanurate modified tri(meth)acrylate, and pentaerythritol tri(meth)acrylate are also preferred. Commercially available trifunctional (meth)acrylate compounds include ARONIX M-309, M-310, M-321, M-350, M-360, M-313, M-315, M-306, M-305, M-303, M-452, M-450 (manufactured by TOAGOSEI CO.,LTD.), NK ESTER A9300, A-GLY-9E, A-GLY-20E, A-TMM-3, A-TMM-3L, A-TMM-3LM-N, A-TMPT, TMPT (manufactured by Shin-Nakamura Chemical Co.,Ltd.), KAYARAD GPO-303, TMPTA, THE-330, TPA-330, PET-30 (manufactured by Nippon Kayaku Co.,Ltd.), etc.

[0035] Compounds containing ethylene-containing unsaturated bonds may also contain acid groups such as carboxyl, sulfonic acid, and phosphoric acid groups. Commercially available examples of such compounds include ARONIX M-305, M-510, M-520, and ARONIX TO-2349 (manufactured by TOAGOSEI CO.,LTD.).

[0036] As compounds having groups containing ethylene-containing unsaturated bonds, compounds having a caprolactone structure can also be used. For details regarding compounds having a caprolactone structure, please refer to paragraphs 0042-0045 of Japanese Patent Application Publication No. 2013-253224, which is incorporated herein by reference. Examples of compounds having a caprolactone structure include DPCA-20, DPCA-30, DPCA-60, and DPCA-120, which are commercially available as a series from Nippon Kayaku Co., Ltd.

[0037] As compounds having groups containing ethylene unsaturated bonds, compounds having groups containing ethylene unsaturated bonds and alkoxy groups can also be used. These compounds are preferably compounds having groups containing ethylene unsaturated bonds and ethyleneoxy and / or propyleneoxy groups, more preferably compounds having groups containing ethylene unsaturated bonds and ethyleneoxy groups, and even more preferably 3- to 6-functional (meth)acrylate compounds having 4 to 20 ethyleneoxy groups. Commercially available examples include SR-494, a tetrafunctional (meth)acrylate having 4 ethyleneoxy groups manufactured by Sartomer Company, Inc., and KAYARAD TPA-330, a trifunctional (meth)acrylate having 3 isobutoxy groups manufactured by Nippon Kayaku Co., Ltd.

[0038] As compounds containing groups with ethylene-containing unsaturated bonds, polymerizable compounds with a fusiform skeleton can also be used. Examples of commercially available products include OGSOL EA-0200 and EA-0300 (manufactured by Osaka Gas Chemicals Co., Ltd., (meth)acrylate monomers with a fusiform skeleton).

[0039] It is preferable to use compounds containing groups with ethylene-containing unsaturated bonds that do not substantially contain environmentally regulated substances such as toluene. Commercially available examples of such compounds include KAYARAD DPHA LT and KAYARAD DPEA-12 LT (manufactured by Nippon Kayaku Co., Ltd.).

[0040] As compounds containing ethylene-containing unsaturated bonds, UA-7200 (manufactured by Shin-Nakamura Chemical Co., Ltd.), DPHA-40H (manufactured by Nippon Kayaku Co., Ltd.), UA-306H, UA-306T, UA-306I, AH-600, T-600, AI-600, LINC-202UA (manufactured by KYOEISHA CHEMICAL CO.,LTD.), 8UH-1006, 8UH-1012 (all manufactured by TAISEI FINE CHEMICAL CO.,LTD.), and LIGHT ACRYLATEPOB-A0 (manufactured by KYOEISHA CHEMICAL CO.,LTD.) are also preferred.

[0041] Examples of compounds having a cyclic ether group include compounds having an epoxy group and compounds having an oxacyclobutyl group, with compounds having an epoxy group being preferred. Examples of compounds having an epoxy group include compounds having 1 to 100 epoxy groups per molecule. The upper limit for the number of epoxy groups can be, for example, 10 or less, or 5 or less. The lower limit for the number of epoxy groups is preferably 2 or more.

[0042] Compounds containing cyclic ether groups can be low molecular weight compounds (e.g., molecular weight less than 1000) or macromolecules (e.g., in the case of polymers with a molecular weight of 1000 or more, the weight average molecular weight is 1000 or more). A weight average molecular weight of 200 to 100,000 is preferred, and 500 to 50,000 is more preferred. An upper limit of 10,000 or less is preferred, less than 5,000 is more preferred, and less than 3,000 is further preferred.

[0043] As compounds having cyclic ether groups, compounds described in paragraphs 0034 to 0036 of Japanese Patent Application Publication No. 2013-011869, compounds described in paragraphs 0147 to 0156 of Japanese Patent Application Publication No. 2014-043556, compounds described in paragraphs 0085 to 0092 of Japanese Patent Application Publication No. 2014-089408, and compounds described in Japanese Patent Application Publication No. 2017-179172 may also be used.

[0044] Commercially available compounds containing cyclic ether groups include DENACOL EX-212L, EX-212, EX-214L, EX-214, EX-216L, EX-216, EX-321L, EX-321, EX-850L, and EX-850 (all manufactured by Nagase ChemteX Corporation), ADEKA RESIN EP-4000S, EP-4003S, EP-4010S, and EP-4011S (all manufactured by ADEKA Corporation), NC-2000, NC-3000, NC-7300, XD-1000, EPPN-501, and EPPN-502 (all manufactured by ADEKA Corporation), CELLOXIDE 2021P, CELLOXIDE 2081, and CELLOXIDE 2083. 2085, EHPE3150, EPOLEAD PB 3600, PB 4700 (all manufactured by Daicel Corporation), CYCLOMER P ACA 200M, ACA 230AA, ACA Z250, ACA Z251, ACA Z300, ACA Z320 (all manufactured by Daicel Corporation), jER1031S, jER157S65, jER152, jER154, jER157S70 (all manufactured by Mitsubishi Chemical Corporation), Aron Oxetane OXT-121, OXT-221, OX-SQ, PNOX (all manufactured by TOAGOSEI CO.,LTD.), ADEKA Glycirol ED-505 (manufactured by ADEKA Corporation, a monomer containing epoxy groups), MARPROOF G-0150M, G-0105SA, G-0130SP, G-0250SP, G-1005S, G-1005SA, G-1010S, G-2050M, G-01100, G-01758 (manufactured by NOF Corporation, a polymer containing epoxy groups), OXT-101, OXT-121, OXT-212, OXT-221 (manufactured by TOAGOSEI CO.,LTD., monomers containing oxy-heterocyclic butyl groups), OXE-10, OXE-30 (manufactured by OSAKA ORGANIC CHEMICAL INDUSTRY LTD., monomers containing oxy-heterocyclic butyl groups), etc.

[0045] (resin) The composition of the present invention can use resin as a curing compound. It is preferred that the curing compound contains at least a resin. The resin is incorporated, for example, for the purpose of dispersing pigments or the like in the composition, or as an adhesive. Furthermore, resins used primarily for dispersing pigments or the like in the composition are called dispersants. However, these uses of resin are only one example; resins can also be used for purposes other than these uses. Furthermore, resins having polymerizable groups are also equivalent to polymerizable compounds.

[0046] The weight-average molecular weight of the resin is preferably 3,000 to 2,000,000. The upper limit is preferably below 1,000,000, and even better below 500,000. The lower limit is preferably above 4,000, and even better above 5,000.

[0047] Examples of resins include (meth)acrylic resins, epoxy resins, olefin-thiol resins, polycarbonate resins, polyether resins, polyaryl ester resins, polyurethane resins, polyether-urethane resins, polystyrene resins, polyaryl ether phosphine oxide resins, polyimide resins, polyamide resins, polyamide-amide resins, polyolefin resins, cyclic olefin resins, polyester resins, styrene resins, vinyl acetate resins, polyvinyl alcohol resins, polyvinyl acetal resins, polyurethane resins, and polyurea resins. One of these resins can be used alone, or two or more can be mixed. From the viewpoint of improving heat resistance, nobornene resins are preferred among cyclic olefin resins. Commercially available nobornene resins include, for example, the ARTON series manufactured by JSR CORPORATION (e.g., ARTON F4520). Furthermore, as the resin, the resin described in the examples of International Publication No. 2016 / 088645, the resin described in Japanese Patent Application Publication No. 2017-057265, the resin described in Japanese Patent Application Publication No. 2017-032685, the resin described in Japanese Patent Application Publication No. 2017-075248, the resin described in Japanese Patent Application Publication No. 2017-066240, and the resin described in Japanese Patent Application Publication No. 2017-16 can also be used. The resins described in Japanese Patent Application Publication No. 7513, Japanese Patent Application Publication No. 2017-173787, Japanese Patent Application Publication No. 2017-206689 (paragraphs 0041-0060), Japanese Patent Application Publication No. 2018-010856 (paragraphs 0022-0071), Japanese Patent Application Publication No. 2016-222891 (block polyisocyanate resin), Japanese Patent Application Publication No. 2020-122052, Japanese Patent Application Publication No. 2020-111656, Japanese Patent Application Publication No. 2020-139021, and Japanese Patent Application Publication No. 2017-138503 (resins comprising a ring structure on the main chain and a biphenyl structure on the side chain). Furthermore, resins with a stroma skeleton can be used more preferably as resins. For information on resins with a stroma skeleton, please refer to the description in U.S. Patent Application Publication No. 2017 / 0102610, which is incorporated herein by reference. Also, as resins, the resins described in paragraphs 0199 to 0233 of Japanese Patent Application Publication No. 2020-186373, the alkali-soluble resins described in Japanese Patent Application Publication No. 2020-186325, and the resin represented by Formula 1 described in Korean Patent Publication No. 10-2020-0078339 can also be used.

[0048] As a resin, it is preferable to use a resin with acid groups. Examples of acid groups include carboxyl groups, phosphoric acid groups, sulfonic acid groups, and phenolic hydroxyl groups. There may be only one type of acid group or two or more types. Resins with acid groups can be used, for example, as alkali-soluble resins. The acid value of the resin with acid groups is preferably 30-500 mg KOH / g. A lower limit of 50 mg KOH / g or higher is preferred, and 70 mg KOH / g or higher is even better. An upper limit of 400 mg KOH / g or lower is preferred, 200 mg KOH / g or lower is even better, 150 mg KOH / g or lower is further preferred, and 120 mg KOH / g or lower is optimal.

[0049] As a resin, a resin containing repeating units derived from compounds represented by formula (ED1) and / or compounds represented by formula (ED2) (hereinafter, these compounds are sometimes also referred to as "ether dimers") is also preferred.

[0050] [Chemical Formula 1]

[0051] In formula (ED1), R1 and R2 independently represent a hydrogen atom or a hydrocarbon group with 1 to 25 carbon atoms that may have substituents. [Chemical Formula 2] In formula (ED2), R represents a hydrogen atom or an organic group having 1 to 30 carbon atoms. For a specific example of formula (ED2), please refer to Japanese Patent Application Publication No. 2010-168539.

[0052] For specific examples of ether dimers, please refer to paragraph 0317 of Japanese Patent Application Publication No. 2013-029760, which is incorporated herein by reference.

[0053] As a resin, it is preferable to use a resin with polymerizable groups. Examples of polymerizable groups include groups containing vinyl unsaturated bonds and cyclic ether groups.

[0054] Furthermore, as a resin, a resin having at least one repeating unit (hereinafter also referred to as repeating unit Ep) selected from repeating units represented by formula (Ep-1) and repeating units represented by formula (Ep-2) can also be used. The aforementioned resin Ep may contain only one repeating unit from repeating units represented by formula (Ep-1) and repeating units represented by formula (Ep-2), or it may contain repeating units represented by formula (Ep-1) and repeating units represented by formula (Ep-2) respectively. In the case of containing repeating units from both, the ratio of repeating units represented by formula (Ep-1) to repeating units represented by formula (Ep-2), expressed in molar ratios, is preferably 5:95 to 95:5, more preferably 10:90 to 90:10, and further preferably 20:80 to 80:20. [Chemical Formula 3]

[0055] In formulas (Ep-1) and (Ep-2), L1 represents a single bond or a divalent linker, and R1 represents a hydrogen atom or a substituent. Examples of substituents represented by R1 include alkyl and aryl groups, with alkyl being preferred. The alkyl group preferably has 1 to 10 carbon atoms, more preferably 1 to 5, and even more preferably 1 to 3. R1 is preferably a hydrogen atom or a methyl group. As the divalent linker represented by L1, alkyl groups (preferably alkyl groups with 1 to 12 carbon atoms), aryl groups (preferably aryl groups with 6 to 20 carbon atoms), -NH-, -SO-, -SO2-, -CO-, -O-, -COO-, -OCO-, -S-, and combinations of two or more of these groups are preferred. alkyl groups can be linear, branched, or cyclic, with linear or branched forms being preferred. Furthermore, alkyl groups can have substituents or be unsubstituted. Examples of substituents include hydroxyl and alkoxy groups.

[0056] The content of the repeating unit Ep in resin Ep is preferably 1 to 100 mol% among all repeating units in resin Ep. The upper limit is preferably below 90 mol%, and below 80 mol% is even better. The lower limit is preferably above 2 mol%, and above 3 mol% is even better.

[0057] In addition to the repeating unit Ep mentioned above, resin Ep may have other repeating units. Examples of other repeating units include repeating units with acid groups and repeating units with groups containing vinyl unsaturated bonds.

[0058] Examples of acid groups include phenolic hydroxyl, carboxyl, sulfonyl, and phosphate groups, with phenolic hydroxyl or carboxyl being preferred, and carboxyl being even more preferred.

[0059] Examples of groups containing ethylene-containing unsaturated bonds include vinyl, styryl, (methyl)allyl, and (methyl)acrylyl.

[0060] When resin Ep contains repeating units with acid groups, it is preferable that the content of repeating units with acid groups in resin Ep is 5 to 85 mol% among all repeating units in resin Ep. The upper limit is preferably 60 mol% or less, and more preferably 40 mol% or less. The lower limit is preferably 8 mol% or more, and more preferably 10 mol% or more.

[0061] When resin Ep contains repeating units with groups containing vinyl unsaturated bonds, the content of repeating units with groups containing vinyl unsaturated bonds in resin Ep is preferably 1 to 65 mol% among all repeating units in resin Ep. The upper limit is preferably 45 mol% or less, and more preferably 30 mol% or less. The lower limit is preferably 2 mol% or more, and more preferably 3 mol% or more.

[0062] Resin Ep preferably contains repeating units with aromatic hydrocarbon rings. Benzene or naphthalene rings are preferred as aromatic hydrocarbon rings, with a benzene ring being more preferred. The aromatic hydrocarbon ring may have substituents. Examples of substituents include alkyl groups. When a resin with a cyclic ether group contains repeating units with aromatic hydrocarbon rings, the content of these repeating units is preferably 1 to 65 mol% among all repeating units in the resin with the cyclic ether group. An upper limit of 45 mol% or less is preferred, and 30 mol% or less is more preferred. A lower limit of 2 mol% or more is preferred, and 3 mol% or more is more preferred. Examples of repeating units with aromatic hydrocarbon rings include vinyltoluene, benzyl (meth)acrylate, and other repeating units derived from monofunctional polymeric compounds.

[0063] As a resin, it is preferable to use a resin containing repeating units of a compound represented by the free formula (X). [Chemical Formula 4] In the formula, R1 represents a hydrogen atom or a methyl group, R21 and R22 independently represent alkyl groups, and n represents an integer from 0 to 15. It is preferred that the alkyl groups represented by R21 and R22 have 1 to 10 carbon atoms, more preferably 1 to 5, further preferably 1 to 3, and especially preferably 2 or 3. It is preferred that n is an integer from 0 to 5, more preferably 0 to 4, and further preferably 0 to 3.

[0064] Examples of compounds represented by formula (X) include ethylene oxide or propylene oxide-modified (meth)acrylates of p-cumylphenol. Commercially available examples include ARONIX M-110 (manufactured by TOAGOSEI CO.,LTD.).

[0065] As the resin, it is preferable to use a resin having aromatic carboxyl groups (hereinafter also referred to as resin Ac). In resin Ac, the aromatic carboxyl groups may be contained in the main chain of the repeating unit or in the side chain of the repeating unit. It is preferable that the aromatic carboxyl groups are contained in the main chain of the repeating unit. Furthermore, in this specification, an aromatic carboxyl group is a group with a structure in which one or more carboxyl groups are bonded to an aromatic ring. Among the aromatic carboxyl groups, it is preferable that the number of carboxyl groups bonded to the aromatic ring is 1 to 4, and more preferably 1 to 2.

[0066] The composition of the present invention preferably contains a resin as a dispersant. Examples of dispersants include acidic dispersants (acidic resins) and basic dispersants (basic resins). Here, an acidic dispersant (acidic resin) refers to a resin in which the amount of acid groups exceeds the amount of base groups. As an acidic dispersant (acidic resin), when the total amount of acid groups and basic groups is set to 100 mol%, a resin in which the amount of acid groups is 70 mol% or more is preferred. It is preferable that the acid groups in the acidic dispersant (acidic resin) are carboxyl groups. It is preferable that the acid value of the acidic dispersant (acidic resin) is 10 to 105 mg KOH / g. Similarly, a basic dispersant (basic resin) refers to a resin in which the amount of base groups exceeds the amount of acid groups. As a basic dispersant (basic resin), when the total amount of acid groups and basic groups is set to 100 mol%, a resin in which the amount of basic groups exceeds 50 mol% is preferred. It is preferable for alkaline dispersants to have amine groups as their basic group.

[0067] Grafted resin is preferred as the dispersant. For details regarding grafted resin, please refer to paragraphs 0025 to 0094 of Japanese Patent Application Publication No. 2012-255128, which is incorporated herein by reference.

[0068] The resin used as a dispersant is preferably a polyimide-based dispersant containing a nitrogen atom at least once in the main chain and side chains. As a polyimide-based dispersant, a resin having a main chain and side chains, and having a basic nitrogen atom at least once in the main chain and side chains, is preferred. The main chain contains a partial structure with functional groups having a pKa of 14 or less, and the side chains have 40 to 10,000 atoms. There are no particular limitations as long as the basic nitrogen atom is a basic nitrogen atom. For information on polyimide-based dispersants, please refer to paragraphs 0102 to 0166 of Japanese Patent Application Publication No. 2012-255128, which is incorporated herein by reference.

[0069] The resin used as a dispersant is preferably a resin with a structure in which a plurality of polymer chains are bonded in the core. Examples of such resins include dendritic polymers (including star polymers). Specific examples of dendritic polymers include polymers C-1 to C-31 as described in paragraphs 0196 to 0209 of Japanese Patent Application Publication No. 2013-043962.

[0070] The resin used as a dispersant is preferably a resin containing repeating units with groups having vinyl unsaturated bonds on the side chains. It is preferable that the content of repeating units with groups having vinyl unsaturated bonds on the side chains is 10 mol% or more among all repeating units of the resin, more preferably 10-80 mol%, and further preferably 20-70 mol%.

[0071] Furthermore, as a dispersant, the resin described in Japanese Patent Application Publication No. 2018-087939, the block copolymers (EB-1) to (EB-9) described in paragraphs 0219 to 0221 of Japanese Patent Application Publication No. 6432077, the polyethyleneimine with polyester side chains described in International Publication No. 2016 / 104803, the block copolymers described in International Publication No. 2019 / 125940, the block polymers with acrylamide structural units described in Japanese Patent Application Publication No. 2020-066687, the block polymers with acrylamide structural units described in Japanese Patent Application Publication No. 2020-066688, and the dispersant described in International Publication No. 2016 / 104803, etc., can also be used.

[0072] Dispersants are also available as commercially available products. Specific examples include the Disperbyk series (e.g., Disperbyk-111, 161, 2001, etc.) manufactured by BYK Chemie, the SOLSPERSE series (e.g., SOLSPERSE 20000, 76500, etc.) manufactured by Lubrizol Japan Limited, and the AJISPER series manufactured by Ajinomoto Fine-Techno Co., Inc. Furthermore, the products described in paragraph 0129 of Japanese Patent Application Publication No. 2012-137564 and the products described in paragraph 0235 of Japanese Patent Application Publication No. 2017-194662 can also be used as dispersants.

[0073] The content of the curing compound in the total solids component of the composition is preferably 1 to 70% by mass. A lower limit of 2% by mass or more is preferred, 3% by mass or more is more preferred, and 5% by mass or more is further preferred. An upper limit of 65% by mass or less is preferred, and 60% by mass or less is more preferred. The composition of the present invention may contain only one curing compound, or it may contain two or more. When containing two or more curing compounds, the total amount within the above-mentioned range is preferred.

[0074] When the composition of the present invention contains a polymeric compound as a curing compound, the content of the polymeric compound in the total solids content of the composition is preferably 1 to 70% by mass. A lower limit of 2% by mass or more is preferred, 3% by mass or more is more preferred, and 5% by mass or more is further preferred. An upper limit of 65% by mass or less is preferred, and 60% by mass or less is more preferred. The composition of the present invention may contain only one polymeric compound, or it may contain two or more polymeric compounds. When containing two or more polymeric compounds, the total amount is preferably within the above-mentioned range.

[0075] When the composition of the present invention contains a polymerizable monomer as a curing compound, it is preferable that the content of the polymerizable monomer in the total solids content of the composition is 1 to 50% by mass. A lower limit of 2% by mass or more is preferred, 3% by mass or more is more preferred, and 5% by mass or more is further preferred. An upper limit of 35% by mass or less is preferred, 30% by mass or less is more preferred, and 20% by mass or less is further preferred. The composition of the present invention may contain only one polymerizable monomer, or it may contain two or more. When containing two or more polymerizable monomers, the total amount is preferably within the above-mentioned range.

[0076] When the composition of the present invention contains resin as a curing compound, it is preferable that the resin content is 1 to 70% by mass in the total solids content of the composition. A lower limit of 2% by mass or more is preferred, 3% by mass or more is more preferred, and 5% by mass or more is further preferred. An upper limit of 65% by mass or less is preferred, and 60% by mass or less is more preferred. Furthermore, it is preferable that the content of resin with acidic groups in the total solids composition of the composition is 1 to 70% by mass. A lower limit of 2% by mass or more is preferable, 3% by mass or more is more preferable, and 5% by mass or more is even more preferable. An upper limit of 65% by mass or less is preferable, and 60% by mass or less is even more preferable. Furthermore, the content of alkali-soluble resin in the total solids of the composition is preferably 1 to 70% by mass. A lower limit of 2% by mass or more is preferred, 3% by mass or more is even more preferred, and 5% by mass or more is further preferred. An upper limit of 65% by mass or less is preferred, and 60% by mass or less is even more preferred. When the composition of the present invention contains a resin as a dispersant, the content of the resin as a dispersant in the total solids content of the composition is preferably 0.1 to 30% by mass. An upper limit of 25% by mass or less is preferred, and 20% by mass or less is further preferred. A lower limit of 0.5% by mass or more is preferred, and 1% by mass or more is further preferred. Furthermore, the content of the resin as a dispersant relative to 100 parts by mass of pigment is preferably 1 to 100 parts by mass. An upper limit of 80 parts by mass or less is preferred, 70 parts by mass or less is more preferred, and 60 parts by mass or less is further preferred. A lower limit of 5 parts by mass or more is preferred, 10 parts by mass or more is more preferred, and 20 parts by mass or more is further preferred. The composition of the present invention may contain only one type of resin, or it may contain two or more types. When it contains two or more types of resin, the total amount is preferably within the above-mentioned range.

[0077] <<Polysiloxane-based surfactant A (specific polysiloxane-based surfactant)>> The composition of the first state sample contains a polysiloxane surfactant A (hereinafter, the specific polysiloxane surfactant) exhibiting the specific surface tension shown below. This specific polysiloxane surfactant is one in which, when dissolved in propylene glycol monomethyl ether acetate to prepare a solution with a solid content concentration of 1000 ppm by mass, the surface tension of the solution at 25°C is 26 mN / m or higher. A surface tension of 26.5 mN / m or higher is preferred, 27 mN / m or higher is more preferred, and 27.2 mN / m or higher is further preferred. An upper limit of 28 mN / m or lower is preferred.

[0078] Furthermore, in this specification, polysiloxane surfactants refer to compounds having repeating units containing siloxane bonds on the main chain, and compounds containing both hydrophobic and hydrophilic portions within a single molecule.

[0079] It is preferable that the specific polysiloxane surfactant is a compound that does not contain fluorine atoms. Based on this, it is easier to improve the uniformity of surface tension and more easily achieve the effects of the present invention.

[0080] For specific polysiloxane-based surfactants, a hydroxyl value of 80 mg KOH / g or higher is preferred, 90 mg KOH / g or higher is even better, 100 mg KOH / g or higher is further preferred, and 110 mg KOH / g or higher is especially preferred. As long as the hydroxyl value of the specific polysiloxane-based surfactant is 80 mg KOH / g or higher, the affinity between the membrane surface and water can be further improved. From the viewpoint of its function as a surfactant, an upper limit of hydroxyl value of 200 mg KOH / g or lower is preferred, 190 mg KOH / g or lower is even better, and 180 mg KOH / g or lower is further preferred.

[0081] It is preferable that the dynamic viscosity of the specific polysiloxane surfactant at 25°C is 40 mm² / s or less, more preferably 38 mm² / s or less, and further preferably 36 mm² / s or less. As long as the dynamic viscosity of the specific polysiloxane surfactant is 40 mm² / s or less, the fluidity is improved, thus enhancing the fluidity of the film surface obtained using the composition of the present invention. Therefore, when other pixels are formed using other pixel-forming compositions or the like in adjacent positions to the film formed using the composition of the present invention, the improved fluidity of the film surface suggests that deposits of other pixel-forming compositions can be removed along with the outermost layer of the film using the developing solution or rinsing solution. As a result, it is difficult for residues of other pixel-forming compositions to form on the film surface, and color mixing can be more effectively suppressed. From the perspective of the function of surfactants, the lower limit of the dynamic viscosity of a certain polysiloxane surfactant is preferably 10 mm² / s or higher, even better is 15 mm² / s or higher, further better is 20 mm² / s or higher, and best is 25 mm² / s or higher.

[0082] The weight average molecular weight of certain polysiloxane surfactants is preferably 500 to 30,000.

[0083] Modified polysiloxanes are preferred as specific polysiloxane surfactants. Examples of modified polysiloxanes include compounds with substituents introduced into the side chains and / or ends of the polysiloxane. Examples of substituents include groups containing functional groups selected from amino, epoxy, alicyclic epoxy, hydroxyl, mercapto, carboxyl, fatty acid ester, and fatty acid amide groups, as well as groups containing polyether chains. Groups containing hydroxyl groups are preferred, and groups containing both alkoxy and hydroxyl groups are even more preferred.

[0084] It is preferable that the hydroxyl group is represented by formula (G-1) or formula (G-2). -L G1-(OR G1) m1OH ･･･(G-1) -L G1-(R G1O) m1H ･･･(G-2)

[0085] In formulas (G-1) and (G-2), LG1 represents a single bond or a divalent linker. Examples of divalent linkers represented by LG1 include alkyl groups (preferably alkyl groups with 1 to 12 carbon atoms, more preferably alkyl groups with 1 to 6 carbon atoms), aryl groups (preferably aryl groups with 6 to 20 carbon atoms, more preferably aryl groups with 6 to 12 carbon atoms), -NH-, -SO-, -SO 2-, -CO-, -O-, -COO-, -OCO-, -S-, and groups formed by combining two or more of these.

[0086] In equations (G-1) and (G-2), m1 represents an integer greater than or equal to 0 or 1, with integers from 1 to 10 being preferred and integers from 1 to 5 being even more preferred.

[0087] In formulas (G-1) and (G-2), R G1 represents an alkyl group. It is preferred that the alkyl group has 1 to 10 carbon atoms, more preferably 1 to 5, further preferably 1 to 3, and especially preferably 2 or 3. The alkyl group represented by R G1 can be either straight-chain or branched. The alkyl groups represented by m1 R G1 can be the same or different.

[0088] Examples of groups containing polyether chains include those represented by formula (G-11) and those represented by formula (G-12).

[0089] -L G11-(R G11O) m2R G12……(G-11) -L G11-(OR G11) m2OR G12……(G-12)

[0090] In formulas (G-11) and (G-12), LG11 represents a single bond or a divalent linker. Examples of divalent linkers represented by LG11 include alkyl groups (preferably alkyl groups with 1 to 12 carbon atoms, more preferably alkyl groups with 1 to 6 carbon atoms), aryl groups (preferably aryl groups with 6 to 20 carbon atoms, more preferably aryl groups with 6 to 12 carbon atoms), -NH-, -SO-, -SO 2-, -CO-, -O-, -COO-, -OCO-, -S-, and groups formed by combining two or more of these.

[0091] In equations (G-11) and (G-12), m2 represents a number greater than 2, with 2 to 200 being preferred.

[0092] In formulas (G-11) and (G-12), R G11 represents an alkylene group. It is preferred that the alkylene group has 1 to 10 carbon atoms, more preferably 1 to 5, further preferably 1 to 3, and especially preferably 2 or 3. The alkylene group represented by R G11 can be either straight-chain or branched. The m² alkylene groups represented by R G11 can be the same or different.

[0093] In formulas (G-11) and (G-12), R G12 represents an alkyl or aryl group. It is preferred that the alkyl group represented by R G12 has 1 to 10 carbon atoms, more preferably 1 to 5, and further preferably 1 to 3. The alkyl group can be either straight-chain or branched. It is preferred that the aryl group represented by R G12 has 6 to 20 carbon atoms, and more preferably 6 to 10.

[0094] Methanol-modified polysiloxanes are preferred among specific polysiloxane surfactants, and methanol-modified dialkyl polysiloxanes are even better. Furthermore, dimethyl polysiloxanes containing alkoxy and hydroxyl groups are preferred among specific polysiloxane surfactants.

[0095] The preferred polysiloxane surfactant is a compound represented by formula (Si-1) or formula (Si-2). [Chemical Formula 5]

[0096] In formula (Si-1), RS1 to RS7 independently represent alkyl or aryl groups, X S1 represents a group represented by formula (G-1) or a group represented by formula (G-2) above. n1 represents a number from 2 to 200.

[0097] In formula (Si-2), RS11 to RS16 independently represent alkyl or aryl groups, XS11 and XS12 independently represent the group represented by formula (G-1) or the group represented by formula (G-2) above. n11 represents a number from 2 to 200.

[0098] It is preferred that the alkyl groups represented by RS1 to RS7 in formula (Si-1) and RS11 to RS16 in formula (Si-2) have 1 to 10 carbon atoms, more preferably 1 to 5, further preferably 1 to 3, and especially preferably 1. The alkyl groups can be either straight-chain or branched, with straight-chain being preferred. It is preferred that the number of carbons of the aryl group represented by RS1 to RS7 in formula (Si-1) and the aryl group represented by RS11 to RS16 in formula (Si-2) is 6 to 20, more preferred that it is 6 to 12, and particularly preferred that it is 6. It is preferred that RS1~RS7 and RS11~RS16 are methyl or phenyl, with methyl being even more preferred.

[0099] It is better if n1 and n11 are numbers between 1 and 100.

[0100] Specific examples of particular polysiloxane surfactants include the compounds described in the examples described later.

[0101] The content of the specific polysiloxane surfactant in the composition is preferably 1 to 1000 ppm by mass. A lower limit of 0.5 ppm by mass or more is preferred, and 1 ppm by mass or more is preferred. An upper limit of 750 ppm by mass or less is preferred, and 500 ppm by mass or less is even more preferred.

[0102] <<Other Surfactants>> The composition of the first state sample may contain surfactants other than the specific polysiloxane surfactants mentioned above (hereinafter also referred to as other surfactants). Examples of other surfactants include fluorinated surfactants, nonionic surfactants, cationic surfactants, and anionic surfactants. Furthermore, polysiloxane surfactants other than the specific polysiloxane surfactants mentioned above can also be used as other surfactants.

[0103] Examples of fluorinated surfactants include those described in Japanese Patent Application Publication No. 2014-041318 (paragraphs 0060-0064 of the corresponding International Publication No. 2014 / 017669), Japanese Patent Application Publication No. 2011-132503 (paragraphs 0117-0132), and Japanese Patent Application Publication No. 2020-008634, all of which are incorporated herein by reference. Commercially available fluorinated surfactants include, for example, MEGAFACE. F-171, F-172, F-173, F-176, F-177, F-141, F-142, F-143, F-144, F-437, F-475, F-477, F-479, F-482, F-554, F-555-A, F-556, F-557, F-558, F-559, F-560, F-561, F-565, F-563, F-568, F-575, F-780, EXP, MFS-330, R-01, R-40, R-40-LM, R-41, R-41-LM, RS-43, R-43, TF-1956, RS-90, R-94, RS-72-K, DS-21 (the above are DIC) (manufactured by CORPORATION), FLUORAD FC430, FC431, FC171 (the above are manufactured by Sumitomo 3M Limited), SURFLON S-382, SC-101, SC-103, SC-104, SC-105, SC-1068, SC-381, SC-383, S-393, KH-40 (the above are manufactured by AGC INC.), PolyFox PF636, PF656, PF6320, PF6520, PF7002 (the above are manufactured by OMNOVA SOLUTIONS INC.), Futurgent 208G, 215M, 245F, 601AD, 601ADH2, 602A, 610FM, 710FL, 710FM, 710FS, FTX-218 (the above are manufactured by NEOS), etc.

[0104] Fluorinated surfactants can also be used more effectively with acrylic compounds, which have a molecular structure containing functional groups with fluorine atoms. When heated, the functional groups containing fluorine atoms are cleaved, and the fluorine atoms volatilize. Examples of such fluorinated surfactants include the MEGAFACE DS series manufactured by DIC Corporation (Chemical Industry Daily (February 22, 2016), Nikkei Industrial News (February 23, 2016)), such as MEGAFACE DS-21.

[0105] Regarding fluorinated surfactants, polymers of vinyl ether compounds having fluorinated alkyl or fluorinated alkyl ether groups and hydrophilic vinyl ether compounds are preferred. Examples of such fluorinated surfactants include those described in Japanese Patent Application Publication No. 2016-216602, the contents of which are incorporated herein by reference.

[0106] Fluorinated surfactants can also be used with block polymers. Fluorinated surfactants can also preferably use fluorinated polymers comprising: repeating units derived from (meth)acrylate compounds having fluorine atoms; and repeating units derived from (meth)acrylate compounds having two or more (preferably five or more) alkoxy groups (preferably ethoxy or propyleneoxy groups). Furthermore, the fluorinated surfactants described in paragraphs 0016 to 0037 of Japanese Patent Application Publication No. 2010-032698, and the following compounds, are also exemplified as fluorinated surfactants used in this invention. [Chemical Formula 6] The weight-average molecular weight of the above compounds is preferably 3,000 to 50,000, for example, 14,000. In the above compounds, the percentage of repeating units is expressed in moles.

[0107] Furthermore, fluorinated surfactants can also be used on fluoropolymers with ethylene-containing unsaturated groups on their side chains. Specific examples include compounds described in paragraphs 0050-0090 and 0289-0295 of Japanese Patent Application Publication No. 2010-164965, and MEGAFACE RS-101, RS-102, RS-718K, and RS-72-K manufactured by DIC Corporation. Additionally, compounds described in paragraphs 0015-0158 of Japanese Patent Application Publication No. 2015-117327 can also be used as fluorinated surfactants.

[0108] Furthermore, from an environmental regulation perspective, it is preferable to use the surfactants described in International Publication No. 2020 / 084854 as substitutes for perfluoroalkyl surfactants having 6 or more carbon atoms.

[0109] Furthermore, using fluoroimidine chloride compounds represented by formula (fi-1) as surfactants is also preferable. [Chemical Formula 7] In formula (fi-1), m represents 1 or 2, n represents an integer from 1 to 4, a represents 1 or 2, and X a+ represents a metal ion with valence a, primary ammonium ion, secondary ammonium ion, tertiary ammonium ion, quaternary ammonium ion, or NH 4+.

[0110] Examples of nonionic surfactants include glycerol, trimethylolpropane, trimethylolethane, and their ethoxylated and propoxylated derivatives (e.g., glycerol propoxylated, glycerol ethoxylated, etc.), polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene oil ether, polyoxyethylene octylphenyl ether, polyoxyethylene nonylphenyl ether, polyethylene glycol dilaurate, polyethylene glycol distearate, sorbitan fatty acid esters, Pluronic L10, L31, L61, L62, 10R5, 17R2, 25R2 (manufactured by BASF), Tetronic 304, 701, 704, 901, 904, 150R1 (manufactured by BASF), and Solsperse 20000 (Japan Lubrizol). (Manufactured by FUJIFILM Wako Pure Chemical Corporation), NCW-101, NCW-1001, NCW-1002 (manufactured by FUJIFILM Wako Pure Chemical Corporation), PIONIN D-6112, D-6112-W, D-6315 (manufactured by Takemoto Oil & Fat Co., Ltd.), OLFIN E1010, Surfynol 104, 400, 440 (manufactured by Nissin Chemical Co., Ltd.), etc.

[0111] Examples of cationic surfactants include tetraalkylammonium salts, alkylamine salts, benzylammonium chloride, alkylpyridinium salts, and imidazoline salts. Specific examples include dihydroxyethylstearylamine, 2-heptadecenyl-hydroxyethylimidazoline, lauryl dimethyl benzylammonium chloride, hexadecylpyridinium chloride, and stearylamine methylpyridinium chloride.

[0112] Examples of anionic surfactants include dodecylbenzenesulfonic acid, sodium dodecylbenzenesulfonate, sodium lauryl sulfate, sodium alkyl diphenyl ether disulfonate, sodium alkyl naphthalene sulfonate, sodium dialkyl sulfosuccinate, sodium stearate, potassium oleate, sodium dioctyl sulfosuccinate, sodium polyoxyethylene alkyl ether sulfate, sodium polyoxyethylene alkylphenyl ether sulfate, sodium dialkyl sulfosuccinate, sodium stearate, sodium oleate, and sodium tri-octylphenoxyethoxypolyethoxyethyl sulfate.

[0113] The content of other surfactants in the composition is preferably below 1000 ppm by mass, more preferably below 500 ppm by mass, and further preferably below 250 ppm by mass. The lower limit can be set to 1 ppm by mass or more, for example. Furthermore, it is preferable that the content of other surfactants is 100 parts by weight or less relative to 100 parts by weight of the specific polysiloxane surfactant, more preferably 50 parts by weight or less, and even more preferably 25 parts by weight or less. The lower limit can be set to 1 part by weight or more, for example. It is also preferable that the composition of the present invention does not contain other surfactants.

[0114] <<Solvent>> The composition of the first state sample contains a solvent. Examples of solvents include water and organic solvents. There are essentially no particular restrictions on the type of solvent, as long as it satisfies the solubility of each component or the coatability of the composition. Examples of organic solvents include aliphatic hydrocarbon solvents, halogenated hydrocarbon solvents, alcohol solvents, ether solvents, ester solvents, ketone solvents, nitrile solvents, amide solvents, sulfide solvents, and aromatic solvents. For details regarding these, please refer to paragraph 0223 of International Publication No. 2015 / 166779, which is incorporated herein by reference. Furthermore, ester solvents with cyclic alkyl substitutions and ketone solvents with cyclic alkyl substitutions are also preferred. Specific examples of organic solvents include polyethylene glycol monomethyl ether, dichloromethane, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, ethyl celecoxyl acetate, ethyl lactate, diethylene glycol dimethyl ether, butyl acetate, methyl 3-methoxypropionate, 2-heptanone, 2-pentanone, 3-pentanone, 4-heptanone, cyclohexanone, 2-methylcyclohexanone, 3-methylcyclohexanone, 4-methylcyclohexanone, cycloheptanone, cyclooctanone, cyclohexyl acetate, cyclopentanone, ethyl carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether, propylene glycol monomethyl ether, etc. Ether acetates, 3-methoxy-N,N-dimethylpropionic acid, 3-butoxy-N,N-dimethylpropionic acid, propylene glycol diacetate, 3-methoxybutanol, methyl ethyl ketone, γ-butyrolactone, cyclobutane, anisole, 1,4-diethoxybutane, diethylene glycol monoethyl ether acetate, diacetate butane-1,3-diyl, dipropylene glycol methyl ether acetate, diacetone alcohol (also known as diacetone alcohol, 4-hydroxy-4-methyl-2-pentanone), 2-methoxypropyl acetate, 2-methoxy-1-propanol, isopropanol, etc. However, sometimes for environmental reasons, it is better to reduce the amount of aromatic hydrocarbons (benzene, toluene, xylene, ethylbenzene, etc.) used as organic solvents (for example, relative to the total amount of organic solvents, it can be set to 50 ppm by mass (parts per million) or less, or 10 ppm by mass or less, or 1 ppm by mass or less).

[0115] In this invention, it is preferable to use an organic solvent with a low metal content. For example, a metal content of 10 ppb (parts per billion) or less is preferred. Depending on the need, organic solvents at the ppt (parts per trillion) level can be used, such as those supplied by Toyo Gosei Co., Ltd. (Chemical Industry Daily, November 13, 2015).

[0116] Methods for removing impurities such as metals from organic solvents include, for example, distillation (molecular distillation or membrane distillation) or filtration using a filter. For the filter used in the filtration, a pore size of 10 μm or less is preferred, 5 μm or less is more preferred, and 3 μm or less is even more preferred. The filter material is preferably polytetrafluoroethylene, polyethylene, or nylon.

[0117] Organic solvents can contain isomers (compounds that have the same number of atoms but different structures). Furthermore, isomers can be a single type or a plurality of types.

[0118] It is preferable for the peroxide content in the organic solvent to be below 0.8 mmol / L, and even better if it is virtually free of peroxides.

[0119] The solvent content in the composition is preferably 10-95% by mass, more preferably 20-90% by mass, and even more preferably 30-90% by mass. The composition of the present invention may contain only one solvent or two or more solvents. When two or more solvents are contained, the total amount is preferably within the above-mentioned range.

[0120] <<Color material>> The composition of the first state sample preferably contains a colorant. Such a composition can be preferably used as a composition for filter forming (more specifically, for filter pixel forming).

[0121] Examples of color materials include white color materials, black color materials, colored color materials, and near-infrared absorbing color materials. Furthermore, in this specification, white color materials include not only pure white, but also light gray color materials that are close to white (e.g., off-white, light gray, etc.).

[0122] It is preferable that the colorant includes at least one selected from the group consisting of colored colorants, black colorants and near-infrared absorbing colorants, it is even more preferable that it includes at least one selected from the group consisting of colored colorants and black colorants, and it is even more preferable that it includes colored colorants.

[0123] Furthermore, it is preferable that the colorant includes two or more colored colorants and a near-infrared absorbing colorant. Also, black can be formed by combining two or more colored colorants. Furthermore, it is preferable that the colorant includes a black colorant and a near-infrared absorbing colorant. Based on these embodiments, the composition of the present invention can be preferably used as a composition for forming a near-infrared transmission filter. Regarding combinations of colorants that form black by combining two or more colored colorants, see Japanese Patent Application Publication No. 2013-077009, Japanese Patent Application Publication No. 2014-130338, and International Publication No. 2015 / 166779, etc.

[0124] The colorant can be either a pigment or a dye, with pigments being preferred. The average primary particle size of the pigment is preferably 1-200 nm. A lower limit of 5 nm or more is preferred, and 10 nm or more is even better. An upper limit of 180 nm or less is preferred, 150 nm or less is even better, and 100 nm or less is even more preferred. Furthermore, in this specification, the primary particle size of the pigment can be determined by observing the primary particles of the pigment using a transmission electron microscope and based on the obtained image photographs. Specifically, the projected area of ​​the primary particles of the pigment is calculated, and the corresponding equivalent circle diameter is calculated as the primary particle size of the pigment. Also, the average primary particle size in this specification is set as the arithmetic mean of the primary particle sizes of 400 pigment particles. Furthermore, the primary particles of the pigment refer to unaggregated, independent particles.

[0125] (color material) As color materials, examples include those with extremely high absorption wavelengths in the range of 400-700 nm. Examples include green, red, yellow, purple, blue, and orange color materials.

[0126] Phthalocyanine compounds and squaric acid cyanine compounds can be cited as green color materials, with phthalocyanine compounds being preferred. Furthermore, pigments are preferred as green color materials. Specific examples of green color materials include CI pigments green 7, 10, 36, 37, 58, 59, 62, 63, 64, 65, and 66. Additionally, zinc halide phthalocyanine pigments with an average of 10-14 halogen atoms, 8-12 bromine atoms, and 2-5 chlorine atoms per molecule can also be used as green color materials. Specific examples include compounds described in International Publication No. 2015 / 118720. Furthermore, as a green pigment, it is also possible to use compounds described in Chinese Patent Application No. 106909027, phthalocyanine compounds with phosphate esters as ligands described in International Publication No. 2012 / 102395, phthalocyanine compounds described in Japanese Patent Application Publication No. 2019-008014, phthalocyanine compounds described in Japanese Patent Application Publication No. 2018-180023, compounds described in Japanese Patent Application Publication No. 2019-038958, aluminum phthalocyanine compounds described in Japanese Patent Application Publication No. 2020-070426, core-shell pigments described in Japanese Patent Application Publication No. 2020-076995, and diarylmethane compounds described in Japanese Patent Application Publication No. 2020-504758, etc.

[0127] For green pigments, CI pigment green 7, 36, 58, 59, 62, and 63 are preferred, with CI pigment green 7, 36, 58, and 59 being even better.

[0128] Examples of red pigments include diketopyrrolopyrrole compounds, anthraquinone compounds, azo compounds, naphthol compounds, methylimine compounds, succinyl compounds, quinacrine compounds, perylene compounds, and thioindole compounds. Diketopyrrolopyrrole compounds, anthraquinone compounds, and azo compounds are preferred, with diketopyrrolopyrrole compounds being even better. Furthermore, red pigments are preferred as dyes. As specific examples of red pigments, the CI (colorimetric index) of pigment reds can be cited as follows: 1, 2, 3, 4, 5, 6, 7, 9, 10, 14, 17, 22, 23, 31, 38, 41, 48:1, 48:2, 48:3, 48:4, 49, 49:1, 49:2, 52:1, 52:2, 53:1, 57:1, 60:1, 63:1, 66, 67, 81:1, 81:2, 81:3, 83, 88, 90, 105, 112, 119, 122, 123, 144, 1 Red pigments in the following colors: 46, 149, 150, 155, 166, 168, 169, 170, 171, 172, 175, 176, 177, 178, 179, 184, 185, 187, 188, 190, 200, 202, 206, 207, 208, 209, 210, 216, 220, 224, 226, 242, 246, 254, 255, 264, 269, 270, 272, 279, 291, 294, 295, 296, 297, etc.Furthermore, as a red pigment, it is also possible to use the following: diketopyrrolopyrrole compounds that substitute at least one bromine atom in the structure as described in Japanese Patent Application Publication No. 2017-201384; diketopyrrolopyrrole compounds described in paragraphs 0016-0022 of Japanese Patent No. 6248838; diketopyrrolopyrrole compounds described in International Publication No. 2012 / 102399; diketopyrrolopyrrole compounds described in International Publication No. 2012 / 117965; brominated diketopyrrolopyrrole compounds described in Japanese Patent Application Publication No. 2020-085947; naphthol azo compounds described in Japanese Patent Application Publication No. 2012-229344; red pigments described in Japanese Patent No. 6516119; and other red pigments described in Japanese Patent No. 6516119. The red pigment described in Japanese Patent Application Publication No. 6525101, the brominated diketone pyrrolopyrrole compound described in paragraph 0229 of Japanese Patent Application Publication No. 2020-090632, the anthraquinone compound described in Korean Patent Publication No. 10-2019-0140741, the anthraquinone compound described in Korean Patent Publication No. 10-2019-0140744, the perylene compound described in Japanese Patent Application Publication No. 2020-079396, the perylene compound described in Japanese Patent Application Publication No. 2020-083982, the acetophenone compound described in Japanese Patent Application Publication No. 2018-035345, and the diketone pyrrolopyrrole compound described in paragraphs 0025 to 0041 of Japanese Patent Application Publication No. 2020-066702, etc. Furthermore, compounds with the following structure can also be used as red pigments: the aforementioned structure is formed by introducing groups with bonded oxygen, sulfur, or nitrogen atoms into an aromatic ring, resulting in an aromatic cyclic group bonded to a diketopyrrole skeleton. Lumogen F Orange 240 (manufactured by BASF, a red pigment, perylene pigment) can also be used as a red pigment.

[0129] For red pigments, CI Pigment Red 122, 177, 179, 254, 255, 264, 269, 272, and 291 are preferred, with CI Pigment Red 254, 264, and 272 being even better.

[0130] Examples of yellow pigments include azo compounds, methylimine compounds, isoindoline compounds, pteridine compounds, quinoline yellow compounds, and perylene compounds. Pigments are preferred as yellow pigments, with azo pigments, methylimine pigments, isoindoline pigments, pteridine pigments, quinoline yellow pigments, or perylene pigments being even better, and azo pigments or methylimine pigments being the most desirable. Specific examples of yellow pigments include CI pigments yellow 1, 2, 3, 4, 5, 6, 10, 11, 12, 13, 14, 15, 16, 17, 18, 20, 24, 31, 32, 34, 35, 35:1, 36, 36:1, 37, 37:1, 40, 42, 43, 53, 55, 60, 61, 62, 63, 65, 73, 74, 77, 81, 83, 86, 93, 94, 95, 97, 98, 100, 101, 104, 106, 108, 109, 110, 113, 114, 115, 116, 117, 118, 119, and 12. Yellow pigments in the following digits: 0, 123, 125, 126, 127, 128, 129, 137, 138, 139, 147, 148, 150, 151, 152, 153, 154, 155, 156, 161, 162, 164, 166, 167, 168, 169, 170, 171, 172, 173, 174, 175, 176, 177, 179, 180, 181, 182, 185, 187, 188, 193, 194, 199, 213, 214, 215, 228, 231, 232, 233, 234, 235, 236, etc.

[0131] Furthermore, nickel azobarbiturate complexes with the following structure can also be used as yellow pigments. [Chemical Formula 8]

[0132] Furthermore, as a yellow pigment, compounds described in Japanese Patent Application Publication No. 2017-201003, Japanese Patent Application Publication No. 2017-197719, Japanese Patent Application Publication No. 2017-171912 (paragraphs 0011-0062, 0137-0276), Japanese Patent Application Publication No. 2017-171913 (paragraphs 0010-0062, 0138-0295), Japanese Patent Application Publication No. 2017-171914 (paragraphs 0011-0062, 0139-0190), and Japanese Patent Application Publication No. 2017-171915 (paragraphs 0010-0065) are also applicable. The compounds described in paragraphs 0142 to 0222, the quinoline yellow compounds described in paragraphs 0011 to 0034 of Japanese Patent Application Publication No. 2013-054339, the quinoline yellow compounds described in paragraphs 0013 to 0058 of Japanese Patent Application Publication No. 2014-026228, the isoindoline compounds described in Japanese Patent Application Publication No. 2018-062644, the quinoline yellow compounds described in Japanese Patent Application Publication No. 2018-203798, the quinoline yellow compounds described in Japanese Patent Application Publication No. 2018-062578, the quinoline yellow compounds described in Japanese Patent Application Publication No. 6432076, and the compounds described in Japanese Patent Application Publication No. 2018-155881. Quinoline yellow compounds, quinoline yellow compounds described in Japanese Patent Application Publication No. 2018-111757, quinoline yellow compounds described in Japanese Patent Application Publication No. 2018-040835, quinoline yellow compounds described in Japanese Patent Application Publication No. 2017-197640, quinoline yellow compounds described in Japanese Patent Application Publication No. 2016-145282, quinoline yellow compounds described in Japanese Patent Application Publication No. 2014-085565, quinoline yellow compounds described in Japanese Patent Application Publication No. 2014-021139, quinoline yellow compounds described in Japanese Patent Application Publication No. 2013-209614, and quinoline yellow compounds described in Japanese Patent Application Publication No. 2013-209435. The compounds described in Japanese Patent Application Publication No. 2013-181015, Japanese Patent Application Publication No. 2013-061622, Japanese Patent Application Publication No. 2013-032486, Japanese Patent Application Publication No. 2012-226110, Japanese Patent Application Publication No. 2008-074987, Japanese Patent Application Publication No. 2008-081565, Japanese Patent Application Publication No. 2008-074986, and Japanese Patent Application Publication No. 2008-074985.The following compounds are described in Japanese Patent Application Publication No. 2008-050420, Japanese Patent Application Publication No. 2008-031281, Japanese Patent Publication No. 48-032765, Japanese Patent Application Publication No. 2019-008014, Japanese Patent No. 6607427, Korean Patent Publication No. 10-2014-0034963, Japanese Patent Application Publication No. 2017-095706, Taiwan Patent Application Publication No. 201920495, Japanese Patent No. 6607427, Japanese Patent Application Publication No. 2020-033525, and Japanese Patent Application Publication No. 2020. The compounds described in Japanese Patent Application Publication No. 033524, Japanese Patent Application Publication No. 2020-033523, Japanese Patent Application Publication No. 2020-033522, Japanese Patent Application Publication No. 2020-033521, International Patent Application Publication No. 2020 / 045200, International Patent Application Publication No. 2020 / 045199, International Patent Application Publication No. 2020 / 045197, azo compounds described in Japanese Patent Application Publication No. 2020-093994, perylene compounds described in International Patent Application Publication No. 2020 / 105346, quinoline yellow compounds described in Japanese Patent Application Publication No. 2020-517791, compounds represented by the following formula (QP1), and compounds represented by the following formula (QP2). Furthermore, from the perspective of improving color value, polymerizing these compounds is also a better option. [Chemical Formula 9]

[0133] In formula (QP1), X1 to X16 independently represent hydrogen atoms or halogen atoms, and Z1 represents an alkyl group having 1 to 3 carbon atoms. As a specific example of a compound represented by formula (QP1), the compound described in paragraph 0016 of Japanese Patent No. 6443711 can be cited. [Chemical Formula 10]

[0134] In formula (QP2), Y1 to Y3 each independently represent a halogen atom. n and m represent integers from 0 to 6, and p represents an integer from 0 to 5. (n+m) is 1 or more. As a specific example of a compound represented by formula (QP2), the compound described in paragraphs 0047 to 0048 of Japanese Patent No. 6432077 can be cited.

[0135] For yellow pigments, CI Pigment Yellow 117, 129, 138, 139, 150, and 185 are preferred.

[0136] Examples of orange pigments include CI Pigment Orange 2, 5, 13, 16, 17:1, 31, 34, 36, 38, 43, 46, 48, 49, 51, 52, 55, 59, 60, 61, 62, 64, 71, and 73.

[0137] Examples of purple pigments include CI pigments purple 1, 19, 23, 27, 32, 37, 42, 60, and 61.

[0138] Examples of blue pigments include CI Pigment Blue 1, 2, 15, 15:1, 15:2, 15:3, 15:4, 15:6, 16, 22, 29, 60, 64, 66, 79, 80, 87, and 88. Furthermore, aluminum phthalocyanine compounds containing phosphorus atoms can also be used as blue pigments. Specific examples include compounds described in paragraphs 0022-0030 of Japanese Patent Application Publication No. 2012-247591 and paragraph 0047 of Japanese Patent Application Publication No. 2011-157478.

[0139] Dyes can also be used in colored pigments. There are no particular restrictions on the types of dyes used, and well-known dyes can be used. Examples include pyrazole azo, aniline azo, triarylmethane, anthraquinone, anthraquinone, benzene, oxacyanine, pyrazolotriazole azo, pyridone azo, anthocyanin, phenanthrene, pyrrolopyrazole methylene azo, xanthones, phthalocyanine, benzopyran, indigo, and pyrrole methylene dyes.

[0140] Pigment polymers can also be used in colored pigments. Pigment polymers are preferably dyes dissolved in organic solvents. Furthermore, pigment polymers can form particles. When pigment polymers are in particle form, they are usually used in a dispersed state in a solvent. Particle-state pigment polymers can be obtained, for example, by emulsion polymerization; specific examples include the compound and manufacturing method described in Japanese Patent Application Publication No. 2015-214682. Pigment polymer systems having two or more pigment structures in one molecule are preferred, with three or more pigment structures being preferable. There is no particular upper limit, but it can also be set to 100 or less. The multiple pigment structures in one molecule can be the same pigment structure or different pigment structures. The weight-average molecular weight (Mw) of the pigment polymer is preferably 2000 to 50000. A lower limit of 3000 or more is more preferred, and 6000 or more is further preferred. A value below 30,000 is preferred, and below 20,000 is even more preferred. The pigment polymer can also be compounds described in Japanese Patent Application Publication No. 2011-213925, Japanese Patent Application Publication No. 2013-041097, Japanese Patent Application Publication No. 2015-028144, Japanese Patent Application Publication No. 2015-030742, and International Publication No. 2016 / 031442.

[0141] The colored pigments may include diarylmethane compounds as described in Japanese Patent Application Publication No. 2020-504758, triarylmethane dye polymers as described in Korean Patent Application Publication No. 10-2020-0028160, terbinafine compounds as described in Japanese Patent Application Publication No. 2020-117638, phthalocyanine compounds as described in International Patent Application Publication No. 2020 / 174991, isoindoline compounds or salts thereof as described in Japanese Patent Application Publication No. 2020-160279, and compounds represented by Formula 1 as described in Korean Patent Application Publication No. 10-2020-0069442. The compounds represented by Formula 1 as described in Korean Patent Publication No. 10-2020-0069730, Korean Patent Publication No. 10-2020-0069070, Korean Patent Publication No. 10-2020-0069067, Korean Patent Publication No. 10-2020-0069062, zinc halide phthalocyanine pigment as described in Patent No. 6809649, and isoindoline compounds as described in Japanese Patent Application Publication No. 2020-180176. The colored pigment can be rotaxane, and the pigment skeleton can be a cyclic structure of rotaxane, a rod-shaped structure, or both.

[0142] Two or more colored pigments can also be used in combination. Furthermore, when two or more colored pigments are used in combination, black can also be formed by combining two or more colored pigments. Examples of such combinations include the following (1) to (7). (1) The appearance contains red and blue pigments. (2) The appearance contains red, blue and yellow pigments. (3) It contains red, blue, yellow and purple pigments. (4) It contains red, blue, yellow, purple and green pigments. (5) The appearance contains red, blue, yellow and green pigments. (6) The appearance contains red, blue and green pigments. (7) It contains yellow and purple pigments.

[0143] (White pigment) Examples of inorganic white pigments include titanium dioxide, strontium titanate, barium titanate, zinc oxide, magnesium oxide, zirconium oxide, aluminum oxide, barium sulfate, silicon dioxide, talc, mica, aluminum hydroxide, calcium silicate, aluminum silicate, and zinc sulfide. White pigments containing titanium atoms are preferred, with titanium dioxide being even more preferred. Furthermore, white pigments with a refractive index of 2.10 or higher relative to a wavelength of 589 nm are preferred. A refractive index of 2.10 to 3.00 is preferred, and 2.50 to 2.75 is even more preferred.

[0144] Furthermore, white pigments can also use the titanium dioxide described in "Titanium Oxide Properties and Application Technology, Kiyono Gakusho, pp. 13-45, published on June 25, 1991, by Gihodo Publishing".

[0145] White pigments are not limited to those consisting of a single inorganic substance; particles composed of other materials can also be used. For example, particles with internal pores or other materials, particles with multiple inorganic particles attached to a core particle, and core-core composite particles consisting of a core particle comprising polymer particles and a shell layer comprising inorganic nanoparticles are preferred. For example, the description in paragraphs 0012 to 0042 of Japanese Patent Application Publication No. 2015-047520, which is incorporated herein by reference, can be found in this specification.

[0146] Hollow inorganic particles can also be used for white pigments. Hollow inorganic particles refer to inorganic particles with an internal cavity structure, and specifically to inorganic particles with a cavity surrounded by an outer shell. Examples of hollow inorganic particles include those described in Japanese Patent Application Publication No. 2011-075786, International Publication No. 2013 / 061621, and Japanese Patent Application Publication No. 2015-164881, the contents of which are incorporated herein by reference.

[0147] (Black pigment) There are no particular limitations on the type of black pigment used; any known pigment may be used. Pigment (black pigment) is preferred. Furthermore, in this specification, black pigment refers to a pigment that exhibits absorption across the entire wavelength range of 400-700 nm. Examples of inorganic black pigments include carbon black, titanium black, and graphite, with carbon black and titanium black being preferred, and titanium black being even more preferred. Titanium black consists of black particles containing titanium atoms; low-valence titanium oxide or titanium oxynitride is preferred. The surface of titanium black can be modified as needed to improve dispersibility and suppress aggregation. For example, the surface of titanium black can be coated with silicon oxide, titanium oxide, germanium oxide, aluminum oxide, magnesium oxide, or zirconium oxide. Treatment with a water-repellent substance, as shown in Japanese Patent Application Publication No. 2007-302836, is also possible. Pigment Black with a colorimetric index (CI) of 1 or 7 can also be used as a black pigment. Regarding titanium black, it is preferable that both the primary particle size and the average primary particle size of each particle are small. Specifically, an average primary particle size of 10-45 nm is preferred. Titanium black can also be used as a dispersion. For example, a dispersion containing titanium black particles and silicon dioxide particles, wherein the ratio of Si atoms to Ti atoms in the dispersion is adjusted to be in the range of 0.20-0.50, can be cited. For the above-mentioned dispersions, please refer to paragraphs 0020-0105 of Japanese Patent Application Publication No. 2012-169556, the contents of which are incorporated herein by reference. Examples of commercially available titanium black include 10S, 12S, 13R, 13M, 13M-C, 13R-N, 13M-T (manufactured by Mitsubishi Materials Corporation), and Tilack D (manufactured by Ako Kasei Co., Ltd.).

[0148] Examples of organic black pigments include bisbenzofuranone compounds, imine compounds, perylene compounds, and azo compounds, with bisbenzofuranone compounds and perylene compounds being preferred. Examples of bisbenzofuranone compounds include those described in Japanese Patent Publication Nos. 2010-534726, 2012-515233, 2012-515234, International Publication No. 2014 / 208348, and 2015-525260, which can be obtained, for example, as "Irgaphor Black" manufactured by BASF. Examples of perylene compounds include CIPigment Black 31 and 32. Examples of methylimine compounds include those described in Japanese Patent Application Publication Nos. 01-170601 and 02-034664, which can be obtained, for instance, as "CHROMOFINE BLACK A1103" manufactured by Dainichiseika Color & Chemicals Mfg.Co.,Ltd. Furthermore, as an organic black pigment, Perylene Black (Lumogen Black FK4280, etc.) described in paragraphs 0016-0020 of Japanese Patent Application Publication No. 2017-226821 can also be used.

[0149] (Near-infrared absorbing colorant) Near-infrared absorbing colorants are preferably compounds whose maximum absorption wavelength is located in the range of wavelengths exceeding 700 nm but below 1400 nm. A maximum absorption wavelength of 1200 nm or less is preferred, 1000 nm or less is even better, and 950 nm or less is further preferred. The ratio of absorbance A550 at 550 nm to absorbance Amax at the maximum absorption wavelength (A550 / Amax) is preferably 0.1 or less, more preferably 0.05 or less, further preferably 0.03 or less, and particularly preferably 0.02 or less. The lower limit is not particularly limited; for example, it can be set to 0.0001 or more, or 0.0005 or more. Near-infrared absorbing colorants can be pigments or dyes, with pigments being preferred, and organic pigments being even better.

[0150] There are no particular limitations on near-infrared absorbing color materials, and examples include pyrrolopyrrole compounds, anthocyanin compounds, squaric acid cyanide compounds, phthalocyanine compounds, naphthalene phthalocyanine compounds, quaterrylene compounds, anthocyanin compounds, ketoneon compounds, oxacyanine compounds, iminium compounds, dithiol compounds, triarylmethane compounds, pyrrole methylene compounds, methylimine compounds, anthraquinone compounds, dibenzofuranone compounds, and dithioene metal complexes. Examples of pyrrolopyrrole compounds include those described in paragraphs 0016 to 0058 of Japanese Patent Application Publication No. 2009-263614, those described in paragraphs 0037 to 0052 of Japanese Patent Application Publication No. 2011-068731, and those described in paragraphs 0010 to 0033 of International Patent Application Publication No. 2015 / 166873. Examples of compounds that are squaric acid cyanines include those described in paragraphs 0044-0049 of Japanese Patent Application Publication No. 2011-208101, those described in paragraphs 0060-0061 of Japanese Patent Application Publication No. 6065169, those described in paragraph 0040 of International Publication No. 2016 / 181987, those described in Japanese Patent Application Publication No. 2015-176046, and those described in paragraph 0072 of International Publication No. 2016 / 190162. Compounds described in paragraphs 0196 to 0228 of Japanese Patent Application Publication No. 2016-074649, compounds described in paragraph 0124 of Japanese Patent Application Publication No. 2017-067963, compounds described in International Publication No. 2017 / 135359, compounds described in Japanese Patent Application Publication No. 2017-114956, compounds described in Japanese Patent No. 6197940, and compounds described in International Publication No. 2016 / 120166, etc. Examples of anthocyanin compounds include those described in paragraphs 0044-0045 of Japanese Patent Application Publication No. 2009-108267, those described in paragraphs 0026-0030 of Japanese Patent Application Publication No. 2002-194040, those described in Japanese Patent Application Publication No. 2015-172004, those described in Japanese Patent Application Publication No. 2015-172102, those described in Japanese Patent Application Publication No. 2008-088426, those described in paragraph 0090 of International Patent Application Publication No. 2016 / 190162, and those described in Japanese Patent Application Publication No. 2017-031394. Examples of ketoneon compounds include those described in Japanese Patent Application Publication No. 2017-082029.Examples of ammonium compounds include those described in Japanese Patent Publication No. 2008-528706, Japanese Patent Application Publication No. 2012-012399, Japanese Patent Application Publication No. 2007-092060, and International Patent Publication No. 2018 / 043564, paragraphs 0048 to 0063. Examples of phthalocyanine compounds include those described in Japanese Patent Application Publication No. 2012-077153, paragraph 0093, Japanese Patent Application Publication No. 2006-343631, Japanese Patent Application Publication No. 2013-195480, Japanese Patent Application Publication No. 6081771, and International Patent Publication No. 2020 / 071470. As a naphthalene phthalocyanine compound, the compound described in paragraph 0093 of Japanese Patent Application Publication No. 2012-077153 can be cited. As a dithioene metal complex, the compound described in Japanese Patent Publication No. 5733804 can be cited.

[0151] Furthermore, as a near-infrared absorbing colorant, it is also possible to use the squaring compound described in Japanese Patent Application Publication No. 2017-197437, Japanese Patent Application Publication No. 2017-025311, Japanese Patent Publication No. 2016 / 154782, Japanese Patent No. 5884953, Japanese Patent No. 6036689, and Japanese Patent No. 5810604. The compounds containing pyrrole rings described in the publications, the compounds containing pyrrole rings described in paragraphs 0090-0107 of Japanese Patent Application Publication No. 2017 / 213047, the compounds containing pyrrole rings described in paragraphs 0019-0075 of Japanese Patent Application Publication No. 2018-054760, the compounds containing pyrrole rings described in paragraphs 0078-0082 of Japanese Patent Application Publication No. 2018-040955, and the compounds containing pyrrole rings described in paragraphs 0043-0069 of Japanese Patent Application Publication No. 2018-002773. Compounds containing a pyrrole ring; squaric acid compounds with an aromatic ring at the α-position of acetylamine as described in paragraphs 0024 to 0086 of Japanese Patent Application Publication No. 2018-041047; acetylamine-linked squaric acid compounds as described in Japanese Patent Application Publication No. 2017-179131; compounds having a pyrrole bisquaric acid skeleton or a ketone skeleton as described in Japanese Patent Application Publication No. 2017-141215; and dihydroxycarbazole bisquaric acid compounds as described in Japanese Patent Application Publication No. 2017-082029. Compounds, asymmetric compounds described in paragraphs 0027 to 0114 of Japanese Patent Application Publication No. 2017-068120, compounds containing pyrrole rings (carbazole type) described in Japanese Patent Application Publication No. 2017-067963, phthalocyanine compounds described in Japanese Patent Application Publication No. 6251530, squaric acid cyanine compounds described in Japanese Patent Application Publication No. 2020-075959, and copper complexes described in Korean Patent Publication No. 10-2019-0135217, etc.

[0152] The content of colorant in the total solids composition of the product is preferably 20-80% by mass. The lower limit is preferably 30% by mass or more, more preferably 40% by mass or more, and further preferably 50% by mass or more. The upper limit is preferably 75% by mass or less, and more preferably 70% by mass or less. The composition of the present invention may contain only one colorant or may contain two or more colorants. When containing two or more colorants, the total amount is preferably within the above-mentioned range.

[0153] <<Photopolymerization Initiators>> The coloring composition of the first phase can contain a photopolymerization initiator. When using a polymerizable monomer as a curing compound, the presence of a photopolymerization initiator is preferred. There are no particular limitations on the photopolymerization initiator; it can be appropriately selected from known photopolymerization initiators. For example, a compound that is photosensitive to light in the ultraviolet to visible regions is preferred. A photoradical polymerization initiator is preferred.

[0154] Examples of photopolymerization initiators include halogenated hydrocarbon derivatives (e.g., compounds with a trihalomethane skeleton, compounds with a diazole skeleton, etc.), acetyphosphine compounds, hexaaryl biimidazole compounds, oxime compounds, organic peroxides, sulfur compounds, ketone compounds, aromatic onium salts, α-hydroxy ketone compounds, α-amino ketone compounds, etc. From the perspective of exposure sensitivity, photopolymerization initiators are preferably trihalomethyl triazine compounds, benzyl dimethyl ketal compounds, α-hydroxy ketone compounds, α-amino ketone compounds, acetophosphine compounds, phosphine oxide compounds, metallocene compounds, oxime compounds, hexaaryl diimidazole compounds, onium compounds, benzothiazole compounds, benzophenone compounds, acetophenone compounds, cyclopentadiene-benzene-iron complexes, halomethyl diazole compounds, and 3-aryl substituted coumarin compounds. Compounds selected from oxime compounds, α-hydroxy ketone compounds, α-amino ketone compounds, and acetophosphine compounds are more preferred, with oxime compounds being even more preferred. Furthermore, compounds described in paragraphs 0065 to 0111 of Japanese Patent Application Publication No. 2014-130173, compounds described in Japanese Patent Application Publication No. 6301489, and MATERIAL STAGE are examples of photopolymerization initiators. Peroxide-based photopolymerization initiators described in 37~60p, vol.19, No.3, 2019; photopolymerization initiators described in International Publication No. 2018 / 221177; photopolymerization initiators described in International Publication No. 2018 / 110179; photopolymerization initiators described in Japanese Patent Application Publication No. 2019-043864; photopolymerization initiators described in Japanese Patent Application Publication No. 2019-044030; Japanese Patent Application Publication No. 2019- The peroxide-based initiators described in Japanese Patent Application Publication No. 167313, the aminoacetophenone-based initiators containing acezolidinyl groups described in Japanese Patent Application Publication No. 2020-055992, the oxime-based photopolymerization initiators described in Japanese Patent Application Publication No. 2013-190459, the polymers described in Japanese Patent Application Publication No. 2020-172619, and the compounds represented by Formula 1 described in International Publication No. 2020 / 152120 are all included in this specification.

[0155] Specific examples of hexaaryl diimidazole compounds include 2,2',4-tris(2-chlorophenyl)-5-(3,4-dimethoxyphenyl)-4,5-diphenyl-1,1'-diimidazole, etc.

[0156] Commercially available α-hydroxy ketone compounds include Omnirad 184, Omnirad 1173, Omnirad 2959, Omnirad 127 (all manufactured by IGM Resins BV), and Irgacure 184, Irgacure 1173, Irgacure 2959, and Irgacure 127 (all manufactured by BASF). Commercially available α-amino ketone compounds include Omnirad 907, Omnirad 369, Omnirad 369E, Omnirad 379EG (all manufactured by IGM Resins BV), and Irgacure 907, Irgacure 369, Irgacure 369E, and Irgacure 379EG (all manufactured by BASF). Commercially available acetylsphine compounds include Omnirad 819, Omnirad TPO (both manufactured by IGM Resins BV), Irgacure 819, and Irgacure TPO (both manufactured by BASF).

[0157] Examples of oxime compounds include those described in Japanese Patent Application Publication No. 2001-233842, Japanese Patent Application Publication No. 2000-080068, Japanese Patent Application Publication No. 2006-342166, JCS Perkin II (1979, pp. 1653-1660), JCS Perkin II (1979, pp. 156-162), and the Journal of Photopolymer Science and... Compounds described in Japanese Patent Application Publication No. 2000-066385, Japanese Patent Application Publication No. 2004-534797, Japanese Patent Application Publication No. 2006-342166, Japanese Patent Application Publication No. 2017-019766, Japanese Patent No. 6065596, International Publication No. 2015 / 152153, International Publication No. 2017 / 051680, Japanese Patent Application Publication No. 2017-198865, International Publication No. 2017 / 164127 (paragraphs 0025-0038), and International Publication No. 2013 / 167515, etc. Specific examples of oxime compounds include 3-benzoxyloxyiminobutane-2-one, 3-acetoxyiminobutane-2-one, 3-propoxyiminobutane-2-one, 2-acetoxyiminopentane-3-one, 2-acetoxyimino-1-phenylpropane-1-one, 2-benzoxyloxyimino-1-phenylpropane-1-one, 3-(4-toluenesulfonoxy)iminobutane-2-one, 2-ethoxycarbonyloxyimino-1-phenylpropane-1-one, and 1-[4-(phenylthio)phenyl]-3-cyclohexylpropane-1,2-dione-2-(O-acetylgoxime), etc. Commercially available products include Irgacure OXE01, Irgacure OXE02, Irgacure OXE03, and Irgacure OXE04 (all manufactured by BASF), TR-PBG-304, TR-PBG-327 (manufactured by TRONLY), and ADEKA OPTOMER N-1919 (manufactured by ADEKA Corporation, as described in Japanese Patent Application Publication No. 2012-014052, a photopolymerization initiator 2). Furthermore, as oxime compounds, compounds that are colorless or highly transparent and resistant to discoloration are preferred.Examples of commercially available products include ADEKA ARKLS NCI-730, NCI-831, and NCI-930 (all manufactured by ADEKA CORPORATION).

[0158] Oxime compounds having a cyclohexane ring can also be used as photopolymerization initiators. Specific examples of oxime compounds having a cyclohexane ring include the compound described in Japanese Patent Application Publication No. 2014-137466, the compound described in Japanese Patent No. 6636081, and the compound described in Korean Patent Publication No. 10-2016-0109444.

[0159] As photopolymerization initiators, oxime compounds having at least one benzene ring in the carbazole ring as the backbone of the naphthalene ring can also be used. Specific examples of such oxime compounds include the compound described in International Publication No. 2013 / 083505.

[0160] Oxime compounds containing fluorine atoms can also be used as photopolymerization initiators. Specific examples of oxime compounds containing fluorine atoms include the compounds described in Japanese Patent Application Publication No. 2010-262028, compounds 24, 36-40 described in Japanese Patent Application Publication No. 2014-500852, and compound (C-3) described in Japanese Patent Application Publication No. 2013-164471.

[0161] Nitro-containing oxime compounds can be used as photopolymerization initiators. It is also preferable to use nitro-containing oxime compounds as dimers. Specific examples of nitro-containing oxime compounds include the compounds described in paragraphs 0031 to 0047 of Japanese Patent Application Publication No. 2013-114249, paragraphs 0008 to 0012 and 0070 to 0079 of Japanese Patent Application Publication No. 2014-137466, the compounds described in paragraphs 0007 to 0025 of Japanese Patent Application No. 4223071, and ADEKA ARKLS NCI-831 (manufactured by ADEKA CORPORATION).

[0162] Oxime compounds having a benzofuran skeleton can also be used as photopolymerization initiators. Specific examples include OE-01 to OE-75 as described in International Publication No. 2015 / 036910.

[0163] As photopolymerization initiators, oxime compounds with hydroxyl substituents bonded to the carbazole skeleton can also be used. Examples of such photopolymerization initiators include compounds described in International Publication No. 2019 / 088055.

[0164] As a photopolymerization initiator, an oxime compound (hereinafter also referred to as an oxime compound OX) having an aromatic cyclic group Ar OX1 formed by introducing an electron-withdrawing group into the aromatic ring can also be used. Examples of electron-withdrawing groups in the aforementioned aromatic cyclic Ar OX1 include acetyl, nitro, trifluoromethyl, alkylsulfinyl, arylsulfinyl, alkylsulfinyl, arylsulfinyl, and cyano. Acetyl and nitro are preferred, and acetyl is more preferred from the perspective of easily forming a film with excellent lightfastness, while benzoyl is further preferred. Benzyl may have substituents. As substituents, halogen atoms, cyano, nitro, hydroxyl, alkyl, alkoxy, aryl, aryloxy, heterocyclic, heterocyclic, alkenyl, alkylthioalkyl, arylthioalkyl, acetyl or amino are preferred, alkyl, alkoxy, aryl, aryloxy, heterocyclic, alkylthioalkyl, arylthioalkyl or amino are even more preferred, and alkoxy, alkylthioalkyl or amino are further preferred.

[0165] The oxime compound OX is preferably selected from at least one of the compounds represented by formula (OX1) and the compounds represented by formula (OX2), with the compound represented by formula (OX2) being more preferred. [Chemical Formula 11] In the formula, R X1 represents alkyl, alkenyl, alkoxy, aryl, aryloxy, heterocyclic, heterocyclic, alkylthioalkyl, arylthioalkyl, alkylsulfinyl, arylsulfinyl, alkylsulfonyl, arylsulfonyl, acetyl, acetoxy, amino, phosphinyl, aminomethyl, or aminosulfonyl. RX2 represents alkyl, alkenyl, alkoxy, aryl, aryloxy, heterocyclic, heterocyclic, alkylthioalkyl, arylthioalkyl, alkylsulfinyl, arylsulfinyl, alkylsulfonyl, arylsulfonyl, acetoxy, or amino. RX3 to RX14 represent hydrogen atoms or substituents independently, respectively; However, at least one of RX10 to RX14 is an electron-withdrawing group.

[0166] Examples of electron-withdrawing groups include acetyl, nitro, trifluoromethyl, alkylsulfinyl, arylsulfinyl, alkylsulfinyl, arylsulfinyl, and cyano. Acetyl and nitro are preferred. Considering the ease with which a film with excellent lightfastness can be formed, acetyl is even better, and benzoyl is even more preferred.

[0167] In the above formula, RX12 is an electron-withdrawing group, and RX10, RX11, RX13, and RX14 are preferably hydrogen atoms.

[0168] As a specific example of the oxime compound OX, the compound described in paragraphs 0083 to 0105 of Japanese Patent No. 4600600 can be cited.

[0169] The following are specific examples of oxime compounds that are preferred for use in this invention, but the invention is not limited to these.

[0170] [Chemical Formula 12] [Chemical Formula 13] [Chemical Formula 14]

[0171] Oxidime compounds are preferably those with maximum absorption wavelengths in the range of 350–500 nm, and even more preferably those with maximum absorption wavelengths in the range of 360–480 nm. Furthermore, from a sensitivity perspective, high molar absorptivity at 365 nm or 405 nm is preferred, 1000–300000 is more preferred, 2000–300000 is further preferred, and 5000–200000 is particularly preferred. The molar absorptivity of the compound can be measured using known methods. For example, it is preferable to measure it using ethyl acetate solvent at a concentration of 0.01 g / L using a spectrophotometer (Varian Cary-5 spectrophotometer).

[0172] As photopolymerization initiators, the combination of Irgacure OXE01 (manufactured by BASF) and / or Irgacure OXE02 (manufactured by BASF) and Omnirad 2959 (manufactured by IGM Resins BV) is also preferred.

[0173] As photopolymerization initiators, photoradical polymerization initiators with two or more functionalities can be used. By using such photoradical polymerization initiators, two or more free radicals are generated from one molecule of the initiator, thus achieving good sensitivity. Furthermore, when using compounds with asymmetric structures, crystallinity decreases while solubility in solvents increases, making it less prone to precipitation over time, thereby improving the long-term stability of the composition. Specific examples of photoradical polymerization initiators with two or more functionalities include dimers of oxime compounds described in Japanese Patent Application Publication No. 2010-527339, Japanese Patent Application Publication No. 2011-524436, International Publication No. 2015 / 004565, Japanese Patent Application Publication No. 2016-532675 (paragraphs 0407-0412), and International Publication No. 2017 / 033680 (paragraphs 0039-0055), and compounds (E) described in Japanese Patent Application Publication No. 2013-522445. The photoinitiators described in Japanese Patent Publication No. 2016 / 034963, including compounds (G), Cmpd1-7, oxime esters described in paragraph 0007 of Japanese Patent Publication No. 2017-523465, photoinitiators described in paragraphs 0020-0033 of Japanese Patent Application Publication No. 2017-167399, photopolymerization initiators (A) described in paragraphs 0017-0026 of Japanese Patent Application Publication No. 2017-151342, and oxime esters described in Japanese Patent Publication No. 6469669.

[0174] The content of photopolymerization initiator in the total solids component of the composition is preferably 0.1-20% by mass. The lower limit is preferably 0.5% by mass or more, and more than 1% by mass. The upper limit is preferably 15% by mass or less, and more than 10% by mass. The composition of the present invention may contain only one photopolymerization initiator, or it may contain two or more. When containing two or more photopolymerization initiators, the total amount of these initiators is preferably within the above-mentioned range.

[0175] Pigment Derivatives The first-state coloring composition may contain pigment derivatives. Pigment derivatives are used, for example, as dispersing agents. Examples of pigment derivatives include compounds having a structure in which acid or base groups are bonded to the pigment backbone.

[0176] Examples of pigment skeletons constituting pigment derivatives include quinoline pigment skeletons, benzimidazolone pigment skeletons, benzisoindole pigment skeletons, benzothiazole pigment skeletons, iminium pigment skeletons, squaric acid cyanine pigment skeletons, ketoneonium pigment skeletons, oxacyanine pigment skeletons, pyrrolopyrrole pigment skeletons, diketopyrrolopyrrole pigment skeletons, azo pigment skeletons, methylimine pigment skeletons, phthalocyanine pigment skeletons, naphthylphthalocyanine pigment skeletons, anthraquinone pigment skeletons, quinacrine pigment skeletons, dithiol pigment skeletons, perinone pigment skeletons, perylene pigment skeletons, thioindole pigment skeletons, isoindoline pigment skeletons, isoindolineone pigment skeletons, quinoline yellow pigment skeletons, iminium pigment skeletons, dithiol pigment skeletons, triarylmethane pigment skeletons, and pyrrole methylene pigment skeletons.

[0177] Examples of acid groups include carboxyl groups, sulfonic acid groups, phosphate groups, borate groups, carboxylic acid amino groups, sulfonic acid amino groups, amide amino groups, and their salts. Examples of atoms or groups constituting the salt include alkali metal ions (Li+, Na+, K+, etc.), alkaline earth metal ions (Ca2+, Mg2+, etc.), ammonium ions, imidazolium ions, pyridinium ions, phosphonium ions, etc. For carboxylic acid amino groups, the group represented by -NHCOR X1 is preferred. For sulfonic acid amino groups, the group represented by -NHSO2R X2 is preferred. For amide amino groups, the group represented by -SO2NHSO2R X3, -CONHSO2R X4, -CONHCOR X5, or -SO2NHCOR X6 is preferred, with -SO2NHSO2R X3 being more preferred. R X1 to R X6 independently represent alkyl or aryl groups. The alkyl and aryl groups represented by RX1 to RX6 may have substituents. Halogen atoms are preferred as substituents, and fluorine atoms are even more preferred.

[0178] Examples of bases include amino groups, pyridyl groups and their salts, ammonium salts, and phthalimide methyl groups. Examples of atoms or groups that constitute salts include hydroxide ions, halide ions, carboxylate ions, sulfonate ions, and phenoxy ions.

[0179] Pigment derivatives with excellent visible transparency (hereinafter also referred to as transparent pigment derivatives) can also be used. The maximum value (εmax) of the molar absorptivity of the transparent pigment derivative in the wavelength region of 400~700 nm is preferably below 3000 L·mol⁻¹·cm⁻¹, more preferably below 1000 L·mol⁻¹·cm⁻¹, and further preferably below 100 L·mol⁻¹·cm⁻¹. The lower limit of εmax is, for example, above 1 L·mol⁻¹·cm⁻¹, or above 10 L·mol⁻¹·cm⁻¹.

[0180] Specific examples of pigment derivatives include compounds described in Japanese Patent Application Publication No. 56-118462, Japanese Patent Application Publication No. 63-264674, Japanese Patent Application Publication No. 01-217077, Japanese Patent Application Publication No. 03-009961, Japanese Patent Application Publication No. 03-026767, Japanese Patent Application Publication No. 03-153780, Japanese Patent Application Publication No. 03-045662, and Japanese Patent Application Publication No. 04-285669. The compounds described in the announcements, the compounds described in Japanese Patent Application Publication No. 06-145546, the compounds described in Japanese Patent Application Publication No. 06-212088, the compounds described in Japanese Patent Application Publication No. 06-240158, the compounds described in Japanese Patent Application Publication No. 10-030063, the compounds described in Japanese Patent Application Publication No. 10-195326, the compounds described in paragraphs 0086 to 0098 of International Patent Application Publication No. 2011 / 024896, and the compounds described in paragraphs 0063 to 0094 of International Patent Application Publication No. 2012 / 102399. Compounds, compounds described in paragraph 0082 of Japanese Patent Publication No. 2017 / 038252, compounds described in paragraph 0171 of Japanese Patent Application Publication No. 2015-151530, compounds described in paragraphs 0162-0183 of Japanese Patent Application Publication No. 2011-252065, compounds described in Japanese Patent Application Publication No. 2003-081972, compounds described in Japanese Patent Application Publication No. 5299151, compounds described in Japanese Patent Application Publication No. 2015-172732, compounds described in Japanese Patent Application Publication No. 2014-199308, and Japanese... The compounds described in Japanese Patent Application Publication No. 2014-085562, the compounds described in Japanese Patent Application Publication No. 2014-035351, the compounds described in Japanese Patent Application Publication No. 2008-081565, the compounds described in Japanese Patent Application Publication No. 2019-109512, the compounds described in Japanese Patent Application Publication No. 2019-133154, the diketopyrrolopyrrole compounds having a thiol linker described in International Patent Application Publication No. 2020 / 002106, the benzimidazolone compounds described in Japanese Patent Application Publication No. 2018-168244, or salts thereof.

[0181] The content of the pigment derivative is preferably 1 to 30 parts by mass relative to 100 parts by mass of the pigment, and more preferably 3 to 20 parts by mass. Furthermore, the total content of the pigment derivative and the colorant is preferably 35% by mass or more in the total solids content of the composition, more preferably 40% by mass or more, further preferably 45% by mass or more, and especially preferably 50% by mass or more. The upper limit is preferably 70% by mass or less, and more preferably 65% ​​by mass or less. The composition of the present invention may contain only one pigment derivative, or it may contain two or more. When containing two or more pigment derivatives, the total amount is preferably within the above-mentioned range. By containing two or more pigment derivatives, the dispersion stability of the composition can be further improved. Furthermore, by using pigment derivatives with excellent visible transparency, the color change of the film after heat resistance or light resistance tests can be suppressed, resulting in superior heat resistance and light resistance. Furthermore, by using pigment derivatives with pigment skeletons and pigment derivatives with excellent visibility and transparency, dispersion stability, heat resistance and lightfastness can coexist at a higher level.

[0182] <<Polyalkylimide>> The coloring composition of the first state can also contain polyalkylimide. Polyalkylimide is used, for example, as a dispersing agent for pigments. A dispersing agent is a material used to improve the dispersibility of pigments in a composition. The polyalkylimide is a ring-opening polymer of a polyalkylimide, a polymer having at least a secondary amino group. In addition to the secondary amino group, the polyalkylimide also contains a primary or tertiary amino group. It is preferable that the polyalkylimide has a branched structure containing primary, secondary, and tertiary amino groups respectively. It is preferable that the polyalkylimide has 2 to 6 carbon atoms, more preferably 2 to 4, further preferably 2 or 3, and especially preferably 2.

[0183] The molecular weight of polyalkylimide is preferably 200 or higher, and more preferably 250 or higher. An upper limit of 100,000 or lower is preferred, 50,000 or lower is even better, 10,000 or lower is further preferred, and 2,000 or lower is particularly preferred. Furthermore, regarding the molecular weight of polyalkylimide, if the molecular weight can be calculated from the structural formula, the molecular weight of polyalkylimide is the value calculated from the structural formula. On the other hand, if the molecular weight of a specific amine compound cannot be calculated from the structural formula or is difficult to calculate, the number average molecular weight measured by the boiling point rise method is used. Also, if the boiling point rise method cannot be used or is difficult to measure, the number average molecular weight measured by the viscosity method is used. Also, if the viscosity method cannot be used or is difficult to measure, the number average molecular weight measured by GPC (gel permeation chromatography) and converted to polystyrene is used.

[0184] The amine value of polyalkylimide is preferably 5 mmol / g or higher, more preferably 10 mmol / g or higher, and even more preferably 15 mmol / g or higher.

[0185] Specific examples of polyalkylene imides include ethyleneimine, propyleneimine, 1,2-buteneimine, and 2,3-buteneimine, with ethyleneimine or propyleneimine being preferred, and ethyleneimine being even more preferred. Polyethyleneimine is particularly preferred among polyalkylene imides. Furthermore, relative to the total number of primary, secondary, and tertiary amino groups, polyethyleneimine containing 10 mol% or more of primary amino groups is preferred, 20 mol% or more is even more preferred, and 30 mol% or more is further preferred. Commercially available polyethyleneimine products include Epomin SP-003, SP-006, SP-012, SP-018, SP-200, and P-1000 (all manufactured by NIPPON SHOKUBAI CO.,LTD.).

[0186] The content of polyalkylimide in the total solids composition of the composition is preferably 0.1 to 5% by mass. A lower limit of 0.2% by mass or more is preferred, 0.5% by mass or more is more preferred, and 1% by mass or more is further preferred. An upper limit of 4.5% by mass or less is preferred, 4% by mass or less is more preferred, and 3% by mass or less is further preferred. Furthermore, the content of polyalkylimide relative to 100 parts by mass of pigment is preferably 0.5 to 20 parts by mass. A lower limit of 0.6 parts by mass or more is preferred, 1 part by mass or more is more preferred, and 2 parts by mass or more is further preferred. An upper limit of 10 parts by mass or less is preferred, and 8 parts by mass or less is more preferred. Only one type of polyalkylimide may be used, or two or more types may be used. When two or more types are used, the total amount within the above-mentioned range is preferred.

[0187] <<Hardening Accelerator>> The coloring composition of the first state sample may contain a curing accelerator. Examples of curing accelerators include thiols, hydroxymethyl compounds, amine compounds, phosphonium salts, amidine chlorides, amides, alkane-generating agents, isocyanate compounds, alkoxysilane compounds, and onium salts. Specific examples of curing accelerators include compounds described in paragraphs 0094-0097 of International Patent Application Publication No. 2018 / 056189, compounds described in paragraphs 0246-0253 of Japanese Patent Application Publication No. 2015-034963, compounds described in paragraphs 0186-0251 of Japanese Patent Application Publication No. 2013-041165, and compounds described in Japanese Patent Application Publication No. 2014-055114. Ionic compounds, compounds described in paragraphs 0071-0080 of Japanese Patent Application Publication No. 2012-150180, alkoxysilane compounds with epoxy groups described in Japanese Patent Application Publication No. 2011-253054, compounds described in paragraphs 0085-0092 of Japanese Patent Application No. 5765059, and carboxyl-containing epoxy curing agents described in Japanese Patent Application Publication No. 2017-036379, etc. The content of the curing accelerator in the total solids of the composition is preferably 0.3-8.9% by mass, and more preferably 0.8-6.4% by mass. Only one type of curing accelerator may be used, or two or more types may be used. When two or more types are used, the total amount within the above-mentioned range is preferred.

[0188] <<Ultraviolet Absorbers>> The coloring composition of the first state sample may contain an ultraviolet absorber. Conjugated diene compounds, amino diene compounds, salicylate compounds, benzophenone compounds, benzotriazole compounds, acrylonitrile compounds, hydroxyphenyl triterpenoid compounds, indole compounds, triterpenoid compounds, etc., may be used as ultraviolet absorbers. Specific examples of such compounds include those described in paragraphs 0038 to 0052 of Japanese Patent Application Publication No. 2009-217221, paragraphs 0052 to 0072 of Japanese Patent Application Publication No. 2012-208374, paragraphs 0317 to 0334 of Japanese Patent Application Publication No. 2013-068814, and paragraphs 0061 to 0080 of Japanese Patent Application Publication No. 2016-162946, the contents of which are incorporated herein by reference. Commercially available ultraviolet absorbers include, for example, UV-503 (manufactured by DAITO CHEMICAL CO.,LTD.), the Tinuvin series and Uvinul series manufactured by BASF, and the Sumisorb series manufactured by Sumika Chemtex Company, Limited. Also, as benzotriazole compounds, the MYUA series manufactured by MIYOSHI OIL & FAT CO.,LTD. can be cited (Chemical Industry Daily, February 1, 2016). Furthermore, ultraviolet absorbers can also include compounds described in paragraphs 0049-0059 of Japanese Patent No. 6268967, compounds described in paragraphs 0059-0076 of International Publication No. 2016 / 181987, and thioaryl-substituted benzotriazole type ultraviolet absorbers described in International Publication No. 2020 / 137819. The content of ultraviolet absorber in the total solids component of the composition is preferably 0.01 to 10% by mass, and more preferably 0.01 to 5% by mass. Only one type of ultraviolet absorber may be used, or two or more types may be used. When two or more types are used, the total amount within the above-mentioned range is preferred.

[0189] <<Polymerization Inhibitors>> The coloring composition of the first state sample may contain a polymerization inhibitor. Examples of polymerization inhibitors include hydroquinone, p-methoxyphenol, di-tert-butyl-p-cresol, pyrogallol, tert-butylcatechol, benzoquinone, 4,4'-thiobis(3-methyl-6-tert-butylphenol), 2,2'-methylenebis(4-methyl-6-tert-butylphenol), and N-nitrosophenylhydroxylamine salts (ammonium salts, primary cerium salts, etc.). Among these, p-methoxyphenol is preferred. The content of the polymerization inhibitor in the total solids of the composition is preferably 0.0001 to 5% by mass. Only one polymerization inhibitor may be used, or two or more may be used. When two or more are used, the total amount within the above-mentioned range is preferred.

[0190] <<Silane Coupling Agents>> The first-state colored composition may contain a silane coupling agent. In this invention, the silane coupling agent refers to a silane compound having a hydrolyzable group and other functional groups. Furthermore, the hydrolyzable group refers to a substituent that is directly bonded to a silicon atom and can generate a siloxane bond through at least one of a hydrolysis reaction and a condensation reaction. Examples of hydrolyzable groups include halogen atoms, alkoxy groups, and aceoxy groups, with alkoxy groups being preferred. That is, a silane coupling agent having an alkoxysilyl group is preferred. Furthermore, examples of functional groups other than the hydrolyzable group include vinyl, (meth)allyl, (meth)acrylyl, mercapto, epoxy, oxetyl, amino, urea, thioether, isocyanate, and phenyl groups, with amino, (meth)acrylyl, and epoxy groups being preferred. Specific examples of silane coupling agents include N-β-aminoethyl-γ-aminopropylmethyldimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., product name KBM-602), N-β-aminoethyl-γ-aminopropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., product name KBM-603), N-β-aminoethyl-γ-aminopropyltriethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., product name KBE-602), γ-aminopropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., product name KBM-903), and γ-aminopropyltriethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., product name KBM-903). (e.g., manufactured by Shin-Etsu Chemical Co., Ltd., product name KBE-903), 3-methylpropenoxypropylmethyldimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., product name KBM-502), 3-methylpropenoxypropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., product name KBM-503), etc. Furthermore, specific examples of silane coupling agents include the compounds described in paragraphs 0018 to 0036 of Japanese Patent Application Publication No. 2009-288703 and the compounds described in paragraphs 0056 to 0066 of Japanese Patent Application Publication No. 2009-242604, the contents of which are incorporated herein by reference. The content of silane coupling agent in the total solids composition of the composition is preferably 0.01~15.0% by mass, and more preferably 0.05~10.0% by mass. Only one type of silane coupling agent may be used, or two or more types may be used. When two or more types are used, the total amount within the above range is preferred.

[0191] Antioxidants The colored composition of the first state sample can contain an antioxidant. Examples of antioxidants include phenolic compounds, phosphite compounds, and thioether compounds. As a phenolic compound, any phenolic compound referred to as a phenolic antioxidant can be used. As a preferred phenolic compound, a hindered phenolic compound can be mentioned. Compounds having a substituent at the position adjacent to the phenolic hydroxyl group (ortho position) are preferred. As the aforementioned substituent, substituted or unsubstituted alkyl groups having 1 to 22 carbon atoms are preferred. Furthermore, compounds having both a phenolic group and a phosphite group within the same molecule are also preferred as antioxidants. Additionally, phosphorus-based antioxidants are also preferred. Examples of phosphorus-based antioxidants include tris[2-[[2,4,8,10-tetra(1,1-dimethylethyl)dibenzo[d,f][1,3,2]dioxaphosphonium-heptacyclic-6-yl]oxy]ethyl]amine, tris[2-[(4,6,9,11-tetra-tertiary butyldibenzo[d,f][1,3,2]dioxaphosphonium-heptacyclic-2-yl)oxy]ethyl]amine, and bis(2,4-di-tertiary butyl-6-methylphenyl) ethyl phosphite. Commercially available antioxidants include, for example, ADK STAB AO-20, ADK STAB AO-30, ADK STAB AO-40, ADK STAB AO-50, ADK STAB AO-50F, ADK STAB AO-60, ADK STAB AO-60G, ADK STAB AO-80, and ADK STAB AO-330 (all manufactured by ADEKA Corporation). Furthermore, antioxidants can also include compounds described in paragraphs 0023-0048 of Patent No. 6268967, compounds described in International Publication No. 2017 / 006600, compounds described in International Publication No. 2017 / 164024, and compounds described in Korean Patent Publication No. 10-2019-0059371. The antioxidant content in the total solids component of the composition is preferably 0.01~20% by mass, and more preferably 0.3~15% by mass. Only one type of antioxidant may be used, or two or more types may be used. When two or more types are used, the total amount within the above range is preferred.

[0192] <<Other Ingredients>> The coloring composition of the first state sample may, as needed, contain sensitizers, fillers, thermosetting accelerators, plasticizers, and other additives (e.g., conductive particles, defoamers, flame retardants, leveling agents, peeling accelerators, fragrances, surface tension modifiers, chain transfer agents, etc.). The physical properties of the film can be adjusted by appropriately containing these components. For details regarding these components, please refer to paragraph 0183 onwards in Japanese Patent Application Publication No. 2012-003225 (corresponding to paragraph 0237 of U.S. Patent Application Publication No. 2013 / 0034812), and paragraphs 0101-0104, 0107-0109 of Japanese Patent Application Publication No. 2008-250074, the contents of which are incorporated herein by reference. Furthermore, the coloring composition of the first state sample may, as needed, contain potential antioxidants. As potential antioxidants, examples include compounds in which the site where the antioxidant functions is protected by a protecting group, and which function as antioxidants by removing the protecting group through heating at 100–250°C or heating at 80–200°C in the presence of an acid / base catalyst. Examples of potential antioxidants include compounds described in International Publication No. 2014 / 021023, International Publication No. 2017 / 030005, and Japanese Patent Application Publication No. 2017-008219. Commercially available examples of potential antioxidants include ADEKA ARKLS GPA-5001 (manufactured by ADEKA CORPORATION).

[0193] The coloring composition of the first state sample may contain a lightfastness improver. Examples of lightfastness improvers include compounds described in paragraphs 0036-0037 of Japanese Patent Application Publication No. 2017-198787, compounds described in paragraphs 0029-0034 of Japanese Patent Application Publication No. 2017-146350, compounds described in paragraphs 0036-0037 and 0049-0052 of Japanese Patent Application Publication No. 2017-129774, and compounds described in Japanese Patent Application Publication No. 201... The compounds described in paragraphs 0031-0034 and 0058-0059 of Japanese Patent Application Publication No. 7-129674, the compounds described in paragraphs 0036-0037 and 0051-0054 of Japanese Patent Application Publication No. 2017-122803, the compounds described in paragraphs 0025-0039 of International Publication No. 2017 / 164127, and Japanese Patent Application Publication No. 2017-186546. The compounds described in paragraphs 0034-0047 of Japanese Patent Application Publication No. 2015-025116, the compounds described in paragraphs 0019-0041 of Japanese Patent Application Publication No. 2012-145604, the compounds described in paragraphs 0101-0125 of Japanese Patent Application Publication No. 2012-103475, the compounds described in paragraphs 0018-0021 of Japanese Patent Application Publication No. 2011- The compounds described in paragraphs 0015 to 0018 of Japanese Patent Application Publication No. 257591, the compounds described in paragraphs 0017 to 0021 of Japanese Patent Application Publication No. 2011-191483, the compounds described in paragraphs 0108 to 0116 of Japanese Patent Application Publication No. 2011-145668, and the compounds described in paragraphs 0103 to 0153 of Japanese Patent Application Publication No. 2011-253174, etc.

[0194] From an environmental control perspective, the use of perfluoroalkyl sulfonic acids and their salts, as well as perfluoroalkyl carboxylic acids and their salts, is sometimes regulated. In the compositions of the present invention, while reducing the content of the aforementioned compounds, the content of perfluoroalkyl sulfonic acids (especially perfluoroalkyl sulfonic acids with 6 to 8 carbon atoms) and their salts, and perfluoroalkyl carboxylic acids (especially perfluoroalkyl carboxylic acids with 6 to 8 carbon atoms) and their salts relative to the total solids content of the composition is preferably in the range of 0.01 ppb to 1,000 ppb, more preferably in the range of 0.05 ppb to 500 ppb, and further preferably in the range of 0.1 ppb to 300 ppb. The compositions of the present invention may also substantially not contain perfluoroalkyl sulfonic acids and their salts, as well as perfluoroalkyl carboxylic acids and their salts. For example, by using compounds that can replace perfluoroalkyl sulfonic acids and their salts, and compounds that can replace perfluoroalkyl carboxylic acids and their salts, compositions that substantially do not contain perfluoroalkyl sulfonic acids and their salts can also be selected. As alternatives to regulated compounds, examples include compounds that are removed from the regulated list due to differences in the number of carbon atoms in the perfluoroalkyl group. However, the foregoing does not preclude the use of perfluoroalkyl sulfonic acids and their salts, as well as perfluoroalkyl carboxylic acids and their salts. The compositions of the present invention may also include perfluoroalkyl sulfonic acids and their salts, as well as perfluoroalkyl carboxylic acids and their salts, to the maximum permissible extent.

[0195] [Components of the second state] <<Inorganic Particles>> The composition of the second state contains inorganic particles. Examples of inorganic particles include silicon dioxide particles, titanium oxide particles, strontium titanate particles, barium titanate particles, zinc oxide particles, magnesium oxide particles, zirconium oxide particles, aluminum oxide particles, barium sulfate particles, aluminum hydroxide particles, calcium silicate particles, aluminum silicate particles, and zinc sulfide particles, with silicon dioxide particles being preferred. Compositions using silicon dioxide particles as inorganic particles are preferably used as components for spacer formation.

[0196] Examples of silica particles include silica particles in the form of multiple spherical silica particles connected in a beaded manner, silica particles in the form of multiple spherical silica particles connected in a planar manner, hollow silica particles, and solid silica particles. Commercially available examples of solid silica particles include PL-2L-IPA (manufactured by FUSO CHEMICAL CO., LTD.).

[0197] Considering the ease of forming films with lower refractive indices, silicon dioxide particles in the form of multiple spherical silicon dioxide particles connected in a beaded manner, multiple spherical silicon dioxide particles connected in a planar manner, and hollow silicon dioxide particles are preferred. Multiple spherical silicon dioxide particles connected in a beaded manner and multiple spherical silicon dioxide particles connected in a planar manner are even more preferred. Hereinafter, multiple spherical silicon dioxide particles connected in a beaded manner and multiple spherical silicon dioxide particles connected in a planar manner are collectively referred to as beaded silicon dioxide. Furthermore, multiple spherical silicon dioxide particles connected in a beaded manner can also have a shape consisting of multiple spherical silicon dioxide particles connected in a planar manner.

[0198] Furthermore, in this specification, "spherical" in "spherical silicon dioxide" refers to something that is substantially spherical, and can be deformed within the scope of achieving the effects of the present invention. For example, it also includes a surface with unevenness or a flat shape with a long axis in a specified direction. Also, "a plurality of spherical silicon dioxide connected in a beaded manner" refers to a structure in which a plurality of spherical silicon dioxide are connected to each other in a straight chain and / or branched form. For example, as shown in FIG1, a structure in which a plurality of spherical silicon dioxide 1 are connected to each other by a joint 2 smaller than its outer diameter can be cited. Furthermore, in this invention, the structure of "a plurality of spherical silicon dioxide connected in a beaded manner" includes not only structures connected in a ring shape, but also structures in a chain shape with ends. Also, "a plurality of spherical silicon dioxide connected in a planar manner" refers to a structure in which a plurality of spherical silicon dioxide are connected to each other on approximately the same plane. Furthermore, "roughly in the same plane" not only refers to the case of being in the same plane, but can also mean shifting vertically from the same plane. For example, it can mean shifting vertically within a range of less than 50% of the particle size of spherical silicon dioxide.

[0199] Regarding beaded silica, a ratio of D1 / D2, where the average particle size D1 measured by dynamic light scattering is 3 or higher than the average particle size D2 obtained by the following formula (1), is preferred. There is no particular upper limit for D1 / D2; 1000 or less is preferred, 800 or less is even better, and 500 or less is further preferred. By setting D1 / D2 within such a range, good optical properties can be observed. Furthermore, the value of D1 / D2 in beaded silica is also an indicator of the degree of connection between spherical silica particles. D 2=2720 / S ･･･(1) In the formula, D2 is the average particle size of beaded silica in nm, and S is the specific surface area of ​​beaded silica measured by nitrogen adsorption method in m2 / g.

[0200] The average particle size D2 of the beaded silica can be considered as the average particle size of primary particles of spherical silica. An average particle size D2 of 1 nm or more is preferred, 3 nm or more is even more preferred, 5 nm or more is further preferred, and 7 nm or more is particularly preferred. As an upper limit, 100 nm or less is preferred, 80 nm or less is more preferred, 70 nm or less is further preferred, 60 nm or less is even more preferred, and 50 nm or less is particularly preferred.

[0201] The average particle size D2 can be replaced by the equivalent circle diameter (D0) in the projected image of the spherical portion measured by transmission electron microscopy (TEM). Unless otherwise stated, the average particle size based on the equivalent circle diameter is evaluated by averaging the number of particles of 50 or more.

[0202] The average particle size D1 of the beaded silica can be considered as the number average particle size of secondary particles formed by the aggregation of a plurality of spherical silica particles. Therefore, the relationship D1 > D2 generally holds. An average particle size D1 of 25 nm or more is preferred, 30 nm or more is more preferred, and 35 nm or more is particularly preferred. As an upper limit, 1000 nm or less is preferred, 700 nm or less is more preferred, 500 nm or less is further preferred, and 300 nm or less is particularly preferred.

[0203] The measurement of the average particle size D1 of beaded silica, unless otherwise specified, is performed using a dynamic light scattering particle size distribution measuring device (Nikkiso Co., Ltd. NANOTRAC Wave-EX150 [product name]). The procedure is as follows: A 20 ml sample vial of the beaded silica dispersion is dispensed and diluted with toluene to a solid content concentration of 0.2% by mass. The diluted sample solution is irradiated with 40 kHz ultrasound for 1 minute and then immediately used for testing. Data is collected 10 times using a 2 ml measuring quartz cell at 25°C, and the obtained "number average" is taken as the average particle size. Other detailed conditions are described in JIS Z 8828:2013 "Particle Size Analysis - Dynamic Light Scattering Method" as needed. Five samples are prepared for each level, and the average value is used.

[0204] Regarding beaded silica, it is preferable to connect a plurality of spherical silica particles with an average particle size of 1 to 80 nm via a connecting material. As an upper limit for the average particle size of the spherical silica, 70 nm or less is preferred, 60 nm or less is more preferred, and 50 nm or less is even more preferred. Furthermore, as a lower limit for the average particle size of the spherical silica, 3 nm or more is preferred, 5 nm or more is more preferred, and 7 nm or more is even more preferred. Moreover, in this invention, the average particle size of the spherical silica is determined based on the average particle size calculated from the equivalent circle diameter in the projected image of the spherical portion measured by a transmission electron microscope (TEM).

[0205] As a bonding material for connecting spherical silicon dioxide particles, silicon dioxide containing metal oxides can be cited. Examples of metal oxides include oxides of metals selected from Ca, Mg, Sr, Ba, Zn, Sn, Pb, Ni, Co, Fe, Al, In, Y, and Ti. Examples of silicon dioxide containing metal oxides include reactants and mixtures of these metal oxides and silicon dioxide (SiO₂). For information on bonding materials, please refer to International Publication No. 2000 / 015552, the contents of which are incorporated herein by reference.

[0206] The number of spherical silica particles connected in beaded silica is preferably 3 or more, and even better if it is 5 or more. The upper limit is preferably 1000 or less, even better if it is 800 or less, and further better if it is 500 or less. The number of spherical silica particles connected can be measured using TEM.

[0207] As a beaded silica, the surface of spherical silica can be surface-treated using a substance such as hexamethyldisilazane.

[0208] Silicon dioxide particles can be used in the form of a particle liquid (sol). Examples of media for dispersing silicon dioxide particles include alcohols (e.g., methanol, ethanol, isopropanol), ethylene glycol, glycol ethers (e.g., propylene glycol monomethyl ether), and glycol ether acetates (e.g., propylene glycol monomethyl ether acetate). Solvents A1 and A2, described later, can also be used. A SiO2 concentration of 5–40% by mass is preferred in the particle liquid (sol).

[0209] As a granular liquid of beaded silica, for example, the silica sol described in Japanese Patent No. 4328935 can be used. Furthermore, commercially available products can also be used as granular liquids (sols) of beaded silica. Examples include “SNOWTEX OUP,” “SNOWTEX UP,” “IPA-ST-UP,” “SNOWTEX PS-M,” “SNOWTEX PS-MO,” “SNOWTEX PS-S,” and “SNOWTEX PS-SO” manufactured by Nissan Chemical Industries, Ltd.; “Fine Kata Lloyd F-120” manufactured by Catalysts & Chemicals Industries Company; and “Quartron PL” manufactured by FUSO CHEMICAL CO., LTD.

[0210] Furthermore, commercially available products can also be used for particle liquids of hollow silica particles. For example, "Thrylya 4110" manufactured by JGC Catalysts and Chemicals Ltd. can be cited.

[0211] The content of inorganic particles in the composition is preferably 4% by mass or more, more preferably 6% by mass or more, and even more preferably 7% by mass or more. The upper limit is preferably 15% by mass or less, more preferably 13% by mass or less, and even more preferably 11% by mass or less. Furthermore, the content of inorganic particles in the total solid content of the composition is preferably 20% by mass or more, more preferably 40% by mass or more, even more preferably 50% by mass or more, even more preferably 60% by mass or more, and particularly preferably 70% by mass or more. The upper limit can be set to 99.95% by mass or less, or 99.9% by mass or less, or 99% by mass or less, or 95% by mass or less.

[0212] When silicon dioxide particles are used as inorganic particles, it is preferable that the content of silicon dioxide particles in the composition is 4% by mass or more, more preferably 6% by mass or more, and even more preferably 7% by mass or more. The upper limit is preferably 15% by mass or less, more preferably 13% by mass or less, and even more preferably 11% by mass or less. Furthermore, it is preferable that the content of silicon dioxide particles in the total solid content of the composition is 20% by mass or more, more preferably 40% by mass or more, even more preferably 50% by mass or more, even more preferably 60% by mass or more, and particularly preferably 70% by mass or more. The upper limit can be set to 99.95% by mass or less, or 99.9% by mass or less, or 99% by mass or less, or 95% by mass or less. As long as the content of silicon dioxide particles is within the above range, it is easy to obtain a film with low refractive index, high anti-reflective effect, and defect suppression. Furthermore, in the case where no pattern is formed or the pattern is formed by etching, it is preferable to have a high content of silicon dioxide particles in the total solid composition of the composition, for example, 95% by mass or more is preferable, 97% by mass or more is even more preferable, and 99% by mass or more is even more preferable.

[0213] <<Polysiloxane-based surfactant A (specific polysiloxane-based surfactant)>> The composition of the second state sample contains the aforementioned polysiloxane surfactant A (specific polysiloxane surfactant). As a specific polysiloxane surfactant, examples of specific polysiloxane surfactants that can be contained in the composition of the first state sample will be provided.

[0214] The content of the specific polysiloxane surfactant in the composition is preferably 1 to 1000 ppm by mass. A lower limit of 0.5 ppm by mass or more is preferred, and 1 ppm by mass or more is preferred. An upper limit of 750 ppm by mass or less is preferred, and 500 ppm by mass or less is even more preferred.

[0215] <<Other Surfactants>> The composition of the second state sample may contain surfactants other than specific polysiloxane surfactants (other surfactants). Examples of other surfactants that may be contained in the composition of the first state sample can be provided.

[0216] The content of other surfactants in the composition is preferably below 1000 ppm by mass, more preferably below 500 ppm by mass, and further preferably below 250 ppm by mass. The lower limit can be set to 1 ppm by mass or more, for example. Furthermore, it is preferable that the content of other surfactants is 100 parts by weight or less relative to 100 parts by weight of the specific polysiloxane surfactant, more preferably 50 parts by weight or less, and even more preferably 25 parts by weight or less. The lower limit can be set to 1 part by weight or more, for example. The composition of the second state sample is also preferred as it does not contain other surfactants.

[0217] <<Solvent>> The composition of the second state sample contains a solvent. Examples of solvents include organic solvents and water, with at least an organic solvent being preferred. Examples of organic solvents include aliphatic hydrocarbon solvents, halogenated hydrocarbon solvents, alcohol solvents, ether solvents, ester solvents, ketone solvents, nitrile solvents, amide solvents, sulfide solvents, and aromatic solvents.

[0218] The solvent content in the composition is preferably 70-99% by mass. The upper limit is preferably 93% by mass or less, more preferably 92% by mass or less, and further preferably 90% by mass or less. The lower limit is preferably 75% by mass or more, more preferably 80% by mass or more, and further preferably 85% by mass or more. Only one solvent may be used, or two or more solvents may be used. When two or more solvents are used, the total amount within the above-mentioned range is preferred.

[0219] In the case where the composition of the second state sample contains silicon dioxide particles, it is preferable to use solvent A1, which has a boiling point of 190°C or higher and 280°C or lower, as the solvent. Furthermore, in this specification, the boiling point of the solvent is a value at 1 atmosphere (0.1 MPa).

[0220] Solvent A1 preferably has a boiling point of 200°C or higher, more preferably 210°C or higher, and even more preferably 220°C or higher. Furthermore, solvent A1 preferably has a boiling point of 270°C or lower, and even more preferably 265°C or lower.

[0221] The viscosity of solvent A1 is preferably below 10 mPa·s, more preferably below 7 mPa·s, and even more preferably below 4 mPa·s. From the viewpoint of coatability, the lower limit of the viscosity of solvent A1 is preferably above 1.0 mPa·s, more preferably above 1.4 mPa·s, and even more preferably above 1.8 mPa·s.

[0222] Solvent A1 has a molecular weight of 100 or higher, which is preferred, 130 or higher is even better, 140 or higher is further preferred, and 150 or higher is particularly preferred. From the viewpoint of coatability, a molecular weight of 300 or lower is preferred, 290 or lower is even better, 280 or lower is further preferred, and 270 or lower is particularly preferred.

[0223] The solubility parameter of solvent A1 is preferably 8.5~13.3 (cal / cm³) 0.5. The upper limit is preferably below 12.5 (cal / cm³) 0.5, more preferably below 11.5 (cal / cm³) 0.5, and further preferably below 10.5 (cal / cm³) 0.5. The lower limit is preferably above 8.7 (cal / cm³) 0.5, more preferably above 8.9 (cal / cm³) 0.5, and further preferably above 9.1 (cal / cm³) 0.5. As long as the solubility parameter of solvent A1 is within the above range, high affinity with silicon dioxide particles is obtained, and excellent coating properties are easily achieved. Furthermore, 1 (cal / cm³) 0.5 corresponds to 2.0455 MPa 0.5. Also, the solubility parameter of the solvent is a value calculated using HSPiP.

[0224] Furthermore, in this specification, the solubility parameter of the solvent is the Hansen solubility parameter. Specifically, the value is calculated using the Hansen solubility parameter software "HSPiP 5.0.09".

[0225] Solvent A1 is preferably an aprotic solvent. By using an aprotic solvent as solvent A1, the aggregation of silicon dioxide particles during film formation can be suppressed more effectively.

[0226] Solvent A1 is preferably an ether-based or ester-based solvent, with ester-based solvents being more preferred. Furthermore, the ester-based solvent used as solvent A1 is preferably a compound that does not contain a hydroxyl group or a terminal alkoxy group.

[0227] Considering the need for high affinity with silicon dioxide particles and easy acquisition of excellent coatability, solvent A1 is preferably selected from at least one of alkyl glycol diacetates and cyclic carbonates. Examples of alkyl glycol diacetates include propylene glycol diacetate, 1,4-butanediol diacetate, 1,3-butanediol diacetate, and 1,6-hexanediol diacetate. Examples of cyclic carbonates include propylene carbonate and ethylene carbonate.

[0228] Specific examples of solvent A1 include propylene glycol carbonate (boiling point 240℃), ethylene glycol carbonate (boiling point 260℃), propylene glycol diacetate (boiling point 190℃), dipropylene glycol methyl-n-propyl ether (boiling point 203℃), dipropylene glycol methyl ether acetate (boiling point 213℃), 1,4-butanediol diacetate (boiling point 232℃), 1,3-butanediol diacetate (boiling point 232℃), and 1,6-hexanediol diacetate (boiling point 260℃). Ethylene glycol monoethyl ether acetate (boiling point 217℃), diethylene glycol monobutyl ether acetate (boiling point 247℃), triacetin (boiling point 260℃), diallyl glycol monomethyl ether (boiling point 190℃), diethylene glycol monoethyl ether (boiling point 202℃), dipropylene glycol monopropyl ether (boiling point 212℃), dipropylene glycol monobutyl ether (boiling point 229℃), tripropylene glycol monomethyl ether (boiling point 242℃), tripropylene glycol monobutyl ether (boiling point 274℃), etc.

[0229] The solvent used in the composition of the second state sample preferably contains 3% by mass or more of the aforementioned solvent A1, more preferably 4% by mass or more, and even more preferably 5% by mass or more. Based on this state sample, the effects of the present invention described above are readily and significantly obtained. A maximum of 20% by mass or less is preferred, 15% by mass or less is more preferred, and 12% by mass or less is even more preferred. Based on this state sample, a film with good surface properties is readily obtained. Solvent A1 may be a single type, or two or more types may be used in combination. When the composition of the second state sample contains two or more types of solvent A1, it is preferable that the total amount is within the aforementioned range.

[0230] In the second state sample, it is preferable that the solvent used in the composition also contains solvent A2, which has a boiling point of 110°C or higher but not exceeding 190°C. Based on this state sample, the drying properties of the composition can be moderately improved, effectively suppressing the generation of uneven wavy coating and easily forming a film with good surface properties.

[0231] It is preferable for solvent A2 to have a boiling point of 115°C or higher, more preferably 120°C or higher, and even more preferably 130°C or higher. Furthermore, it is preferable for solvent A2 to have a boiling point of 170°C or lower, and even more preferably 150°C or lower. If the boiling point of solvent A2 is within the above range, the aforementioned effects are more easily and significantly achieved.

[0232] Considering the ease with which the aforementioned effects can be achieved, a molecular weight of solvent A2 of 100 or higher is preferred, 130 or higher is even better, 140 or higher is further preferred, and 150 or higher is exceptionally preferred. From the viewpoint of coatability, a molecular weight of 300 or lower is preferred, 290 or lower is even better, 280 or lower is further preferred, and 270 or lower is exceptionally preferred.

[0233] The solubility parameter of solvent A2 is preferably 9.0~11.4 (cal / cm3) ≤ 0.5. The upper limit is preferably 11.0 (cal / cm3) ≤ 0.5, more preferably 10.6 (cal / cm3) ≤ 0.5, and further preferably 10.2 (cal / cm3) ≤ 0.5. The lower limit is preferably 9.2 (cal / cm3) ≤ 0.5, more preferably 9.4 (cal / cm3) ≤ 0.5, and further preferably 9.6 (cal / cm3) ≤ 0.5. As long as the solubility parameter of solvent A2 is within the above range, high affinity with silicon dioxide particles is obtained, and excellent coating properties are easily achieved. Furthermore, the absolute value of the difference between the solubility parameters of solvent A1 and solvent A2 is preferably 0.01~1.1 (cal / cm3) ≤ 0.5. The upper limit is 0.9 (cal / cm3) below 0.5, which is better; 0.7 (cal / cm3) below 0.5, which is even better; and 0.5 (cal / cm3) below 0.5, which is further better. The lower limit is 0.03 (cal / cm3) above 0.5, which is better; 0.05 (cal / cm3) above 0.5, which is even better; and 0.08 (cal / cm3) above 0.5, which is further better.

[0234] Solvent A2 is preferably selected from at least one of ether solvents and ester solvents, preferably including at least ester solvents, and even more preferably including both ether solvents and ester solvents. Specific examples of solvent A2 include cyclohexanol acetate (boiling point 173°C), dipropylene glycol dimethyl ether (boiling point 175°C), butyl acetate (boiling point 126°C), ethylene glycol monomethyl ether acetate (boiling point 145°C), propylene glycol monomethyl ether acetate (boiling point 146°C), 3-methoxybutyl acetate (boiling point 171°C), propylene glycol monomethyl ether (boiling point 120°C), 3-methoxybutanol (boiling point 161°C), propylene glycol monopropyl ether (boiling point 150°C), propylene glycol monobutyl ether (boiling point 170°C), and ethylene glycol monobutyl ether acetate (boiling point 188°C). Considering the high affinity with silicon dioxide particles and the ease of obtaining excellent coatability, it is preferable to contain at least propylene glycol monomethyl ether acetate.

[0235] When the solvent used in the photosensitive composition of the second state contains solvent A2, the content of solvent A2 relative to 100 parts by mass of solvent A1 is preferably 500 to 5000 parts by mass. The upper limit is preferably 4500 parts by mass or less, more preferably 4000 parts by mass or less, and further preferably 3500 parts by mass or less. The lower limit is preferably 600 parts by mass or more, more preferably 700 parts by mass or more, and further preferably 750 parts by mass or more. Furthermore, the content of solvent A2 in the total solvent is preferably 50% by mass or more, more preferably 60% by mass or more, and further preferably 70% by mass or more. The upper limit is preferably 95% by mass or less, more preferably 90% by mass or less, and further preferably 85% by mass or less. If the content of solvent A2 is within the above range, the effects of the present invention are more easily and significantly obtained. Solvent A2 may be only one type, or two or more types may be used together. When the composition of the second state sample contains two or more solvents A2, it is preferable that the total amount is within the above range.

[0236] Furthermore, it is preferable that the solvents used in the composition of the second state sample contain a total of 62% by mass or more of solvent A1 and solvent A2, more preferably 72% by mass or more, and even more preferably 82% by mass or more. The upper limit can be set to 100% by mass, or 96% by mass or less, or 92% by mass or less.

[0237] It is preferable that the solvent used in the composition of the second state sample also contains at least one solvent A3 selected from methanol, ethanol, and 2-propanol. According to this state sample, high affinity with silicon dioxide particles is obtained, and excellent coatability is easily achieved. When the solvent used in the composition of the second state sample also contains solvent A3, the content of solvent A3 in the total solvent is preferably 0.1 to 10% by mass. The upper limit is preferably 8% by mass or less, more preferably 6% by mass or less, and further preferably 4% by mass or less. The lower limit is preferably 0.3% by mass or more, more preferably 0.5% by mass or more, and further preferably 1% by mass or more. If the content of solvent A3 is within the above range, the above-mentioned effects are more easily and significantly obtained. Solvent A3 may be only one type, or two or more types may be used together. When the composition contains two or more types of solvent A3, it is preferable that the total amount is within the above range.

[0238] It is preferable that the solvent used in the composition of the second state sample also contains water. Based on this state sample, high affinity with silicon dioxide particles is obtained, and excellent coatability is easily achieved. When the solvent used in the composition of the second state sample also contains water, the water content in the total solvent is preferably 0.1 to 5% by mass. The upper limit is preferably 4% by mass or less, more preferably 2.5% by mass or less, and further preferably 1.5% by mass or less. The lower limit is preferably 0.3% by mass or more, more preferably 0.5% by mass or more, and further preferably 1.0% by mass or more. If the water content is within the above range, the above-mentioned effects are more easily and significantly obtained.

[0239] The solvent used in the composition of the second state sample preferably contains solvent A3 and water as described above. This results in high affinity for silicon dioxide particles and facilitates excellent coatability. When the solvent used in the composition of the second state sample contains solvent A3 and water, the total content of solvent A3 and water in the total solvent volume is preferably 0.2 to 15% by mass. The upper limit is preferably 12% by mass or less, more preferably 9% by mass or less, and further preferably 6% by mass or less. The lower limit is preferably 0.4% by mass or more, more preferably 0.7% by mass or more, and further preferably 1.5% by mass or more. If the total content of solvent A3 and water is within the above range, the aforementioned effects are more easily and significantly obtained.

[0240] The solvent used in the composition of the second state sample may also contain solvent A4, which has a boiling point exceeding 280°C. According to this state sample, the drying properties of the composition can be moderately improved, effectively suppressing the generation of uneven wavy coating and easily forming a film with good surface properties. It is preferable that the upper limit of the boiling point of solvent A4 is below 400°C, more preferably below 380°C, and further preferably below 350°C. It is preferable that solvent A4 is selected from at least one of ether-based solvents and ester-based solvents. Specific examples of solvent A4 include polyethylene glycol monomethyl ether. When the solvent used in the composition of the second state sample also contains solvent A4, it is preferable that the content of solvent A4 in the total solvent is 0.5 to 15% by mass. It is preferable that the upper limit is below 10% by mass, more preferably below 8% by mass, and further preferably below 6% by mass. It is preferable that the lower limit is 1% by mass or more, more preferably 1.5% by mass or more, and further preferably 2% by mass or more. Furthermore, it is preferable that the solvent used in the composition of the second state sample is substantially free of solvent A4. Moreover, substantially free of solvent A4 means that the content of solvent A4 in the total solvent is 0.1% by mass or less, preferably 0.05% by mass or less, further preferably 0.01% by mass or less, and absolutely free of it is even more preferable.

[0241] The solvent used in the composition of the second state sample may contain solvents A1, A2, A3, and A4 as well as solvents other than water (other solvents), but it is preferable that it does not contain other solvents. Furthermore, "not containing other solvents" means that the content of other solvents in the total amount of solvent is less than 0.1% by mass, preferably less than 0.05% by mass, further preferably less than 0.01% by mass, and even more preferably not at all.

[0242] Regarding the solvent used in the composition of the second state sample, it is preferable that the content of compounds with a molecular weight (weight average molecular weight in the case of polymers) exceeding 300 is 10% by mass or less, more preferably 8% by mass or less, further preferably 5% by mass or less, even more preferably 3% by mass or less, and especially preferably 1% by mass or less. Based on this state sample, it is easy to obtain films with superior coatability and excellent surface properties.

[0243] Regarding the solvent used in the composition of the second state sample, it is preferable that the content of the compound with a viscosity exceeding 10 mPa·s at 25°C is 10% by mass or less, more preferably 8% by mass or less, further preferably 5% by mass or less, even more preferably 3% by mass or less, and especially preferably 1% by mass or less. Based on this state sample, it is easy to obtain films with superior coatability and excellent surface properties.

[0244] <<Hardening Compounds>> The composition of the second state sample may contain a curing compound. Examples of curing compounds include resins or polymeric monomers, which are materials that can be included in the composition of the first state sample. It is preferable that the curing compound contains a resin.

[0245] The content of the curing compound in the composition is preferably 0.01% by mass or more, more preferably 0.05% by mass or more, and even more preferably 0.1% by mass or more. The upper limit is preferably 10% by mass or less, more preferably 5% by mass or less, and even more preferably 3% by mass or less. Furthermore, the content of the curing compound in the total solids component of the composition is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, and even more preferably 1% by mass or more. The upper limit is preferably 30% by mass or less, more preferably 20% by mass or less, and even more preferably 10% by mass or less. Only one type of curing compound may be used, or two or more types may be used. When two or more types are used, the total amount within the above-mentioned range is preferred. The composition of the second state sample is preferably free of polymerizable monomers. Based on this state sample, films with lower refractive indices are easily formed. Furthermore, films with low haze are readily formed.

[0246] <<Photopolymerization Initiators>> The composition of the second state sample may contain a photopolymerization initiator. Examples of photopolymerization initiators that may be contained in the composition of the first state sample can be described.

[0247] The content of photopolymerization initiator in the composition is preferably 0.1% by mass or more, more preferably 0.2% by mass or more, and further preferably 0.5% by mass or more. The upper limit is preferably 10% by mass or less, more preferably 5% by mass or less, and more preferably 3% by mass or less. Furthermore, the content of photopolymerization initiator in the total solids content of the composition is preferably 1% by mass or more, more preferably 2% by mass or more, and further preferably 5% by mass or more. The upper limit is preferably 30% by mass or less, more preferably 25% by mass or less, and more preferably 20% by mass or less. Only one type of photopolymerization initiator may be used, or two or more types may be used. When two or more types are used, the total amount within the above-mentioned range is preferred. The composition of the second state sample is preferably free of photopolymerization initiator. Based on this state sample, films with lower refractive index are easily formed. Furthermore, films with low haze are readily formed.

[0248] <<Silane Coupling Agents>> The composition of the second state sample may contain a silane coupling agent. Examples of silane coupling agents that may be contained in the composition of the first state sample can be cited as examples.

[0249] The content of silane coupling agent in the total solids composition of the composition is preferably 0.001% by mass or more, more preferably 0.01% by mass or more, and particularly preferably 0.1% by mass or more. The upper limit is preferably 20% by mass or less, more preferably 10% by mass or less, and particularly preferably 5% by mass or less. Only one type of silane coupling agent may be used, or two or more types may be used. When two or more types are used, the total amount within the above-mentioned range is preferred. It is preferable that the composition of the second state sample does not contain a silane coupling agent.

[0250] <<Black Pigment>> The composition of the second state sample may contain a black pigment. As a black pigment, materials that can be contained in the composition of the first state sample can be described as examples.

[0251] The content of black pigment in the total solids of the composition is preferably below 10% by mass, even better below 5% by mass, and particularly good below 1% by mass. It is also preferable that the composition of the second state sample does not substantially contain black pigment. Furthermore, the situation where the composition does not substantially contain black pigment means that the content of black pigment in the total solid component of the composition is preferably less than 0.1% by mass and less than 0.05% by mass, and even more preferably, it does not contain black pigment at all.

[0252] <<Color color materials>> The composition of the second state sample may contain colored pigments. As examples of colored pigments, materials that can be contained in the composition of the first state sample can be described.

[0253] The content of colored pigment in the total solids of the composition is preferably below 10% by mass, even better below 5% by mass, and especially good below 1% by mass. It is also preferable that the composition of the second state sample does not substantially contain colored pigments. Furthermore, the situation where the composition does not substantially contain colored pigments means that the content of colored pigments in the total solid components of the composition is preferably less than 0.1% by mass and less than 0.05% by mass, and even more preferably, it does not contain colored pigments at all.

[0254] <<Other Ingredients>> The composition of the second state sample may, as needed, contain ultraviolet absorbers, antioxidants, potential antioxidants, polymerization inhibitors, sensitizers, fillers, thermosetting accelerators, plasticizers, and other additives (e.g., conductive particles, defoamers, flame retardants, leveling agents, peeling accelerators, fragrances, surface tension modifiers, chain transfer agents, etc.). Examples of materials that may be included in the composition of the first state sample described above will be explained.

[0255] <Containment Container> There are no particular limitations on the container used as a component of the present invention, and known containers can be used. Furthermore, as a container, for the purpose of suppressing the mixing of impurities into the raw materials or coloring components, it is preferable to use a multi-layered bottle with an inner wall composed of six layers of six different resins, or a bottle with a seven-layer structure of the six resins. For example, the container described in Japanese Patent Application Publication No. 2015-123351 can be cited as such a container. Furthermore, for the purposes of preventing metal from leaching from the inner wall of the container, improving the storage stability of the components, or suppressing component deterioration, it is preferable to make the inner wall of the container out of glass or stainless steel.

[0256] <Manufacturing Method of Components> The composition of the present invention can be manufactured by mixing the aforementioned components. When manufacturing the composition, all components can be dissolved and / or dispersed in a solvent simultaneously, or the components can be appropriately prepared as two or more solutions or dispersions and mixed during use (coating) to manufacture the composition.

[0257] Furthermore, processes that include pigment dispersion are preferred during the manufacturing of the composition. Examples of mechanical forces used for pigment dispersion in these processes include compression, extrusion, impact, shearing, and cavitation. Specific examples of such processes include bead milling, sand milling, roller milling, ball milling, paint mixing, microjet milling, high-speed impeller milling, sand mixing, jet mixing, high-pressure wet microparticle formation, and ultrasonic dispersion. In the pulverization of pigments using sand milling (bead milling), it is preferable to improve pulverization efficiency by using small-diameter microspheres and increasing the microsphere filling rate. Furthermore, it is preferable to remove coarse particles after pulverization by filtration, centrifugation, or other methods. Furthermore, regarding the process and dispersing machine for dispersing pigments, the processes and dispersing machines described in "Complete Collection of Dispersion Technology, JOHOKIKO CO.,LTD., July 15, 2005" or "Comprehensive Data Collection on Dispersion Technology and Practical Industrial Applications Centered on Suspension (Solid / Liquid Dispersion Systems), Business Development Center Publishing Department, October 10, 1978" and paragraph 0022 of Japanese Patent Application Publication No. 2015-157893 are preferred. Also, in the process of dispersing pigments, particle refinement can be achieved through a salt milling step. For example, the raw materials, equipment, and processing conditions used in the salt milling step can be found in Japanese Patent Application Publication Nos. 2015-194521 and 2012-046629. Zirconia, agate, quartz, titanium dioxide, tungsten carbide, silicon nitride, alumina, stainless steel, glass, or combinations thereof can be used as microbeads for dispersion. Inorganic compounds with a Mohs hardness of 2 or higher can also be used. The composition may contain 1 to 10,000 ppm of the aforementioned microbeads.

[0258] When manufacturing the composition of the present invention, it is preferable to filter the composition using a filter in order to remove impurities or reduce defects. As for the filter, any filter that has been used for filtration purposes can be used without particular limitation. Examples include filters using materials such as fluoropolymers like polytetrafluoroethylene (PTFE) and polyvinylidene fluoride (PVDF), polyamide resins like nylon (e.g., nylon-6, nylon-6,6), polyolefin resins like polyethylene and polypropylene (PP) (including high-density and ultra-high molecular weight polyolefin resins). Among these materials, polypropylene (including high-density polypropylene) and nylon are preferred.

[0259] A filter pore size of 0.01~7.0μm is preferred, 0.01~3.0μm is more preferred, and 0.05~0.5μm is even more preferred. As long as the filter pore size is within the above range, fine impurities can be removed more reliably. For filter pore size values, please refer to the filter manufacturer's specifications. Various filters supplied by NIHON PALL Corporation (DFA4201NXEY, DFA4201NAEY, DFA4201J006P, etc.), Advantec Toyo Kaisha, Ltd., Nihon Entegris KK (Formerly Nippon Mykrolis Corporation), and KITZ MICROFILTER Corporation can be used.

[0260] Furthermore, fibrous filter media are preferred for use as filters. Examples of fibrous filter media include polypropylene fiber, nylon fiber, and glass fiber. Commercially available products include the SBP series (SBP008, etc.), TPR series (TPR002, TPR005, etc.), and SHPX series (SHPX003, etc.) manufactured by ROKI TECHNO CO.,LTD.

[0261] When using filters, different filters can be combined (e.g., a first filter and a second filter). Filtration can then be performed once or more than once using each filter. Furthermore, filters with different pore sizes can be combined within the aforementioned range. Alternatively, the first filter can be used only for filtration of the dispersion, and after mixing other components, the second filter can be used for further filtration. Moreover, filters can be appropriately selected based on the hydrophilicity / hydrophobicity of the components.

[0262] <membrane> The membrane of the present invention is a membrane obtained from the compositions of the present invention described above. The membrane of the present invention can be used in color filters, near-infrared transmission filters, near-infrared cutoff filters, and other light filters. Furthermore, the membrane of the present invention can also be used in light-shielding films, partitions, etc.

[0263] The thickness of the membrane of the present invention can be appropriately adjusted according to the purpose. For example, a membrane thickness of 20 μm or less is preferred, 10 μm or less is more preferred, and 5 μm or less is even more preferred. A lower limit of 0.1 μm or more is preferred, 0.2 μm or more is more preferred, and 0.3 μm or more is even more preferred.

[0264] When the film of the present invention is used as a color filter, it is preferable that the film has a green, red, blue, cyan, magenta, or yellow hue. Furthermore, the film of the present invention can be preferably used as a colored pixel in a color filter. Examples of colored pixels include red pixels, green pixels, blue pixels, magenta pixels, cyan pixels, and yellow pixels.

[0265] When the membrane of the present invention is used as a near-infrared cutoff filter, it is preferable that the maximum absorption wavelength of the membrane is in the wavelength range of 700 to 1800 nm, more preferably in the wavelength range of 700 to 1300 nm, and even more preferably in the wavelength range of 700 to 1100 nm. Furthermore, it is preferable that the transmittance of the membrane in all wavelength ranges of 400 to 650 nm is 70% or more, more preferably 80% or more, and even more preferably 90% or more. Furthermore, it is preferable that the transmittance of the membrane at at least one point in the wavelength range of 700 to 1800 nm is 20% or less. Furthermore, it is preferable that the ratio of absorbance Amax at the maximum absorption wavelength to absorbance A550 at a wavelength of 550 nm, i.e., absorbance Amax / absorbance A550, is 20 to 500, more preferably 50 to 500, even more preferably 70 to 450, and particularly preferably 100 to 400.

[0266] When the membrane of the present invention is used as a near-infrared transmission filter, it is preferable that the membrane of the present invention has any one of the following spectral characteristics (i1) to (i5). (i1): A filter with a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10%) in the wavelength range of 400-640 nm and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 800-1500 nm. A film with these equal beam-splitting characteristics can block light in the wavelength range of 400-640 nm while allowing light exceeding wavelength 750 nm to pass through. (i2): A filter with a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10%) in the wavelength range of 400-750 nm and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 900-1500 nm. A film with these equal beam-splitting characteristics can block light in the wavelength range of 400-750 nm while allowing light exceeding wavelength 850 nm to pass through. (i3): A filter with a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10%) in the wavelength range of 400-830 nm and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 1000-1500 nm. A film with these equal beam-splitting characteristics can block light in the wavelength range of 400-830 nm while allowing light exceeding 950 nm to pass through. (i4): A filter with a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10%) in the wavelength range of 400-950 nm and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 1100-1500 nm. A film with these equal beam-splitting characteristics can block light in the wavelength range of 400-950 nm while allowing light exceeding wavelength 1050 nm to pass through. (i5): A filter with a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10%) in the wavelength range of 400 to 1050 nm and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 1200 to 1500 nm. A film with these equal beam-splitting characteristics can block light in the wavelength range of 400 to 1050 nm while allowing light exceeding wavelength 1150 nm to pass through.

[0267] When the film of the present invention is used as a light-shielding film, it is preferable that the optical density (OD) per 1.5 μm film thickness in the wavelength region of 400 to 1100 nm is 2.5 or more, and more preferably 3.0 or more. There is no particular upper limit, but it is generally preferred to be 10 or less. Furthermore, it is preferable for the reflectivity of the aforementioned film to be less than 8%, even better if it is less than 6%, and further preferably less than 4%. A lower limit of 0% or higher is preferred.

[0268] Light-shielding films can be used in portable devices such as personal computers, tablets, mobile phones, smartphones, and digital cameras; OA (Office Automation) equipment such as printing multifunction printers and scanners; industrial equipment such as surveillance cameras, barcode readers, automated teller machines (ATMs), high-speed cameras, and devices with facial recognition or biometric authentication functions; automotive camera equipment; medical camera equipment such as endoscopes, capsule endoscopes, and catheters; and space equipment such as biometric sensors, biosensors, military reconnaissance cameras, stereoscopic mapping cameras, meteorological and marine observation cameras, land resource exploration cameras, and space astronomy and deep-space target exploration cameras; and filters and modules used in these applications. Furthermore, light-shielding films can also be used in applications such as micro-LEDs (Light Emitting Diodes) and micro-OLEDs (Organic Light Emitting Diodes). Examples of micro-LEDs and micro-OLEDs include those described in Japanese Patent Application Publication No. 2015-500562 and Japanese Patent Application Publication No. 2014-533890. Furthermore, light-shielding films can also be used in quantum dot sensors. Examples of quantum dot sensors include those described in U.S. Patent Application Publication No. 2012 / 37789 and International Patent Application Publication No. 2008 / 131313.

[0269] When the membrane of the present invention is used as a partition, it is preferable that the refractive index of the membrane for light with a wavelength of 633 nm is 1.4 or less, more preferably 1.35 or less, further preferably 1.3 or less, and even more preferably 1.27 or less. Furthermore, the above-mentioned refractive index values ​​are values ​​measured at a temperature of 25°C.

[0270] <Membrane Manufacturing Methods> The film of the present invention can be manufactured by coating the components of the present invention onto a support. The method for manufacturing the film further includes a patterning step. Examples of patterning methods include photolithography and dry etching, with photolithography being preferred.

[0271] The pattern formation based on photolithography preferably includes the following steps: forming a composition layer on a support using the composition of the present invention; exposing the composition layer in a patterned manner; and developing to remove the unexposed portions of the composition layer to form a pattern. Depending on the need, a baking step (pre-baking step) of the composition layer and a baking step (post-baking step) of the developed pattern may also be provided.

[0272] In the step of forming the composition layer, the composition of the present invention is used to form the composition layer on a support. There are no particular limitations on the support, and it can be appropriately selected according to the application. Examples include glass substrates and silicon substrates, with silicon substrates being preferred. Furthermore, charge-coupled devices (CCDs), complementary metal-oxide-semiconductor (CMOS) films, transparent conductive films, etc., can be formed on the silicon substrate. Also, sometimes a black matrix is ​​formed on the silicon substrate to isolate each pixel. Furthermore, in order to improve adhesion to the upper layer, prevent material diffusion, or planarize the substrate surface, a base layer can be provided on the silicon substrate.

[0273] As a coating method for the constituent material, known methods can be used. Examples include drop casting; slot coating; spraying; roller coating; spin coating; cast coating; slot spin coating; pre-wetting (e.g., the method described in Japanese Patent Application Publication No. 2009-145395); inkjet printing (e.g., on-demand, piezoelectric, thermal), nozzle jetting and other ejection systems; flexographic printing, screen printing, gravure printing, reverse offset printing, metal mask printing and other various printing methods; transfer methods using molds, etc.; nanoimprinting, etc. There are no particular limitations on the application methods in inkjet printing. For example, the methods described in "Inkjet Printing That Can Be Promoted and Used - Infinite Possibilities Appearing in Patents - Published February 2005, Sumitbe Techon Research Co., Ltd." (especially pages 115-133) or those described in Japanese Patent Application Publication Nos. 2003-262716, 2003-185831, 2003-261827, 2012-126830, and 2006-169325 can be cited. Furthermore, regarding the coating methods of the composition, please refer to International Publication Nos. 2017 / 030174 and 2017 / 018419, the contents of which are incorporated in this specification.

[0274] The constituent layer formed on the support can be dried (pre-baked). When the film is manufactured using a low-temperature process, pre-baking is not necessary. When pre-baking is performed, a pre-baking temperature of 150°C or below is preferred, 120°C or below is more preferred, and 110°C or below is even more preferred. The lower limit can be set to, for example, 50°C or above, or 80°C or above. A pre-baking time of 10–300 seconds is preferred, 40–250 seconds is more preferred, and 80–220 seconds is even more preferred. Pre-baking can be performed using a heating plate, oven, or similar equipment.

[0275] Next, the substrate layer is exposed in a pattern (exposure step). For example, using a stepper or scanning exposure machine, the substrate layer is exposed through a mask with a predetermined mask pattern, thereby enabling patterned exposure. This allows the exposed areas to harden.

[0276] Examples of radiation (light) that can be used during exposure include gamma rays and i-rays. Light with wavelengths below 300 nm can also be used (preferably light with wavelengths of 180-300 nm). Examples of light with wavelengths below 300 nm include KrF rays (wavelength 248 nm) and ArF rays (wavelength 193 nm), with KrF rays (wavelength 248 nm) being preferred. Furthermore, light sources with wavelengths above 300 nm can also be used.

[0277] Furthermore, during exposure, exposure can be performed by continuous illumination or by pulsed illumination (pulse exposure). Moreover, pulse exposure is an exposure method that involves repeatedly illuminating and pausing light for short periods of time (e.g., less than milliseconds).

[0278] The irradiation dose (exposure dose) is preferably 0.03~2.5 J / cm², and even better is 0.05~1.0 J / cm². Regarding the oxygen concentration during exposure, it can be appropriately selected. Besides exposure under atmospheric conditions, it can be performed in a low-oxygen environment with an oxygen concentration of less than 19% (e.g., 15% vol%, 5% vol%, or virtually oxygen-free), or in a high-oxygen environment with an oxygen concentration exceeding 21% (e.g., 22% vol%, 30% vol%, or 50% vol%). Furthermore, the exposure illuminance can be appropriately set, typically within the range of 1000 W / m² to 100000 W / m² (e.g., 5000 W / m², 15000 W / m², or 35000 W / m²). Oxygen concentration and exposure illuminance can be appropriately combined, for example, it can be set to an oxygen concentration of 10% by volume and an illuminance of 10,000 W / m², or an oxygen concentration of 35% by volume and an illuminance of 20,000 W / m², etc.

[0279] Next, the unexposed portions of the constituent layer are removed by development to form a pattern. The removal of the unexposed portions of the constituent layer can be performed using a developing solution. Here, the unexposed portions of the constituent layer from the exposure step dissolve in the developing solution, leaving only the photocured portion. The temperature of the developing solution is preferably 20-30°C. The development time is preferably 20-180 seconds. Furthermore, to improve residue removal, the step of repeatedly discarding the developing solution every 60 seconds and then supplying fresh developing solution can be repeated several times.

[0280] Developers can include organic solvents and alkaline developers, with alkaline developers being preferred. An alkaline aqueous solution (alkaline developer) obtained by diluting an alkaline agent with pure water is preferred. Examples of alkaline agents include, for example, organic alkaline compounds such as ammonia, ethylamine, diethylamine, dimethylethanolamine, diglycolamine, hydroxylamine, ethylenediamine, tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrapropylammonium hydroxide, tetrabutylammonium hydroxide, ethyltrimethylammonium hydroxide, benzyltrimethylammonium hydroxide, dimethylbis(2-hydroxyethyl)ammonium hydroxide, choline, pyrrole, piperidine, and 1,8-diazabicyclo-[5.4.0]-7-undecene, or inorganic alkaline compounds such as sodium hydroxide, potassium hydroxide, sodium carbonate, sodium bicarbonate, sodium silicate, and sodium metasilicate. From an environmental and safety perspective, compounds with high molecular weights are preferred as alkaline agents. The concentration of the alkaline agent in the alkaline aqueous solution is preferably 0.001~10% by mass, and more preferably 0.01~1% by mass. Furthermore, the developer may further contain surfactants. From the viewpoint of convenient transportation or storage, the developer can be temporarily prepared as a concentrated solution and diluted to the required concentration before use. There is no particular limitation on the dilution ratio; for example, it can be set in the range of 1.5~100 times. Furthermore, rinsing with pure water after development is also preferable. Furthermore, rinsing is preferably performed by rotating the support on which the developed composition layer has formed while supplying rinsing solution to the developed composition layer. Furthermore, it is also preferable to perform rinsing by moving the nozzle dispensing the rinsing solution from the center of the support to the periphery of the support. In this case, when moving the nozzle from the center of the support to the periphery, the moving speed of the nozzle can be gradually reduced. By performing rinsing in this manner, in-plane deviation during rinsing can be suppressed. Alternatively, the same effect can be achieved by gradually reducing the rotational speed of the support while moving the nozzle from the center to the periphery of the support.

[0281] After development, drying followed by additional exposure and heating (post-baking) is preferable. This additional exposure and post-baking is a post-development curing process used to produce a fully cured film. The heating temperature during post-baking is preferably 100-240°C, and more preferably 200-240°C. The developed film can be post-baked continuously or intermittently using heating mechanisms such as heating plates, convection ovens (hot air circulating dryers), or high-frequency heaters, in accordance with the above conditions. When performing additional exposure, light with a wavelength of 400 nm or less is preferable. Furthermore, the additional exposure can be performed using the method described in Korean Patent Publication No. 10-2017-0122130.

[0282] The preferred method for forming patterns by dry etching includes the following steps: forming a composition layer on a support using the composition of the present invention, and hardening the entire composition layer to form a hardened layer; forming a photoresist layer on the hardened layer; exposing the photoresist layer in a patterned manner, followed by development to form a resist pattern; and using the resist pattern as a mask to perform dry etching on the hardened layer using an etching gas. It is preferable to further perform a pre-baking process when forming the photoresist layer. In particular, it is preferable to perform a post-exposure heating process and a post-development heating process (post-baking process) as the photoresist layer formation process. For details on forming patterns by dry etching, please refer to paragraphs 0010 to 0067 of Japanese Patent Application Publication No. 2013-064993, which is incorporated herein by reference.

[0283] <Structure> Next, the structure of the present invention will be described using drawings. FIG2 is a side sectional view showing one embodiment of the structure of the present invention, and FIG3 is a top view viewed from the top of the support in the same structure. As shown in FIG2 and FIG3, the structure 100 of the present invention has a support 11, a partition 12 disposed on the support 11, and pixels 14 disposed on the support 11 and divided into regions by the partition 12. Examples of pixels include colored pixels, transparent pixels, pixels of near-infrared transmission filter layers, and pixels of near-infrared cutoff filter layers. Examples of colored pixels include red pixels, green pixels, blue pixels, magenta pixels, cyan pixels, and yellow pixels.

[0284] In the structure of the present invention, the type of support 11 is not particularly limited. Substrates used in various electronic devices such as solid-state imaging elements (silicon wafers, silicon carbide wafers, silicon nitride wafers, sapphire wafers, glass wafers, etc.) can be used. Furthermore, substrates for solid-state imaging elements with photodiodes formed on them can also be used. Additionally, a base layer can be provided on these substrates as needed; this base layer is used to improve adhesion to the upper layer, prevent material diffusion, or planarize the surface.

[0285] As shown in Figures 2 and 3, partitions 12 are formed on the support 11. In this embodiment, as shown in Figure 3, in the top view viewed from directly above the support 11, the partitions 12 are formed in a grid pattern. Furthermore, in this embodiment, the shape of the area divided by the partitions 12 on the support 11 (hereinafter also referred to as the shape of the opening of the partition) is square, but the shape of the opening of the partition is not particularly limited, and can be, for example, rectangular, circular, elliptical, or polygonal.

[0286] The partition 12 can be formed using the composition of the present invention (preferably the composition of the second state). Specifically, it can be formed by a step of forming a composition layer using the composition of the present invention and a step of forming a pattern on the composition layer by photolithography or dry etching.

[0287] The width W1 of the adjacent 12 is preferably 20~500nm. The lower limit is preferably above 30nm, above 40nm is better, and above 50nm is even better. The upper limit is preferably below 300nm, below 200nm is better, and below 100nm is even better. Furthermore, a height H1 of 12 is preferably 200nm or more, better 300nm or more, and even better 400nm or more. The upper limit is preferably less than 200% of the thickness of 14, better than 150% of the thickness of 14, and practically the same as the thickness of 14 is even better. The height-to-width ratio (height / width) of the adjacent 12 is preferably 1~100, 5~50 is even better, and 5~30 is even better.

[0288] Pixels 14 are formed on the support 11 in a region (the opening of the partition) divided by the partition 12.

[0289] The width L1 of pixel 14 can be appropriately selected according to the application. For example, 500~2000nm is preferred, 500~1500nm is better, and 500~1000nm is even better. The height (thickness) H2 of pixel 14 can be appropriately selected according to the application. For example, 300~1000nm is preferred, 300~800nm ​​is more preferred, and 300~600nm is even more preferred. Also, it is preferred that the height H2 of pixel 14 is 50~150% of the height H1 of the neighboring pixel 12, 70~130% is more preferred, and 90~110% is even more preferred.

[0290] In the structure of the present invention, it is preferable to provide a protective layer on the surface of the partition wall. By providing a protective layer on the surface of the partition wall 12, the adhesion between the partition wall 12 and the pixel 14 can be improved. Various inorganic or organic materials can be used as the material for the protective layer. Examples of organic materials include acrylic resins, polystyrene resins, polyimide resins, and organic SOG (Spin On Glass) resins. Furthermore, it is also possible to use a composition containing compounds having groups containing ethylene unsaturated bonds.

[0291] The structure of the present invention can be preferably used as a filter, an optical sensor, an image display device, etc.

[0292] <Filter> The filter of the present invention has the film of the present invention as described above. Examples of filters include color filters, near-infrared transmission filters, and near-infrared cutoff filters, with color filters being preferred. As a color filter, the colored pixel having the film of the present invention is preferred. Furthermore, the filter can also have the following structure: each pixel is embedded in a space separated by partitions, such as a grid. Furthermore, the filter can have a light-shielding film. For example, a color filter, a near-infrared transmission filter, or a near-infrared cutoff filter can be formed at the opening of the light-shielding film formed on the support. The filter of the present invention can be used in optical sensors such as solid-state imaging elements or image display devices.

[0293] In the filter, the film thickness of the film of the present invention can be appropriately adjusted according to the purpose. It is preferable that the film thickness of the pixels included in the filter is 5 μm or less, more preferably 1 μm or less, and further preferably 0.6 μm or less. It is preferable that the lower limit of the film thickness is 0.1 μm or more, more preferably 0.2 μm or more, and further preferably 0.3 μm or more.

[0294] The width of the pixels included in the filter is preferably 0.4~10.0μm. A lower limit of 0.4μm or more is preferred, 0.5μm or more is better, and 0.6μm or more is further preferred. An upper limit of 5.0μm or less is preferred, 2.0μm or less is better, 1.0μm or less is further preferred, and 0.8μm or less is even more preferred. Furthermore, the Young's modulus of the pixels is preferably 0.5~20GPa, and 2.5~15GPa is more preferred.

[0295] The pixels included in the filter preferably have high flatness. Specifically, a pixel surface roughness Ra of 100 nm or less is preferred, 40 nm or less is even better, and 15 nm or less is further preferred. There is no specified lower limit, but for example, 0.1 nm or more is preferred. The pixel surface roughness can be measured, for example, using a Veeco AFM (Atomic Force Microscope) Dimension 3100. Furthermore, the water contact angle on the pixel can be appropriately set to a preferred value, typically in the range of 50 to 110°. The contact angle can be measured, for example, using a contact angle meter CV-DT･A type (manufactured by Kyowa Interface Science Co., LTD.). Also, a high pixel volume resistivity is preferred. Specifically, a pixel volume resistivity of 10⁹ Ω･cm or more is preferred, and 10¹¹ Ω･cm or more is even better. There is no specified upper limit, but for example, 10¹⁴ Ω･cm or less is preferred. The volume resistivity of a pixel can be measured using an ultra-high resistance meter 5410 (manufactured by Advantest Corporation).

[0296] Furthermore, when the filter includes a light-shielding film, it is preferable that the film thickness is 5 μm or less, and even more preferable that it is 2.5 μm or less. It is preferable that the film thickness is 0.1 μm or more, even more preferable that it is 0.5 μm or more, and even more preferable that it is 1 μm or more.

[0297] In the filter, a protective layer can be provided on the surface of the membrane of the present invention. By providing a protective layer, various functions can be imparted, such as oxidation resistance, low reflectivity, hydrophilicity / hydrophobicity, and shielding of light of specific wavelengths (ultraviolet, near-infrared, etc.). The thickness of the protective layer is preferably 0.01 to 10 μm, and more preferably 0.1 to 5 μm. Examples of methods for forming the protective layer include methods of coating a composition for forming a protective layer, chemical vapor deposition, and methods of attaching the molded resin with an adhesive material. Examples of components constituting the protective layer include (meth)acrylic resin, olefin-thiol resin, polycarbonate resin, polyether resin, polyaryl ester resin, polyurethane resin, polyetherurethane resin, polystyrene resin, polyaryl ether phosphine oxide resin, polyimide resin, polyamide-amide resin, polyolefin resin, cyclic olefin resin, polyester resin, styrene resin, polyol resin, polyvinylidene chloride resin, melamine resin, polyurethane resin, aromatic polyamide resin, polyamide resin, alkyd resin, epoxy resin, modified polysiloxane resin, fluoropolymer resin, polyacrylonitrile resin, cellulose resin, Si, C, W, Al₂O₃, Mo, SiO₂, Si₂N₄, etc., and may contain two or more of these components. For example, in the case of a protective layer used for oxidation inhibition, it is preferable that the protective layer contains polyol resin, SiO₂, and Si₂N₄. Furthermore, in the case of a protective layer used for low reflectivity, it is preferable that the protective layer contains (meth)acrylic resin and fluoropolymer.

[0298] Depending on the requirements, the protective layer may contain additives such as organic / inorganic microparticles, absorbers for specific wavelengths of light (e.g., ultraviolet, near-infrared, etc.), refractive index modifiers, antioxidants, adhesives, and surfactants. Examples of organic / inorganic microparticles include polymeric microparticles (e.g., polysiloxane microparticles, polystyrene microparticles, melamine resin microparticles), titanium dioxide, zinc oxide, zirconium oxide, indium oxide, aluminum oxide, titanium nitride, titanium oxynitride, magnesium fluoride, hollow silica, silicon dioxide, calcium carbonate, and barium sulfate. Known absorbers can be used for the specific wavelengths of light. The content of these additives can be appropriately adjusted, but 0.1 to 70% by mass relative to the total mass of the protective layer is preferred, and 1 to 60% by mass is further preferred.

[0299] Furthermore, as a protective layer, the protective layer described in paragraphs 0073 to 0092 of Japanese Patent Application Publication No. 2017-151176 can also be used.

[0300] <Optical Sensor> The optical sensor of the present invention includes the film of the present invention described above. Examples of optical sensors include solid-state imaging elements. The structure of the solid-state imaging element is not particularly limited as long as it functions as a solid-state imaging element, but examples include the following structures.

[0301] The structure of the imaging element is as follows: A substrate has a plurality of photodiodes constituting the light-receiving area of ​​a solid-state imaging element (CCD (Charge-Coupled Device) image sensor, CMOS (Complementary Metal-Oxide-Semiconductor) image sensor, and a transmission electrode made of polysilicon, etc. A light-shielding film with openings only in the light-receiving portion of the photodiodes is provided on the photodiodes and the transmission electrode. An element protective film made of silicon nitride, etc., is formed on the light-shielding film to cover the entire surface of the light-shielding film and the light-receiving portion of the photodiodes. A color filter is provided on the element protective film. Furthermore, the structure may have a light-gathering mechanism (e.g., a microlens, etc. The same applies hereinafter) on the device protective film and on the underside (near the substrate) of the color filter, or a structure with a light-gathering mechanism on the color filter. The color filter may also have a structure in which each colored pixel is embedded in a space separated by partitions, for example, in a grid pattern. In this case, it is preferable that the refractive index of the partitions is lower than that of each colored pixel. Examples of camera devices with this structure include those described in Japanese Patent Application Publication No. 2012-227478, Japanese Patent Application Publication No. 2014-179577, and International Publication No. 2018 / 043654. Furthermore, as shown in Japanese Patent Application Publication No. 2019-211559, providing an ultraviolet absorption layer within the structure of the solid-state camera element can also improve lightfastness. Camera devices equipped with solid-state camera elements can be used not only as digital cameras or electronic devices with camera functions (such as mobile phones), but also as vehicle-mounted cameras or surveillance cameras.

[0302] <Image display device> The image display device of the present invention includes the film of the present invention described above. Examples of image display devices include liquid crystal display devices and organic electroluminescent display devices. Definitions of image display devices and detailed descriptions of various image display devices are provided, for example, in "Electronic Display Devices" (by Akio Sasaki, Kogyo Chosakai Publishing Co., Ltd., 1990) and "Display Devices" (by Junsho Ibuki, Sangyo Tosho Publishing Co., Ltd., 1989). Furthermore, liquid crystal display devices are described, for example, in "Next-Generation Liquid Crystal Display Technology" (edited by Tatsuo Uchida, Kogyo Chosakai Publishing Co., Ltd., 1994). There are no particular limitations on the liquid crystal display devices to which the present invention can be applied; for example, liquid crystal display devices of various types described in the aforementioned "Next-Generation Liquid Crystal Display Technology" can be applied. [Example]

[0303] The present invention will be further described in detail below with examples. The materials, amounts, proportions, processing contents, and processing order shown in the following examples can be appropriately modified as long as they do not depart from the spirit of the present invention. Therefore, the scope of the present invention is not limited to the specific examples shown below. Furthermore, Ph in the following structural formulas represents phenyl.

[0304] <Preparation of Dispersions> The mixture containing the raw materials listed in the table below was mixed and dispersed for 3 hours using a bead mill (zirconia beads with a diameter of 0.1 mm). Next, dispersion was performed using a NANO-3000-10 high-pressure disperser with a pressure reduction mechanism at a pressure of 2000 kg / cm² and a flow rate of 500 g / min. This dispersion process was repeated 10 times to obtain the dispersion. The values ​​in the table below representing the amount of dispersant are parts by weight. Furthermore, the values ​​for the amount of dispersant are converted from solid components.

[0305] [Table 1] Particle 1 Particle 2 Particle 3 Particle 4 dispersant Solvent 1 Solvent 2 Solvent 3 type Dosage type Dosage type Dosage type Dosage type Dosage type Dosage type Dosage type Dosage Dispersion 1 PR254 10.6 PY139 4.8 D-1 4.6 S-1 80 Dispersion 2 PG36 8.5 PY150 6.9 D-1 4.6 S-1 80 Dispersion 3 PB15:6 12.3 PV23 3.1 D-1 4.6 S-1 80 Dispersion 4 PG7 15.4 D-1 4.6 S-1 80 Dispersion 5 PR122 15.4 D-1 4.6 S-1 80 Dispersion 6 PY150 15.4 D-1 4.6 S-1 80 Dispersion 7 TiO 2-1 15.4 D-1 4.6 S-1 80 Dispersion 8 TiON 15.4 D-1 4.6 S-1 80 Dispersion 9 TiO 2-2 15.4 D-1 4.6 S-1 80 Dispersion 10 Pigment A 15.4 D-1 4.6 S-1 80 Dispersion 11 PR254 5.7 PY139 2.6 PB15:6 5.5 PV23 1.5 D-1 4.6 S-1 80 Dispersion 12 PB15:6 10.1 PV23 2.8 D-1 5.1 S-1 54 S-2 25 S-3 3

[0306] [Table 2] Particle 1 Particle 2 Pigment derivatives Pigment derivatives Pigment derivatives Dispersant 1 Dispersant 2 solvent solvent type Dosage type Dosage type Dosage type Dosage type Dosage type Dosage type Dosage type Dosage type Dosage Dispersion 13 PB15:6 7.1 PV23 2.4 Syn-3 0.6 Syn-1 1.4 Syn-2 0.4 D-1 4.1 - - S-1 58.8 S-2 25.2 Dispersion 14 PB15:3 7.1 PV23 2.4 Syn-3 0.6 Syn-1 1.4 Syn-2 0.4 D-1 3.7 D-2 0.4 S-1 58.8 S-5 25.2 Dispersion 15 PB15:4 7.1 PV23 2.4 Syn-3 0.6 Syn-1 1.4 Syn-2 0.4 D-1 4.1 - - S-1 58.8 S-2 25.2 Dispersion 16 PB16 7.1 PV23 2.4 Syn-3 0.6 Syn-1 1.4 Syn-2 0.4 D-1 3.7 D-2 0.4 S-1 58.8 S-2 25.2 Dispersion 17 PB15:6 7.0 PV23 2.5 Syn-3 0.6 Syn-1 1.5 Syn-2 0.2 D-3 4.1 - - S-1 58.8 S-5 25.2 Dispersion 18 PB15:6 6.9 PV23 2.6 Syn-3 0.6 Syn-1 1.7 Syn-2 0.1 D-1 4.1 - - S-1 58.8 S-5 25.2 Dispersion 19 PB15:6 9.0 - - Syn-3 0.8 Syn-1 2.0 Syn-2 0.0 D-1 4.1 - - S-1 58.8 S-5 25.2 Dispersion 20 PB15:6 7.1 PV23 2.4 Syn-4 0.6 Syn-1 1.4 Syn-2 0.4 D-4 4.1 - - S-1 58.8 S-2 25.2 Dispersion 21 PB15:6 7.1 PV23 2.4 Syn-5 0.6 Syn-1 1.4 Syn-2 0.4 D-1 4.1 - - S-1 58.8 S-2 25.2

[0307] The details of the raw materials listed in the table above, indicated by abbreviations, are as follows.

[0308] [particle] PR122:CI Pigment Red 122 (Red Pigment) PR254:CI Pigment Red 254 (Red Pigment) PG7:CI Pigment Green 7 (Green Pigment) PG36:CI Pigment Green 36 (Green Pigment) PB15:3:CI Pigment Blue 15:3 (Blue Pigment) PB15:4:CI Pigment Blue 15:4 (Blue Pigment) PB15:6:CI Pigment Blue 15:6 (Blue Pigment) PB16:CI Pigment Blue 16 (Blue Pigment) PY139: CI Pigment Yellow 139 (Yellow Pigment) PY150: CI Pigment Yellow 150 (Yellow Pigment) PV23: CI Pigment Violet 23 (Purple Pigment) TiON: Titanium nitride (black pigment) TiO₂-1:TTO-51 (manufactured by ISHIHARA SANGYO KAISHA,LTD., titanium dioxide, white pigment) TiO₂-2:MPT-141 (manufactured by Ishihara Sanyo Kaisha, Ltd., titanium dioxide, white pigment) Pigment A: A compound with the following structure (near-infrared absorbing pigment, a mixture of isomers with different carbon numbers and branch positions for iC 8H 17 and iC 10H 21). [Chemical Formula 15]

[0309] [Pigment Derivatives] Syn-1: Compounds with the following structures [Chemical Formula 16] Syn-2: A compound with the following structure [Chemical Formula 17] Syn-3: Compounds with the following structure [Chemical Formula 18] Syn-4: A compound with the following structure [Chemical Formula 19] Syn-5: Compounds with the following structures [Chemical Formula 20]

[0310] [Dispersant] D-1: Resin with the following structure (values ​​on the main chain are molars, and values ​​on the side chains are the number of repeating units. Weight average molecular weight 24000, acid value 47 mgKOH / g) [Chemical Formula 21] D-2: Resins with the following structure [Chemical Formula 22] D-3: Resins with the following structure (values ​​on the main chain are molars, and values ​​on the side chains are the number of repeating units. Weight average molecular weight 20,000, acid value 70 mg KOH / g) [Chemical Formula 23] D-4: The resin shown below (weight average molecular weight 8000, acid value 37 mgKOH / g, number of groups containing ethylene unsaturated bonds 0.22 mmol / g) [Table 3] Structural Unit 1 Structural Unit 2 Structural Unit 3 type Mörby type Mörby type Mörby D-4 1-A 5 2-A 87 3-A 8 [Chemical Formula 24] [Chemical Formula 25] [Chemical Formula 26]

[0311] [solvent] S-1: Propylene glycol monomethyl ether acetate (PGMEA) S-2: Cyclopentanone S-3: Propylene glycol monomethyl ether (PGME) S-5: Cyclohexanone

[0312] <Manufacturing of Components> The composition was prepared by mixing the raw materials listed in the table below and filtering them using a NIHON PALL Corporation DFA4201NIEY (0.45μm nylon filter). The values ​​in the table below indicating the amount of admixture are parts by mass.

[0313] [Table 4] Dispersion Polymerizable monomers resin Photopolymerization initiator surfactants solvent type Dosage type Dosage type Dosage type Dosage type Dosage type Dosage Example 1-1 Dispersion 1 65 M-1 3 B-1 7.3 I-1 1.1 W-1 0.008 S-1 23.6 Example 2-1 Dispersion 2 65 M-1 3 B-1 7.3 I-1 1.1 W-1 0.008 S-1 23.6 Example 3-1 Dispersion 3 65 M-1 3 B-1 7.3 I-1 1.1 W-1 0.008 S-1 23.6 Example 4-1 Dispersion 4 65 M-1 3 B-1 7.3 I-1 1.1 W-1 0.008 S-1 23.6 Example 5-1 Dispersion 5 65 M-1 3 B-1 7.3 I-1 1.1 W-1 0.008 S-1 23.6 Example 6-1 Dispersion 6 65 M-1 3 B-1 7.3 I-1 1.1 W-1 0.008 S-1 23.6 Example 7-1 Dispersion 7 65 M-1 3 B-1 7.3 I-1 1.1 W-1 0.008 S-1 23.6 Example 8-1 Dispersion 8 65 M-1 3 B-1 7.3 I-1 1.1 W-1 0.008 S-1 23.6 Example 9-1 Dispersion 9 65 M-1 3 B-1 7.3 I-1 1.1 W-1 0.008 S-1 23.6 Example 10-1 Dispersion 10 65 M-1 3 B-1 7.3 I-1 1.1 W-1 0.008 S-1 23.6 Example 11-1 Dispersion 11 65 M-1 3 B-1 7.3 I-1 1.1 W-1 0.008 S-1 23.6 Example 13-1 Dispersion 12 39 M-2 M-3 1.2 0.5 B-2 2.2 I-1 I-2 0.7 0.7 W-1 0.008 S-1 S-4 36.7 19.0 Example 14-1 Dispersion 1 65 M-2 3 B-1 7.3 I-1 1.1 W-1 0.008 S-1 23.6 Example 15-1 Dispersion 1 65 M-1 M-2 1.5 1.5 B-1 7.3 I-1 1.1 W-1 0.008 S-1 23.6 Example 16-1 Dispersion 1 65 M-1 3 B-2 7.3 I-1 1.1 W-1 0.008 S-1 23.6 Example 17-1 Dispersion 1 65 M-1 3 B-1 B-2 3.65 3.65 I-1 1.1 W-1 0.008 S-1 23.6 Example 18-1 Dispersion 1 65 M-1 3 B-1 7.3 I-2 1.1 W-1 0.008 S-1 23.6 Example 19-1 Dispersion 1 65 M-1 3 B-1 7.3 I-1 I-2 0.55 0.55 W-1 0.008 S-1 23.6 Example 20-1 Dispersion 1 65 M-1 3 B-1 7.3 I-1 1.1 W-1 W-2 0.004 0.004 S-1 23.6 Example 21-1 Dispersion 1 65 M-1 3 B-1 7.3 I-1 1.1 W-1 0.008 S-2 23.6 Example 22-1 Dispersion 1 65 M-1 3 B-1 7.3 I-1 1.1 W-1 0.008 S-1 S-2 11.8 11.8

[0314] [Table 5] Dispersion dye resin Polymerizable monomers Photopolymerization initiator surfactants solvent type Dosage type Dosage type Dosage type Dosage type Dosage type Dosage type Dosage Example 23-1 Dispersion 13 65.0 B-1 1.0 M-1 M-3 2.0 2.0 I-1 0.8 W-1 0.02 S-1 29.2 Example 24-1 Dispersion 14 65.0 B-1 1.0 M-1 M-3 2.0 2.0 I-1 I-3 0.72 0.08 W-1 0.02 S-1 29.2 Example 25-1 Dispersion 15 65.0 B-1 1.0 M-1 M-3 2.0 2.0 I-4 0.8 W-1 0.02 S-1 29.2 Example 26-1 Dispersion 16 65.0 B-1 1.0 M-1 M-3 2.0 2.0 I-1 I-3 0.64 0.16 W-1 0.02 S-1 29.2 Example 27-1 Dispersion 17 65.0 B-1 1.0 M-1 M-3 2.0 2.0 I-1 0.8 W-1 0.02 S-1 29.2 Example 28-1 Dispersion 18 65.0 B-1 1.0 M-1 M-3 2.0 2.0 I-1 0.8 W-1 0.02 S-1 29.2 Example 29-1 Dispersion 19 50.0 Dye 1 6.0 B-1 1.0 M-1 M-3 2.0 2.0 I-1 I-3 0.72 0.08 W-1 0.02 S-1 38.2 Example 30-1 Dispersion 20 65.0 B-1 1.0 M-1 M-3 2.0 2.0 I-1 I-3 0.72 0.08 W-1 0.02 S-1 29.2 Example 31-1 Dispersion 21 65.0 B-1 1.0 M-1 M-3 2.0 2.0 I-1 I-3 0.72 0.08 W-1 0.02 S-1 29.2

[0315] [Table 6] Dispersion Polymerizable monomers resin Photopolymerization initiator surfactants solvent type Dosage type Dosage type Dosage type Dosage type Dosage type Dosage Examples 1-2 Dispersion 1 65 M-1 3 B-1 7.3 I-1 1.1 W-2 0.008 S-1 23.6 Example 2-2 Dispersion 2 65 M-1 3 B-1 7.3 I-1 1.1 W-2 0.008 S-1 23.6 Example 3-2 Dispersion 3 65 M-1 3 B-1 7.3 I-1 1.1 W-2 0.008 S-1 23.6 Example 4-2 Dispersion 4 65 M-1 3 B-1 7.3 I-1 1.1 W-2 0.008 S-1 23.6 Example 5-2 Dispersion 5 65 M-1 3 B-1 7.3 I-1 1.1 W-2 0.008 S-1 23.6 Example 6-2 Dispersion 6 65 M-1 3 B-1 7.3 I-1 1.1 W-2 0.008 S-1 23.6 Example 7-2 Dispersion 7 65 M-1 3 B-1 7.3 I-1 1.1 W-2 0.008 S-1 23.6 Example 8-2 Dispersion 8 65 M-1 3 B-1 7.3 I-1 1.1 W-2 0.008 S-1 23.6 Example 9-2 Dispersion 9 65 M-1 3 B-1 7.3 I-1 1.1 W-2 0.008 S-1 23.6 Example 10-2 Dispersion 10 65 M-1 3 B-1 7.3 I-1 1.1 W-2 0.008 S-1 23.6 Example 11-2 Dispersion 11 65 M-1 3 B-1 7.3 I-1 1.1 W-2 0.008 S-1 23.6 Example 13-2 Dispersion 12 39 M-2 M-3 1.2 0.5 B-2 2.2 I-1 I-2 0.7 0.7 W-2 0.008 S-1 S-4 36.7 19.0

[0316] [Table 7] Dispersion Polymerizable monomers resin Photopolymerization initiator surfactants solvent type Dosage type Dosage type Dosage type Dosage type Dosage type Dosage Examples 1-3 Dispersion 1 65 M-1 3 B-1 7.3 I-1 1.1 W-3 0.008 S-1 23.6 Example 2-3 Dispersion 2 65 M-1 3 B-1 7.3 I-1 1.1 W-3 0.008 S-1 23.6 Example 3-3 Dispersion 3 65 M-1 3 B-1 7.3 I-1 1.1 W-3 0.008 S-1 23.6 Example 4-3 Dispersion 4 65 M-1 3 B-1 7.3 I-1 1.1 W-3 0.008 S-1 23.6 Example 5-3 Dispersion 5 65 M-1 3 B-1 7.3 I-1 1.1 W-3 0.008 S-1 23.6 Example 6-3 Dispersion 6 65 M-1 3 B-1 7.3 I-1 1.1 W-3 0.008 S-1 23.6 Example 7-3 Dispersion 7 65 M-1 3 B-1 7.3 I-1 1.1 W-3 0.008 S-1 23.6 Example 8-3 Dispersion 8 65 M-1 3 B-1 7.3 I-1 1.1 W-3 0.008 S-1 23.6 Example 9-3 Dispersion 9 65 M-1 3 B-1 7.3 I-1 1.1 W-3 0.008 S-1 23.6 Example 10-3 Dispersion 10 65 M-1 3 B-1 7.3 I-1 1.1 W-3 0.008 S-1 23.6 Examples 11-3 Dispersion 11 65 M-1 3 B-1 7.3 I-1 1.1 W-3 0.008 S-1 23.6 Example 13-3 Dispersion 12 39 M-2 M-3 1.2 0.5 B-2 2.2 I-1 I-2 0.7 0.7 W-3 0.008 S-1 S-4 36.7 19.0

[0317] [Table 8] Dispersion Polymerizable monomers resin Photopolymerization initiator surfactants solvent type Dosage type Dosage type Dosage type Dosage type Dosage type Dosage Comparative Example 1-1 Dispersion 1 65 M-1 3 B-1 7.3 I-1 1.1 CW-1 0.008 S-1 23.6 Comparative Example 2-1 Dispersion 2 65 M-1 3 B-1 7.3 I-1 1.1 CW-1 0.008 S-1 23.6 Comparative Example 3-1 Dispersion 3 65 M-1 3 B-1 7.3 I-1 1.1 CW-1 0.008 S-1 23.6 Comparative Example 4-1 Dispersion 4 65 M-1 3 B-1 7.3 I-1 1.1 CW-1 0.008 S-1 23.6 Comparative Example 5-1 Dispersion 5 65 M-1 3 B-1 7.3 I-1 1.1 CW-1 0.008 S-1 23.6 Comparative Example 6-1 Dispersion 6 65 M-1 3 B-1 7.3 I-1 1.1 CW-1 0.008 S-1 23.6 Comparative Example 7-1 Dispersion 7 65 M-1 3 B-1 7.3 I-1 1.1 CW-1 0.008 S-1 23.6 Comparative Example 8-1 Dispersion 8 65 M-1 3 B-1 7.3 I-1 1.1 CW-1 0.008 S-1 23.6 Comparative Example 9-1 Dispersion 9 65 M-1 3 B-1 7.3 I-1 1.1 CW-1 0.008 S-1 23.6 Comparative Example 10-1 Dispersion 10 65 M-1 3 B-1 7.3 I-1 1.1 CW-1 0.008 S-1 23.6 Comparative Example 11-1 Dispersion 11 65 M-1 3 B-1 7.3 I-1 1.1 CW-1 0.008 S-1 23.6 Comparative Example 13-1 Dispersion 12 39 M-2 M-3 1.2 0.5 B-2 2.2 I-1 I-2 0.7 0.7 CW-1 0.008 S-1 S-4 36.7 19.0

[0318] [Table 9] Dispersion Polymerizable monomers resin Photopolymerization initiator surfactants solvent type Dosage type Dosage type Dosage type Dosage type Dosage type Dosage Comparative Examples 1-2 Dispersion 1 65 M-1 3 B-1 7.3 I-1 1.1 CW-2 0.008 S-1 23.6 Comparative Example 2-2 Dispersion 2 65 M-1 3 B-1 7.3 I-1 1.1 CW-2 0.008 S-1 23.6 Comparative Example 3-2 Dispersion 3 65 M-1 3 B-1 7.3 I-1 1.1 CW-2 0.008 S-1 23.6 Comparative Example 4-2 Dispersion 4 65 M-1 3 B-1 7.3 I-1 1.1 CW-2 0.008 S-1 23.6 Comparative Example 5-2 Dispersion 5 65 M-1 3 B-1 7.3 I-1 1.1 CW-2 0.008 S-1 23.6 Comparative Example 6-2 Dispersion 6 65 M-1 3 B-1 7.3 I-1 1.1 CW-2 0.008 S-1 23.6 Comparative Example 7-2 Dispersion 7 65 M-1 3 B-1 7.3 I-1 1.1 CW-2 0.008 S-1 23.6 Comparative Example 8-2 Dispersion 8 65 M-1 3 B-1 7.3 I-1 1.1 CW-2 0.008 S-1 23.6 Comparative Example 9-2 Dispersion 9 65 M-1 3 B-1 7.3 I-1 1.1 CW-2 0.008 S-1 23.6 Comparative Example 10-2 Dispersion 10 65 M-1 3 B-1 7.3 I-1 1.1 CW-2 0.008 S-1 23.6 Comparative Example 11-2 Dispersion 11 65 M-1 3 B-1 7.3 I-1 1.1 CW-2 0.008 S-1 23.6 Comparative Example 13-2 Dispersion 12 39 M-2 M-3 1.2 0.5 B-2 2.2 I-1 I-2 0.7 0.7 CW-2 0.008 S-1 S-4 36.7 19.0

[0319] [Table 10] Dispersion surfactants solvent type Dosage type Dosage type Dosage Example 12-1 Silicon dioxide particle liquid 1 44.8 W-1 0.2 S-11 S-12 S-13 S-14 S-15 43 8 2 1 1 Example 12-2 Silicon dioxide particle liquid 1 44.8 W-2 0.2 S-11 S-12 S-13 S-14 S-15 43 8 2 1 1 Example 12-3 Silicon dioxide particle liquid 1 44.8 W-3 0.2 S-11 S-12 S-13 S-14 S-15 43 8 2 1 1 Comparative Example 12-1 Silicon dioxide particle liquid 1 44.8 CW-1 0.2 S-11 S-12 S-13 S-14 S-15 43 8 2 1 1 Comparative Example 12-2 Silicon dioxide particle liquid 1 44.8 CW-2 0.2 S-11 S-12 S-13 S-14 S-15 43 8 2 1 1

[0320] The detailed information of the raw materials listed in the table above, indicated by abbreviations, is as follows.

[0321] [Dispersion] Dispersions 1-21: The above-mentioned dispersions 1-21 Silica Particle Liquid 1: A silica particle liquid was prepared by adding 3.0 g of trimethylmethoxysilane as a hydrophobic treatment agent to 100.0 g of propylene glycol monomethyl ether solution (silica particle concentration 20% by mass) and reacting at 20°C for 6 hours. The aforementioned propylene glycol monomethyl ether solution contained a plurality of spherical silica particles with an average particle size of 15 nm, which were connected in a beaded shape by silica containing metal oxides (connecting material) (beaded silica). Furthermore, the average particle size of the spherical silica in silica particle liquid 1 was calculated by averaging the number of equivalent circle diameters in the projected images of the spherical portions of 50 spherical silica particles measured by transmission electron microscopy (TEM). Furthermore, in the silica particle liquid 1, the presence of multiple spherical silica particles connected in a bead-like shape was investigated by TEM observation.

[0322] [dye] Dye 1: A compound with the following structure (weight average molecular weight 9000) [Chemical Formula 27]

[0323] [Polymerizable monomers] M-1: KAYARAD DPHA (manufactured by Nippon Kayaku Co., Ltd.) M-2: ARONIX TO-2349 (manufactured by TOAGOSEI CO., LTD.) M-3:NK ESTER A-DPH-12E (manufactured by Shin-Nakamura Chemical Co., Ltd.)

[0324] [Resin] B-1: Resins with the following structure (the values ​​noted on the main chain are in molar ratios. Weight average molecular weight 11000). [Chemical Formula 28] B-2: Resin with the following structure (the values ​​on the main chain are in molar ratios. Weight average molecular weight 19000. Solid content 40%). [Chemical Formula 29]

[0325] [Photopolymerization initiator] I-1: Compounds with the following structures (oxime compounds) [Chemical Formula 30] I-2: Compounds with the following structures (oxime compounds) [Chemical Formula 31] I-3: Compounds with the following structures (oxime compounds) [Chemical Formula 32] I-4: Compounds with the following structures (oxime compounds) [Chemical Formula 33]

[0326] [Surfactants] W-1: A compound with the following structure (polysiloxane surfactant, hydroxyl value 120 mg KOH / g, dynamic viscosity at 25°C = 35 mm² / s, surface tension at 25°C = 27.6 mN / m) W-2: Compounds with the following structure (polysiloxane surfactant, hydroxyl value 100 mg KOH / g, dynamic viscosity at 25°C = 38 mm² / s, surface tension at 25°C = 27.1 mN / m) W-3: Compounds with the following structure (polysiloxane surfactant, hydroxyl value 80 mg KOH / g, dynamic viscosity at 25°C = 40 mm² / s, surface tension at 25°C = 26 mN / m) [Chemical Formula 34]

[0327] CW-1: BYK-330 (manufactured by BYK Chemie GmbH, a polysiloxane surfactant with a surface tension of 25.1 mN / m at 25°C) CW-2: Futurgent 710FM (manufactured by NEOS, fluorine-based surfactant, surface tension at 25°C = 24.3 mN / m)

[0328] Furthermore, dynamic viscosity is measured using an Ubbelohde viscometer. Furthermore, regarding surface tension, a solution with a solid component concentration of 1000 ppm prepared by dissolving each surfactant in PGMEA was used as the measurement sample. The temperature of the measurement sample was adjusted to 25°C, and a surface tension meter CBVP-Z (manufactured by Kyowa Interface Science Co., Ltd.) was used as the measuring device. The measurement was performed using the plate method with a platinum plate.

[0329] [solvent] S-1, S-11: Propylene glycol monomethyl ether acetate S-2: Cyclopentanone S-4: Butyl acetate S-12: 1,4-Butanediol diacetate S-13: Methanol S-14: Ethanol S-15: Water

[0330] <Evaluation of Mixed Colors> The substrate layer forming composition (CT-4000L, manufactured by FUJIFILM Electronic Materials Co., Ltd.) was coated on a glass wafer with a diameter of 8 inches (20.32 cm) to make the dried film thickness 0.1 μm. After drying, it was heat-treated at 220°C for 5 minutes to form the substrate layer. Next, using a spin coater, the components were coated onto a glass wafer with a substrate layer to achieve a pre-baked film thickness of 0.6 μm. The wafer was then pre-baked at 100°C for 120 seconds. Following this, the entire surface of the glass wafer was exposed to 365 nm light at an exposure dose of 500 mJ / cm² using an i-ray stepper exposure apparatus (FPA-3000i5+, Canon Inc.). The exposed glass wafer was then post-baked at 200°C for 300 seconds using a hot plate to form the film. The transmittance of the glass wafer with the film was measured in the wavelength range of 400–1100 nm using a spectrometer (U-4150, Hitachi, Ltd.). Next, the composition for color evaluation was coated using a spin coater to achieve a pre-baked film thickness of 0.6 μm, and then pre-baked using a 100°C heating plate for 120 seconds. Furthermore, regarding Examples 1-1, 1-2, 1-3, and Comparative Examples 1-1 and 1-2, the composition of Comparative Example 3-1 was used as the composition for color mixing evaluation. Furthermore, regarding Examples 2-1 to 31-1, Examples 2-2 to 13-2, Examples 2-3 to 13-3, Comparative Examples 2-1 to 13-1, and Comparative Examples 2-2 to 13-2, the composition of Comparative Example 1-1 was used as the composition for color mixing evaluation. Next, the glass wafer was placed on the horizontal turntable of a spin / spray developer (DW-30 type, manufactured by CHEMITRONICS CO., Ltd.), and immersion development was performed at 23°C for 60 seconds using alkaline developer (CD-2060, manufactured by FUJIFILM Electronic Materials Co., Ltd.). Following this, the immersion-developed glass wafer was fixed to the horizontal turntable using a vacuum chuck. The wafer was then rotated at 50 rpm while pure water was sprayed from above its center of rotation via a nozzle for rinsing (23 seconds x 2 times). Spin drying followed, and then a heating treatment (post-baking) was performed at 200°C for 300 seconds. A color mixing test was conducted to evaluate the composition of the developed material. After the color mixing test, the transmittance of the coated glass wafer in the wavelength range of 400–1100 nm was measured again using a spectrometer (U-4150, manufactured by Hitachi, Ltd.).

[0331] For Examples 1-1 to 7-1, 9-1 to 31-1, Examples 1-2 to 7-2, 9-2 to 13-2, Examples 1-3 to 7-3, 9-3 to 13-1, Comparative Examples 1-1 to 7-1, 9-1 to 13-1, Comparative Examples 1-2 to 7-2, 9-2 to 13-2, the maximum value of the difference in transmittance of the film before and after the color mixing test was evaluated, and the color mixing was evaluated based on the following criteria. Transmittance difference = |Transmittance of the membrane before the color mixing test - Transmittance of the membrane after the color mixing test| 5: The maximum transmittance difference is less than 1%. 4: The maximum transmittance difference exceeds 1% but is less than 2%. 3: The maximum transmittance difference exceeds 2% but is less than 3%. 2: The maximum transmittance difference exceeds 3% but is less than 4%. 1: The maximum transmittance difference exceeds 4%.

[0332] Regarding Examples 8-1, 8-2, 8-3, and Comparative Examples 8-1 and 8-2, the spectral change rate based on the transmittance before the color mixing test was evaluated, and the color mixing was evaluated based on the following criteria. The evaluation was conducted using the following method: Spectral change rate = (1 - transmittance of the film after the color mixing test / transmittance of the film before the color mixing test) x 100. 5: The maximum spectral change rate is less than 1%. 4: The maximum spectral change rate exceeds 1% but is less than 2%. 3: The maximum spectral change rate exceeds 2% but is less than 3%. 2: The maximum spectral change rate exceeds 3% but is less than 4%. 1: The maximum spectral change rate exceeds 4%.

[0333] [Table 11] Mixed colors Example 1-1 5 Example 2-1 5 Example 3-1 5 Example 4-1 5 Example 5-1 5 Example 6-1 5 Example 7-1 5 Example 8-1 5 Example 9-1 5 Example 10-1 5 Example 11-1 5 Example 12-1 5 Example 13-1 5 Example 14-1 5 Example 15-1 5 Example 16-1 5 Example 17-1 5 Example 18-1 5 Example 19-1 5 Example 20-1 5 Example 21-1 5 Example 22-1 5 Example 23-1 5 Example 24-1 5 Example 25-1 5 Example 26-1 5 Example 27-1 5 Example 28-1 5 Example 29-1 5 Example 30-1 5 Example 31-1 5

[0334] [Table 12] Mixed colors Mixed colors Mixed colors Mixed colors Examples 1-2 4 Examples 1-3 3 Comparative Example 1-1 2 Comparative Examples 1-2 1 Example 2-2 4 Example 2-3 3 Comparative Example 2-1 2 Comparative Example 2-2 1 Example 3-2 4 Example 3-3 3 Comparative Example 3-1 2 Comparative Example 3-2 1 Example 4-2 4 Example 4-3 3 Comparative Example 4-1 2 Comparative Example 4-2 1 Example 5-2 4 Example 5-3 3 Comparative Example 5-1 2 Comparative Example 5-2 1 Example 6-2 4 Example 6-3 3 Comparative Example 6-1 2 Comparative Example 6-2 1 Example 7-2 4 Example 7-3 3 Comparative Example 7-1 2 Comparative Example 7-2 1 Example 8-2 4 Example 8-3 3 Comparative Example 8-1 2 Comparative Example 8-2 1 Example 9-2 4 Example 9-3 3 Comparative Example 9-1 2 Comparative Example 9-2 1 Example 10-2 4 Example 10-3 3 Comparative Example 10-1 2 Comparative Example 10-2 1 Example 11-2 4 Examples 11-3 3 Comparative Example 11-1 2 Comparative Example 11-2 1 Example 12-2 4 Example 12-3 3 Comparative Example 12-1 2 Comparative Example 12-2 1 Example 13-2 4 Example 13-3 3 Comparative Example 13-1 2 Comparative Example 13-2 1

[0335] As shown in the table above, compared with the comparative examples, the embodiments are able to suppress the generation of color mixing.

[0336] 1: Spherical silicon dioxide 2: Joint 11: Support 12: Next door 14 pixels 100: Structure

Claims

1. A composition comprising: a curable compound; a polysiloxane surfactant A; and a solvent, wherein, when the polysiloxane surfactant A is dissolved in propylene glycol monomethyl ether acetate to prepare a solution with a solid content concentration of 1000 ppm by mass, the surface tension of the solution at 25°C is 27 mN / m or higher, and the polysiloxane surfactant A is a dimethyl polysiloxane having alkoxy and hydroxyl groups.

2. The composition as claimed in claim 1, wherein the aforementioned curing compound contains a resin and a polymerizable monomer, and the aforementioned composition further contains a photopolymerization initiator.

3. The composition as described in claim 1 or claim 2 further comprises a colorant.

4. A composition comprising: inorganic particles; polysiloxane surfactant A; and a solvent, wherein, when the aforementioned polysiloxane surfactant A is dissolved in propylene glycol monomethyl ether acetate to prepare a solution with a solid content concentration of 1000 ppm by mass, the surface tension of the aforementioned solution at 25°C is 27 mN / m or higher, and the aforementioned polysiloxane surfactant A is a dimethyl polysiloxane having alkoxy and hydroxyl groups.

5. The composition as described in claim 4, wherein the aforementioned inorganic particles comprise silicon dioxide particles.

6. The composition as described in claim 5, wherein the aforementioned silica particles comprise at least one of the following: silica particles in the shape of a plurality of spherical silica particles connected in a beaded manner, silica particles in the shape of a plurality of spherical silica particles connected in a planar manner, and silica particles with a hollow structure.

7. The composition as described in claim 4 or claim 5, wherein the content of the aforementioned inorganic particles in the total solid component of the aforementioned composition is 20% by mass or more.

8. The composition as described in claim 1 or claim 4, wherein the hydroxyl value of the aforementioned polysiloxane surfactant A is 80 mg KOH / g or higher.

9. The composition as described in claim 1 or claim 4, wherein the aforementioned polysiloxane surfactant A has a dynamic viscosity of less than 40 mm² / s at 25°C.

10. The composition as described in claim 1 or claim 4, wherein the content of the aforementioned polysiloxane surfactant A in the aforementioned composition is 1 to 1000 ppm by mass.

11. A membrane obtained using the composition described in claim 1 or claim 4.

12. A filter having the membrane described in claim 11.

13. An optical sensor having the membrane described in claim 11.

14. An image display device having the film described in claim 11.

15. A structure having: a support; partitions obtained using the components described in claim 4 disposed on the support; and pixels disposed in the area divided by the partitions.

Images