Adhesion treatment method

Abstract

The present invention addresses the problem of providing a substrate processing method that effectively prevents a predetermined treatment from reaching untreated areas of the substrate. The solution comprises: a substrate processing apparatus EA for applying a predetermined treatment to a substrate WK, comprising: a sheet attachment unit 10, which designates a predetermined area of ​​the substrate WK as an untreated area WK1, and attaches an adhesive sheet AS to the untreated area WK1 so that the predetermined treatment does not reach the untreated area WK1; and a processing unit 30, which applies the predetermined treatment to the substrate WK; the adhesive sheet AS is formed to be cured by a predetermined energy (ultraviolet light, UV); the substrate processing apparatus EA further comprises: an energy application unit 20, which applies a predetermined energy (ultraviolet light, UV) to the adhesive sheet AS attached to the substrate WK to cure the adhesive sheet AS.

Description

Method and apparatus for processing substrate This invention relates to a method and apparatus for processing a substrate. A known method for treating a substrate involves designating a predetermined area of ​​the substrate as an untreated area, attaching an adhesive sheet to the untreated area so that the predetermined treatment does not reach the untreated area, and then applying the predetermined treatment to the substrate (see, for example, Patent Document 1). [Prior Art Documents] [Patent Documents] [Patent Document 1] Japanese Patent Application Publication No. 2016-115868. [The problem that the invention aims to solve] In the semiconductor device manufacturing method (substrate processing method) described in Patent Document 1, when the outer periphery of the semiconductor substrate (1010) (substrate) is set as an unprocessed area, and a film (1100) (adhesive sheet) is attached to the unprocessed area so that the plating process (predetermined process) does not reach the unprocessed area, if the adhesive sheet is forcibly deformed and attached in accordance with the planar shape or concave-convex shape of the unprocessed area, the outer edge of the adhesive sheet will lift up due to its own residual stress, resulting in an undesirable situation where the predetermined process reaches the unprocessed area. The object of this invention is to provide a substrate processing method and a substrate processing apparatus, both of which can maximize the prevention of predetermined processing from unprocessed areas of the substrate. [Means for solving the problem] This invention adopts the structure described in the claims. [Invention Benefits] According to the present invention, since an adhesive sheet capable of being cured by a predetermined energy is used and the adhesive sheet is cured, it is possible to suppress the formation of a floating portion at the outer edge of the adhesive sheet and to maximize the absence of the predetermined treatment in the untreated area of ​​the bonded body. Hereinafter, an embodiment of the present invention will be described based on the drawings. Furthermore, in this embodiment, the X-axis, Y-axis, and Z-axis are orthogonal to each other. The X-axis and Y-axis are defined as axes within a predetermined plane, and the Z-axis is defined as an axis orthogonal to the predetermined plane. Further, in this embodiment, the view from the direction of arrow DR, which is parallel to the Y-axis, is used as a reference. When directions are indicated without specifying a figure, "up" refers to the direction of the arrow on the Z-axis, and "down" is the opposite direction of the arrow on the Z-axis; "left" refers to the direction of the arrow on the X-axis, and "right" is the opposite direction of the arrow on the X-axis; "front" is the direction directly in front in Figure 1, which is parallel to the Y-axis, and "back" is the opposite direction of the direction directly in front. The substrate processing apparatus EA of the present invention is an apparatus for applying a plating treatment as a predetermined treatment to a substrate WK, and includes: a sheet attachment unit 10, which performs a sheet attachment process in which an outer edge of a predetermined region in the substrate WK is designated as an untreated region WK1, and an adhesive sheet AS is attached to the untreated region WK1 so that the plating treatment does not reach the untreated region WK1; an energy application unit 20, which performs an energy application process in which ultraviolet light UV (refer to (C) in FIG2) of predetermined energy is applied to the adhesive sheet AS attached to the substrate WK to cure the adhesive sheet AS; and a processing unit 30, which performs a processing process in which a plating treatment is applied to the substrate WK. The plating process includes a separation unit 40, which performs a separation step by forming a cut CU (see Figure 2(A)) as a separation line on the plated substrate WK to separate the substrate WK into a first substrate portion WKA (see Figure 2(B)) including an untreated area WK1 and a second substrate portion WKB excluding the first substrate portion WKA; and an untreated area removal unit 50, which performs an untreated area removal step by removing the first substrate portion WKA from the substrate WK; and a substrate processing device EA is disposed near a conveying unit 60, which performs a conveying step by conveying the substrate WK. Furthermore, regarding the adhesive strip AS, an adhesive strip AS is prepared that can be cured in the adhesive strip preparation process by ultraviolet light (UV) as a predetermined energy and can be deformed by heat (hot gas HA) as a second energy. Furthermore, in this embodiment, the substrate WK, as shown in Figure AA of FIG1(A), has a surface WK2 on one side and a surface WK3 on the other side, which are circular in shape with a reference position WKR as the center. An annular protrusion CV is provided on the surface WK3, and the outer edge of the annular protrusion CV is designated as an unprocessed area WK1. Further, in this embodiment, a cover sheet CS is attached to the surface WK3 side containing the annular protrusion CV. The sheet attachment unit 10 includes: a base plate 11, which directly or indirectly supports the components constituting the sheet attachment unit 10; a support roller 12, which supports the raw sheet RS formed by the adhesive sheet AS temporarily attached to a strip-shaped release sheet RL; a guide roller 13, which guides the raw sheet RS; a release plate 14, which serves as a release unit, folds the release sheet RL back using a release edge 14A and peels the adhesive sheet AS from the release sheet RL; a pressing roller 15, which serves as a pressing unit, presses and attaches the adhesive sheet AS to the substrate WK; and a drive roller 16, which is supported by an output shaft (not shown) of a rotary motor 16A, which serves as a drive device, and is connected to a pressure roller. Roller 16B clamps the peeling sheet RL together; the recycling roller 17, which is a recycling unit, is supported by the output shaft of a drive device (not shown) and normally applies a predetermined tension to the peeling sheet RL between the recycling roller 17 and the pressure roller 16B during the automatic operation of the substrate processing device EA, thereby recycling the peeling sheet RL; the deformation unit 18 deforms the adhesive sheet AS attached to the substrate WK and attaches the adhesive sheet AS to the unprocessed area WK1; and the upper and lower pairs of repressing rollers 19, which are the repressing unit, press the adhesive sheet AS onto one side surface WK2 and the other side surface WK3 of the substrate WK. The deformation unit 18 includes: a direct-drive motor 18A as a drive device; a heating device 18C, such as a coil heater or the heating side of a heat pipe, supported by the output shaft 18B of the direct-drive motor 18A, which heats the atmosphere or air to generate hot gas HA as a second energy source; and a blower 18D, which blows the hot gas HA generated by the heating device 18C from the exhaust port 18E. Furthermore, the deformation unit 18 attaches the bonding sheet AS to the unprocessed area WK1, which includes the protrusion CV. The energy supply unit 20 is equipped with a pair of upper and lower energy supply devices 21, which are energy generation devices 21A that can emit ultraviolet light such as light-emitting diodes or mercury lamps. The processing unit 30 includes: a so-called multi-joint robot 31, which serves as a drive device, is composed of a plurality of arms and is a displacement unit capable of moving an object supported by the front end arm 31A, which serves as the working part, to any position and any angle within its working range; a conveying arm 32, which is provided with a first support member 32A, which can be connected to the front end arm 31A; an abutment member 33, which is supported by the conveying arm 32 and is made of an elastic material such as rubber or resin; a rotary motor 34 (holding unit), which serves as a drive device, is supported by the conveying arm 32; a gripper 35, which is supported by the output shaft 34A of the rotary motor 34; a receiving member 37, which is supported by a slider 36A in the linear motor 36, which serves as a drive device, and is capable of receiving the object to be attached WK; and a plating tank 38, which stores an aqueous solution 38A for plating. The linear motor 36 is configured to lower the receiving member 37, which is positioned at the initial position above the plating aqueous solution 38A stored in the plating tank 38, and to immerse the object contained in the receiving member 37 in the plating aqueous solution 38A. The separating unit 40 includes: a multi-joint robot 31 serving as a drive device, a displacement unit shared with the processing unit 30; a cutting arm 41; a second support member 41A that can be connected to the front arm 31A; a cutting blade 42 serving as a cutting unit, supported by the cutting arm 41, capable of forming a cut CU on the substrate WK; a base 43 having a recessed groove 43B for the gripper 35 formed on its upper surface 43A; and a circular placement stage 44 formed on its upper surface 43A and having a holding surface 44A, on which an annular groove 44B is formed, and which can be held by a pressure-reducing unit (holding unit) not shown, such as a pressure-reducing pump or a vacuum ejector. Furthermore, in this embodiment, the separating unit 40 forms the cut CU such that a portion of the bonding sheet AS is attached to the second substrate portion WKB. As shown in Figure BB in Figure 1(A), the unprocessed area removal unit 50 includes: a multi-joint robot 31 as a drive device; a displacement unit shared with the processing unit 30 and the differentiation unit 40; a conveying arm 32 shared with the processing unit 30; an abutment member 33; a rotary motor 34; and a gripper 35. The conveying unit 60 includes: a linear motor 61 as a drive device; a rotary motor 62 as a drive device, supported by a slider 61A of the linear motor 61; and a support platform 63, supported by the output shaft 62A of the rotary motor 62, and having a holding surface 63A capable of adsorption and holding by a pressure reducing unit (holding unit) not shown, such as a pressure reducing pump or a vacuum pump. The support platform 63 is configured to rotate around the rotation center 62R of the rotary motor 62 by the rotary motor 62. The operation of the aforementioned substrate processing apparatus EA will be explained. First, as shown in Figure 1(A), the user of the substrate processing apparatus EA (hereinafter referred to as "the user") places the raw material sheet RS into the substrate processing apparatus EA, which has already arranged all components in the initial position shown by the solid line in Figure 1(A). Then, the user inputs a signal to start automatic operation via an operation unit (not shown), such as an operation panel or a personal computer. In this way, the sheet attachment unit 10 drives the rotary motor 16A and pulls out the raw material sheet RS. When the front end of the front adhesive sheet AS in the pulling direction is peeled off by the peeling edge 14A of the peeling plate 14 by a predetermined length, as shown by the solid line in Figure 1(A), the rotary motor 16A is stopped. Next, as shown in Figure 1(A), when the user, multi-joint robot or conveyor belt, or other unshown transport unit, places the attached body WK on the holding surface 63A so that the reference position WKR overlaps with the rotation center 62R of the rotary motor 62, the transport unit 60 drives the decompression unit (not shown) and begins to be held by the holding surface 63A. Next, the conveying unit 60 drives the linear motor 61 to move the support platform 62 to the left. When the substrate WK reaches position CC as shown in Figure 1(A), the linear motor 61 stops. At this time, the outer edge of the rear side of the substrate WK abuts against the outer edge of the pressing roller 15, and as shown in Figure 1(B), the outer edge of the front side is clamped by a pair of pressing rollers 19. Furthermore, the outer edge of the front side is positioned between a pair of energy-applying devices 21 as shown in Figure 2(C). Next, the sheet bonding unit 10 drives the linear motor 18A, as shown by the two-point chain line in Figure 1(A), to bring the air supply device 18D close to the outer edge of the substrate WK. Then, it drives the heating device 18C and the air supply device 18D, and begins to supply hot air HA from the exhaust port 18E. The energy-applying unit 20 drives the energy generating device 21A to emit ultraviolet UV light. Then, the conveying unit 60 drives the rotary motor 62 to rotate the support table 62 counterclockwise in the direction RD, and the sheet attaching unit 10 drives the rotary motor 16A to pull out the raw material sheet RS in accordance with the rotational speed of the outer edge of the substrate WK. Here, the adhesive sheet AS is peeled off from the release sheet RL, and the adhesive sheet AS peeled off by the release sheet RL is pressed against the outer edge of the substrate WK by the pressing roller 15 as shown by the two-point chain line in Figure 1(A), and is attached to the outer edge of the substrate WK in a state forming a protruding area ASH as shown in Figure 1(B). Next, when the adhesive sheet AS attached to the outer edge of the substrate WK passes in front of the exhaust port 18E, the adhesive sheet AS is heated by hot gas HA, causing the protruding area ASH to deform as shown by the two-point chain line in Figure 1(B) and attach to the untreated area WK1. Subsequently, when the protruding area ASH of the unprocessed area WK1 passes between the pressing rollers 19, the protruding area ASH is pressed by the pressing rollers 19 and pressed into the unprocessed area WK1. Next, when the adhesive strip AS of the substrate WK is pressed by the pressing roller 19 and passes between the energy application device 21, as shown in Figure 2(C), ultraviolet light (UV) is irradiated onto the adhesive strip AS, causing the irradiated adhesive strip AS to cure. Thus, even if the outer edge of the adhesive strip AS attempts to lift due to its residual stress, it will not lift due to curing. Furthermore, after the substrate WK rotates more than one revolution counterclockwise in the direction RD during attachment, causing the rear end of the pull-out direction of the preceding adhesive strip AS to overlap with the front end of the pull-out direction of the following adhesive strip AS, the adhesive strip unit 10 stops driving the rotation motor 16A when the front end of the next adhesive strip AS is peeled off by the peeling edge 14A of the peeling plate 14 by a predetermined length. Next, when the rear end of the adhesive strip AS in the pull-out direction passes in front of the exhaust port 18E and is attached to the front end of the adhesive strip AS in the pull-out direction to form an integral part UP, the adhesive strip attaching unit 10 stops driving the heating device 18C and the air supply device 18D, drives the direct drive motor 18A, and returns the air supply device 18D to its initial position. Then, when the rear end of the adhesive strip AS in the pull-out direction passes between the pressing rollers 19 and the energy imparting device 21, the conveying unit 60 stops driving the rotary motor 62. Next, the conveying unit 60 drives the linear motor 61 to move the support platform 62 to the left. When the integral object UP reaches the position DD shown in Figure 1(A), the linear motor 61 is stopped, the pressure reduction unit (not shown) is stopped, and the adsorption holding by the holding surface 63A is released. Meanwhile, the processing unit 30 drives the multi-joint robot 31 to connect the front arm 31A to the first support member 32A and support the conveying arm 32, so that the abutment member 33 abuts against the upper surface of the integral object UP. Then, the rotating motor 34 is driven to hold the integral object UP with the gripper 35 and the abutment member 33 (see Figure 2(B)). Next, when the processing unit 30 drives the multi-joint robot 31 to house the integral object UP in the receiving member 37 as shown by the two-point chain line in Figure 1(A), the rotating motor 34 is driven to release the gripper 35 and the abutment member 33 on the integral object UP. Then, the multi-joint robot 31 is driven to retract the conveying arm 32 from the receiving member 37. Subsequently, the processing unit 30 drives the linear motor 36 to lower the receiving member 37 and immerse the integral piece UP in the plating aqueous solution 38A to apply plating to the integral piece UP. When the plating process on the integral piece UP is completed, the processing unit 30 drives the linear motor 36 to return the receiving member 37 to its initial position. Then, the processing unit 30 uses the gripper 35 and the abutment member 33 to hold the integral piece UP with the same actions as described above. Next, when the processing unit 30 drives the articulated robot 31 and places the integral piece UP onto the holding surface 44A so that the reference position WKR overlaps with the center 44R of the loading stage 44 (see Figure 2(B)), the separating unit 40 drives the decompression unit (not shown) and begins to hold it by adsorption from the holding surface 44A. Furthermore, after the processing unit 30 drives the rotary motor 34 to release the gripper 35 and the abutment member 33 from the integral piece UP, it drives the articulated robot 31 and returns the conveying arm 32 to its initial position. Next, the separating unit 40 drives the articulated robot 31 to connect the front arm 31A to the second support member 41A and support the cutting arm 41, so that, as shown in Figure 2(A), the cutting blade 42 passes through the adhesive piece AS and pierces into the integral piece UP, and the front end enters the groove 44B. Afterwards, the separating unit 40 drives the articulated robot 31 and rotates the cutting blade 42 more than one revolution around the center 44R of the loading stage 44 to form a circular cut CU, so as to separate the integral piece UP into a first bonded part WKA including an untreated area WK1 with the adhesive piece AS attached, and a second bonded part WKB with a portion of the adhesive piece AS attached to its outer edge. Then, the cutting arm 41 returns to the initial position. Furthermore, by forming a second bonded portion WKB with a portion of the adhesive piece AS attached to its outer edge in this manner, damage to the outer edge of the second bonded portion WKB and the inner edge of the first bonded portion WKA can be prevented when the cut CU is formed, even if the bonded portion WK is made of a fragile material. In addition, even if the outer edge of the second bonded portion WKB and the inner edge of the first bonded portion WKA are damaged when the cut CU is formed, fragments formed due to the damage can be prevented from scattering to the surrounding area. Next, the non-processing area removal unit 50 drives the articulated robot 31 to connect the front arm 31A to the first support member 32A and support the conveying arm 32. As shown in Figure 2(B), the abutment member 33 abuts against the upper surface of the first bonded portion WKA. Then, the rotary motor 34 is driven to hold the first bonded portion WKA with the gripper 35 and the abutment member 33. Furthermore, the non-processing area removal unit 50 drives the articulated robot 31 to transport the first bonded portion WKA to a recycling area (not shown), and then returns the conveying arm 32 and each arm of the articulated robot 31 to their initial positions. Next, when the separation unit 40 stops driving the decompression unit (not shown) and releases the suction hold provided by the holding surface 44A, the user or the conveying unit (not shown) transports the second bonded portion WKB to the next process, and then repeats the same actions as described above. According to the embodiment described above, since an adhesive sheet AS that can be cured by ultraviolet light (UV) is used and the adhesive sheet AS is cured, it is possible to suppress the formation of a floating portion on the outer edge of the adhesive sheet AS and to maximize the protection of the untreated area WK1 of the substrate WK from the plating process. The units and processes in this invention are not limited in any way as long as they can perform the actions, functions, or processes described for these units and processes, and are not limited to the components or processes of only one embodiment shown in the foregoing embodiments. For example, a processing unit can be any processing unit that can apply a predetermined treatment to the bonded body, as long as it is within the scope of the technology at the time of application (the same applies to other units and processes). Regarding the sheet attachment unit 10, the sheet attachment unit 10 can pull out the raw material sheet RS and peel the adhesive strip AS from the release strip RL for attachment. The raw material sheet RS has a closed-loop or full-length cut along the short side of the strip adhesive substrate temporarily attached to the strip-shaped release strip RL, with the predetermined area defined by the cut serving as the adhesive strip AS. The sheet attachment unit 10 can also pull out the raw material sheet RS and peel the adhesive strip AS from the release strip RL for attachment. The raw material sheet RS is a strip-shaped adhesive material sheet formed by temporarily attaching a strip-shaped adhesive substrate to the strip-shaped release strip RL, and is used as a cutting unit during the pulling out of the strip-shaped adhesive material sheet. The cutting blade forms a closed-loop or full-length cut in the adhesive substrate, and the predetermined area defined by the cut is used as the adhesive AS; the sheet attachment unit 10 can also pull out the raw material sheet RS formed by temporarily attaching the strip-shaped adhesive AS to the strip-shaped release sheet RL, and peel the strip-shaped adhesive AS off the release sheet RL for attachment; the sheet attachment unit 10 can also pull out the raw material sheet RS that is not wound but fan-folded; the sheet attachment unit 10 can also use a recycling unit that does not involve winding but fan-folding for recycling, shredding for recycling, or collecting the release sheet RL without intentional accumulation; the sheet attachment unit 10 may also not use The recycling unit; the sheet attachment unit 10 can also pull out the adhesive sheet AS that is not temporarily attached to the release sheet RL and attach the adhesive sheet AS to the substrate WK; the sheet attachment unit 10 can also replace the pressing roller 15 with the following configuration: the adhesive sheet AS is held by a holding member supported by a drive device and serving as the output shaft of a direct-drive motor of the pressing unit, and is held by a pressure-reducing unit (holding unit) such as a pressure-reducing pump or a vacuum pump (not shown), and the adhesive sheet AS held by the holding member is pressed and attached to the substrate WK; when the unprocessed area WK1 is set as only one side of the surface WK2 or only the other side of the surface WK3, the sheet attachment unit 10 The adhesive strip AS can also be attached to the substrate WK by making the protruding area ASH protrude only to one side of the surface WK2 or only to the other side of the surface WK3. The adhesive strip attachment unit 10 can also attach a plurality of adhesive strips AS to the substrate WK. The adhesive strip attachment unit 10 can also be configured to form a depressurization unit that creates a depressurization atmosphere including a vacuum and attach the adhesive strip AS to the untreated area WK1 in the depressurization atmosphere. The adhesive strip attachment unit 10 can also adopt a re-pressing unit that presses the adhesive strip AS only to one side of the surface WK2 or only to the other side of the surface WK3. The adhesive strip attachment unit 10 may or may not have a re-pressing unit.In the above embodiment, a sheet attachment unit 10 is shown that deforms the adhesive piece AS into the shape of the untreated area WK1 (the shape of the outer edge of the bonded body WK) and attaches the adhesive piece AS to the untreated area WK1. However, the sheet attachment unit 10 can also attach an adhesive piece AS that is pre-formed into the shape of the untreated area (e.g., the shape of the outer edge of the surface WK2 side of one side of the bonded body WK, the shape of the central part of the surface WK3 side of the other side of the bonded body WK, etc.) to the untreated area. Regarding the deformation unit 18, the predetermined second energy applied to the adhesive strip AS by the deformation unit 18 can be electromagnetic waves such as ultraviolet rays, infrared rays, visible light, sound waves, X-rays, or gamma rays, or heat such as hot water or cold air. Any energy can be applied, taking into account the characteristics, properties, materials, composition, and structure of the adhesive strip AS to deform it. The same energy can be used as the predetermined second energy and applied in one or more applications; different energies can also be used as the predetermined second energy and applied in one or more applications. The deformation unit 18 can be applied without pulling the bonded object WK closer or further away. The deformation unit 18 can also be disposed inside the support platform 63. The deformation unit 18 can also apply the predetermined second energy to the adhesive strip AS from above, below, or obliquely. The deformation unit 18 can also apply the predetermined second energy without moving the adhesive strip AS attached to the bonded object WK, or even when moving... When the adhesive piece AS is attached to the substrate WK, the deformation unit 18 moves itself and applies a predetermined second energy to the adhesive piece AS. The deformation unit 18 can also apply a predetermined second energy to the adhesive piece AS attached to the substrate WK at one time. The deformation unit 18 may also have a guiding unit such as a guide shaft or roller to guide the protruding area ASH to deform in the direction of the untreated area WK1. The deformation unit 18 may be provided in the substrate treatment device EA of the present invention, or it may not be provided in the substrate treatment device EA of the present invention. The deformation unit 18 can deform the adhesive piece AS to the point where the protruding area ASH abuts against the untreated area WK1. The deformation unit 18 may also not deform the adhesive piece AS to the point where the protruding area ASH abuts against the untreated area WK1. When the deformation unit 18 does not make the protruding area ASH abut against the untreated area WK1, the protruding area ASH can also abut against the untreated area WK1 by using the pressing unit 18 or the pressing unit of other devices. The following method can also be adopted in the adhesive bonding unit 10: In the adhesive bonding preparation process, an adhesive bonding sheet AS that can be elastically deformed is prepared, tension is applied to the adhesive bonding sheet AS located between the pressing roller 15 and the peeling plate 14, and the adhesive bonding sheet AS is attached to the substrate WK, so that the protruding area ASH is bent and attached to the untreated area WK1 by means of the original elastic recovery force of the adhesive bonding sheet AS itself. Regarding the energy imparting unit 20, the predetermined energy imparted to the adhesive strip AS by the energy imparting unit 20 can be electromagnetic waves such as ultraviolet rays, infrared rays, visible light, sound waves, X-rays, or gamma rays, or heat such as hot water or cold air. Any energy can be used, as long as it is energy sufficient to cure the adhesive strip AS considering its characteristics, properties, materials, composition, and structure. The same energy can be used as the predetermined energy and imparted in one or more passes; different energies can also be used as the predetermined energy and imparted in one or more passes. The energy imparting unit 20 can be configured to pull the bonded object WK closer or further away. The energy imparting unit 20 can also be disposed inside the support stage 63. The energy imparting unit 20 can also impart the predetermined energy to the adhesive strip AS from above, below, or obliquely. The energy imparting unit 20 can also be used without... When the adhesive patch AS attached to the substrate WK moves, or when the adhesive patch AS attached to the substrate WK is moving, the energy supply unit 20 moves itself and applies a predetermined energy to the adhesive patch AS; the energy supply unit 20 can also apply a predetermined energy to the adhesive patch AS attached to the substrate WK at one time; the energy supply unit 20 can also be a depressurization unit that forms a depressurization atmosphere including a vacuum, and applies a predetermined energy to the adhesive patch AS attached to the substrate WK in the depressurization atmosphere to cure the adhesive patch AS; the energy supply unit 20 can also be a gas removal unit that forms a barrier gas removal atmosphere after removing the gas that hinders the curing of the adhesive patch AS, and applies a predetermined energy to the adhesive patch AS attached to the substrate WK in the barrier gas removal atmosphere to cure the adhesive patch AS. In addition to applying electrolytic plating or non-electrolytic plating to the substrate WK, the processing unit 30 may employ any processing device, such as a device for sandblasting, coating, etching, engraving, cutting, drilling, mounting components, heating, cooling, etc., to the substrate WK; it may also employ a displacement unit that can perform the same actions as described above with other components, instead of sharing a displacement unit with at least one of the separation unit 40 and the unprocessed area removal unit 50; it may also employ a component that can perform the same actions as described above with other components, instead of sharing a conveying arm 32, abutting member 33, rotating motor 34, and gripper 35 with the unprocessed area removal unit 50; it may employ a receiving member 37 that can accommodate only one or more integral objects UP; and it may employ a plating tank 38 (processing device) that can only plate (process) one integral object UP or simultaneously plate (process) multiple integral objects UP. Regarding the distinguishing unit 40, the distinguishing unit 40 may also not share a displacement unit with at least one of the processing unit 30 and the unprocessed area removal unit 50, but may instead employ a displacement unit capable of performing the same operation as described above using other components; the distinguishing unit 40 may move the bonded body WK without moving the cutting unit or while moving the cutting unit, thereby forming a cut CU on the bonded body WK; the distinguishing unit 40 may also form the cut CU such that a portion of the adhesive piece AS is only attached to one side of the surface WK2 of the second bonded body portion WKB; the distinguishing unit 40 may also... The cut CU is formed such that a portion of the adhesive piece AS is attached only to the surface WK3 side of the other side of the second substrate portion WKB; the separating unit 40 can also form the cut CU such that a portion of the adhesive piece AS is not attached to the second substrate portion WKB; the separating unit 40 can also form the cut CU along the outer edge of the substrate WK; the separating unit 40 can also form the cut CU without following the outer edge of the substrate WK; the separating unit 40 may be provided in the substrate processing device EA of the present invention, or it may not be provided in the substrate processing device EA of the present invention. In addition to complete separation lines that continuously connect the cut surfaces of the substrate WK, adhesive piece AS, etc., to completely separate the cut surfaces, the separation lines in this invention also include, for example: incomplete separation lines that intermittently connect the cut surfaces of the substrate to partially connect the cut surfaces; incomplete separation lines that continuously or intermittently connect the cut surfaces that do not penetrate the substrate; incomplete separation lines that continuously or intermittently connect the weak parts formed by subjecting the substrate to lasers, electromagnetic waves, heat, chemicals, etc., to alter the characteristics, properties, materials, composition, structure, size, etc., of the substrate and weakening it; and incomplete separation lines that regularly or irregularly connect at least two of the cut surfaces of the substrate, the cut surfaces that do not penetrate the substrate, and the weak parts. Furthermore, the incomplete separation line described above is transformed into a complete separation line by applying vibration, tension, light, heat, chemicals, etc. Therefore, in the substrate processing method and substrate processing apparatus EA of the present invention, a complete separation process and a complete separation apparatus can be used to apply vibration, tension, light, heat, chemicals, etc., thereby transforming the incomplete separation line described above into a complete separation line. Regarding the unprocessed area removal unit 50, the unprocessed area removal unit 50 may also not share a displacement unit with at least one of the processing unit 30 and the distinguishing unit 40, but may adopt a displacement unit that can perform the same operation as described above with other components; the unprocessed area removal unit 50 may also not share the conveying arm 32, the abutting member 33, the rotating motor 34 and the gripper 35 with the processing unit 30, but may adopt a component that can perform the same operation as described above with other components; the unprocessed area removal unit 50 may also remove the first bonded body part WKA from the loading table 44 after the second bonded body part WKB has been conveyed to the next process; the unprocessed area removal unit 50 may be provided in the bonded body processing device EA of the present invention, or it may not be provided in the bonded body processing device EA of the present invention. The conveying unit 60 can move the attaching unit 10 to attach the adhesive piece AS to the substrate WK without moving the support table 63 or while the support table 63 is moving; the conveying unit 60 may be provided in the substrate processing device EA of the present invention, or it may not be provided in the substrate processing device EA of the present invention. The substrate treatment method and substrate treatment apparatus EA of the present invention can be any treatment method and apparatus other than electrolytic plating or non-electrolytic plating applied to the substrate WK, such as sandblasting method and sandblasting apparatus, coating method and coating apparatus, etching method and etching apparatus, engraving method and engraving apparatus, cutting method and cutting apparatus, drilling method and drilling apparatus, component mounting method and component mounting apparatus, heating method and heating apparatus, cooling method and cooling apparatus, etc. In the adhesive sheet preparation process, adhesive sheets AS that can be cured by electromagnetic waves such as ultraviolet light, infrared light, visible light, sound waves, X-rays, or gamma rays, or by a predetermined energy source such as hot water or cold air, can be prepared. In the adhesive sheet preparation process, adhesive sheets in which only the substrate constituting the adhesive sheet AS is cured by a predetermined energy source can also be prepared. In the adhesive sheet preparation process, adhesive sheets in which only the adhesive layer constituting the adhesive sheet AS is cured by a predetermined energy source can also be prepared. In the adhesive sheet preparation process, adhesive sheets in which both the substrate and the adhesive layer constituting the adhesive sheet AS are cured by a predetermined energy source can also be prepared. In the process, an adhesive sheet AS can also be prepared by depositing a substrate onto an adhesive layer and depositing a material that can be cured by a predetermined energy onto the substrate. In the adhesive sheet preparation process, the sheet attachment unit 10 can also pull out a substrate formed by depositing a substrate onto the adhesive layer. During the process of pulling out the substrate, a material that can be cured by a predetermined energy is deposited on the substrate to prepare an adhesive sheet AS that can be cured by a predetermined energy. In the adhesive sheet preparation process, adhesive sheets AS that are cured by a predetermined energy with shrinkage, or with expansion, or without shrinkage or expansion can also be prepared. In the adhesive sheet preparation process, when preparing an adhesive sheet AS that can be deformed by a predetermined second energy: In the adhesive sheet preparation process, an adhesive sheet AS that can be deformed by a predetermined second energy such as ultraviolet light, infrared light, visible light, sound waves, X-rays, or gamma rays, or hot water, cold air, etc., can also be prepared; In the adhesive sheet preparation process, an adhesive sheet in which only the substrate constituting the adhesive sheet AS can be deformed by a predetermined second energy can also be prepared; In the adhesive sheet preparation process, an adhesive sheet in which only the adhesive layer constituting the adhesive sheet AS can be deformed by a predetermined second energy can also be prepared; In the adhesive sheet preparation process, an adhesive sheet in which both the substrate and the adhesive layer constituting the adhesive sheet AS can be deformed by a predetermined second energy can also be prepared; In the adhesive sheet preparation process, it is also possible to… An adhesive sheet AS is prepared by laminating a substrate onto an adhesive layer and depositing a material deformable by a predetermined second energy onto the substrate. During the adhesive sheet preparation process, a substrate with a substrate deposited on it can be pulled out using the sheet attachment unit 10. During the pulling out of the substrate, a material deformable by a predetermined second energy is deposited on the substrate to prepare an adhesive sheet AS capable of deforming by a predetermined second energy. The adhesive sheet preparation process can also prepare adhesive sheets AS that are cured by a predetermined second energy with or without shrinkage or expansion. Furthermore, the adhesive sheet preparation process can also prepare adhesive sheets AS that undergo different deformations caused by various different energies as the predetermined second energy. Additionally, the adhesive sheet preparation process can also prepare adhesive sheets AS that are cured by a predetermined energy without deforming due to a predetermined second energy.Regarding the substrate WK, the substrate WK may not have an annular protrusion CV on its outer edge; the substrate WK may also have a cover sheet CS attached to the surface WK3 on the other side that does not include the annular protrusion CV; the substrate WK may also have a cover sheet CS attached to at least one of the surface WK2 on one side and the surface WK3 on the other side; the substrate WK may also not have a cover sheet CS attached to both the surface WK2 on one side and the surface WK3 on the other side. Regarding the untreated area WK1, the untreated area WK1 can be the outer edge of the bonded body WK or other areas; the untreated area WK1 can also be a part of the outer edge of the bonded body WK or other areas, such as the outer edge of only one side of the surface WK2 of the bonded body WK, or the outer edge of only one side of the surface WK3 of the bonded body WK, or the central part of only one side of the surface WK2 of the bonded body WK, or the central part of only one side of the surface WK3 of the bonded body WK, etc., any location, or it can be an area including a recess; or it can be an area without a protrusion CV or a recess, etc.; or it can be any location including the outer edge or central part of the surface WK2 of one side or the surface WK3 of the bonded body WK. The materials, types, and shapes of the bonding pad AS, cover plate CS, and bonded body WK in this invention are not particularly limited. For example, the bonding pad AS, cover plate CS, and bonded body WK can be polygons such as circles, ellipses, triangles, or quadrilaterals, or other shapes; the bonding pad AS and cover plate CS can also be pressure-sensitive bonding, heat-sensitive bonding, or other bonding forms. When using heat-sensitive bonding pad AS and cover plate CS, bonding can be performed in an appropriate manner, such as by providing a heating unit, such as a suitable coil heater or a heating side of a heat pipe, for heating the bonding pad AS and cover plate CS. Furthermore, such adhesive sheets AS and cover sheets CS can be, for example, single-layer sheets having only an adhesive layer; two-layer sheets formed by laminating a substrate and an adhesive layer; three-layer or more sheets formed by laminating one or more intermediate layers between the substrate and the adhesive layer; three-layer or more sheets with one or more cover layers on the upper surface of the substrate; sheets where the substrate, intermediate layers, or cover layers are peelable; single-layer double-sided adhesive sheets consisting only of an adhesive layer; double-sided adhesive sheets with adhesive layers on the two outermost outermost surfaces of one or more intermediate layers, etc., and can be any type of sheet. Further, the bonded object WK can be, for example, a semiconductor wafer such as food, resin container, silicon semiconductor wafer or compound semiconductor wafer, an information recording substrate such as a circuit board or optical disc, a single material such as a glass plate, steel plate, ceramic, wood board, or resin, or a composite material formed from two or more of these materials, and can be used as an object for components or articles of any shape. In addition, the terms AS and CS can be replaced with functional or application-specific terms, such as labels for information recording, decorative labels, protective sheets, cutting tapes, die attach films, die bond tapes, recording layer forming resin sheets, and any other sheets, films, or tapes. The drive device in the aforementioned embodiments can employ: electric devices such as rotary motors, direct-drive motors, linear motors, single-axis robots, and multi-joint robots with two or more axes; actuators such as air cylinders, hydraulic cylinders, rod-less cylinders, and rotary cylinders; and drive devices composed of these directly or indirectly combined. In the aforementioned embodiments, when a rotating member such as a roller is used, a drive device for rotating the rotating member may also be provided; the surface of the rotating member or the rotating member itself may be made of a deformable member such as rubber or resin; the surface of the rotating member or the rotating member itself may be made of a non-deformable member; rotating or non-rotating shafts or blades may be used instead of rollers; when a pressing unit such as a pressing roller or pressing head or a member for pressing an object is used, rollers, round bars, blades, or brush-shaped members may be used instead of the aforementioned exemplary members or used in conjunction with the aforementioned exemplary members; additionally, the method of injecting air or other gases may be used. The pressing component can be made of deformable components such as rubber, resin, or sponge; it can also be made of non-deformable components such as metal or resin. When a peeling unit or peeling component for peeling off the object is used, such as a peeling plate or peeling roller, plate-shaped components, round bars, rollers, etc., can be used instead of or in conjunction with the aforementioned exemplary components. The peeling component can be made of deformable components such as rubber or resin, or it can be made of non-deformable components. When a support (holding) unit or support (holding) component is used to support (hold) the supported component (held component), it can also be used in mechanical clamps. The structure consists of a holding unit such as a chuck or chuck cylinder, Coulomb force, adhesive (adhesive sheet, adhesive tape), magnetic force, Bernoulli adsorption, suction adsorption, and a drive device to support (hold) the supported member; when a cutting unit or cutting member is used to cut the member or to form a cut or cutting line on the member, it can replace the above-described member or be used in conjunction with the above-described member for cutting by means of cutting blades, laser cutters, ion beams, thermal power, heat, water pressure, electric heating wires, gas or liquid jets, etc., or to move a member of a device composed of appropriate drive devices to perform cutting. 10: Sheet attaching unit; 11: Base plate; 12: Support roller; 13: Guide roller; 14: Peeling plate; 14A: Peeling edge; 15: Pressing roller; 16: Drive roller; 16A: Rotary motor; 16B: Pressure roller; 17: Recovering roller; 18: Deformation unit; 18A: Direct-drive motor; 18B: Output shaft; 18C: Heating device; 18D: Air supply device; 18E: Exhaust port; 19: Re-pressing roller; 20: Energy imparting unit; 21: Energy imparting device; 21A: Energy generation device; 30: Processing unit; 31: Articulated robot (displacement unit). 31A: Front arm 32: Conveying arm 32A: First support member 33: Abutting member 34: Rotary motor 34A: Output shaft 35: Gripper 36: Linear motor 36A: Slider 37: Receiving member 38: Plating tank 38A: Plating aqueous solution 40: Differentiating unit 41: Cutting arm 41A: Second support member 42: Cutting blade 43: Base 43A: Upper surface 43B: Recessed groove 44: Loading table 44A: Holding surface 44B: Groove 44R: (Loading table) center 50: Unprocessed area removal unit 60: Conveying unit 61: Linear motor 61A: Slider 62: Motor 62A: Output shaft; 62R: Rotation center; 63: Support platform; 63A: Holding surface; AA: Figure AS: Adhesive piece; ASH: Protruding area; BB: Figure CC: Position; CS: Cover piece; CU: Cutout; CV: Protrusion; DD: Position; DR: Arrow; EA: Adhesive body processing device; HA: Hot gas; RD: Counterclockwise rotation direction; RL: Peeling piece; RS: Raw material piece; UP: Integrated material; UV: Ultraviolet light; WK: Adhesive body; WK1: Untreated area; WK2: Surface on one side; WK3: Surface on the other side; WKA: First adhesive body portion; WKB: Second adhesive body portion; WKR: Reference position. [Figure 1] is an explanatory diagram of a substrate processing apparatus according to an embodiment of the present invention and an explanatory diagram of the operation of the substrate processing apparatus. [Figure 2] is an explanatory diagram of the operation of the substrate processing apparatus. 10: Sheet mounting unit 11: Base Plate 12: Support roller 13: Guide rollers 14: Peeling plate 14A: Peeling edge 15: Pressing roller 16: Drive roller 16A: Rotary motor 16B: Pressure Roller 17: Recycling Roller 18: Deformation Unit 18A: Direct-acting motor 18B: Output shaft 18C: Heating device 18D: Air supply device 18E: Exhaust port 19: Press the pressure roller again 20: Energy-Generating Unit 21: Energy Conversion Device 21A: Energy Generation Device 30: Processing Unit 31: Articulated Robot (Transmission Unit) 31A: Forearm 32:Conveying arm 32A: First supporting member 33: Abutment component 34: Rotate the motor 34A: Output shaft 35: Gripper 36: Linear Motor 36A: Slider 37: Retaining component 38: Plating tank 38A: Aqueous solution for plating 40: Differentiating Units 41: Cut-off arm 41A: Second support member 42: Cutting knife 43:Abutment 43A: Upper surface 43B: Setback Ditch 44: Platform 44A: Maintain surface 44B: Groove 44R: (Platform) Center 50: Unprocessed area removal unit 60: Transport Unit 61: Linear Motor 61A: Slider 62: Motor 62A: Output shaft 62R: Center of Rotation 63: Support platform 63A: Maintain surface AA: Picture AS: Continuing film ASH: Highlighting Area BB: Picture CC: Position CS: Cover sheet CV: convex part DD: Location DR: Arrow EA: Adhesive processing device HA: Hot air RD: Counterclockwise rotation direction RL: Peeling tablet RS: Raw material sheet UP: One-piece object WK: The body that is attached WK1: No-processing area WK2: Surface on one side WK3: The surface on the other side WKR: Reference Position

Claims

1. A substrate processing method, comprising applying a predetermined treatment to the substrate; wherein the substrate processing method comprises: a patch attachment step, wherein an outer edge portion of the substrate is designated as an untreated area, and an adhesive patch is attached to the untreated area so as not to cover the central portion of the substrate and such that the predetermined treatment does not reach the untreated area; and a processing step, wherein the predetermined treatment is applied to the substrate; wherein the substrate processing method further comprises: an adhesive patch preparation step, wherein an adhesive patch capable of being cured by a predetermined energy is prepared as the adhesive patch; and an energy application step, wherein, in the preceding stage of the processing step, the predetermined energy is applied to the adhesive patch attached to the substrate to cure the adhesive patch.

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