Ultrapure water supply apparatus, substrate processing system including the same, and substrate processing method using the same

Abstract

An ultrapure water supply apparatus, a substrate processing system, and a substrate processing method are provided. The ultrapure water supply apparatus includes: a first supply device for generating first ultrapure water; a second supply device for generating second ultrapure water; a first reserved supply device for supplying a portion of the fluid in the first supply device to the second supply device; and a second reserved supply device for supplying a portion of the fluid in the second supply device to the first supply device. The first supply device includes a first front-side filter component, a first rear-side filter component, and a first connecting component. The second supply device includes a second front-side filter component, a second rear-side filter component, and a second connecting component. Each of the first reserved supply device and the second reserved supply device connects the first connecting component and the second connecting component to each other.

Description

Ultrapure Water Supply Device, Substrate Processing System Comprising the Same, and Substrate Processing Method Using the Same The present disclosure relates to an ultrapure water supply device, a substrate processing system including the ultrapure water supply device, and a substrate processing method using the ultrapure water supply device, and more particularly, to an ultrapure water supply device capable of stably supplying ultrapure water at a flow rate at or above a specific level, a substrate processing system including the ultrapure water supply device, and a substrate processing method using the ultrapure water supply device. [Cross-reference to Related Applications] This U.S. application claims priority under 35 U.S.C § 119 to Korean Patent Application No. 10-2022-0035146, filed with the Korean Intellectual Property Office on Mar. 22, 2022, the entire disclosure of which is incorporated herein by reference. Semiconductor devices can be fabricated through a series of processes. For example, semiconductor devices can be manufactured by performing lithography processes, etching processes, deposition processes, polishing processes, and cleaning processes on silicon wafers. Such processes can use ultrapure water (UPW). Ultrapure water can indicate water having a low conductivity and fewer impurities. Ultrapure water can be generated through a separate process. It may be necessary to supply the generated ultrapure water to a substrate processing device at a specific flow rate or a flow rate higher than a specific flow rate. One or more embodiments of the present disclosure provide an ultrapure water supply device capable of stably supplying ultrapure water to two or more semiconductor production lines, a substrate processing system including the ultrapure water supply device, and a substrate processing method using the ultrapure water supply device. One or more embodiments of the present disclosure provide an ultrapure water supply device capable of continuously supplying ultrapure water having a constant quality, a substrate processing system including the ultrapure water supply device, and a substrate processing method using the ultrapure water supply device. One or more embodiments of the present disclosure provide an ultrapure water supply device capable of preparing for a certain failure of equipment, a substrate processing system including the ultrapure water supply device, and a substrate processing method using the ultrapure water supply device. Aspects of the present disclosure are not limited to the aspects mentioned above, and those skilled in the art will clearly understand other aspects not mentioned above from the following description. According to aspects of an exemplary embodiment, an ultrapure water supply device includes: a first supply device configured to generate first ultrapure water; a second supply device configured to generate second ultrapure water; a first reserve supply device configured to provide a portion of the fluid in the first supply device to the second supply device; and a second reserve supply device configured to provide a portion of the fluid in the second supply device to the first supply device. The first supply device includes: a first front-side filtering component; a first rear-side filtering component configured to filter the fluid passing through the first front-side filtering component; and a first connection component located between the first front-side filtering component and the first rear-side filtering component. The second supply device includes: a second front-side filtering component; a second rear-side filtering component configured to filter the fluid passing through the second front-side filtering component; and a second connection component located between the second front-side filtering component and the second rear-side filtering component, wherein each of the first reserve supply device and the second reserve supply device connects the first connection component and the second connection component to each other. According to aspects of an exemplary embodiment, a substrate processing system includes: a first production line configured to process a substrate; a second production line spaced apart from the first production line; a first supply device configured to supply first ultrapure water to the first production line; a second supply device configured to supply second ultrapure water to the second production line; and a reserve supply device connecting the first supply device and the second supply device to each other. The first supply device includes: a first front-side filtering component; and a first connection component configured to provide the fluid passing through the first front-side filtering component to the first production line. The second supply device includes: a second front-side filtering component; and a second connection component configured to provide the fluid passing through the second front-side filtering component to the second production line, wherein a first end of the reserve supply device is connected to the first connection component, and wherein a second end of the reserve supply device is connected to the second connection component. According to aspects of an exemplary embodiment, a substrate processing method includes: supplying first ultrapure water to a first production line; treating a substrate on the first production line using the first ultrapure water supplied to the first production line; supplying second ultrapure water to a second production line; and treating a substrate on the second production line using the second ultrapure water supplied to the second production line. Supplying the first ultrapure water to the first production line includes supplying the first ultrapure water from a first supply device to the first production line. Supplying the second ultrapure water to the second production line includes: supplying the second ultrapure water from a second supply device to the second production line; monitoring a flow rate of the second ultrapure water supplied to the second production line; and supplying water from the first supply device to the second supply device based on the flow rate of the second ultrapure water supplied to the second production line. Details of other exemplary embodiments are included in the description and the drawings. Exemplary embodiments of the present disclosure will now be described with reference to the accompanying drawings. Throughout the description and all the figures, the same reference numerals may indicate the same components. FIG. 1 shows a schematic diagram of a substrate processing system according to some embodiments of the present disclosure. Referring to FIG. 1, a substrate processing system ST may be provided. The substrate processing system ST may be a system in which one or more processes are performed on a substrate. The substrate may include a wafer-type silicon (Si) substrate, but the embodiments of the present disclosure are not limited thereto. The substrate processing system ST may be configured to perform various processes on the substrate. For example, the substrate processing system ST may perform a polishing process, a cleaning process, and / or an etching process on the substrate. According to an embodiment, such processes may include the use of ultrapure water (UPW). The substrate processing system ST may include a first production line L1, a second production line L2, an ultrapure water supply device A, and a controller C. Each of the first production line L1 and the second production line L2 may be configured to perform various processes on the substrate. Each of the first production line L1 and the second production line L2 may include a plurality of substrate processing chambers CH. Each of the plurality of substrate processing chambers CH may be one of a substrate polishing device, a substrate cleaning device, and an etching device. The first production line L1 may be spaced apart from the second production line L2. For example, the first production line L1 and the second production line L2 may be on different floors. The ultrapure water device A may supply ultrapure water to the first production line L1 and the second production line L2. For example, the ultrapure water supply device A may generate ultrapure water from fresh water and supply the ultrapure water to the first production line L1 and / or the second production line L2. The ultrapure water supply device A may include a first supply device 1, a second supply device 3, a first reserved supply device 5, and a second reserved supply device 7. The first supply device 1 may generate and supply ultrapure water. For example, the first supply device 1 may supply ultrapure water to the first production line L1. Additionally, in certain cases, the first supply device 1 may be used to supply ultrapure water to the second production line L2. For example, according to an embodiment, the first supply device 1 may supply a fluid (e.g., ultrapure water, de-ionized water (DIW), or other types of water) to the second supply device 3, and the second supply device 3 may then supply ultrapure water to the second production line L2 based on such fluid. The first supply device 1 may include a first front-side filtering component 11, a first rear-side filtering component 15, and a first connection component 13. The first front-side filtering component 11 may be provided with fresh water and may filter the fresh water. The first front-side filtering component 11 may include various filtering devices (e.g., filters). The fresh water may be converted into de-ionized water (DIW) while passing through the first front-side filtering component 11. The first connection component 13 may receive the fluid that has passed through the first front-side filtering component 11. The first rear-side filtering component 15 can be connected to the first front-side filtering component 11. The first rear-side filtering component 15 can filter the fluid that has passed through the first front-side filtering component 11 again. The first rear-side filtering component 15 can include filtering equipment (e.g., a filter). The first production line L1 can be supplied with ultrapure water converted from the fluid that has passed through the first rear-side filtering component 15. The first connecting component 13 can be located between the first front-side filtering component 11 and the first rear-side filtering component 15. For example, the first front-side filtering component 11, the first connecting component 13, and the first rear-side filtering component 15 can be connected in series to each other. The first connecting component 13 can supply a part of the fluid that has passed through the first front-side filtering component 11 to the first rear-side filtering component 15. The first connecting component 13 can be connected to the first reserved supply device 5 and the second reserved supply device 7. The first connecting component 13 can supply another part of the fluid that has passed through the first front-side filtering component 11 to the first reserved supply device 5. A detailed description of the first supply device 1 will be provided further below. The second supply device 3 can be different from the first supply device 1. For example, the second supply device 3 can be an instrument independent of the first supply device 1. The second supply device 3 can generate and supply ultrapure water. For example, the second supply device 3 can supply ultrapure water to the second production line L2. Additionally, in some cases, the second supply device 3 can be used to supply ultrapure water to the first production line L1. For example, according to an embodiment, the second supply device 3 can supply a fluid (e.g., ultrapure water, deionized water, or other types of water) to the first supply device 1, and the first supply device 1 then supplies ultrapure water to the first production line L1 based on this fluid. The second supply device 3 can include a second front-side filtering component 31, a second rear-side filtering component 35, and a second connecting component 33. The second front-side filtering component 31 can be supplied with fresh water and can filter the fresh water. The second front-side filtering component 31 can include various filtering equipment (e.g., a filter). The fresh water can be converted into deionized water (DIW) while passing through the second front-side filtering component 31. The second connecting component 33 can receive the fluid that has passed through the second front-side filtering component 31. The second rear-side filtering component 35 can be connected to the second front-side filtering component 31. The second rear-side filtering component 35 can filter the fluid that has passed through the second front-side filtering component 31 again. The second rear-side filtering component 35 can include filtering equipment (e.g., a filter). The second production line L2 can be supplied with ultrapure water converted from the fluid that has passed through the second rear-side filtering component 35. The second connection component 33 can be located between the second front-side filtering component 31 and the second rear-side filtering component 35. For example, the second front-side filtering component 31, the second connection component 33, and the second rear-side filtering component 35 can be connected in series to each other. The second connection component 33 can supply a part of the fluid that has passed through the second front-side filtering component 31 to the second rear-side filtering component 35. The second connection component 33 can be connected to the first reserved supply device 5 and the second reserved supply device 7. The second connection component 33 can supply another part of the fluid that has passed through the second front-side filtering component 31 to the second reserved supply device 7. The first reserved supply device 5 can connect the first supply device 1 to the second supply device 3. For example, the first reserved supply device 5 can connect the first connection component 13 to the second connection component 33. A part of the fluid that has passed through the first front-side filtering component 11 can be supplied to the second production line L2 via the first reserved supply device 5. The first reserved supply device 5 can include a first reserved pipe 51 and a first reserved bypass device 5a. A detailed description thereof will be provided further below. The second reserved supply device 7 can connect the second supply device 3 to the first supply device 1. For example, the second reserved supply device 7 can connect the second connection component 33 to the first connection component 13. A part of the fluid that has passed through the second front-side filtering component 31 can be supplied to the first production line L1 via the second reserved supply device 7. The second reserved supply device 7 can include a second reserved pipe 71 and a second reserved bypass device 7a. A detailed description thereof will be provided further below. The controller C can control the ultrapure water supply device A. For example, the controller C can receive signals from the first connection component 13 and / or the second connection component 33 and can control the first reserved supply device 5 and / or the second reserved supply device 7. More specifically, when there is a signal indicating that the flow rate of the fluid supplied from the second connection component 33 to the second rear-side filtering component 35 is insufficient, the controller C can control the first reserved supply device 5 to allow the second production line L2 to receive a part of the fluid discharged from the first front-side filtering component 11. A detailed description thereof will be provided further below. According to an embodiment, the controller C can include at least one processor and a memory for storing computer instructions. The computer instructions, when executed by the at least one processor, can cause the at least one processor to implement the functions of the controller C. For example, the functions can include the control functions described herein (including the control functions described with reference to FIG. 8). FIG. 2 shows an enlarged schematic view of the first front-side filtering component in the substrate processing system shown in FIG. 1. Referring to FIG. 2, the first front-side filtering component 11 may include a plurality of filtering devices. For example, the first front-side filtering component 11 may include a first filtering device 113, a second filtering device 115, and a third filtering device 117. Each of the first filtering device 113, the second filtering device 115, and the third filtering device 117 may include one of an activated carbon filter device, an ion exchange resin device, a reverse osmosis membrane device, and a hollow fiber membrane device. The plurality of filtering devices may be connected to each other in series. The plurality of filtering devices may be connected to each other by a first front-side filtering pipe 111. A buffer tank may be provided between the plurality of filtering devices. For example, a first tank T1 may be located in front of the first filtering device 113. A second tank T2 may be located between the first filtering device 113 and the second filtering device 115. A third tank T3 may be located between the second filtering device 115 and the third filtering device 117. A fourth tank T4 may be located behind the third filtering device 117. Fresh water supplied from the outside may be filtered while passing through the plurality of filtering devices. For example, the fluid that has passed through the plurality of filtering devices may be converted into deionized water (DIW). According to an embodiment of the present disclosure, the second front-side filtering component 31 may have the same or similar structure as the first front-side filtering component 11. Therefore, an exemplary structure of the second front-side filtering component 31 may be understood based on FIG. 2. FIG. 3 shows an enlarged schematic view showing a first connection component and a first rear-side filtering component in the substrate processing system shown in FIG. 1. Referring to FIG. 3, the first connection component 13 may include a first connection pipe 131, a first connection bypass device 13a, a first connection valve 135, and a first flow meter 133. The first connection pipe 131 may connect the first front-side filtering component 11 (refer to FIG. 2) to the first rear-side filtering component 15. The first connection bypass device 13a may be coupled to the first connection pipe 131. The first connection bypass device 13a may provide a path for bypassing the first connection pipe 131. Therefore, it may be possible to prepare for the failure of certain devices. As an alternative, the first connection bypass device 13a may be used for flushing. A detailed description thereof will be further provided below. The first connection valve 135 may be located on the first connection pipe 131. The first connection valve 135 may control the flow rate of the fluid in the first connection pipe 131. The first connection valve 135 may include a level control valve (LCV), but the embodiments of the present disclosure are not limited thereto. The first flow meter 133 may be located on the first connecting pipe 131. The first flow meter 133 may be disposed adjacent to the first connection valve 135. For example, the first flow meter 133 may be located in front of the first connection valve 135. The first flow meter 133 may detect the flow rate of the fluid flowing in the first connecting pipe 131. The first flow meter 133 may include a mass flow meter (MFC). However, the embodiments of the present disclosure are not limited thereto, and the first flow meter 133 may include various devices capable of measuring the flow rate of the fluid. The first flow meter 133 may provide information on the flow rate of the fluid flowing in the first connecting pipe 131 to the controller C (refer to FIG. 1). According to an embodiment, the controller C may receive the information via a wired connection or a wireless connection between the first flow meter 133 and the controller C. The first rear-side filtering component 15 may include a first rear-side filtering pipe 151, a first rear-side filtering device 153, and a fifth tank T5. The first rear-side filtering pipe 151 may be connected to the first connecting pipe 131. The first rear-side filtering device 153 may be located on the first rear-side filtering pipe 151. The first rear-side filtering device 153 may include an instrument capable of filtering the fluid. For example, the first rear-side filtering device 153 may include one of an activated carbon filtering device, an ion exchange resin device, a reverse osmosis membrane device, and a hollow fiber membrane device. The fifth tank T5 may be located behind the first rear-side filtering device 153. The fluid that has passed through the first rear-side filtering component 15 may be converted into ultrapure water. The ultrapure water may be provided to the first production line L1 (see FIG. 1). FIG. 4 shows an enlarged schematic view partially showing the first connection component shown in FIG. 3. Referring to FIG. 4, the first connection bypass device 13a may include a first valve 137, a first connection bypass pipe 139, a first connection bypass valve 132, and first connection shut-off valves 134 and 136. The first valve 137 may be located on the first connecting pipe 131. The first valve 137 may control the flow rate of the fluid flowing in the first connecting pipe 131. The first valve 137 may include an automatic valve. In this case, the first valve 137 may be automatically opened and closed by the controller C (refer to FIG. 1). The first connection bypass pipe 139 may be connected to the first connecting pipe 131. The first connection bypass pipe 139 may bypass the first valve 137. For example, one end of the first connection bypass pipe 139 may be connected to the first connecting pipe 131 in front of the first valve 137, and the other end of the first connection bypass pipe 139 may be connected to the first connecting pipe 131 behind the first valve 137. The first connection bypass valve 132 may be located on the first connection bypass pipe 139. The first connection bypass valve 132 may include a manual valve, but the embodiments of the present disclosure are not limited thereto. The first connection shut-off valves 134 and 136 can be located on the first connecting pipe 131. For example, the first connection shut-off valves 134 and 136 can be coupled to the first connecting pipe 131 between the first valve 137 and the first connection bypass pipe 139. Two first connection shut-off valves 134 and 136 can be provided. One of the two first connection shut-off valves 134 and 136 can be located in front of the first valve 137, and the other of the two first connection shut-off valves 134 and 136 can be located behind the first valve 137. When the first connection shut-off valves 134 and 136 are closed, no fluid can move to the first valve 137. In this case, when the first connection bypass valve 132 is opened, the fluid can move through the first connection bypass pipe 139. When the first valve 137 is in an abnormal state, the first connection shut-off valves 134 and 136 can be closed and the first connection bypass valve 132 can be opened, and such valve operation can allow the fluid to flow through the first connection bypass pipe 139. During the bypass of the fluid, the first valve 137 can be repaired. According to an embodiment of the present disclosure, the second connection component 33 can have the same or similar structure as the first connection component 13. Therefore, the exemplary structure of the second connection component 33 can be understood based on FIGS. 3 to 4. FIG. 5 shows an enlarged schematic view showing the first reserved supply device. Referring to FIGS. 1, 3, and 5, one end of the first reserved pipe 51 can be connected to the first connecting pipe 131. Additionally, the other end of the first reserved pipe 51 can be connected to the second connecting pipe (not denoted by a reference numeral) of the second connection component 33. Referring to FIG. 5, the first reserved bypass device 5a can include a first reserved valve 57, a first bypass pipe 59, a first bypass valve 52, first shut-off valves 54 and 56, a first resistivity meter 53, and a first pressure sensor 55. The first reserved valve 57 can be located on the first reserved pipe 51. The first reserved valve 57 can control the flow rate of the fluid flowing in the first reserved pipe 51. The first reserved valve 57 can include an automatic valve. In this case, the first reserved valve 57 can be automatically opened and closed by the controller C (refer to FIG. 1). The first bypass pipe 59 can be connected to the first reserved pipe 51. The first bypass pipe 59 can bypass the first reserved valve 57. For example, one end of the first bypass pipe 59 can be connected to the first reserved pipe 51 in front of the first reserved valve 57, and the other end of the first bypass pipe 59 can be connected to the first reserved pipe 51 behind the first reserved valve 57. The first bypass valve 52 can be located on the first bypass pipe 59. The first bypass valve 52 can include a manual valve, but the embodiments of the present disclosure are not limited thereto. The first shut-off valves 54 and 56 can be located on the first reserved pipe 51. For example, the first shut-off valves 54 and 56 can be coupled to the first reserved pipe 51 between the first reserved valve 57 and the first bypass pipe 59. Two first shut-off valves 54 and 56 can be provided. One of the two first shut-off valves 54 and 56 can be located in front of the first reserved valve 57, and the other of the two first shut-off valves 54 and 56 can be located behind the first reserved valve 57. When the first shut-off valves 54 and 56 are closed, no fluid can move to the first reserved valve 57. In this case, when the first bypass valve 52 is opened, the fluid can move through the first bypass pipe 59. The first resistivity meter 53 can be located on the first reserved pipe 51. The first resistivity meter 53 can measure the resistivity of the fluid flowing in the first reserved pipe 51. When measuring the resistivity of the fluid, high-quality ultrapure water may be obtained. For example, the first resistivity meter 53 can detect the quality of the fluid. The controller C (refer to FIG. 1) can receive the information of the resistivity measured by the first resistivity meter 53. According to an embodiment, the controller C can receive the information via a wired connection or a wireless connection between the first resistivity meter 53 and the controller C. The first pressure sensor 55 can be located on the first reserved pipe 51. The first pressure sensor 55 can measure the pressure of the fluid flowing in the first reserved pipe 51. The first pressure sensor 55 can include a main pressure gauge such as a pressure gauge or a barometer, a secondary pressure gauge such as a Bourdon tube pressure gauge, and a pressure transmitter. However, the embodiments of the present disclosure are not limited thereto, and the first pressure sensor 55 can include any other suitable configuration capable of measuring and transmitting the pressure of the fluid in the first reserved pipe 51. When the pressure of the fluid in the first reserved pipe 51 is lower than the atmospheric pressure, the first pressure sensor 55 can send an abnormal signal to the controller C. In this case, some measures can be taken to increase the pressure of the fluid in the first reserved pipe 51. Further details thereof will be provided below. According to an embodiment, the controller C can receive the signal from the first pressure sensor 55 via a wired connection or a wireless connection between the first pressure sensor 55 and the controller C. According to an embodiment of the present disclosure, the second reserved bypass device 7a can have the same or similar structure as the first reserved bypass device 5a. Therefore, the exemplary structure of the second reserved bypass device 7a can be understood based on FIG. 5. FIG. 6 shows a cross-sectional view showing an example of a substrate processing chamber in a substrate processing system according to some embodiments of the present disclosure. Referring to FIG. 6, the substrate processing chamber CH can include a substrate cleaning device. In this case, the substrate processing chamber CH can include a cleaning chamber 41, a cleaning table 43, a rotation driving mechanism 45, a cleaning nozzle N1, and a cleaning bowl 47. The cleaning chamber 41 can provide a cleaning space 4h. A cleaning process can be performed on the substrate W in the cleaning chamber 41. The cleaning stage 43 can be located in the cleaning chamber 41. The cleaning stage 43 can support the substrate W. The rotation drive mechanism 45 can rotate the cleaning stage 43. Thus, the substrate W can rotate on the rotating cleaning stage 43. According to an embodiment, the rotation drive mechanism 45 can include, for example, an actuator (e.g., a motor) that rotates the cleaning stage 43. The cleaning nozzle N1 can be disposed at an upward interval from the cleaning stage 43. The cleaning nozzle N1 can be connected to the ultrapure water supply device A. Ultrapure water can be supplied from the ultrapure water supply device A to the cleaning nozzle N1 and thereby sprayed onto the substrate W. The substrate W on the cleaning stage 43 can be cleaned by the ultrapure water sprayed from the cleaning nozzle N1. In this case, the cleaning stage 43 and the substrate W thereon can rotate due to the rotation drive mechanism 45. The ultrapure water in contact with the top surface of the substrate W can be pushed outwards. The cleaning bowl 47 can surround the cleaning stage 43. The cleaning bowl 47 can collect the ultrapure water pushed outwards from the top surface of the substrate W. FIG. 7 shows a schematic perspective view illustrating an example of a substrate processing chamber in a substrate processing system according to some embodiments of the present disclosure. Referring to FIG. 7, the substrate processing chamber CH can include a substrate grinding device. In this case, the substrate processing chamber CH can include a grinding head 61, a grinding stage 63, a grinding pad 65, a conditioning disk 67, a head drive component HD, a conditioning drive component CD, a slurry supply component SLS, and a grinding nozzle N2. The polishing head 61 can support the substrate W. The polishing pad 65 can polish the substrate W supported by the polishing head 61. The polishing table 63 can rotate the polishing pad 65. The polishing pad 65 can polish one surface of the substrate W while being in contact with the substrate W. The dressing disk 67 can improve the condition of the top surface of the polishing pad 65. For example, the dressing disk 67 can polish the top surface of the polishing pad 65. The head driving part HD can rotate and / or translate the polishing head 61. According to an embodiment, the head driving component HD can include at least one actuator (e.g., a motor) to rotate and / or translate the polishing head 61. The dressing driving component CD can drive the dressing disk 67 to move. According to an embodiment, the dressing driving component CD can include at least one actuator (e.g., a motor) to drive the dressing disk 67 to move. The slurry supply component SLS can supply slurry to the polishing nozzle N2. The polishing nozzle N2 can be connected to the slurry supply component SLS and the ultrapure water supply device A. The ultrapure water supply device A can supply ultrapure water to the polishing nozzle N2. The polishing nozzle N2 can mix the slurry supplied from the slurry supply component SLS with the ultrapure water supplied from the ultrapure water supply device A, and can spray the mixture onto the polishing pad 65. Figures 6 and 7 show that the substrate processing chamber CH can be a substrate cleaning device or a substrate polishing device, but the embodiments of the present disclosure are not limited thereto. For example, the substrate processing chamber CH can include any other device in which an ultrapure water is used to perform a treatment process on the substrate. Figure 8 shows a flowchart illustrating a substrate processing method according to some embodiments of the present disclosure. Referring to Figure 8, a substrate processing method S can be provided. The substrate processing method S can be a method in which a substrate is processed using the substrate processing system ST discussed with reference to Figures 1 to 7. The substrate processing method S can include a step S1 of supplying ultrapure water to a first production line, a step S2 of processing the substrate on the first production line, a step S3 of supplying ultrapure water to a second production line, and a step S4 of processing the substrate on the second production line. The step S1 can include a step S11 of supplying ultrapure water from a first supply device to the first production line, a step S12 of monitoring the flow rate of the ultrapure water supplied to the first production line, and a step S13 of supplying water from a second supply device to the first supply device, such that the first supply device supplies ultrapure water to the first production line based on the water supplied from the second supply device to the first supply device. The step S3 can include a step S31 of supplying ultrapure water from the second supply device to the second production line, a step S32 of monitoring the flow rate of the ultrapure water supplied to the second production line, and a step S33 of supplying water from the first supply device to the second supply device, such that the second supply device supplies ultrapure water to the second production line based on the water supplied from the first supply device to the second supply device. It shows that the steps shown in FIG. 8 are implemented sequentially, but the embodiments of the present disclosure are not limited thereto. For example, the steps shown in FIG. 8 can be executed simultaneously, or can be implemented in the reverse order. The substrate processing method S shown in FIG. 8 will be described in detail below with reference to FIGS. 9 to 13. FIGS. 9 to 13 show schematic diagrams showing a substrate processing method according to the flowchart shown in FIG. 8. Referring to FIGS. 8, 9, 10 and 11, step S11 may include allowing the first fluid UPW1 that has passed through the first front-side filtering member 11 to enter the first production line L1 after sequentially passing through the first connection member 13 and the first back-side filtering member 15. The first fluid UPW1 can pass through the first back-side filtering member 15 and can be turned into ultrapure water. Step S12 may include allowing the first flowmeter 133 (refer to FIG. 3) of the first connection member 13 to measure the flow rate of the fluid in the first connection pipe 131. The controller C can be provided with the information of the flow rate of the fluid in the first connection pipe 131. When the flow rate of the fluid in the first connection pipe 131 is equal to or greater than a specific value, the controller C can determine that it is in a normal operation state. Referring to FIG. 11, based on the controller C determining the existence of a normal operation state, the first reserved valve 57 can be controlled by the controller C to close. Therefore, no fluid can pass through the first reserved valve 57. On the contrary, based on the controller C determining the existence of a normal operation state, the first bypass valve 52 can be controlled by the controller C to be partially opened. Therefore, after passing through the first front-side filtering member 11 (refer to FIG. 10), in step s33, a part UPW1x of the first fluid UPW1 (refer to FIG. 10) can move to the second supply device 3 via the first reserved supply device 5. For example, the part UPW1x of the first fluid UPW1 can pass through the first bypass valve 52 while moving along the first bypass pipe 59, and then can enter the second reserved supply device 7. Step S33 can be implemented even in a normal operation state. In this case, the part UPW1x of the first fluid UPW1 can flow at a relatively low rate. In short, step S31 can be similar to step S11. For example, the second fluid UPW2 that has passed through the second front-side filtering member 31 can be provided to the second production line L2 after sequentially passing through the second connection member 33 and the second back-side filtering member 35. Step S32 can be similar to step S12. Step S13 may be similar to step S33. For example, after passing through the second front filter member 31 (refer to FIG. 10), a part UPW2x of the second fluid UPW2 (refer to FIG. 10) may move to the first supply device 1 via the second reserved supply device 7. In short, step S13 can be implemented even in the normal operating state. In this case, the said part UPW2x of the second fluid UPW2 may flow at a relatively low rate. When the flow rate of the fluid in the first connecting pipe 131 is equal to or greater than a specific value or another specific value, the controller C may determine that it is in the normal operating state. Referring to FIGS. 12 and 13, based on the controller C determining the existence of an abnormal operating state, the first reserved valve 57 can be controlled by the controller C to open. Thus, the fluid can pass through the first reserved valve 57. In the abnormal operating state, the first bypass valve 52 can still be partially opened. Therefore, after passing through the first front filter member 11 (refer to FIG. 10), in step S33, a part UPW1y of the first fluid UPW1 (refer to FIG. 10) may move to the second supply device 3 via the first reserved supply device 5. For example, the said part UPW1y of the first fluid UPW1 may pass through the first reserved valve 57 while moving along the first reserved pipe 51, and then may enter the second reserved supply device 7. In short, step S33 can be implemented even in the abnormal operating state. In this case, since the first reserved valve 57 is opened, the said part UPW1y of the first fluid UPW1 may flow at a relatively high rate. Even in the case where the flow rate of the fluid in the second connecting member 33 is equal to or less than a specific value or another specific value, it can be similar to the above-mentioned situation. For example, in this case, the controller C may open the first reserved valve 57 to supply the ultra-pure water to the second production line L2 by supplying the said part UPW1y of the first fluid UPW1 from the first supply device 1 to the second supply device 3. As described above, step S13 can be implemented differently based on the flow rate of the ultra-pure water supplied to the first production line L1. In addition, step S33 can be implemented differently based on the flow rate of the ultra-pure water supplied to the second production line L2. Therefore, when a certain supply device fails, the ultra-pure water can be supplied to the line connected to the failed supply device at a sufficient flow rate based on the supply from all two supply devices. In some embodiments, step S33 may further include when the opening time length of the first reserved valve 57 exceeds a specific duration, allowing (or controlling) the first reserved valve 57 to close regardless of the flow rate of the ultra-pure water supplied to the second production line L2. Therefore, it may be possible to prevent the shortage of ultra-pure water supplied to the first production line L1. In some embodiments, step S33 may further include allowing (or controlling) the first reserved valve 57 to close and allowing (or controlling) the first bypass valve 52 to fully open when the first reserved valve 57 fails in an abnormal operating state. For example, in a situation where an abnormal operating state is detected, it may be necessary to supply fluid from the first supply device 1 to the second production line L2. However, when the first reserved valve 57 fails, the first bypass valve 52 may be fully opened so that the second production line L2 can receive ultrapure water at a sufficient flow rate by supplying the portion UPW1y of the first fluid UPW1 via the first bypass pipe 59. During this process, the first reserved valve 57 can be repaired. Step S33 may further include monitoring the pressure in the first reserved pipe 51 by the first pressure sensor 55. When the pressure of the fluid in the first reserved pipe 51 is lower than the atmospheric pressure, the first pressure sensor 55 may transmit an abnormal signal to the controller C. In such a case, one of the first bypass valve 52 and the first reserved valve 57 may be opened more by the controller C. Therefore, the pressure of the fluid in the first reserved pipe 51 can be maintained at a specific level or higher. For example, it is possible to prevent the pressure in the first reserved pipe 51 from becoming lower than the atmospheric pressure. The first reserved pipe 51 can always maintain its positive pressure therein. Therefore, it is possible to prevent the inside of the first reserved pipe 51 from being contaminated due to external substances leaking into the first reserved pipe 51. Referring back to FIGS. 6, 7, and 8, each of steps S2 and S4 may include cleaning the substrate W using ultrapure water supplied to the cleaning chamber 41. Alternatively, each of steps S2 and S4 may include polishing the substrate W using ultrapure water supplied to the substrate polishing device. According to an ultrapure water supply device, a substrate processing system including the ultrapure water supply device, and a substrate processing method using the ultrapure water supply device according to some embodiments of the present disclosure, ultrapure water can be stably supplied to two or more semiconductor production lines. For example, when the flow rate of the supplied fluid decreases due to an abnormality of one supply device, another supply device can be used so that the flow rate of the fluid can be maintained at a specific value or higher. Therefore, it may be possible to minimize damage to the substrates on the line. According to an ultrapure water supply device, a substrate processing system including the ultrapure water supply device, and a substrate processing method using the ultrapure water supply device according to some embodiments of the present disclosure, it may be possible to bypass the fluid in preparation for a certain failure of the equipment. For example, when a specific valve fails, the fluid can be bypassed to flow through the bypass valve, thereby obtaining the time required to repair the valve. An ultrapure water supply device according to some embodiments of the present disclosure, a substrate processing system including the ultrapure water supply device, and a substrate processing method using the ultrapure water supply device can locally open a valve to allow fluid to flow through a bypass pipe on a reserved supply device, and thus even in a normal operating state, the fluid can flow in the pipe. Therefore, any pipe can be prevented from being contaminated in a normal operating state, and the quality of the ultrapure water supplied in an abnormal operating state can be maintained at a specific level or higher. Ultrapure water may be cleaner than ordinary deionized water (DIW), and the presence of impurities in the water may induce damage to the substrate. Therefore, according to embodiments of the present disclosure, in an abnormal operating state, the reserved supply device can always be flushed to supply ultrapure water at a specific level or higher. In addition, a resistivity meter can be used to monitor the quality of the ultrapure water. FIG. 14 shows a simplified schematic diagram showing a substrate processing system according to some embodiments of the present disclosure. The following may omit the repeated description of substantially the same or similar content provided above with reference to FIGS. 1 to 13. Referring to FIG. 14, a substrate processing system STa can be provided. Different from the embodiment shown in FIG. 1, the substrate processing system STa can further include a first recovery pipe 81 and a second recovery pipe 83. The first recovery pipe 81 can connect the first connection member 13 and the first front-side filtering member 11 to each other to allow a part of the fluid in the first connection member 13 to move back to the first front-side filtering member 11. When the first rear-side filtering member 15 does not dispose of all the fluid supplied from the first front-side filtering member 11 at a specific rate, a part of the fluid may return to the first front-side filtering member 11. The second recovery pipe 83 can also have a function similar to that of the first recovery pipe 81. FIG. 15 shows a simplified schematic diagram showing a substrate processing system according to some embodiments of the present disclosure. The following may omit the repeated description of substantially the same or similar content provided above with reference to FIGS. 1 to 14. Referring to FIG. 15, a substrate processing system STb can be provided. Different from the embodiment shown in FIG. 1, in the substrate processing system STb, the first supply device 1b can include a plurality of first rear-side filtering members 15b. For example, two first rear-side filtering members 15b1 and 15b2 can be provided. Therefore, when the flow rate of the fluid supplied from the first front-side filtering member 11 increases, the two first rear-side filtering members 15b1 and 15b2 can dispose of all the fluid supplied at the increased flow rate. The first supply device 3b can also be similar to the first supply device 1b. According to an ultrapure water supply device, a substrate processing system including the ultrapure water supply device, and a substrate processing method using the ultrapure water supply device according to embodiments of the present disclosure, it may be possible to stably supply ultrapure water to two or more semiconductor production lines. According to an ultrapure water supply device, a substrate processing system including the ultrapure water supply device, and a substrate processing method using the ultrapure water supply device according to embodiments of the present disclosure, it may be possible to continuously supply ultrapure water with a constant quality. According to an ultrapure water supply device, a substrate processing system including the ultrapure water supply device, and a substrate processing method using the ultrapure water supply device according to embodiments of the present disclosure, it may be possible to prepare for certain failures of the equipment. The effects of the embodiments of the present disclosure are not limited to the effects mentioned above, and those skilled in the art will clearly understand other effects not mentioned above based on the above description. Although the exemplary embodiments of the present disclosure have been described in conjunction with the accompanying drawings, those skilled in the art will understand that various changes and modifications can be made without departing from the technical spirit of the present disclosure. Therefore, it will be understood that the above exemplary embodiments are illustrative only and not restrictive in all aspects. 1, 1b, 3b: First supply device 3: Second supply device 4h: Cleaning space 5: First reserved supply device 5a: First reserved bypass device 7: Second reserved supply device 7a: Second reserved bypass device 11: First front-side filtering component 13: First connecting component 13a: First connecting bypass device 15, 15b, 15b1, 15b2: First rear-side filtering component 31: Second front-side filtering component 33: Second connecting component 35: Second rear-side filtering component 41: Cleaning chamber 43: Cleaning table 45: Rotary drive mechanism 47: Cleaning bowl 51: First reserved pipe 52: First bypass valve 53: First resistivity meter 54, 56: First shut-off valve 55: First pressure sensor 57: First reserved valve 59: First bypass pipe 61: Polishing head 63: Polishing table 65: Polishing contact pad 67: Dressing disk 71: Second reserved pipe 81: First recovery pipe 83: Second recovery pipe 111: First front-side filtering pipe 113: First filtering device 115: Second filtering device 117: Third filtering device 131: First connecting pipe 132: First connecting bypass valve 133: First flow meter 134, 136: First connecting shut-off valve 135: First connecting valve 137: First valve 139: First connecting bypass pipe 151: First rear-side filtering pipe 153: First rear-side filtering device A: Ultra-pure water supply device C: Controller CD: Dressing drive component CH: Substrate processing chamber HD: Head drive component L1: First production line L2: Second production line N1: Cleaning nozzle N2: Polishing nozzle S: Substrate processing method S1, S2, S3, S4, S11, S12, S13, S31, S32, S33: Steps SLS: Slurry supply component ST, STa, STb: Substrate processing system T1: First tank T2: Second tank T3: Third tank T4: Fourth tank T5: Fifth tank UPW1: First fluid UPW1x, UPW1y, UPW2x: Parts UPW2: Second fluid W: Substrate Read the following detailed description with reference to the accompanying drawings, and the above and other aspects, features, and advantages of certain embodiments of the present disclosure will become more apparent. In the drawings: FIG. 1 shows a schematic diagram of a substrate processing system according to some embodiments of the present disclosure. FIG. 2 shows an enlarged schematic diagram of a first front-side filtering component in the substrate processing system shown in FIG. 1. FIG. 3 shows an enlarged schematic diagram of a first connection component and a first rear-side filtering component in the substrate processing system shown in FIG. 1. FIG. 4 shows a partially enlarged schematic diagram of the first connection component shown in FIG. 3. FIG. 5 shows an enlarged schematic diagram of a first reserved supply device. FIG. 6 shows a cross-sectional view of an example of a substrate processing chamber in a substrate processing system according to some embodiments of the present disclosure. FIG. 7 shows a schematic perspective view of an example of a substrate processing chamber in a substrate processing system according to some embodiments of the present disclosure. FIG. 8 shows a flowchart of a substrate processing method according to some embodiments of the present disclosure. FIG. 9 is a first schematic diagram showing the substrate processing method according to the flowchart shown in FIG. 8. FIG. 10 is a second schematic diagram showing the substrate processing method according to the flowchart shown in FIG. 8. FIG. 11 is a third schematic diagram showing the substrate processing method according to the flowchart shown in FIG. 8. FIG. 12 is a fourth schematic diagram showing the substrate processing method according to the flowchart shown in FIG. 8. FIG. 13 is a fifth schematic diagram showing the substrate processing method according to the flowchart shown in FIG. 8. FIG. 14 shows a simplified schematic diagram of a substrate processing system according to some embodiments of the present disclosure. FIG. 15 shows a simplified schematic diagram of a substrate processing system according to some embodiments of the present disclosure. 1: First supply device 3: Second supply device 5: First reserved supply device 5a: First reserved bypass device 7: Second reserved supply device 7a: Second reserved bypass device 11: First front-side filtering component 13: First connection component 15: First rear-side filtering component 31: Second front-side filtering component 33: Second connection component 35: Second rear-side filtering component 51: First reserved pipe 71: Second reserved pipe A: Ultra-pure water supply device C: Controller CH: Substrate processing chamber L1: First production line L2: Second production line ST: Substrate processing system

Claims

1. An ultrapure water supply device, comprising: The first supply unit is configured to generate the first ultrapure water; The second supply unit is configured to generate a second ultrapure water; A first reserved supply device is configured to supply a portion of the fluid in the first supply device to the second supply device; The first supply device includes a second reserved supply device configured to supply a portion of the fluid from the second supply device to the first supply device. The first supply device includes: a first front filter component; a first rear filter component configured to filter fluid passing through the first front filter component; and a first connecting component located between the first front filter component and the first rear filter component. The second supply device includes: a second front filter component; a second rear filter component configured to filter fluid passing through the second front filter component; and a second connecting component located between the second front filter component and the second rear filter component. The first reserved supply device connects the first connecting component to the second connecting component, and the second reserved supply device connects the second connecting component to the first connecting component. The first connecting component is configured to supply another portion of the fluid that has passed through the first front filter component to the first reserved supply device when a portion of the fluid that has passed through the first front filter component is supplied to the first rear filter component, such that the other portion of the fluid is supplied to the second rear filter component through the second connecting component.

2. The ultrapure water supply device as claimed in claim 1, wherein the first reserved supply device comprises: The first pre-reserved tube connects the first connecting component and the second connecting component to each other; And a first reserved valve, located on the first reserved pipe.

3. The ultrapure water supply device as claimed in claim 2, wherein the second reserved supply device comprises: First bypass pipe; and a first bypass valve located on the first bypass pipe, wherein a first end of the first bypass pipe is connected to the first reserved pipe in front of the first reserved valve, and wherein a second end of the first bypass pipe is connected to the first reserved pipe behind the first reserved valve.

4. The ultrapure water supply device as claimed in claim 3, wherein the first reserved supply device further includes a first shut-off valve located on the first reserved pipe between the first reserved valve and the first bypass pipe.

5. A substrate processing system, comprising: The first production line is configured to process substrates; The second production line is spaced apart from the first production line; The first supply equipment is configured to supply the first ultrapure water to the first production line; The second supply equipment is configured to supply the second ultrapure water to the second production line; The system includes a reserved supply device that connects the first supply device and the second supply device to each other. The first supply device includes a first front-side filter component and a first connecting component configured to supply fluid passing through the first front-side filter component to the first production line. The second supply device includes a second front-side filter component and a second connecting component configured to supply fluid passing through the second front-side filter component to the second production line. A first end of the reserved supply device is connected to the first connecting component, and a second end of the reserved supply device is connected to the second connecting component. The first connecting component is further configured to supply another portion of the fluid that has passed through the first front-side filter component to the reserved supply device when a portion of the fluid has passed through the first front-side filter component is supplied to the first production line, thereby supplying the other portion of the fluid to the second production line.

6. The substrate processing system as claimed in claim 5, wherein the reserved supply device comprises: The first pre-reserved tube connects the first connecting component and the second connecting component to each other; A first reserved valve is located on the first reserved pipe; a first bypass pipe; and a first bypass valve located on the first bypass pipe, wherein a first end of the first bypass pipe is connected to the first reserved pipe in front of the first reserved valve, and wherein a second end of the first bypass pipe is connected to the first reserved pipe behind the first reserved valve.

7. The substrate processing system of claim 6, wherein the second connection component comprises: A connecting pipe connects the second front-side filter component to the second production line; A flow meter is located on the connecting pipe, wherein the reserved supply device is connected to the connecting pipe between the flow meter and the second front filter component.

8. The substrate processing system of claim 7 further includes a controller configured to control the first reserved valve, wherein the controller is connected to the flow meter and configured to receive information from the flow meter, and wherein, Based on the flow rate of the fluid in the connecting pipe being equal to or less than a specific value, the controller is configured to control the first reserved valve to supply the fluid in the first supply device to the second supply device.

9. A substrate processing method, comprising: Supply the first batch of ultrapure water to the first production line; The substrates on the first production line are treated with the first ultrapure water supplied to the first production line. Supplying a second batch of ultrapure water to the second production line; The method includes processing a substrate on the second production line using the second ultrapure water supplied to the second production line, wherein supplying the first ultrapure water to the first production line includes supplying the first ultrapure water to the first production line from a first supply device, and wherein supplying the second ultrapure water to the second production line includes: supplying the second ultrapure water to the second production line from a second supply device; monitoring the flow rate of the second ultrapure water supplied to the second production line; and supplying water from the first supply device to the second supply device according to the flow rate of the second ultrapure water supplied to the second production line, wherein when a portion of the first ultrapure water is supplied from the first supply device to the first production line, another portion of the first ultrapure water is supplied from the first supply device to the second supply device.

10. The substrate processing method of claim 9, wherein supplying the second ultrapure water from the first supply device to the second supply device includes supplying the second ultrapure water from the first supply device to the second supply device via a first reserved supply device, wherein the first reserved supply device includes: A first reserved pipe connects the first supply device and the second supply device to each other; A first reserved valve is located on the first reserved pipe; a first bypass pipe; and a first bypass valve located on the first bypass pipe, wherein a first end of the first bypass pipe is connected to the first reserved pipe in front of the first reserved valve, and wherein a second end of the first bypass pipe is connected to the first reserved pipe behind the first reserved valve.

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