Aerosol generating apparatus

Abstract

The present invention provides a fog generating device comprising: a heating unit for heating a fog source; a first temperature sensor for measuring the temperature change of a measuring portion accompanying the heating of the heating unit; a first AD conversion circuit for converting the output voltage of the first temperature sensor into digital data; a second temperature sensor for measuring the temperature change of the heating unit; and a second AD conversion circuit for converting the output voltage of the second temperature sensor into digital data; wherein the conversion accuracy of the first AD conversion circuit is higher than that of the second AD conversion circuit, and the conversion speed of the second AD conversion circuit is faster than that of the first AD conversion circuit.

Description

Atomizing device The present disclosure relates to an atomizing device. In an atomizing device that is an electronic device of a portable type, various electronic components are mounted. For example, an MCU (Micro Controller Unit), a memory, an AD (Analog to Digital) conversion circuit, a sensor, a heater for heating, and an LED (Light Emitting Diode) are mounted in the atomizing device. Incidentally, a plurality of AD conversion circuits are mounted according to the voltage value or signal value that is the conversion target. [Prior art documents] [Patent documents] Patent Document 1: Chinese Utility Model No. 211882197 Gazette Patent Document 2: Chinese Invention Patent No. 108802606 Specification Patent Document 3: Chinese Utility Model No. 209563498 Specification In the atomizing device, a successive approximation type AD conversion circuit that is a general-purpose AD conversion circuit is used. The successive approximation type AD conversion circuit is known as an AD conversion circuit with good balance between conversion speed and conversion accuracy. However, in the case of an atomizing device having a heat source for heating an atomizing source, the temperature control of the heating part itself emphasizes the conversion speed, and the monitoring of the temperature around the heating part emphasizes the conversion accuracy. In view of the above problems, the present disclosure provides an atomizing device with high control speed of the temperature in the heating part and high detection accuracy of the temperature at the measurement part. As an aspect of the present disclosure, there is provided an atomizing device having: a heating part that heats an atomizing source; a first temperature sensor that measures the temperature change of a measurement part accompanying the heating of the heating part; a first AD conversion circuit that converts the output voltage of the first temperature sensor into digital data; a second temperature sensor that measures the temperature change of the heating part; and a second AD conversion circuit that converts the output voltage of the second temperature sensor into digital data; wherein the conversion accuracy of the first AD conversion circuit is higher than that of the second AD conversion circuit, and the conversion speed of the second AD conversion circuit is faster than that of the first AD conversion circuit. Here, the first AD conversion circuit can use a Sigma-Delta type AD conversion circuit, and the second AD conversion circuit can use a successive approximation type or a pipeline type AD conversion circuit. Furthermore, the first temperature sensor can also operate using the reference voltage of the first AD conversion circuit as the operating power supply. The first temperature sensor may also have a non-linear temperature characteristic. The first temperature sensor can also measure the temperature of the housing or the periphery of the heating unit described above, and the second temperature sensor can also measure the temperature change of the heating unit according to the control sequence. The first temperature sensor can also measure the temperature of the housing or the periphery of the heating unit described above, and the second temperature sensor can also measure the temperature of the mist source. It may also further include a first constant voltage circuit that generates the reference voltage of the first AD conversion circuit, and a second constant voltage circuit that generates the operating power supply for the memory that records the operation log. Additionally, at this time, the potential of the operating power supply of the memory is the same as the potential of the reference voltage. The mist source can be a solid. The mist source can be a liquid. According to one aspect of the present disclosure, a mist generating device can be provided that has both a high control speed of the temperature in the heating unit and a high detection accuracy of the temperature at the measurement location. 1: Mist generating device 10: Front panel 10A: Window 20: Main body device 20A: LED 20B: Power button 20C: Magnet 21: USB connector 30: Baffle 40: Rod core type substrate 40A: Substrate part 40B: Suction port part 201: Power supply part 202: Sensor part 203: Notification part 204: Memory part 205: Communication part 206: Control part 207: Heating part 208: Heat insulation part 209: Holding part 209A: Internal space 209B: Opening 209C: Bottom 211: Charging IC 212: Buck-boost DC / DC circuit 213: MCU 214: Boost DC / DC circuit 215A: Heater switch 215B: Resistance value measurement switch 216: Heater unit 217: Operational amplifier 219, 231, 234, 236: LDO constant voltage circuit 220: Flash memory 221: Heater temperature sensor 222: Cartridge temperature sensor 232, 233: SD type ADC 235, 237: GP type ADC FIG. 1 is a view of the front side of the mist generating device observed from obliquely above. FIG. 2 is a view of the front side of the mist generating device observed from obliquely below. FIG. 3 is a view of the main body device in the state after removing the front panel observed from the front. FIG. 4 is a schematic diagram showing the internal configuration of the main body device. FIG. 5 is a view illustrating an example of the heating setting content used when the mist source is solid. FIG. 6 is a schematic diagram illustrating the electronic circuit used in Embodiment 1. FIG. 7 is a view illustrating the connection relationship between the internal configuration of the MCU and the peripheral circuit. FIG. 8 is a view illustrating an example of the heating setting content used when the mist source is liquid. Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In each drawing, the same reference numerals are given to the same parts. <Terms> The mist generating device of each embodiment is a type of electronic cigarette. In the following description, the substance generated by the mist generating device is referred to as mist. Mist refers to a mixture of minute liquid or solid particles floating in a gas and air or other gases. In each embodiment, a mist generating device that generates mist without combustion is described. In addition, the inhalation of the mist generated by the mist generating device is also referred to as "puff". In each embodiment, a mist generating device capable of installing a solid mist source is described. In addition, the container for storing the solid mist source is also referred to as a "capsule" or a "stick-shaped substrate" depending on the product form. The capsule or stick-shaped substrate is a consumable. Therefore, a replacement standard is defined for the capsule or stick-shaped substrate. <Embodiment 1> <Appearance example> First, an example of the appearance of the mist generating device used in Embodiment 1 will be described. FIG. 1 is a view of the front side of the mist generating device 1 observed from an upper oblique direction. FIG. 2 is a view of the front side of the mist generating device 1 observed from a lower oblique direction. FIG. 3 is a view of the main body device 20 with the front panel 10 removed, observed from the front. The mist generating device 1 used in this embodiment has a size that can be held by a user with one hand. The mist generating device 1 includes: a main body device 20; a front panel 10 installed on the front of the main body device 20; and a shutter 30 disposed on the upper surface of the main body device 20 and slidable along the upper surface. The front panel 10 is a detachable member with respect to the main body device 20. The detachment and attachment of the front panel 10 are performed by the user. As shown in FIGS. 1 and 2, the front panel 10 installed on the main body device 20 covers the front portion of the main body device 20. In other words, after the installation of the front panel 10, parts other than the front portion of the main body device 20 can also be observed from the outside. For example, the side surface, the back surface, the upper surface, and the bottom surface of the main body device 20 can also be observed from the outside after the installation of the front panel 10. A window 10A is provided in the front panel 10. The window 10A is provided at a position opposite to the light emitting element on the side of the main body device 20. In the case of Embodiment 1, the light emitting element uses the LED 20A shown in FIG. 3. In the case of Embodiment 1, eight LEDs 20A are provided in the main body device 20. The window 10A in Embodiment 1 is made of a material that allows light to penetrate. Of course, the window 10A can also be a slit that penetrates from the front surface to the back surface. The lighting or flashing mode of the LED 20A is assigned to the operating state of the mist generating device. For example, the lighting or flashing of the LED 20A is assigned to the state regarding the heating of the mist source. In the state regarding the heating of the mist source, there are, for example, the completion of the heating preparation of the mist source, the start of heating, the completion or end of heating, the number of tasteable mist sources, the remaining time for tasting, and the abnormality of the body temperature. In addition to this, the lighting or flashing of the LED 20A is also assigned the occurrence of a failure or malfunction state of the main body device 20, the remaining battery level, charging in progress or completion of charging, the pairing state, etc. Among the malfunction states here, an abnormality regarding the ambient temperature is also included. The lighting or flashing of the light emitting element is controlled by a control unit 206 (refer to FIG. 4) described later. The front panel 10 also functions to buffer the transfer of heat released from the main body device 20, etc. In the case of this embodiment, the generation of mist is permitted only when the front panel 10 is installed on the main body device 20. In this embodiment, the front panel 10 used is deformed by the user pressing a position below the window 10A with a fingertip, and returns to its original shape when the pressing stops. By this deformation, the operation of the power button 20B provided on the main body device 20 can be directly performed in the state where the front panel 10 is installed on the main body device 20. On the bottom surface side of the main body device 20, a Type-C USB (Universal Serial Bus) connector 21 is provided. The shape or type of the USB connector 21 is only an example. In the case of Embodiment 1, the USB connector 21 is used for charging the power supply unit 201 (refer to FIG. 4) built into the main body device 20. On the upper surface portion of the main body device 20, a hole (not shown) into which the rod-shaped base material 40 (refer to FIG. 4) storing the mist source is inserted is provided. The hole is exposed by sliding the baffle 30 to the open position and hidden by sliding the baffle 30 to the closed position. The rod-shaped base material 40 used in this embodiment has a structure in which a solid mist source is stored in a substantially cylindrical paper tube. For example, a magnet is installed on the back surface of the baffle 30. On the other hand, in the main body device 20, a Hall IC is installed within the movable range of the baffle 30. The Hall IC is a magnetic sensor composed of a Hall element, an operational amplifier, etc., and outputs a voltage corresponding to the intensity of the magnetic field across the Hall IC. In this embodiment, the opening and closing of the baffle 30 are detected from the change in the voltage output from the Hall IC as the baffle 30 slides. That is, it is detected whether the baffle 30 is in the open position or the closed position. As shown in FIG. 3, a power button 20B is disposed substantially at the center of the front surface of the main body device 20. As described above, the power button 20B can be directly operated in the state where the front panel 10 is installed. The power button 20B is used, for example, for turning on and off the power of the main body device, turning on and off the power supply to the heating unit 207 (refer to FIG. 4) that heats the mist source, and pairing instructions for Bluetooth (registered trademark), etc. In addition, if the power button 20B is long-pressed (for example, pressed for 5 seconds or more) in the state where the front panel 10 is removed from the main body device 20, the reset function is activated. In this embodiment, BLE (Bluetooth Low Energy) is used as Bluetooth (registered trademark). As shown in Fig. 3, magnets 20C for mounting the front panel 10 are arranged at the upper and lower parts of the front of the main body device 20. The magnet 20C is set at a position opposite to a magnet (not shown) provided inside the front panel 10. For example, if the magnet on the front panel 10 is an N pole, the magnet 20C on the main body device 20 side is an S pole. By the attractive force between the magnets, the front panel 10 can be detachably mounted on the main body device 20. In addition, either the magnet on the front panel 10 side or the magnet 20C on the main body device 20 side can be made of iron or other magnetically permeable metal sheets. Incidentally, the mounting of the front panel 10 to the main body device 20 is detected by a Hall IC provided on the main body device 20 side. In addition, various electronic components required for generating mist are built into the main body device 20. In Embodiment 1, although the device configuration in which the front panel 10 is installed in the main body device 20 is shown as the mist generating device 1, strictly speaking, the main body device 20 is called the mist generating device. <Internal Structure> Fig. 4 is a schematic diagram showing the internal structure of the main body device 20. In addition, Fig. 4 shows the state in which the rod core type substrate 40 is mounted on the main body device 20. The internal structure shown in Fig. 4 is for explaining the parts provided in the main body device 20 and their positional relationships. Therefore, the appearance of the parts shown in Fig. 4 does not necessarily have to be the same as that of the aforementioned external view. The main body device 20 is composed of a power supply unit 201, a sensor unit 202, a notification unit 203, a memory unit 204, a communication unit 205, a control unit 206, a heating unit 207, a heat insulation unit 208, and a holding unit 209. As described above, Fig. 4 shows the state in which the rod core type substrate 40 is held by the holding unit 209. In this state, the user inhales the mist. The power supply unit 201 is a unit that supplies power to each part. The power supply unit 201 uses a secondary battery for storing the power required for the main body device 20. In Embodiment 1, for example, a lithium ion secondary battery is used as the secondary battery. The secondary battery can be charged from an external power source. In the case of Embodiment 1, the external power source is supplied through a USB connector 21 (refer to Fig. 2). Hereinafter, the power supplied from the secondary battery is represented as "VBAT", and the power supplied through the USB connector 21 is represented as "VBUS". The power VBUS is a 5V power source. In addition, the 5V power source can also be generated from VBAT. The sensor unit 202 is an electronic component that detects various information about the main body device 20. The sensor unit 202 includes pressure sensors such as a microphone capacitor and flow sensors. The sensor unit 202 outputs the detected information to the control unit 206. For example, when detecting a change in air pressure or air flow accompanying inhalation, the sensor unit 202 outputs a value indicating the inhalation of the mist performed by the user to the control unit 206. The sensor unit 202 is arranged in a way that corresponds to, for example, buttons or switches used to receive operations from the user. Among these buttons is the aforementioned power button 20B (refer to FIG. 3). In addition, among the switches is the aforementioned baffle 30 (refer to FIG. 1). When detecting an operation by the user, the sensor unit 202 outputs the detection of the operation to the control unit 206. In addition to the above, the sensor unit 202 also has a temperature sensor that detects the temperature of the heating unit 207. The temperature sensor detects the temperature of the heating unit 207 based on, for example, a change in the resistance value of the conductive circuit of the heating unit 207. A voltage corresponding to the current resistance value is output from the temperature sensor. The control unit 206 calculates the temperature of the heating unit 207 from the output voltage of the temperature sensor. This temperature sensor is used for the purpose of changing the temperature of the heating unit 207 according to the heating setting content. FIG. 5 is a diagram illustrating an example of the heating setting content used when the mist source is solid. The horizontal axis represents the elapsed time since the start of heating. The vertical axis represents the target temperature. In the case of the heating setting content shown in FIG. 5, there is a preheating period before the inhalation period. The preheating period is a preparation period for generating a sufficient amount of mist at the start of inhalation. This is because the temperature of the mist source before starting the heating of the heating unit 207 is the same as the room temperature, and a sufficient amount of mist cannot be generated immediately after operating the power button. The target temperature of the heating unit 207 during the preheating period is T1. In the case of this embodiment, the target temperature T1 is defined as the highest temperature throughout the period. In addition, if the temperature of the heating unit 207 is continuously maintained at the target temperature T1 even after the preheating period, not only will the amount of mist generated be excessive, but the amount of mist generated will not be stable throughout the entire inhalation period. Therefore, after the mist source is sufficiently heated, the temperature of the heating unit 207 is lowered to the target temperature T3. In addition, in the latter half of the inhalation period, the temperature of the heating unit 207 is raised to the target temperature T2 (>T3), and the amount of mist generated is kept constant throughout the period. In this heating setting content, it is stored as a data file that defines the time change of the target temperature after starting heating in the storage unit 204. In the case of this embodiment, a heating setting content is stored in the memory unit 204. Of course, a plurality of heating setting contents may also be stored. When a plurality of heating setting contents can be stored, the heating setting content to be used for heating the mist source is selected in advance. In addition, the heating setting content is also referred to as "control setting content" and also referred to as "control sequence". Other temperature sensors include a temperature sensor that detects the temperature around the heating unit 207 and a temperature sensor that detects the temperature near the surface of the main body device 20. These two types of temperature sensors are used from the perspective of detecting an unexpected temperature rise. In other words, the temperature sensors here are provided from the perspective of safety. The notification unit 203 is an electronic component that notifies the user of various information about the main body device 20. The notification unit 203 includes, for example, an LED 20A (refer to FIG. 3). The lighting or flashing of the LED 20A is controlled in a mode corresponding to the content of the notification. When a plurality of LEDs 20A with different emission colors are provided, the difference in emission colors can also be combined in the lighting or flashing. For example, red can be used for notifications of the state of suspension of use or the need for repair, and white, green, blue, etc. can be used for notifications of the normal use state. The notification unit 203 may also include other devices used in conjunction with the LED 20A or in place of the LED 20A. Other devices include a display device that displays text, images, or other information, a sound output device that outputs sound, a vibration device that vibrates the main body device 20, and the like. A light-emitting device, a display device, a sound output device, a vibration device, etc. are also used for notifying the state of the operation of the mist generating device 1. The memory unit 204 is an electronic component that stores various information about the operation of the main body device 20. The memory unit 204 is constituted by a non-volatile semiconductor memory medium such as a flash memory, for example. The information stored in the memory unit 204 includes, for example, an OS (Operating System) or other programs such as FW (FirmWare). In addition, the information stored in the memory unit 204 includes, for example, information about the control of electronic components. The information about control is information about the inhalation performed by the user, such as the number of inhalations, the inhalation time, and the cumulative inhalation time. Such information is also referred to as an operation log. The communication unit 205 is a communication interface for enabling the communication between the main body device 20 and other devices. The communication unit 205 communicates with other devices by conforming to any communication standard, either wired or wireless. Examples of such communication standards include Wireless LAN (Local Area Network), USB, Wi-Fi (Wireless Fidelity) (registered trademark), and Bluetooth (registered trademark). For example, the communication unit 205 transmits information about the tasting performed by the user to a smart phone. In addition, the communication unit 205 downloads an update program from a server or heating setting content that specifies the temperature change of the heating unit 207 in the heating mode. The control unit 206 functions as a computing processing device or a control device, and controls the operations of the respective components constituting the main body device 20 according to various programs. The transmission of control signals is performed through a signal line different from the power line. For example, the communication within the main body device 20 uses serial communication methods such as the I2C (=Inter-Integrated Circuit) communication method, the SPI (Serial Peripheral Interface) communication method, and the UART (Universal Asynchronous Receiver / Transmitter) communication method. The control unit 206 is implemented by electronic circuits such as a CPU (Central Processing Unit), an MCU (Micro Controller Unit), an MPU (Micro Processing Unit), a GPU (Graphical Processing Unit), an ASIC (application specific integrated circuit), an FPGA (Field Programmable Gate Array), and a DSP (Digital Signal Processor). In the control unit 206, a ROM (Read Only Memory) for storing programs or arithmetic parameters, etc., and a RAM (Random Access Memory) for temporarily storing parameters that change appropriately may also be included. The control unit 206 performs various processes or controls through the execution of programs. The processing or control here includes, for example, power supply by the power supply unit 201, charging of the power supply unit 201, detection of information by the sensor unit 202, notification of information using the notification unit 203, writing information to or reading information from the memory unit 204, and transmission and reception of information using the communication unit 205. In addition, information input to the electronic components and processing based on the information output from the electronic components are also controlled by the control unit 206. The holding unit 209 is a substantially cylindrical container. In this embodiment, the space inside the holding unit 209 defined by the inner wall and the bottom surface is referred to as the internal space 209A. The internal space 209A is substantially cylindrical. The holding unit 209 here corresponds to the hole exposed by the sliding of the baffle 30. An opening 209B that connects the internal space 209A to the outside is provided in the holding unit 209. The rod core type substrate 40 is inserted into the internal space 209A from this opening 209B. The rod core type substrate 40 is inserted until its front end touches the bottom 209C. Only a part of the rod core type substrate 40 is housed in the internal space 209A. The state where the rod core type substrate 40 is housed in the internal space 209A is referred to as holding the rod core type substrate 40 in the internal space 209A. The holding unit 209 is formed such that the inner diameter in at least a part of its axial direction is smaller than the outer diameter of the rod core type substrate 40. Therefore, the outer peripheral surface of the rod core type substrate 40 inserted into the internal space 209A receives pressure from the inner wall of the holding unit 209. The rod core type substrate 40 is deformed by this pressure and is held in the internal space 209A. The holding unit 209 also has the function of defining a flow path for the air passing through the rod core type substrate 40. The air inlet hole, which is the entrance of the air inlet flow path, is arranged, for example, on the bottom 209C. In addition, the opening 209B corresponds to the air outlet hole, which is the outlet of the air. In the case of this embodiment, only a part of the rod core type substrate 40 is held by the holding unit 209, and the rest protrudes from the housing to the outside. Hereinafter, the part of the rod core type substrate 40 held by the holding unit 209 is referred to as the substrate part 40A, and the part protruding from the housing is referred to as the suction port part 40B. A mist source is stored in at least the substrate part 40A. The mist source is a substance that is atomized by heating to generate mist. The mist source includes, in addition to tobacco shreds, processed products obtained by forming tobacco raw materials into granular, flaky, or powdery forms or other substances derived from tobacco. Furthermore, the mist source may also include non-tobacco-derived substances made from plants other than tobacco, such as mint or herb. For example, the mist source may also include fragrance components such as menthol. When the main body device 20 is a medical inhaler, the mist source may also include a medicament for the patient to inhale. In addition, the mist source is not limited to solids, and may also be, for example, polyols such as glycerin and propylene glycol, or liquids such as water. At least a part of the mouthpiece portion 40B is held by the user when tasting. When the user holds the mouthpiece portion 40B and tastes, air flows into the internal space 209A from the air inlet hole. The inflowing air passes through the internal space 209A and the base material portion 40A and reaches the user's mouth. The air reaching the user's mouth contains the mist generated in the base material portion 40A. The heating portion 207 is composed of a heater or other heating element. The heating portion 207 is composed of an arbitrary material such as metal or polyimide. The heating portion 207 is configured, for example, in a thin film shape and is mounted on the outer peripheral surface of the holding portion 209. By the heat generation of the heating portion 207, the mist source contained in the rod-shaped base material 40 is heated and atomized. The atomized mist source is mixed with air and the like to generate mist. In the case of FIG. 4, the vicinity of the outer periphery of the rod-shaped base material 40 is heated first, and the heated range gradually moves toward the center. Therefore, the atomization of the mist source starts from the vicinity of the outer periphery of the rod-shaped base material 40 and gradually moves toward the center. The heating portion 207 generates heat by power supply from the power supply portion 201. When, for example, a predetermined operation of the user is detected by the sensor portion 202, power supply to the heating portion 207 is permitted. The predetermined operation of the user here includes an operation on the baffle 30 (see FIG. 1) or the power button 20B (see FIG. 3). In addition, when the temperature of the rod-shaped base material 40 after being heated by the heating portion 207 reaches a predetermined temperature, it becomes available for the user to taste. The time change of the target temperature from the start to the end of heating is stored in the memory portion 204 as the heating setting content. The heating setting content is an example of a control sequence. The inhalation of the mist performed by the user is detected by a flow sensor of the sensor portion 202 and stored in the memory portion 204. If a predetermined time has elapsed since the start of heating, or a predetermined operation performed by the user is detected, the power supply to the heating portion 207 is stopped. The predetermined operation is, for example, the removal of the rod-shaped base material 40. In addition, in the example of FIG. 4, although the heating unit 207 is disposed on the outer peripheral portion of the rod core type substrate 40, the heating unit 207 may also be a blade type metal sheet inserted into the rod core type substrate 40. In addition, the atomization of the mist source can also use, for example, an induction heating method. In the case of this heating method, the heating unit 207 at least has an electromagnetic induction source such as a coil that generates a magnetic field. At this time, a susceptor is disposed at a position overlapping with the magnetic field generated by the electromagnetic induction source. The susceptor generates heat along with the generation of the magnetic field and heats the mist source. The susceptor may also be a metal sheet built into the rod core type substrate 40. When the metal sheet acting as the heating unit 207 is built into the rod core type substrate 40, the coil for induction heating the metal sheet is disposed around the holding unit 209. In addition, a susceptor may be disposed on the outer peripheral portion of the rod core type substrate 40 within the main body device 20, and a coil belonging to the electromagnetic induction source may be wound around the outer peripheral portion. The heat insulation unit 208 is a member that reduces the heat transfer from the heating unit 207 to the surroundings. Therefore, the heat insulation unit 208 is disposed to cover at least the outer peripheral surface of the heating unit 207. The heat insulation unit 208 is composed of, for example, a vacuum heat insulation material, an aerogel heat insulation material, etc. The vacuum heat insulation material is, for example, a heat insulation material that forms a high vacuum state by coating glass wool and silica (powder of silicon) with a resin film, thereby making the heat conduction by gas approach zero infinitely. <Schematic Configuration of Electronic Circuit> FIG. 6 is a schematic diagram showing the electronic circuit used in Embodiment 1. In FIG. 6, the connection relationship between representative parts is shown. In addition, in FIG. 6, the wiring used for power supply (hereinafter referred to as "power line") is shown by thick lines, and the wiring used for control etc. (hereinafter referred to as "signal line") is shown by thin lines. The electronic circuit shown in FIG. 6 is composed of a charging IC 211, a buck-boost DC / DC circuit 212, an MCU 213, a boost DC / DC circuit 214, a heater switch 215A, a resistance value measurement switch 215B, a heater unit 216, an operational amplifier 217, a remaining amount meter IC 218, an LDO (Low Dropout) constant voltage circuit 219, a flash memory 220, a heater temperature sensor 221, a case temperature sensor 222, and an LED 20A. The charging IC 211 is an electronic circuit that switches the power supply path. For example, when a USB cable is connected to the USB connector 21 (refer to FIG. 2), the charging IC 211 connects the power supply VBUS to the buck-boost DC / DC circuit 212 and the power supply VBAT. In contrast, when the USB cable is not connected to the USB connector 21, the charging IC 211 connects the power supply VBAT to the buck-boost DC / DC circuit 212. The charging IC 211 detects whether the USB cable is connected to the USB connector 21 and switches the power path according to the detection result. When the LED 20A is lit in a state where the USB cable is not connected, the charging IC 211 generates a 5V power supply by OTG (On-The-Go) and applies it to the power supply line for the LED 20A. The buck-boost DC / DC circuit 212 is a circuit that converts the power supply VBUS or the power supply VBAT supplied from the charging IC 211 into a system power supply Vsys of a certain voltage. In the case of this embodiment, the system power supply Vsys is 3.3V. In the case of FIG. 6, the system power supply Vsys is supplied to the MCU 213, the remaining amount meter IC 218, and the LDO constant voltage circuit 219. For example, when the power supply VBAT is supplied, the buck-boost DC / DC circuit 212 boosts or buck-boosts the power supply VBAT to generate the system power supply Vsys. Although the power supply VBAT varies with the remaining capacity or the degree of deterioration of the secondary battery, it is converted into a constant voltage by the buck-boost DC / DC circuit 212. On the other hand, when the voltage from the power supply VBUS (i.e., 5V power supply) is supplied, the buck-boost DC / DC circuit 212 buck-boosts the supplied voltage to generate the system power supply Vsys. The MCU 213 is an example of the control unit 206 (refer to FIG. 4) that controls the operations of the respective parts constituting the atomizing device 1 (refer to FIG. 1), and operates by the system power supply Vsys. The MCU 213 is composed of a plurality of electronic components. For example, the MCU 213 is composed of an AD conversion circuit that converts an analog signal input from an input terminal into a digital signal, an LDO constant voltage circuit that generates various power supplies, and a field effect transistor (FET: Field Effect Transistor) that controls the operations of external components (such as the LED 20A). The MCU 213 has the following functions: before starting the heating of the rod-shaped substrate 40 (refer to FIG. 4) by the heater unit 216, it detects the temperature by the cartridge temperature sensor 222, and when the detected temperature exceeds the threshold value, it does not start the heating of the rod-shaped substrate 40 by the heater unit 216. The threshold value here can be used, for example: the upper and lower temperatures of the operating environment temperature, or the upper limit value of the temperature allowed at the measurement site can also be used. The boost DC / DC circuit 214 is a circuit that converts the power supply VBAT supplied from the secondary battery into a boosted power supply Vboost with a constant voltage. The boosted power supply Vboost is a power supply with a potential higher than the system power supply. For example, it is 5V. In the case of FIG. 6, for the purpose of distributing the load, the 5V power supply supplied to the LED 20A and the boosted power supply Vboost supplied to the heater unit 216 are made into different wirings. The heater switch 215A is a switch that controls the application of the boosted power supply Vboost to the heater unit 216 and is composed of, for example, an FET. In the case of this embodiment, the opening and closing of the heater switch 215A is controlled by the MCU 213 for PWM (Pulse Width Modulation) control. By the PWM control of the heater switch 215A, the temperature of the heater unit 216 is controlled to be consistent with the heating setting content. Incidentally, the heating setting content provides data corresponding to the target temperature over time and is stored in the memory unit 204 (refer to FIG. 4). The opening and closing control of the heater switch 215A can also be started by detecting a predetermined user input, such as the input of the power button 20B (refer to FIG. 3). The resistance value measurement switch 215B is a switch that performs open control when the resistance value of the heater unit 216 is detected and performs closed control during the period when the resistance value is not detected, and is composed of, for example, an FET. The opening and closing of the resistance value measurement switch 215B is also controlled by the MCU 213. The closed control of the resistance value measurement switch 215B is executed when the heater switch 215A is in the off state. If the resistance value measurement switch 215B performs closed control, the boosted power supply Vboost is applied to the operational amplifier 217. In addition, the resistor R is connected in series with respect to the heater unit 216. As a result, at the connection midpoint of the resistor R and the heater unit 216, a voltage Vheat that is the boosted power supply Vboost divided according to the ratio of the resistance value of the resistor R to the resistance value of the heater unit 216 (i.e., the resistance ratio) appears. The heater unit 216 is an example of the heating unit 207 that generates heat by being energized and heats the rod-shaped base material 40 inserted into the holding unit 209. The resistance value of the heater unit 216 changes with the temperature of the heater unit 216. For example, the resistance value of the heater unit 216 becomes higher as the temperature rises. As a result, the higher the temperature of the heater unit 216, the higher the potential of the voltage Vheat. The operational amplifier 217 is a circuit that detects the resistance value of the heater unit 216. In the case of this embodiment, the operational amplifier 217 uses the boost power supply Vboost as the operating power supply. As described above, the supply of the boost power supply Vboost to the operational amplifier 217 is limited to the time point when the voltage Vheat corresponding to the resistance value of the heater unit 216 is detected. The operational amplifier 217 outputs a voltage corresponding to the voltage Vheat input to the non-inverting input terminal to the MCU 213. The MCU 213 measures the temperature change of the heater unit 216 through this voltage. In this embodiment, the operational amplifier 217 that detects the voltage Vheat is an example of the second temperature sensor. The remaining amount meter IC 218 operates with the system power supply Vsys as the operating power supply, and calculates and holds the SOH (State of Health), SOC (State Of Charge), full charge capacity, and remaining capacity of the secondary battery by monitoring the power supply VBAT. In addition, the remaining amount meter IC 218 notifies the MCU 213 of information such as SOH calculated by I2C communication. The LDO constant voltage circuit 219 is a power supply circuit that generates a predetermined voltage from the system power supply Vsys. In the case of FIG. 6, the LDO constant voltage circuit 219 outputs 1.8V. The flash memory 220 is a non-volatile semiconductor memory that stores firmware or an operation log, and is an example of the storage unit 204. In the case of FIG. 6, the potential of the operating power supply of the flash memory 220 is 1.8V. In addition, the communication between the flash memory 220 and the MCU 213 uses SPI communication. The heater temperature sensor 221 is a temperature sensor that measures the temperature around the heater unit 216. The heater temperature sensor 221 is provided for the purpose of detecting abnormal heat generation. In other words, it is set from the viewpoint of safety. In the case of this embodiment, the heater temperature sensor 221 uses a thermistor. A thermistor is a temperature sensor with a relatively large change in resistance value with respect to temperature change. A thermistor is a temperature sensor having non-linear temperature characteristics. In addition, the heater temperature sensor 221 is an example of a first temperature sensor. The power supply voltage of the heater temperature sensor 221 shown in FIG. 6 is 1.8V. In the case of this embodiment, the potential of the power supply voltage supplied to the heater temperature sensor 221 is the same as the potential of the power supply voltage supplied to the flash memory 220. In addition, the potential of the power supply voltage supplied to the flash memory 220 and the potential of the power supply voltage supplied to the heater temperature sensor 221 do not need to be 1.8V, nor do they need to be the same. The output voltage indicating the temperature of the measurement site is supplied from the heater temperature sensor 221 to the MCU 213. The case temperature sensor 222 is a temperature sensor that measures the temperature near the surface of the main body device 20. The case temperature sensor 222 is also provided for the purpose of detecting abnormal heat generation. In other words, it is provided from the viewpoint of safety. In the case of this embodiment, the case temperature sensor 222 uses a thermistor. The case temperature sensor 222 is also an example of a first temperature sensor. The power supply voltage of the case temperature sensor 222 shown in FIG. 6 is 1.8V. In the case of this embodiment, the potential of the power supply voltage supplied to the case temperature sensor 222 is the same as the potential of the power supply voltage supplied to the flash memory 220. In addition, the potential of the power supply voltage supplied to the flash memory 220 and the potential of the power supply voltage supplied to the case temperature sensor 222 do not need to be 1.8V, nor do they need to be the same. The output voltage indicating the temperature of the measurement site is supplied from the case temperature sensor 222 to the MCU 213. <Internal Structure of MCU> FIG. 7 is a diagram illustrating the connection relationship between the internal structure of the MCU 213 and the peripheral circuit. In addition, the internal structure of the MCU 213 shown in FIG. 7 is depicted from the perspective of the electronic components connected to the power supply line. Of course, in the MCU 213, there are various electronic components not depicted in FIG. 7. For example, a CPU is built-in. The CPU here generates, for example, control signals for the heater switch 215A (refer to FIG. 6) and the resistance value measurement switch 215B (refer to FIG. 6). In addition, in the MCU 213, a switch (such as an FET) for controlling the lighting and extinguishing of the LED 20A (refer to FIG. 6) is also provided. In the MCU 213 shown in FIG. 7, there are an LDO fixed voltage circuit 231, SD (Sigma-Delta, ΔΣ) type ADCs 232 and 233, LDO fixed voltage circuits 234 and 236, and GP (general purpose) type ADCs 235 and 237. Of course, the LDO fixed voltage circuit 234 and the LDO fixed voltage circuit 236 can also be shared. Among these, the LDO fixed voltage circuits 231, 234, and 236 are circuits that generate a fixed voltage, and the Sigma-Delta (SD) type ADCs 232 and 233 or the GP type ADCs 235 and 237 are circuits that generate the data required for the processing of the aforementioned CPU. As described above, the heater temperature sensor 221 and the case temperature sensor 222 are temperature sensors used from the perspective of safety. Therefore, a high conversion accuracy is required for the AD conversion circuit that converts the output voltage from such temperature sensors into digital data. In this embodiment, for the conversion of the output voltages Vin1 and Vin2 of the heater temperature sensor 221 and the case temperature sensor 222, the SD type ADCs 232 and 233 with higher conversion accuracy are used. The SD type ADCs 232 and 233 here are an example of the first AD conversion circuit that converts the output voltage of the first temperature sensor into digital data. On the other hand, the measurement of the temperature of the heater unit 216 is performed for the heating control according to the heating setting content. Therefore, immediacy is required for the conversion of the output voltage representing the resistance value that changes according to the temperature of the heater unit 216. In this embodiment, for the conversion of the output voltage of the operational amplifier 217, the GP type ADC 235 with a faster conversion speed is used. The GP type ADC 235 uses, for example, a successive approximation type ADC or a pipeline type ADC. The GP type ADC 235 here is an example of the second AD conversion circuit that converts the output voltage of the second temperature sensor into digital data. For the conversion of the potential that appears at the cc terminal of the USB cable, the GP type ADC 237 with a larger input voltage variation range than the SD type ADC 232 etc. is used. The LDO fixed voltage circuit 231 is a power supply circuit that generates a 1.8V power supply from the system power supply Vsys. In the case of this embodiment, the 1.8V power supply generated by the LDO fixed voltage circuit 231 is only supplied to the flash memory 220. That is, the LDO fixed voltage circuit 231 is a dedicated power supply circuit for the flash memory 220. In addition, in FIG. 7, although the LDO fixed voltage circuit 231 is built in the MCU 213, it may also be provided outside the MCU 213. In addition to this, in FIG. 7, signal lines for writing digital data from the MCU 213 to the flash memory 220 or reading digital data from the flash memory 220 are shown by bidirectional arrows. The LDO fixed voltage circuit 231 here is an example of a second fixed voltage circuit. The LDO fixed voltage circuit 219 is also a power supply circuit that generates a 1.8V power supply from the system power supply Vsys. In addition, the LDO fixed voltage circuit 219 is an example of a first fixed voltage circuit. The 1.8V power supply generated by the LDO fixed voltage circuit 219 is supplied to the heater temperature sensor 221, the case temperature sensor 222, and the SD type ADCs 232 and 233 through a power supply line different from that of the LDO fixed voltage circuit 231. As shown in FIG. 7, the power supply line used for supplying the 1.8V power supply corresponding to the LDO fixed voltage circuit 231 and the power supply line used for supplying the 1.8V power supply corresponding to the LDO fixed voltage circuit 219 are different. Therefore, even if the potential of the 1.8V power supply for supplying the drive power to the flash memory 220 swings along with the operation of the flash memory 220, the swing will not be transmitted to the potential of the 1.8V power supply supplied by the LDO fixed voltage circuit 219. In this way, even if the flash memory 220 operates, the conversion accuracy of the SD type ADC 232 or the SD type ADC 233 will not be reduced. In the case of FIG. 7, the 1.8V power supply generated by the LDO fixed voltage circuit 219 is supplied to the heater temperature sensor 221 and the SD type ADC 232 through a common power supply line. That is, the 1.8V power supply is provided as an operating power supply to the heater temperature sensor 221 and is provided as a reference voltage Vref1 to the SD type ADC 232. Therefore, even if the potential of the power supply line connecting the heater temperature sensor 221 and the SD type ADC 232 swings due to the overlap of noise, the swings of the 1.8V power supply supplied to the heater temperature sensor 221 and the 1.8V power supply (reference voltage Vref1) supplied to the SD type ADC 232 will change in phase. Therefore, the influence of the swing of the power supply potential is offset. Therefore, the conversion accuracy by the SD type ADC 232 will not be reduced. In addition, the conversion output of the SD type ADC 232 is output to a CPU (not shown). Similarly, the 1.8V power supply generated by the LDO constant voltage circuit 219 is supplied to the cartridge temperature sensor 222 and the SD type ADC 233 through a common power supply line. That is, the 1.8V power supply is supplied as an operating power supply to the cartridge temperature sensor 222 and is supplied as a reference voltage Vref1 to the SD type ADC 233. Therefore, even if the potential of the power supply line connected to the cartridge temperature sensor 222 and the SD type ADC 233 fluctuates due to the superposition of noise, the fluctuations of the 1.8V power supply supplied to the cartridge temperature sensor 222 and the fluctuations of the 1.8V power supply (reference voltage Vref1) supplied to the SD type ADC 233 will change in phase. Therefore, the influence of the power supply potential fluctuation is offset. Therefore, the conversion accuracy by the SD type ADC 233 will not be reduced. In addition, the conversion output of the SD type ADC 233 is also output to a CPU (not shown). In addition, in the case of FIG. 7, although the LDO constant voltage circuit 219 is provided outside the MCU 213, it may also be provided inside the MCU 213. In addition, in the MCU 213, there are provided an LDO constant voltage circuit 234 that generates an operating power supply Vref2 of a constant voltage from the system power supply Vsys, and an LDO constant voltage circuit 236 that generates an operating power supply Vref3 of a constant voltage from the system power supply Vsys. The operating power supplies Vref2 and Vref3 here may be, for example, 1.8V power supplies. In FIG. 7, the case where they are not 1.8V power supplies is assumed and shown as the operating power supplies Vref2 and Vref3. In addition, the operating power supply Vref2 and the operating power supply Vref3 may have the same potential or different potentials. <Effect> In the aerosol generating device 1 of the present embodiment, the SD type ADCs 232 and 233 that convert the output voltage of the temperature sensor provided from the viewpoint of safety into digital data use ADCs with a conversion accuracy higher than that of the GP type ADC 235 that converts the output voltage of the heater unit 216 into digital data. On the other hand, the GP type ADC 235 that converts the output voltage of the heater unit 216 into digital data uses an ADC with a conversion speed faster than that of the SD type ADCs 232 and 233 that convert the output voltage of the temperature sensor provided from the viewpoint of safety into digital data. Therefore, an aerosol generating device with both a high control speed of the temperature in the heating unit 207 and a high detection accuracy of the temperature at the measurement site can be provided. In addition, in the mist generating device 1 of the present embodiment, the reference voltage Vref1 of the SD type ADC 232 is also supplied as an operating power source to the heater temperature sensor 221. In addition, the reference voltage Vref1 of the SD type ADC 233 is also supplied as an operating power source to the cartridge temperature sensor 222. Therefore, even if the potential of the operating power source (or the reference voltage Vref1) fluctuates, the influence of the potential fluctuation can be offset, and the conversion accuracy of the ADC can be improved. That is, the measurement accuracy of the temperature can be improved. <Other Embodiments> (1) Although the embodiments of the present invention have been described above, the technical scope of the present invention is not limited to the scope described in the foregoing embodiments. It should be apparent from the description of the claims that various changes or improvements made to the foregoing embodiments are also included in the technical scope of the present invention. (2) In the foregoing embodiment, although the case of measuring the temperature change of the heater unit 216 has been described, the temperature change of the rod core type base material 40 can also be measured. In other words, the temperature change of the mist source can also be measured. The temperature change of the mist source can be measured, for example, by a temperature sensor provided at the bottom 209C of the holding portion 209 (refer to FIG. 4). In addition, the temperature change of the mist source can also be indirectly measured through the voltage Vheat that appears in the heater unit 216. (3) In the foregoing embodiment, although the SD type ADCs 232 and 233 have been exemplified as an example of an electronic circuit of another constant voltage circuit that prepares a different constant voltage circuit from the constant voltage circuit that supplies the operating power source to the flash memory 220 even when operating at the same potential as the flash memory 220, such an electronic circuit is not limited to the SD type ADCs 232 and 233. For example, in such an electronic circuit, an AD conversion circuit (not shown) used for measuring the temperature around the secondary battery may also be included. (4) In the foregoing embodiment, although the SD type ADCs 232 and 233 with relatively high conversion accuracy have been exemplified as an AD conversion circuit of another constant voltage circuit that prepares a different constant voltage circuit from the constant voltage circuit that supplies the operating power source to the flash memory 220 even when operating at the same potential as the flash memory 220, it may also be the GP type ADCs 235 and 237 with relatively high conversion speed. (5) In the foregoing embodiment, although the case where the mist source is solid has been described, the mist source may also be liquid. When the mist source is liquid, a method is adopted in which the mist source is induced into a thin tube called a wick by capillary action, and the mist source is evaporated by heating a coil wound around the wick. In addition, when the mist source is liquid, the heating of the mist source is linked to the user's sucking. That is, when the sensor unit 202 (refer to FIG. 4) detects the user's puffing, the vapor source of the liquid is immediately heated. However, an upper limit (for example, 2.5 seconds) is set for the heating time length of one puff. Even if the puffing continues beyond the upper limit, the heating of the vapor source is stopped at the moment the upper limit is reached. In addition, for the amount of power required for heating, the vapor source of the liquid is less than that of the solid vapor source. FIG. 8 is a diagram illustrating an example of the heating setting content when the vapor source is a liquid. In the case of FIG. 8, the horizontal axis is the number of puffs. The left vertical axis shows the amount of flavor components, and the right vertical axis shows the target temperature. In addition, the plurality of circular symbols shown in the figure show the measurement results of the amount of flavor components corresponding to the number of puffs, and the line graph shows the target temperature of the heating unit 207 for converging the amount of flavor components to the target amount. (6) In the foregoing embodiment, a vapor generating device that heats a solid vapor source to generate vapor has been described. However, it may also be a vapor generating device that heats a solid vapor source and a liquid vapor source separately to generate vapor. Such a vapor generating device is also referred to as a composite vapor generating device. <Summary> In addition, the present disclosure includes the following configurations. (1) A vapor generating device, the vapor generating device having: a heating unit that heats a vapor source; a first temperature sensor that measures the temperature change of a measurement site accompanying the heating of the heating unit; a first AD conversion circuit that converts the output voltage of the first temperature sensor into digital data; a second temperature sensor that measures the temperature change of the heating unit; and a second AD conversion circuit that converts the output voltage of the second temperature sensor into digital data; wherein the conversion accuracy of the first AD conversion circuit is higher than that of the second AD conversion circuit, and the conversion speed of the second AD conversion circuit is faster than that of the first AD conversion circuit. (2) The vapor generating device according to (1), wherein the first AD conversion circuit is a Sigma-Delta type AD conversion circuit, and the second AD conversion circuit is a successive approximation type or a pipeline type AD conversion circuit. (3) The vapor generating device according to (1) or (2), wherein the first temperature sensor operates with the reference voltage of the first AD conversion circuit as the operating power source. (4) The vapor generating device according to any one of (1) to (3), wherein the first temperature sensor has a non-linear temperature characteristic. (5) The vapor generating device according to any one of (1) to (4), wherein the first temperature sensor measures the temperature of the housing or the periphery of the heating unit, and the second temperature sensor measures the temperature change of the heating unit according to the control sequence. (6) The atomizing device according to any one of (1) to (4), wherein the first temperature sensor measures the temperature of the housing or the periphery of the heating part, and the second temperature sensor measures the temperature of the atomizing source. (7) The atomizing device according to any one of (1) to (6) has: a first constant voltage circuit that generates a reference voltage for the first AD conversion circuit; and a second constant voltage circuit that generates an operating power supply for the memory that records the operation log; the potential of the operating power supply for the memory is the same as the potential of the reference voltage. (8) The atomizing device according to any one of (1) to (6), wherein the atomizing source is a solid. (9) The atomizing device according to any one of (1) to (6), wherein the atomizing source is a liquid. 213: MCU 216: Heater unit 217: Operational amplifier 219, 231, 234, 236: LDO constant voltage circuit 220: Flash memory 221: Heater temperature sensor 222: Housing temperature sensor 232, 233: SD type ADC 235, 237: GP type ADC

Claims

1. A fog generating apparatus comprising: a heating unit for heating a fog source; a first temperature sensor for measuring temperature changes at a measuring portion accompanying heating by the heating unit; a first analog-to-digital (AD) converter circuit for converting the output voltage of the first temperature sensor into digital data; a second temperature sensor for measuring temperature changes in the heating unit; and a second AD converter circuit for converting the output voltage of the second temperature sensor into digital data; wherein... The conversion accuracy of the first AD conversion circuit is higher than that of the second AD conversion circuit, and the conversion speed of the second AD conversion circuit is faster than that of the first AD conversion circuit.

2. The fog generating apparatus as described in claim 1, wherein, The aforementioned first AD conversion circuit is a Sigma-Delta type AD conversion circuit, and the aforementioned second AD conversion circuit is a successive approximation type or pipeline type AD conversion circuit.

3. The fog generating apparatus as described in claim 1 or 2, wherein, The aforementioned first temperature sensor operates using the reference voltage of the aforementioned first AD conversion circuit as its operating power source.

4. The fog generating apparatus as described in claim 1, wherein, The aforementioned first temperature sensor has nonlinear temperature characteristics.

5. The fog generating apparatus as described in claim 1, wherein, The aforementioned first temperature sensor measures the temperature around the housing or the aforementioned heating element, while the aforementioned second temperature sensor measures the temperature change of the aforementioned heating element according to the control sequence.

6. The fog generating apparatus as described in claim 1, wherein, The aforementioned first temperature sensor measures the temperature around the housing or the aforementioned heating element, and the aforementioned second temperature sensor measures the temperature of the aforementioned mist source.

7. The fog generating apparatus as described in claim 1 comprises: a first constant voltage circuit that generates a reference voltage for the aforementioned first AD conversion circuit; and a second constant voltage circuit that generates an operating power supply for a memory that records an action log; wherein the potential of the operating power supply for the aforementioned memory is the same as the potential of the aforementioned reference voltage.

8. The fog generating apparatus as described in claim 1, wherein, The aforementioned fog source is a solid.

9. The fog generating apparatus as described in claim 1, wherein, The aforementioned fog source is a liquid.

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