Method for manufacturing vacuum drying apparatus and articles

Abstract

[The technical problem to be solved] The present invention provides a vacuum drying apparatus and a method for manufacturing an article that reduces the deviation in the drying speed of a solution disposed on a substrate and increases the drying speed. Technical means to solve the problem The depressurization drying apparatus includes: an airtight container; a depressurization mechanism for depressurizing the interior of the airtight container; a substrate holding portion disposed inside the airtight container and capable of holding the substrate; and a rotating member disposed inside the airtight container at a position facing the substrate held in the substrate holding portion and capable of rotating relative to the substrate holding portion.

Description

Technical Field

[0001] The present invention relates to a drying technology for a solution disposed on a substrate. Prior Art

[0002] When manufacturing products such as panels (organic EL panels) that include OLED (Organic Light Emitting Diode) elements, a method known for applying a solution film to desired locations on a substrate using an inkjet device is known. A solution film is composed of a solution containing a solute and a solvent. By drying the solution film applied to the substrate, a film (layer) is formed on the substrate. This solution film is dried using a reduced-pressure drying device used in substrate processing equipment.

[0003] Patent document 1 discloses a reduced-pressure drying device comprising: a substrate holding portion; a surrounding wall arranged to the side of a substrate held by the substrate holding portion and surrounding the side surface of the substrate; and a rectifying plate arranged above the substrate holding portion and movable in the vertical direction. [Prior Art Literature] [Patent Document]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2022-38284 Summary of the Invention

[0005] [Problems to be solved by the invention]

[0006] When adjusting the drying speed deviation using the surrounding walls and rectifying plates disclosed in Patent Document 1, the solvent evaporated during drying accumulates in the space surrounded by the surrounding walls and rectifying plates. The solvent vapor accumulated in the space surrounded by the surrounding walls and rectifying plates may increase the solvent partial pressure around the substrate, causing temporal changes such as a decrease in the drying speed of the solution film. Furthermore, the solvent vapor accumulated in the space surrounded by the surrounding walls and rectifying plates may be adsorbed on the surrounding walls or rectifying plates. The solvent adsorbed on the surrounding walls or rectifying plates evaporates again in the space surrounded by the surrounding walls and rectifying plates, increasing the solvent partial pressure around the substrate and potentially causing temporal changes such as a decrease in the drying speed of the solution film.

[0007] An object of the present invention is to reduce the variation in the drying speed of a solution provided on a substrate and to increase the drying speed. [Technical means to solve the problem]

[0008] The first embodiment of the present invention is a substrate processing device, characterized in that the substrate processing device comprises: an airtight container; a decompression mechanism for decompressing the interior of the airtight container; a substrate holding portion, arranged inside the airtight container and capable of holding a substrate; and a rotating member, arranged inside the airtight container at a position facing the substrate held on the substrate holding portion and capable of rotating relative to the substrate holding portion.

[0009] The second embodiment of the present invention is a method for manufacturing an article, characterized in that a substrate coated with a solution on the main surface of the substrate is arranged on a substrate holding portion arranged inside an airtight container, the interior of the aforementioned airtight container is depressurized to a first pressure higher than the vapor pressure of the solvent contained in the aforementioned solution, and the aforementioned solvent is evaporated. In the process of depressurizing the interior of the aforementioned airtight container from the aforementioned first pressure to a second pressure lower than the vapor pressure of the aforementioned solvent, or in the state of being depressurized to the aforementioned second pressure, a rotating member arranged at a position opposite to the aforementioned substrate is rotated. [Effects of the Invention]

[0010] According to the present invention, the variation in the drying speed of a solution disposed on a substrate is reduced, and the drying speed is improved. Simple diagram description

[0011] FIG1 is a schematic cross-sectional view showing the structure of a reduced-pressure drying apparatus as an example of a substrate processing apparatus according to a first embodiment. FIG. 2A is a plan view showing a portion of the structure of the reduced-pressure drying apparatus according to the first embodiment. [ FIG. 2B ] is a side view of the rotating member of the first embodiment. FIG3A is a plan view showing a portion of the structure of a reduced-pressure drying apparatus according to a modified example of the first embodiment. FIG. 3B is a side view of a rotating member according to a modification of the first embodiment. FIG. 4 is a graph showing the drying rate relative to the solvent amount in the first embodiment. [ Fig. 5 ] is a flowchart of the article manufacturing method according to the first embodiment. FIG. 6 is a graph showing an example of pressure control in the drying process according to the first embodiment. [ FIG. 7A ] is an explanatory diagram of the drying process according to the first embodiment. [ FIG. 7B ] is an explanatory diagram of the drying process according to the first embodiment. [ Fig. 7C ] is an explanatory diagram of the drying process according to the first embodiment. FIG8A is an explanatory diagram of a cover unit of the reduced-pressure drying device according to the second embodiment. [ Fig. 8B ] is a cross-sectional view of a rotating member according to the second embodiment. FIG. 8C is a plan view of the rotating member according to the second embodiment as viewed from the direction of arrow VIIIC. FIG. [ Fig. 9A ] is an explanatory diagram of a drying process according to the second embodiment. [ Fig. 9B ] is an explanatory diagram of the drying process according to the second embodiment. [ Fig. 9C ] is an explanatory diagram of the drying process according to the second embodiment. [ Fig. 9D ] is an explanatory diagram of the drying process according to the second embodiment. [ Fig. 10A ] is an explanatory diagram of a drying process according to the third embodiment. [ Fig. 10B ] is an explanatory diagram of the drying process according to the third embodiment. [ Fig. 10C ] is an explanatory diagram of the drying process according to the third embodiment. FIG. 11A is an explanatory diagram of a drying process according to the fourth embodiment. [ Fig. 11B ] is an explanatory diagram of the drying process according to the fourth embodiment. [ Fig. 11C ] is an explanatory diagram of the drying process according to the fourth embodiment. FIG. 12 is an explanatory diagram of a cover unit of a reduced-pressure drying device according to a fifth embodiment. FIG. 13A is an explanatory diagram of a cover unit of a reduced-pressure drying device according to a sixth embodiment. FIG. 13B is an explanatory diagram of a cover unit of the reduced-pressure drying apparatus according to the sixth embodiment. FIG. 14A is an explanatory diagram of a portion of the structure of a reduced-pressure drying apparatus according to a seventh embodiment. FIG. 14B is an explanatory diagram of a portion of the structure of the reduced-pressure drying apparatus according to the seventh embodiment. FIG. 15A is an explanatory diagram of a cover unit of a reduced-pressure drying apparatus according to an eighth embodiment. FIG. 15B is an explanatory diagram of a cover unit according to a modified example of the eighth embodiment. Implementation Method

[0012] Exemplary embodiments of the present invention are described in detail below with reference to the accompanying drawings. Identical components are denoted by the same reference numerals throughout the figures, and duplicate descriptions are omitted. In the following embodiments, directions are expressed using the XYZ coordinate system, an orthogonal coordinate system. In the XYZ coordinate system, the XY plane is horizontal, and the negative Z-axis corresponds to the vertical direction (the direction of gravity).

[0013] [First embodiment] FIG1 is a schematic cross-sectional view showing the structure of a reduced-pressure drying apparatus 100, an example of a substrate processing apparatus according to a first embodiment. Reduced-pressure drying apparatus 100 is used as part of the manufacturing process for an organic EL panel including OLEDs as organic EL elements. Specifically, reduced-pressure drying apparatus 100 forms an organic film on substrate S by performing a drying process to dry a solution film F applied to substrate S.

[0014] The solution film F is composed of, for example, a solution containing a solute and a solvent for forming an organic film. The solvent contained in the solution film F preferably has a property of promoting evaporation under a reduced pressure environment below atmospheric pressure. The evaporation of the solvent is preferably promoted at a temperature higher than room temperature (25°C), for example.

[0015] The solvent is preferably an organic solvent. The solvent includes at least one organic solvent. Examples of the organic solvent include N,N-dimethylformamide, N,N-dimethylacetamide, N-methylpyrrolidone, 1,3-dimethyl-2-imidazolidinone, diethylene glycol monomethyl ether, cyclohexanone, N,N-dimethylisobutylamide, N-methylformamide, N-methylacetamide, N-diethylformamide, cyclohexanol, ethylene glycol, ethylene glycol diglycidyl ether, 1,3-octanediol, diethylene glycol, dipropylene glycol, triethylene glycol, Tripropylene glycol, 1,3-butanediol, 1,4-butanediol, propylene glycol, hexylene glycol, propylene glycol monomethyl ether, ethylene glycol monobutyl ether, diethylene glycol diethyl ether, diethylene glycol dimethyl ether, ethylene glycol monoethyl ether acetate, ethylene glycol monobutyl ether acetate, dipropylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether, diacetone alcohol, γ-butyrolactone, ethyl lactate, N-hexyl acetate, ethyl cellosolve acetate, etc.

[0016] An organic film is an organic layer, such as any of the following: the hole injection layer, hole transport layer, light-emitting layer, electron transport layer, or electron injection layer of an OLED. The production of an organic EL element involves forming each of these organic films on a substrate S. A solution film F is applied to the necessary areas of the substrate S using a coating device before the substrate S is loaded into the reduced-pressure drying apparatus 100.

[0017] The reduced-pressure drying apparatus 100 includes an airtight container 10, a decompression mechanism 30 for decompressing the interior of the airtight container 10, and a substrate holding portion 20 disposed inside the airtight container 10 and capable of holding a substrate S. Furthermore, the reduced-pressure drying apparatus 100 includes a cover unit 40 disposed inside the airtight container 10 and positioned around the substrate S held by the substrate holding portion 20. The cover unit 40 is disposed at a position that does not contact the substrate S held by the substrate holding portion 20.

[0018] The pressure of the external environment of the airtight container 10 is atmospheric pressure. The airtight container 10 is a member that defines an internal space SP0. The internal space SP0 includes a space SP2 surrounded by the cover unit 40 and a space SP1 outside of the space SP2. In the first embodiment, the space SP2 is the space surrounded by the substrate holder 20 and the cover unit 40. Although the space SP2 inside the cover unit 40 and the space SP1 outside the cover unit 40 are connected to each other, the pressure distribution in the space SP2 is adjusted to be as uniform as possible by surrounding the substrate S with the cover unit 40.

[0019] The reduced-pressure drying apparatus 100 also includes a gate valve 12 provided in the airtight container 10. A substrate S coated with a film of the solution F to be dried is transferred from the exterior space of the airtight container 10 into the interior space SP0 through the gate valve 12. Furthermore, the dried substrate S is transferred from the interior space SP0 to the exterior space through the gate valve 12.

[0020] The decompression mechanism 30 includes at least one pump, for example, multiple pumps. The multiple pumps may include, for example, at least one of a dry pump and a diaphragm vacuum pump. Furthermore, the multiple pumps may include, for example, at least one of a turbomolecular pump, a cryogenic pump, an absorption pump, an oil diffusion pump, a mechanical booster pump, a jet pump, and an oil rotary vacuum pump.

[0021] The reduced pressure drying apparatus 100 further includes a temperature control unit 70. The temperature control unit 70 controls the temperature of the substrate S or the solution film F on the substrate S by controlling the temperature of the substrate holder 20. The temperature control unit 70 preferably includes a heater for heating the substrate holder 20.

[0022] In addition, the temperature control unit 70 may include a cooler for cooling the substrate holding unit 20. The temperature control unit 70 controls the temperature of the substrate holding unit 20 by performing at least one of heating and cooling the substrate holding unit 20.

[0023] The temperature control unit 70 controls the multiple regions of the substrate holder 20 to the same or different temperatures to achieve a uniform temperature distribution on the substrate S. Preferably, the temperature control unit 70 controls the temperature so that the temperature difference between the multiple regions of the substrate S held by the substrate holder 20 is within 10°C. More preferably, the temperature control unit 70 controls the temperature so that the temperature difference between the multiple regions of the substrate S held by the substrate holder 20 is within 5°C. The temperature control unit 70 controls the temperature of the substrate holder 20 to maintain the temperature of the substrate S at a predetermined temperature within the range of 0°C to 100°C. By heating the substrate holder 20, the drying speed of the solution film F applied to the substrate S can be increased.

[0024] The cover unit 40 is disposed on the substrate holding portion 20. The main material of the cover unit 40 is preferably metal, such as stainless steel. For example, the stainless steel is preferably austenitic stainless steel containing no more than 0.045% phosphorus and no more than 0.030% sulfur (i.e., stainless steel designated as SUS304 in the Japanese Industrial Standards (JIS)).

[0025] FIG2A is a top view of a portion of the structure of the reduced-pressure drying apparatus 100 according to the first embodiment. FIG2A shows a top view of the cover unit 40 and its peripheral components when viewed along the Z direction. The cover unit 40 includes a surrounding wall 41, which is an example of a wall member, and a plurality of rotating members, for example, five rotating members 42-1, 42-2, 42-3, 42-4, and 42-5, that are rotatable relative to the substrate holding portion 20, i.e., the surrounding wall 41. The plurality of rotating members 42-1 to 42-5 are supported by the surrounding wall 41 directly or indirectly via other members. FIG2B is a side view of the rotating members 42-1 to 42-5 according to the first embodiment, as viewed along the X direction.

[0026] As shown in FIG1 , the reduced-pressure drying apparatus 100 includes a gas inlet 51 for introducing an inert gas into space SP1 and a gas inlet 52 for introducing an inert gas into space SP2. Gas inlets 51 and 52 are preferably, for example, flexible tubes. A valve 53 is provided in gas inlet 51. A valve 54 is provided in gas inlet 52.

[0027] The gas inlet 51 is provided through the airtight container 10 to supply inert gas to the space SP1. The gas inlet 52 is provided through the airtight container 10 and the surrounding wall 41 of the cover unit 40 to supply inert gas to the space SP2.

[0028] The inert gas is, for example, nitrogen. Furthermore, in the first embodiment, the gas supplied from the gas inlet portions 51 and 52 into the airtight container 10 is preferably an inert gas. However, as long as the gas has a composition different from that of the solvent of the solution film F, it may be a gas other than an inert gas, such as clean dry air.

[0029] By supplying gas to space SP1 through gas inlet 51, the pressure of internal space SP0 of airtight container 10, particularly the pressure of space SP1, is adjusted. Furthermore, by supplying gas to space SP2 through gas inlet 52, the pressure of internal space SP0 of airtight container 10, particularly the pressure of space SP2, is adjusted.

[0030] The reduced-pressure drying apparatus 100 also includes a gas analyzer 55 for detecting a specific gas in the space SP2. The gas in the space SP2 is introduced into the gas analyzer 55 via a connecting member 56. The gas analyzer 55 is, for example, a residual gas analyzer (RGA) such as a mass spectrometer. The specific gas detected by the gas analyzer 55 is the vapor (gas) of the solvent evaporated from the solution film F on the substrate S. The connecting member 56 can be a flexible tube, such as a glass fiber tube, or a bellows tube.

[0031] Furthermore, the reduced-pressure drying apparatus 100 further includes a pressure gauge 57 for detecting the pressure of the internal space SP0 of the airtight container 10. The pressure gauge 57 may be disposed in the space SP1, but preferably detects the pressure of the space SP2. In the first embodiment, the pressure gauge 57 is disposed in the space SP2.

[0032] The substrate holding portion 20 has a planar area 21 on which the substrate S is placed. The area 21 is, for example, a horizontal surface, that is, a surface parallel to the XY plane. That is, the area 21 can also be said to be a substrate placement surface. The surrounding wall 41 is a wall member extending in the Z direction. The surrounding wall 41 is arranged at a position facing the side surface SS of the substrate S placed on the area 21. The surrounding wall 41 is formed in a shape that surrounds the side surface SS of the substrate S placed on the area 21. In this way, the surrounding wall 41 is arranged to the side of the area 21. The surrounding wall 41 has an opening (not shown) for carrying the substrate S in and out. The opening (not shown) is opened and closed by a baffle (not shown). In addition, the surrounding wall 41 is erected on the substrate holding portion 20, but is not limited to this and can also be erected on other components.

[0033] Two or more of the plurality of rotating members 42 are positioned in the Z direction, perpendicular to the region 21, facing the substrate S placed on the region 21. In the first embodiment, the two or more rotating members are rotating members 42-1 to 42-5. Specifically, the rotating members 42-1 to 42-5 are positioned in the Z direction facing the substrate S placed on the region 21. Specifically, the rotating members 42-1 to 42-5 are positioned in the Z direction facing the main surface (substrate main surface) MS of the substrate S placed on the region 21, that is, facing the solution film F applied to the main surface MS. In this manner, the rotating members 42-1 to 42-5 are positioned above the region 21. The rotating members 42-1 to 42-5 are spaced apart from each other so as not to contact each other.

[0034] Rotating members 42-1 to 42-5 are each referred to as rotating member 42. Rotating member 42 is rotatable about a rotation axis L and includes a flat plate member 421 extending in the longitudinal direction (e.g., the X direction) along rotation axis L, and a pair of rotating shafts 422 disposed at both ends of the plate member 421 in the longitudinal direction. The thickness of plate member 421 is preferably 10 mm or less.

[0035] A drive source 44 is connected to one of the pair of rotating shafts 422. The drive source 44, such as a motor, can drive the rotating member 42 to rotate about the rotation axis L. The plurality of rotating members 42 are individually rotationally driven by the plurality of drive sources 44. In the first embodiment, a drive mechanism 45 is configured with the plurality of drive sources 44. The drive mechanism 45 is configured to rotate the rotating members 42-1 to 42-5 individually, but this is not limiting. The drive mechanism 45 may also be configured to rotate the rotating members 42-1 to 42-5 collectively.

[0036] The plate member 421 has two main surfaces 4211 and 4212. Main surface 4212 is the main surface opposite to main surface 4211. By rotating the rotating member 42, either main surface 4211 or 4212 can be made to face the solution film F on the main surface MS of the substrate S. In the example of FIG1 , the main surface 4211 is made to face the solution film F on the main surface MS of the substrate S.

[0037] The rotation axis L of each rotating member 42-1 to 42-5 extends parallel to the X direction along region 21. Rotating members 42-1 to 42-5 are arranged side by side with intervals along the Y direction, which intersects the X direction, along region 21. In each rotating member 42-1 to 42-5, the X direction is an example of a first direction, and the Y direction is an example of a second direction. In the first embodiment, the Y direction is orthogonal to the X direction.

[0038] Each of the rotating members 42-1 to 42-5 has a plurality of openings 43. Each opening 43 is a through-hole. The shape of the openings 43 can be circular or linear, such as a slit. The arrangement and size of the openings 43 are determined to uniformly dry the solution film F applied to the substrate S. For example, by making the area of ​​the openings 43 facing the area of ​​the solution film F on the substrate S where the drying rate is high smaller than that of the other openings 43, the drying rate of the solution film F can be adjusted and variations in the drying rate can be eliminated.

[0039] The opening area per unit area in the cover unit 40 is called the aperture ratio. The area of ​​each opening 43 in the cover unit 40 is adjusted so that the aperture ratio near the periphery of the substrate S is smaller than the aperture ratio near the center of the substrate S. For example, the aperture ratio of the portion of the cover unit 40 facing the center of the substrate S can be set to 40% to 70%, and the aperture ratio of the portion facing the periphery of the substrate S can be set to 20% to 50%. Furthermore, the cover unit 40 need only have a structure that allows the space SP2 to communicate with the space SP1; it does not necessarily need to have the openings 43.

[0040] In addition, the reduced pressure drying device 100 includes a control device 90 that controls the various parts of the entire device. The control device 90 is composed of, for example, a computer. The control device 90 includes a CPU as an example of a processor, a RAM as a temporary memory device, a ROM and an SSD as a non-temporary memory device (recording medium), and an I / O as an interface. The non-temporary memory device stores a control program that causes the CPU of the control device 90 to execute the control of the various parts of the entire device in the manufacturing process described later. The control device 90 controls the pressure inside the airtight container 10 by controlling the decompression mechanism 30, and controls the rotation of the rotating members 42-1 to 42-5 by controlling the drive mechanism 45, that is, the drive source 44. In addition, the control device 90 controls the supply and stop of gas, as well as the flow rate of gas, by controlling valves 53 and 54.

[0041] While the description uses the example of a case where the directions of the rotation axes L of all rotating members 42-1 to 42-5 coincide with the X-direction, this is not limiting. FIG3A is a top view of a portion of the structure of a reduced-pressure drying device according to a modified example of the first embodiment. FIG3A shows a top view of the cover unit 40A and surrounding components of the cover unit 40A, as viewed along the Z-direction, according to the modified example of the first embodiment. FIG3B is a side view of the rotating members 42-1 to 42-5, as viewed along the X-direction, according to the modified example of the first embodiment.

[0042] The cover unit 40A includes seven rotating members 42-1 to 42-7 as a plurality of rotating members. The plurality of rotating members 42-1 to 42-7 are supported on the surrounding wall 41 directly or indirectly via other members. The direction of the rotation axis L of each of the rotating members 42-1 to 42-5 is the X direction. The direction of the rotation axis L of each of the rotating members 42-6 and 42-7 is the Y direction. In other words, the direction of the rotation axis L of each of the rotating members 42-6 and 42-7 is different from the direction of the rotation axis L of each of the rotating members 42-1 to 42-5. The number of rotating members and the direction of their rotation axes can be determined based on the drying rate of the solution film F.

[0043] 4 is a graph showing the evaporation rate of the solvent from the solution film F applied to the substrate S, that is, the drying rate of the solution film F, relative to the amount of the solvent adsorbed on the inner surface of the cover unit 40 on the space SP2 side in the first embodiment.

[0044] As shown in Figure 4, the greater the amount of solvent adsorbed on the inner surface of the cover unit 40, the higher the solvent concentration, or partial pressure, within the space SP2, resulting in a slower drying rate for the solution film F. On the other hand, the smaller the amount of solvent adsorbed on the inner surface of the cover unit 40, the lower the solvent concentration, or partial pressure, within the space SP2, resulting in a faster drying rate for the solution film F. Furthermore, if the drying rate of the solution film F varies, the thickness of the formed film (layer) may also vary. In other words, to reduce variation in the thickness of the formed layer, it is important to maintain a uniform drying rate for the solution film F on the substrate S. To increase the drying rate of the solution film F, it is important to reduce the amount of solvent adsorbed on the inner surface of the cover unit 40.

[0045] The following describes a portion of the multiple steps in a method for manufacturing an organic EL panel, which serves as an example of an article, including the drying step (drying process). A solution film F is applied to required locations on the main surface MS of a substrate S using a coating device such as an inkjet device. The substrate S coated with the solution film F is then transported into the space SP2 inside the cover unit 40 by a transport device (not shown). The control device 90 then controls the drying process, drying the solution film F on the substrate S, i.e., evaporating the solvent in the solution film F.

[0046] FIG5 is a flowchart of the article manufacturing method according to the first embodiment. In step S1, upon receiving an instruction to start processing the substrate S, the control device 90 controls the drive source 44 to rotate the rotating member 42 in a predetermined orientation relative to the surrounding wall 41. Specifically, the control device 90 controls the rotation of the rotating member 42.

[0047] If the rotating member 42 is in a predetermined posture relative to the surrounding wall 41, the processing of step S1 is omitted. The predetermined posture is set according to the type of solution film F and the drying conditions. For example, the predetermined posture is a posture in which the main surface 4211 or 4212 of the rotating member 42 can face the main surface MS of the substrate S, that is, a posture in which the main surfaces 4211 or 4212 of the rotating member 42 are parallel to the horizontal plane.

[0048] Next, in step S2, the control device 90 controls the transport device (not shown) to carry the substrate S coated with the solution film F into the substrate holder 20 disposed inside the airtight container 10. Thus, the substrate S is placed on the area 21 of the substrate holder 20.

[0049] Furthermore, the rotation of the rotating member 42 in step S1 is performed when there is no substrate S on the substrate holder 20, but it can also be performed when there is a substrate S on the substrate holder 20. For example, by using a multi-stage liquid O-ring using a magnetic fluid, dust generated by the rotation of the rotating member 42 can be reduced, and a clean environment inside the airtight container 10 can be maintained.

[0050] Next, in step S3, the control device 90 performs a drying process. The drying process in step S3 is described in detail below. FIG6 is a graph showing an example of pressure control during the drying process of the first embodiment. The horizontal axis in FIG6 represents time, and the vertical axis represents the pressure of the internal space SP0, i.e., the pressure of the space SP2. The control device 90 controls the pressure reducing mechanism 30 so that the pressure value detected by the pressure gauge 57 approaches the pressure command value. FIG7A to FIG7C are explanatory diagrams of the drying process of the first embodiment. FIG7A shows a cross-section of the cover unit 40 and components arranged around the cover unit 40.

[0051] First, the control device 90 controls the decompression mechanism 30 so that the pressure of the internal space SP0 of the airtight container 10, that is, the pressure indicated by the pressure gauge 57, drops from atmospheric pressure to the first pressure P1 (drying process D1). As a result, the interior of the airtight container 10 is decompressed to the first pressure P1. The drying process D1 is a process of reducing pressure from atmospheric pressure to the first pressure P1. The first pressure P1 is a pressure lower than the atmospheric pressure and higher than the vapor pressure of the solvent. The first pressure P1 also depends on the vapor pressure of the solvent and is, for example, 10 Pa. Moreover, after the pressure indicated by the pressure gauge 57 reaches the first pressure P1, the control device 90 controls the decompression mechanism 30 so that the pressure of the internal space SP0, that is, the pressure indicated by the pressure gauge 57, remains at the first pressure P1 for a first time (drying process D2). Drying processes D1 and D2 are equivalent to the first treatment.

[0052] During drying step D2, the control device 90 controls the supply of inert gas from the gas inlet 51 to the space SP1 while operating the decompression mechanism 30, so that the pressure indicated by the pressure gauge 57 exceeds the vapor pressure of the solvent, that is, reaches the first pressure P1. Furthermore, this is not limited to drying step D2; inert gas may also be supplied from the gas inlet 51 to the space SP1 during any of the other drying steps D1, D3, and D4, for example, during drying step D4. Furthermore, the supply of inert gas from the gas inlet 52 is stopped during both drying steps D1 and D2.

[0053] In order to uniformly adjust the pressure distribution around the substrate S, that is, to uniformly adjust the evaporation rate of the solvent from the solution film F on the substrate S, the substrate S is surrounded by a cover unit 40 in the first embodiment. As the solvent evaporates from the solution film F, the solvent vapor G temporarily accumulates in the space SP2 surrounded by the cover unit 40. The solvent vapor G then flows from the space SP2 to the space SP1 through the gaps between the rotating members 42-1 to 42-5, the gap between the rotating member 42-1 and the surrounding wall 41, and the opening 43. In the space SP2, a portion of the solvent vapor G is adsorbed by the surrounding wall 41 and the rotating members 42-1 to 42-5.

[0054] In the drying step D2, the main surface 4211 of the rotating member 42 of the cover unit 40 faces the main surface MS of the substrate S. By maintaining the pressure in the space SP2 at the first pressure P1, the solution film F is uniformly dried. Specifically, the solution film F can be dried so that its thickness is uniform. This allows the surface of the solution film F to be flat. Furthermore, the rotating member 42 of the cover unit 40 is formed with a plurality of openings 43. In the drying step D2, while maintaining the pressure in the space SP2 at a predetermined pressure, the size and number of the openings 43 are adjusted to achieve a uniform pressure distribution in the space SP2. This fine-tuning of the pressure in the space SP2 allows for more efficient and uniform drying of the solution film F. By the time of the drying step D2, the shape of the solution film F is roughly defined.

[0055] After the first time has passed, that is, after the first treatment, the control device 90 controls the decompression mechanism 30 so that the pressure of the internal space SP0 of the airtight container 10, that is, the pressure indicated by the pressure gauge 57, drops from the first pressure P1 to the second pressure P2 (drying process D3). As a result, the interior of the airtight container 10 is decompressed to the second pressure P2. The drying process D3 is a process of reducing the pressure from the first pressure P1 to the second pressure P2. The second pressure P2 is a pressure that is lower than the first pressure P1 and lower than the vapor pressure of the solvent. The second pressure P2 also depends on the vapor pressure of the solvent and is, for example, 10-3Pa. Then, after the pressure indicated by the pressure gauge 57 reaches the second pressure P2, the control device 90 controls the decompression mechanism 30 so that the pressure of the internal space SP0, that is, the pressure indicated by the pressure gauge 57, remains at the second pressure P2 for the second time (drying process D4). Drying processes D3 and D4 are equivalent to the second treatment.

[0056] After the drying step D3, the pressure inside the airtight container 10 is reduced to the second pressure P2, and the solution film F on the substrate S is further dried. In particular, in the drying step D4, the solution film F on the substrate S is further dried while the pressure of the internal space SP0 is maintained at the second pressure P2.

[0057] Here, in drying steps D1 and D2, as shown in Figures 7A and 7B , as the solvent evaporates from the solution film F on the main surface MS of the substrate S, a portion of the solvent vapor G accumulates on the inner surface of the cover unit 40 facing the space SP2, and the liquid solvent Ls is adsorbed thereon, as shown in Figure 7B . If the amount of solvent Ls adsorbed on the inner surface of the cover unit 40 increases, the solvent partial pressure in the space SP2 increases as the solvent Ls adsorbed on the inner surface of the cover unit 40 evaporates.

[0058] Therefore, in the first embodiment, after the drying step D3, that is, in the drying step D3 or D4, preferably in the drying step D3, the control device 90 controls the rotating member 42 so that the rotating member 42 rotates around the rotation axis L by a predetermined angle from the state in the drying steps D1 and D2. Specifically, the control device 90 controls the driving mechanism 45 so that the driving source 44 of the driving mechanism 45 rotates the rotating member 42 by the predetermined angle.

[0059] In the first embodiment, the predetermined angle is 180 degrees. Specifically, by rotating the rotating member 42 half a turn, the main surface 4211 adsorbed with the solvent Ls faces the space SP1 side, while the clean main surface 4212 faces the space SP2 side. Thus, by rotating the rotating member 42 180 degrees, the amount of solvent Ls adsorbed on the inner surface of the cover unit 40 facing the space SP2 can be reduced. This maintains the amount of solvent Ls adsorbed on the inner surface of the cover unit 40 facing the space SP2 at a low level, enabling stable and high-speed drying of the solution film F and stable film formation. In other words, the drying time of the solution film F can be shortened.

[0060] In the first embodiment, in drying step D3 or D4, preferably, all rotating members 42-1 to 42-5 facing the substrate S in the Z direction are rotated by the same predetermined angle, i.e., 180 degrees, in drying step D3. This allows for more stable and faster drying of the solution film F, enabling more stable film formation. In other words, the drying time of the solution film F can be further shortened.

[0061] Furthermore, since the main surface 4211, to which the solvent Ls has been adsorbed, faces the space SP1 side, the solvent Ls adsorbed on the main surface 4211 is removed in the space SP1, leaving the main surface 4211 clean. This allows the solvent to be removed from the main surface 4211 at least during the drying step D4. Therefore, a separate step for removing the solvent Ls from the main surface 4211 is not required after the drying step D4, thus shortening the cycle time.

[0062] Furthermore, during drying steps D3 and D4, the control device 90 introduces an inert gas into the space SP2 via the gas inlet 52. This sprays the inert gas onto the inner surface of the surrounding wall 41, desorbing the solvent adsorbed thereon. This also accelerates the drying of the solution film F, further increasing the drying speed.

[0063] The inert gas introduced from the gas inlet 52 during drying steps D3 and D4 also serves to discharge the solvent remaining in space SP2 into space SP1. This further increases the drying speed of the solution film F. The inert gas introduction can be initiated before, during, or after the rotation of the rotating member 42.

[0064] After the second time has elapsed, that is, after the second process, the control device 90 controls so that the pressure of the internal space SP0 of the airtight container 10, that is, the pressure indicated by the pressure gauge 57, becomes atmospheric pressure. For example, the control device 90 can control the interior of the airtight container 10 to become atmospheric pressure by stopping the operation of the decompression mechanism 30 and introducing an inert gas into the interior of the airtight container 10.

[0065] As described above, the drying process includes multiple drying steps D1 to D4. The control device 90 controls the decompression mechanism 30 to execute the multiple drying steps D1 to D4. In addition, the number of drying steps is not limited to four.

[0066] As described above, the solution film F is dried through the plurality of drying steps D1 to D4 with different pressure conditions. This allows the thickness of the film formed by drying the solution film F to be uniform, and also allows the drying speed to be increased.

[0067] If the pressure in space SP2 is immediately reduced to the second pressure P2 during drying steps D1 and D2, the drying rate of the solution film F increases, but the rapid evaporation of the solvent may lead to uneven film thickness. In the first embodiment, by drying the solution film F to a certain extent at the first pressure P1, the film shape is roughly defined. Therefore, even if the drying rate of the solution film F is subsequently increased at the second pressure P2, the effect on film thickness is reduced. However, if the solvent concentration, or partial pressure, in space SP2 increases, the solvent adsorbed on the inner surface of the cover unit 40 will hinder the pressure reduction. In the first embodiment, by rotating the rotating member 42 half a turn, the solvent adsorbed on the rotating member 42 is discharged outside space SP2, that is, into space SP1. This allows the pressure in space SP2 to be quickly reduced to the second pressure P2. Thus, by performing the drying process, namely the multiple drying steps D1 to D4, it is possible to reduce the variation in the drying rate of the solution film F on the substrate S and shorten the drying time of the solution film F.

[0068] In step S4, the control device 90 determines whether all drying steps have been completed, that is, whether the drying process has ended. The determination of drying completion is based on the output value of the gas analyzer 55 or a preset drying time. Furthermore, if the drying process includes multiple drying steps, the control device 90 may perform the determination in step S4 after the last of the multiple drying steps has begun.

[0069] If the answer to step S4 is "yes", that is, the drying process is completed, the control device 90 executes the next step S5. If the answer to step S4 is "no", that is, the drying process is not completed, the control device 90 returns to the process of step S3 and continues the drying process.

[0070] In step S5 , the control device 90 controls a transport device (not shown) to transport the substrate S held by the substrate holding portion 20 to the outside of the airtight container 10 .

[0071] As described above, according to the first embodiment, it is possible to reduce the variation in the drying speed of the solution film F applied to the substrate S and to increase the drying speed of the solution film F. This improves the productivity of the organic EL panel as a product.

[0072] Furthermore, according to the first embodiment, by rotating the rotating member 42 by 180 degrees, the amount of solvent adsorbed on the main surface 4211 or 4212 of the rotating member 42 facing the space SP2 can be kept low, and a film (layer) can be formed by drying the solution film F stably and quickly.

[0073] [Second embodiment] A reduced-pressure drying apparatus, as an example of a substrate processing apparatus according to the second embodiment, will be described. Figure 8A is an illustrative diagram of the cover unit 40B of the reduced-pressure drying apparatus according to the second embodiment. Figure 8A shows a cross-section of the cover unit 40B and components arranged around the cover unit 40B. The reduced-pressure drying apparatus according to the second embodiment is obtained by replacing the cover unit 40 with the cover unit 40B in the reduced-pressure drying apparatus 100 according to the first embodiment. Therefore, the structure of the reduced-pressure drying apparatus (substrate processing apparatus) according to the second embodiment, excluding the cover unit 40B, is identical to that of the reduced-pressure drying apparatus 100 according to the first embodiment, and therefore its description will be omitted.

[0074] Inside the airtight container 10 ( FIG. 1 ), the cover unit 40B is positioned to surround the substrate S held by the substrate holder 20. The cover unit 40B is positioned so as not to contact the substrate S held by the substrate holder 20. The cover unit 40B of the second embodiment is positioned above the substrate holder 20. A space SP2 is defined by the substrate holder 20 and the cover unit 40B. Although the space SP2 inside the cover unit 40B communicates with the space SP1 outside the cover unit 40B, the pressure distribution in the space SP2 is adjusted to be as uniform as possible by surrounding the substrate S with the cover unit 40B.

[0075] The main material of the cover unit 40B is preferably metal, such as stainless steel. The stainless steel is preferably austenitic stainless steel containing 0.045% or less phosphorus and 0.030% or less sulfur (ie, stainless steel designated as SUS304 in Japanese Industrial Standards: JIS).

[0076] The cover unit 40B of the second embodiment includes a surrounding wall 41, an example of a wall member, and a plurality of rotating members, for example, five rotating members 42B, that are rotatable relative to the substrate holding portion 20 (i.e., the surrounding wall 41). Specifically, in the second embodiment, the rotating members 42 of the first embodiment are replaced with rotating members 42B. The plurality of rotating members 42B are supported by the surrounding wall 41 directly or indirectly via other members.

[0077] Two or more of the plurality of rotating members 42B are arranged in a direction perpendicular to the region 21, i.e., in the Z direction, facing the region 21. In the second embodiment, the two or more rotating members are five rotating members 42B. That is, the five rotating members 42B are arranged in a position facing the substrate S arranged on the region 21 in the Z direction. Specifically, the five rotating members 42B are arranged in a position facing the main surface MS of the substrate S arranged on the region 21, i.e., the solution film F, in the Z direction. In this manner, the rotating members 42B are arranged above the region 21.

[0078] The five rotating members 42B are arranged at intervals from one another so as not to contact one another. The rotation axis L of each of the five rotating members 42B extends parallel to the X direction along the region 21. The five rotating members 42B are arranged in a row at intervals from one another in the Y direction, which intersects the X direction, along the region 21. For each of the five rotating members 42B, the X direction is an example of a first direction, and the Y direction is an example of a second direction. In the second embodiment, the Y direction is orthogonal to the X direction.

[0079] Figure 8B is a cross-sectional view of the rotating member 42B of the second embodiment, and Figure 8C is a top view of the rotating member 42B of the second embodiment as viewed from the direction of arrow VIIIC. The rotating member 42B is rotatable about a rotation axis L. The rotating member 42B includes a column member 421B extending in the longitudinal direction along the rotation axis L, and a pair of rotating shafts 422 arranged on either side of the column member 421B in the longitudinal direction. In the example of Figure 8B , the longitudinal direction is the X direction. The inclusion of the column member 421B makes the rotating member 42B more rigid than the plate member.

[0080] The column member 421B can be a circular cylinder or an elliptical cylinder, but is preferably a polygonal cylinder. Specifically, the column member 421B is preferably a polygonal cylinder having three or more principal faces (N). The polygonal cylinder is preferably a regular polygonal cylinder, and among regular polygonal cylinders, a regular triangular cylinder or a regular square cylinder is preferred. In the second embodiment, the column member 421B is a regular triangular cylinder. Specifically, the column member 421B has three principal faces (N=3): 4211B, 4212B, and 4213B.

[0081] In addition, the rotating member 42B preferably has a plurality of openings 43 formed in the column member 421B. The openings 43 are through holes or slits.

[0082] A driving source (not shown) is connected to one of the pair of rotating shafts 422 of the rotating member 42B. The driving source (not shown) includes, for example, a motor, and can drive the rotating member 42B to rotate about the rotation axis L. The plurality of rotating members 42B can be individually driven to rotate by separate driving sources or can be driven to rotate collectively.

[0083] The method for manufacturing an organic EL panel, an article according to the second embodiment, is similar to that shown in the flowchart of FIG5 described in the first embodiment, except that the rotation angle of rotating member 42B differs from the rotation angle of rotating member 42 in the first embodiment. In the first embodiment, the drying process in step S3 of FIG5 was described as rotating rotating member 42 by 180 degrees around rotation axis L, which is the predetermined angle. However, in the second embodiment, rotating member 42 is rotated by (360 / N) degrees around rotation axis L, which is the predetermined angle. That is, in the second embodiment, since N = 3, rotating member 42B is rotated by 120 degrees around rotation axis L during the drying process in step S3.

[0084] Figures 9A to 9D are explanatory diagrams of the drying process of the second embodiment. Figures 9A to 9D illustrate cross-sections of the cover unit 40B and components disposed around the cover unit 40B. The drying process of the second embodiment, like that of the first embodiment, includes drying steps D1 to D4 shown in Figure 6 .

[0085] As shown in Figure 9A, the control device 90 controls the decompression mechanism 30 to reduce the pressure of the internal space SP0 of the airtight container 10, that is, the pressure indicated by the pressure gauge 57, from atmospheric pressure to the first pressure P1 (drying process D1). As a result, the interior of the airtight container 10 is decompressed to the first pressure P1. Furthermore, as shown in Figure 9B, after the pressure indicated by the pressure gauge 57 reaches the first pressure P1, the control device 90 controls the decompression mechanism 30 to maintain the pressure of the internal space SP0, that is, the pressure indicated by the pressure gauge 57, at the first pressure P1 for a first period of time (drying process D2). Drying processes D1 and D2 correspond to the first treatment.

[0086] After the first period of time has passed, that is, after the first treatment, as shown in FIG9C , the control device 90 controls the decompression mechanism 30 so that the pressure of the internal space SP0 of the airtight container 10, that is, the pressure indicated by the pressure gauge 57, drops from the first pressure P1 to the second pressure P2 (drying process D3). As a result, the interior of the airtight container 10 is decompressed to the second pressure P2. Then, after the pressure indicated by the pressure gauge 57 reaches the second pressure P2, the control device 90 controls the decompression mechanism 30 so that the pressure of the internal space SP0, that is, the pressure indicated by the pressure gauge 57, remains at the second pressure P2 for a second period of time (drying process D4). Drying processes D3 and D4 correspond to the second treatment.

[0087] In the second embodiment, after drying step D3, that is, during drying step D3 or D4, preferably during drying step D3, the control device 90 controls the rotating member 42B so that the rotating member 42B rotates 120 degrees about the rotation axis L from the state in drying steps D1 or D2. The rotating member 42B is controlled to rotate in a predetermined direction, in the example of FIG9C , counterclockwise.

[0088] When the rotating member 42B having the column member 421B in the shape of a regular triangular prism is rotated 120 degrees, the main surface 4211B facing the space SP2 and having the solvent Ls adsorbed thereon can be directed toward the space SP1, and at the same time, one of the main surfaces 4212B and 4213B facing the space SP1 can be directed toward the space SP2.

[0089] As described above, according to the second embodiment, since the rotating member 42B includes the column member 421B, the rigidity of the rotating member 42B is increased, which is advantageous when the cover unit 40B is increased in size in accordance with the increase in size of the substrate S.

[0090] Furthermore, in a polygonal prism-like column member 421B, the time ratio facing space SP1 is higher, which is also advantageous from the perspective of keeping the rotating member 42B clean. For example, in a regular triangular prism-shaped column member 421B, the time ratio facing space SP2 is 1 / 3, and the time ratio facing space SP1 is 2 / 3. On the other hand, in a flat plate-shaped plate member rotated 180 degrees, the time ratio facing space SP2 is 1 / 2, and the time ratio facing space SP1 is 1 / 2. In other words, the time ratio facing space SP1 can be increased compared to a flat plate. The main surface 4211B of the rotating member 42B, which has adsorbed solvent, faces space SP1 during drying steps D3 and D4. This allows the solvent adsorbed on the main surface 4211B to be released into space SP1, facilitating solvent removal from the rotating member 42B. Therefore, a high time ratio facing space SP1 is also advantageous from the perspective of keeping the rotating member 42B clean.

[0091] In the second embodiment, in drying step D3 or D4, preferably in drying step D3, all rotating members 42B facing the substrate S in the Z direction are rotated by the same predetermined angle, i.e., 120 degrees. This allows for more stable and faster drying of the solution film F, enabling more stable film formation. In other words, the drying time of the solution film F can be further shortened.

[0092] 9D , the rotating member 42B may be rotated 240 degrees counterclockwise and the rotating member 42B may be rotated substantially 120 degrees clockwise.

[0093] [Third embodiment] The third embodiment will be described. The structure of the vacuum drying device of the third embodiment is the same as that of the vacuum drying device 100 of the first embodiment. Therefore, in the third embodiment, the same reference numerals as those of the first embodiment are used, and description thereof will be omitted.

[0094] Figures 10A to 10C are explanatory diagrams of the drying process in the third embodiment. Figures 10A to 10C illustrate cross-sections of the cover unit 40 and components disposed around the cover unit 40. In the third embodiment, the rotation control of the rotating member 42 differs from that in the first embodiment. Drying step D1 shown in Figure 10A and drying step D2 shown in Figure 10B are the same as those described in the first embodiment. In drying steps D3 or D4 shown in Figure 10C, the control device 90 rotates the rotating members 42-1 to 42-5 90 degrees about the rotation axis L.

[0095] That is, after the shape of the solution film F is roughly determined in the drying step D2, the rotating member 42 is rotated 90 degrees after the drying step D3 to accelerate the drying of the solution and the discharge of the solvent retained in the space SP2 to the space SP1.

[0096] Furthermore, in drying steps D3 and D4, it is also effective to deliver inert gas from the gas inlet 52 into space SP2, thereby directing the solvent out of space SP2. In this case, by angling the main surface 4211 of the rotating member 42 at a 90-degree angle relative to the horizontal plane, a wide solvent discharge path can be ensured. Specifically, in drying steps D1 and D2, to uniformly dry the solution film F on the substrate S, the rotating member 42 is set to a closed position (rotation angle of 0 degrees) to minimize the opening area. After drying step D3, the rotating member 42 is rotated 90 degrees to expand the opening area, thereby increasing the conductivity of the solvent vapor G from space SP2 to space SP1 and accelerating the discharge of the solvent from space SP2 to space SP1. This allows for stable and high-speed drying of the solution film F, enabling stable film formation. This shortens the drying time of the solution film F. Furthermore, solvent Ls adsorbed on the rotating member 42 can be released.

[0097] In the third embodiment, in drying step D3 or D4, preferably, all rotating members 42-1 to 42-5 facing the substrate S in the Z direction are rotated by the same predetermined angle, i.e., 90 degrees, in drying step D3. This allows for more stable and faster drying of the solution film F, enabling more stable film formation. In other words, the drying time of the solution film F can be further shortened.

[0098] [Fourth embodiment] The fourth embodiment will be described. The structure of the vacuum drying device of the fourth embodiment is the same as that of the vacuum drying device 100 of the first embodiment. Therefore, in the fourth embodiment, the same reference numerals as those of the first embodiment are used, and description thereof will be omitted.

[0099] Figures 11A to 11C are explanatory diagrams of the drying process according to the fourth embodiment. Figures 11A to 11C illustrate cross-sections of the cover unit 40 and the components disposed around the cover unit 40. In the fourth embodiment, the rotation control of the rotating member 42 differs from that in the first to third embodiments. In the first to third embodiments, the control device 90 controls all rotating members facing the substrate to rotate at the same angle. In the fourth embodiment, the control device 90 individually sets the rotation angle of each rotating member 42 (42-1 to 42-5) facing the substrate S.

[0100] Drying step D1 shown in FIG11A and drying step D2 shown in FIG11B are the same as those described in the first embodiment. In drying step D3 or D4 shown in FIG11C , the control device 90 rotates the rotating members 42-1 to 42-5 individually around the rotation axis L at rotation angles set for the rotating members 42-1 to 42-5.

[0101] That is, the rotation angles of the rotating members 42 - 1 to 42 - 5 arranged in the Z direction facing the substrate S are adjusted to independently set angles. Therefore, the gap in the upper portion of the cover unit 40 is adjusted.

[0102] Rotating members 42-1 through 42-5 include rotating members 42-1 and 42-5 located at the extreme ends in the Y direction, and rotating members 42-2 through 42-4 that are distinct from rotating members 42-1 and 42-5. Either rotating member 42-1 or 42-5 is an example of a first rotating member, and either rotating member 42-2 through 42-4 is an example of a second rotating member. The following description focuses on rotating member 42-1, located at the extreme ends in the Y direction, and rotating member 42-3, located in the center in the Y direction.

[0103] The control device 90 controls the rotating member 42-1 so that the main surface 4211 of the rotating member 42-1 forms an angle θ1 relative to the region 21, that is, the horizontal XY plane. Angle θ1 is an example of a first angle. Angle θ1 is an acute angle less than 90 degrees. The control device 90 controls the rotating member 42-3 so that the main surface 4211 of the rotating member 42-3 forms an angle θ2 relative to the region 21, that is, the horizontal XY plane, which is an angle greater than angle θ1. Angle θ2 is an example of a second angle. Angle θ2 is 90 degrees, that is, a right angle, or an acute angle less than 90 degrees. In other words, the closer the rotating member 42 is to the center of the substrate S, the larger the angle of the main surface 4211 relative to the horizontal plane.

[0104] In this way, by individually adjusting the rotation angle of each of the rotating members 42 - 1 to 42 - 5 , the area of ​​the opening connecting the space SP1 and the space SP2 can be individually adjusted, and the drying speed of the solution film F can be adjusted for each portion of the substrate S.

[0105] For example, if the conductivity of solvent vapor from space SP2 to space SP1 remains constant when the substrate S is larger, the drying rate tends to decrease near the center of the substrate S and increase near the ends of the substrate S. Therefore, in the fourth embodiment, the control device 90 rotates the rotating member 42-3 located above the center of the substrate S by 90 degrees, fully opening it to increase the conductivity of solvent vapor G, and rotates the rotating member 42-1 located above the ends of the substrate S by, for example, 30 degrees, tending to close it, thereby reducing the conductivity of solvent vapor G. This allows for uniform drying rates across all areas of the substrate S, even when the substrate S is larger. Furthermore, it allows for the solvent Ls adsorbed on the rotating member 42 to be released.

[0106] [Fifth embodiment] A reduced-pressure drying apparatus, as an example of a substrate processing apparatus according to the fifth embodiment, will now be described. Figure 12 is an illustration of the cover unit 40C of the reduced-pressure drying apparatus according to the fifth embodiment. The reduced-pressure drying apparatus according to the fifth embodiment is obtained by replacing the cover unit 40 with the cover unit 40C in the reduced-pressure drying apparatus 100 according to the first embodiment. Therefore, the structure of the reduced-pressure drying apparatus (substrate processing apparatus) according to the fifth embodiment, excluding the cover unit 40C, is identical to that of the reduced-pressure drying apparatus 100 according to the first embodiment, and therefore its description will be omitted.

[0107] The cover unit 40C is positioned within the airtight container 10 ( FIG. 1 ) to cover the substrate S held by the substrate holder 20. A space SP2 is defined by the substrate holder 20 and the cover unit 40C. While the space SP2 inside the cover unit 40C communicates with the space SP1 outside the cover unit 40C, surrounding the substrate S with the cover unit 40C allows for a uniform pressure distribution within the space SP2.

[0108] The cover unit 40C includes a surrounding wall 41, which is an example of a wall member, and two or more rotating members that are rotatable relative to the surrounding wall 41. In the fifth embodiment, the two or more rotating members are four or more rotating members, for example, eleven rotating members 42-1 to 42-11. The rotating members 42-1 to 42-11 are supported by the surrounding wall 41 directly or indirectly via other members.

[0109] At least two of the four or more rotating elements 42-1 to 42-11, for example, five rotating elements 42-1 to 42-5, constitute group G1. At least two of the four rotating elements 42-1 to 42-11 that are different from rotating elements 42-1 to 42-5, for example, six rotating elements 42-6 to 42-11, constitute group G2. Group G1 is an example of a first group, and group G2 is an example of a second group.

[0110] Group G2 is positioned farther from area 21 than group G1. Specifically, group G1 is positioned above substrate holder 20, and group G2 is positioned above group G1. Therefore, the rotating members 42-1 to 42-11 included in groups G1 and G2 are positioned facing substrate S in the Z direction. Rotating members 42-1 to 42-5 are positioned at intervals in the Y direction. Rotating members 42-6 to 42-11 are positioned at intervals in the X direction.

[0111] When viewed in the Z direction, the rotation axis L2 of each of the rotating elements 42-6 to 42-11 included in group G2 intersects the rotation axis L1 of each of the rotating elements 42-1 to 42-5 included in group G1. In the fifth embodiment, when viewed in the Z direction, the rotation axis L2 is orthogonal to the rotation axis L1. For example, the rotation axis L1 extends in the X direction, and the rotation axis L2 extends in the Y direction.

[0112] In the fifth embodiment, similar to the fourth embodiment, the control device 90 individually sets the rotation angles of the rotating members 42-1 to 42-11 facing the substrate S. Specifically, the rotating members 42-1 to 42-11 are individually driven and rotated by a drive source (not shown), and the rotation angles of the rotating members 42-1 to 42-11 are adjusted to the individually set angles. By individually setting the rotation angles of the rotating members 42-1 to 42-11, the gaps between the rotating members 42-1 to 42-11, i.e., the opening area, can be adjusted for each portion of the substrate S. Therefore, the drying speed of the solution film F can be adjusted to accelerate or delay the drying process for each portion of the substrate S.

[0113] Furthermore, because the cover unit 40C includes groups G1 and G2, the drying rate of the solution film F can be more precisely adjusted for each portion of the substrate S in the XY directions. Furthermore, the control device 90 can independently control the rotation angles of the rotating members included in each of the groups G1 and G2, enabling more efficient and fine adjustment of the drying rate. For example, the control device 90 controls the rotating members included in group G1 and the rotating members included in group G2, similarly to the fourth embodiment, thereby enabling more fine adjustment of the drying rate of the solution film F on the substrate S.

[0114] In addition, although the case where the cover unit 40C includes two groups G1 and G2 has been described, the present invention is not limited thereto and the cover unit 40C may include three or more groups.

[0115] While the description above illustrates a case where rotation axes L1 and L2 intersect orthogonally, i.e., intersecting at 90 degrees, as viewed in the Z direction, the present invention is not limited to this. Alternatively, rotation axes L1 and L2 may intersect at an angle between 60 and 120 degrees as viewed in the Z direction.

[0116] [Sixth embodiment] A reduced-pressure drying apparatus, an example of a substrate processing apparatus according to the sixth embodiment, will be described. Figures 13A and 13B are explanatory diagrams of the cover unit 40D of the reduced-pressure drying apparatus according to the sixth embodiment. Figures 13A and 13B show cross-sections of the cover unit 40D and components arranged around the cover unit 40D. The reduced-pressure drying apparatus according to the fifth embodiment is obtained by replacing the cover unit 40 with the cover unit 40D in the reduced-pressure drying apparatus 100 according to the first embodiment. Therefore, the structure of the reduced-pressure drying apparatus (substrate processing apparatus) according to the sixth embodiment, excluding the cover unit 40D, is identical to that of the reduced-pressure drying apparatus 100 according to the first embodiment, and therefore its description will be omitted.

[0117] As shown in FIG13A , the cover unit 40D includes a surrounding wall 41D and a plurality of rotating members, for example, seven rotating members 42-1 to 42-7, that are rotatable relative to the surrounding wall 41D. The plurality of rotating members 42-1 to 42-7 are supported on the surrounding wall 41D directly or indirectly via other members.

[0118] As in the first embodiment, two or more of the plurality of rotating members 42 - 1 to 42 - 7 , five rotating members 42 - 1 to 42 - 5 in the sixth embodiment, are arranged facing the region 21 in the Z direction, ie, above the region 21 .

[0119] Among the plurality of rotating members 42-1 to 42-7, at least one rotating member different from the rotating members 42-1 to 42-5, in the sixth embodiment, two rotating members 42-6 and 42-7, are arranged on the sides of the area 21. In other words, the rotating members 42-6 and 42-7 are arranged at positions facing the side surface SS of the substrate S held by the substrate holding portion 20.

[0120] The control device 90 controls the rotation angles of the plurality of rotating members 42-1 to 42-7. As shown in FIG13B, similarly to the first to fourth embodiments, the timing for rotating the rotating members 42-1 to 42-7 is after the drying step D3.

[0121] Furthermore, similar to the fourth embodiment, the control device 90 independently sets the rotation angle of at least the rotating members 42-1 to 42-5 facing the substrate S. By independently setting the rotation angles of the rotating members 42-1 to 42-5, the gap between the rotating members 42-1 to 42-5, i.e., the opening area, can be adjusted for each portion of the substrate S. Furthermore, by rotating the rotating members 42-6 and 42-7, the solvent near the end of the substrate S is discharged from the side of the substrate S into the space SP1, as indicated by the thick arrows in FIG13B . This accelerates the discharge of the solvent near the end of the substrate S, thereby increasing the drying speed of the solution film F near the end of the substrate S. Alternatively, the control device 90 can independently set the rotation angles of all the rotating members 42-1 to 42-7.

[0122] [Seventh embodiment] A reduced pressure drying apparatus as an example of a substrate processing apparatus according to the seventh embodiment will be described. The reduced pressure drying apparatus according to the seventh embodiment is an apparatus in which the reduced pressure drying apparatus 100 according to the first embodiment is further provided with a drying auxiliary component described below. Figures 14A and 14B are explanatory diagrams of a portion of the structure of the reduced pressure drying apparatus according to the seventh embodiment. Figures 14A and 14B illustrate a cross section of a rotating member 42. The drying auxiliary component preferably operates after the drying step D3. The solvent adsorbed on the rotating member 42 is removed by the drying auxiliary component due to the rotating member 42 rotating 180 degrees toward the space SP1. The removal of the solvent adsorbed on the rotating member 42 by the drying auxiliary component is performed while the main surface of the rotating member 42, for example, the main surface 4211, to which the solvent is adsorbed, faces the space SP1.

[0123] The drying assisting member includes at least one of the nozzle 61 shown in FIG14A , the heating device 62 shown in FIG14B , and the ultrasonic vibration device 63 shown in FIG14B . In the seventh embodiment, the nozzle 61, the heating device 62, and the ultrasonic vibration device 63 are included. By using these nozzles 61, the heating device 62, and the ultrasonic vibration device 63 in combination, the solvent adsorbed on the rotating member 42 can be effectively removed.

[0124] Nozzle 61 is a gas flow nozzle for injecting gas onto rotating member 42. After drying step D3 shown in Figure 7C, rotating member 42 rotates 180 degrees, so that main surface 4211 adsorbed with solvent faces space SP1. Nozzle 61 is positioned in space SP1 and injects gas onto main surface 4211 of rotating member 42. This allows solvent adsorbed on main surface 4211 of rotating member 42 to be detached, enabling rapid removal of the solvent from rotating member 42. The gas is a trace amount of inert gas sufficient to not disrupt the reduced pressure environment of airtight container 10. By injecting inert gas onto rotating member 42, solvent molecules adsorbed on main surface 4211 are detached, or solvent molecules retained in space SP2 are discharged from space SP2.

[0125] The heating device 62 heats the rotating member 42 and includes, for example, a heater 64 and a temperature control unit 65 for controlling the temperature of the heater 64. The heater 64 is disposed within the rotating member 42. The temperature control unit 65 controls the temperature of the heater 64 to heat the rotating member 42. By heating the rotating member 42, the solvent adsorbed on the rotating member 42 is heated.

[0126] The temperature control unit 65 controls the temperature of each region of the rotating member 42 to be the same or different, so that the temperature distribution of the rotating member 42 is uniform. The temperature control unit 65 preferably controls the temperature difference between each region of the rotating member 42 to within 10°C, and more preferably within 5°C. The temperature control unit 65 controls the heater 64 to maintain the temperature of the rotating member 42 at a predetermined temperature within the range of 0°C to 100°C. Alternatively, the heating device 62 may include a light source for heating the rotating member 42, instead of or in addition to the heater 64. For example, the light source is disposed in the space SP1 and can heat the rotating member 42, or the solvent adsorbed thereon, by irradiating light onto the main surface 4211 or main surface 4212 of the rotating member 42 facing the space SP1.

[0127] The ultrasonic vibration device 63 applies ultrasonic vibrations to the rotating member 42. It includes an ultrasonic vibrator 66, such as a piezoelectric element, and an output control unit 67 that applies voltage to the ultrasonic vibrator 66. The ultrasonic vibrator 66 is located inside the rotating member 42 and converts the applied voltage into vibrations. The output control unit 67 applies voltage to the ultrasonic vibrator 66, causing it to generate ultrasonic waves. The ultrasonic vibrations of the rotating member 42 cause solvent adsorbed on the rotating member 42 to be removed from the rotating member 42.

[0128] The output control unit 67 controls the output power to the ultrasonic vibrator 66 so that ultrasonic waves can be uniformly applied to the rotating member 42. The output power is controlled to a predetermined power within the range of 20 to 600 W according to the size of the rotating member 42.

[0129] [Eighth Embodiment] A reduced-pressure drying apparatus, as an example of a substrate processing apparatus according to the eighth embodiment, will now be described. Figure 15A is an illustrative diagram of the cover unit 40E of the reduced-pressure drying apparatus according to the eighth embodiment. Figure 15A shows a cross-section of the cover unit 40E and the components surrounding the cover unit 40E. The reduced-pressure drying apparatus according to the eighth embodiment is obtained by replacing the cover unit 40 with the cover unit 40E in the reduced-pressure drying apparatus 100 according to the first embodiment. Therefore, the structure of the reduced-pressure drying apparatus (substrate processing apparatus) according to the eighth embodiment, excluding the cover unit 40E, is identical to that of the reduced-pressure drying apparatus 100 according to the first embodiment, and therefore its description will be omitted.

[0130] The cover unit 40E includes a surrounding wall 41E as an example of a wall member, and a plurality of rotating members, for example, five rotating members 42E, supported by the surrounding wall 41E and rotatable relative to the surrounding wall 41E. The five rotating members 42E are arranged in a position facing the substrate S held by the substrate holding portion 20, that is, facing the area 21 of the substrate holding portion 20 in the Z direction.

[0131] The cover unit 40E is a surface-treated version of the cover unit 40 described in the first embodiment. Specifically, at least a portion of the surface of the rotating member 42E is formed from a lyophobic member 44E. The lyophobic member 44E has the property of repelling the solvent contained in the solution film F, namely, the organic solvent described in the first embodiment.

[0132] The rotating member 42E includes a base member 46E and a lyophobic member 44E. The lyophobic member 44E is a lyophobic film disposed on at least a portion of the surface of the base member 46E. Specifically, the lyophobic member 44E is coated on the surface of the base member 46E. The base member 46E has the same structure as the rotating member 42 of the first embodiment. The primary material of the base member 46E is preferably a metal, such as stainless steel. For example, austenitic stainless steel containing no more than 0.045% phosphorus and no more than 0.030% sulfur (i.e., stainless steel designated SUS304 in the Japanese Industrial Standards (JIS)) is preferred.

[0133] The rotating member 42E is rotatable about the rotation axis L. The rotating member 42E includes a plate member 421E extending in the longitudinal direction along the rotation axis L. In the eighth embodiment, at least the main surfaces 4211E and 4212E of the plate member 421E of the rotating member 42E are formed by a lyophobic member 44E. The main surface 4212E is the main surface opposite to the main surface 4211E. The lyophobic member 44E reduces the amount of solvent adsorbed on the rotating member 42E, thereby enabling a more rapid drying process.

[0134] The solvent adsorption capacity of the lyophobic member 44E in a vacuum environment is correlated with the receding contact angle relative to the dynamic contact angle of pure water. The larger the receding contact angle of pure water in the lyophobic member 44E, the smaller the amount of solvent adsorbed onto the cover unit 40E in a vacuum environment. Therefore, the receding contact angle serves as an indicator for evaluating solvent adsorption and separation capabilities.

[0135] The receding contact angle of the lyophobic member 44E with respect to pure water is preferably 90 degrees or greater. This makes it more difficult for the solvent to adhere to the surface of the cover unit 40E. Even if the solvent does adhere to the surface of the cover unit 40E, the solvent droplets adsorbed on the surface of the cover unit 40E are easily detached, further shortening the drying process time. Furthermore, the receding contact angle of the lyophobic member 44E with respect to pure water is preferably 120 degrees or less.

[0136] Pure water used for evaluation can be water with a resistivity of 15 MΩ·cm or higher, so-called ultrapure water. The receding contact angle can be measured using a micro contact angle meter (Microjet Co., Ltd., product name: Drop Measure). This method involves placing a 2 μL water droplet on a test piece and observing the receding contact angle for approximately 20 minutes as the droplet dries. This method allows for the evaluation of the receding contact angle.

[0137] The lyophobic member 44E preferably contains a fluororesin or a fluorine-containing compound as a main component. Preferred fluororesins include tetrafluoroethylene (PTFE), perfluoroalkoxy (PFA), fluorinated ethylene propylene (FEP), ethylene tetrafluoroethylene, or polychlorotrifluoroethylene. Preferred fluorine-containing compounds include fluorine-containing silane coupling agents. Using any of these materials can easily achieve a lyophobic member 44E with a receding contact angle of 90 degrees or greater and 120 degrees or less.

[0138] The main chain of the fluorine-containing compound preferably comprises perfluoropolyether (PFPE). PFPE preferably has at least one chemical structure selected from the group consisting of the following chemical structural formulas (1) to (4). [Chemical Formula 1] In the chemical structural formulas (1) to (4), n1 to n4 each represent an integer greater than or equal to 1.

[0139] In the eighth embodiment, it is preferable that the surface 43E defining the opening of the rotating member 42E is also formed of the lyophobic member 44E. In addition, it is preferable that the inner surface of the surrounding wall 41E is also formed of the lyophobic member 44E.

[0140] In addition, although the case where the rotating member 42E includes the plate member 421E has been described, the present invention is not limited thereto. For example, the rotating member may include a column member.

[0141] Figure 15B is an explanatory diagram of a cover unit 40F according to a modified example of the eighth embodiment. Figure 15B illustrates a cross-section of the cover unit 40F and the components surrounding the cover unit 40F. The cover unit 40F according to the modified example of the eighth embodiment includes a surrounding wall 41E and a rotating member 42F. The rotating member 42F includes a columnar member 421F. The columnar member 421F is similar to that of the second embodiment and is, for example, in the shape of a regular triangular prism. At least a portion of the surface of the rotating member 42F is formed by a liquid-repellent member 44E.

[0142] [Embodiment of the method for manufacturing an article] The manufacturing method of the article of this embodiment is suitable for manufacturing articles such as organic EL panels using an inkjet printing device. The manufacturing method of the article of this embodiment includes a coating process of arranging or coating a solution film on a substrate by a printing method using an inkjet printing device to obtain a coated substrate. In addition, it includes a drying process of drying the solution film on the coated substrate using the above-mentioned reduced pressure drying device to obtain a dried substrate with a dried film formed thereon. In addition, the manufacturing method includes other well-known processes, such as firing, cooling, dehumidification, dry cleaning, electrode formation, or sealing film formation. The manufacturing method of the article of this embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article.

[0143] The present invention is not limited to the above-described embodiments, and various modifications are possible within the technical concept of the present invention. Furthermore, the effects described in the embodiments are merely examples of the best effects resulting from the embodiments of the present invention, and the effects of the embodiments of the present invention are not limited to those described in the embodiments.

[0144] 10: Airtight container 20: substrate holding portion 30: Pressure relief mechanism 42: Rotating component 100: Reduced pressure drying device (substrate processing device)

Claims

1. A depressurization drying apparatus for drying a solution film disposed on a substrate under reduced pressure, characterized in that the substrate processing apparatus comprises: an airtight container; a depressurization mechanism for depressurizing the interior of the airtight container; a substrate holding portion disposed inside the airtight container and capable of holding the substrate; and a rotating member disposed inside the airtight container at a position facing the solution film of the substrate held in the substrate holding portion, and capable of rotating relative to the substrate holding portion.

2. The vacuum drying apparatus as described in claim 1, wherein, The aforementioned rotating component has a rotation axis at its center.

3. The vacuum drying apparatus as described in claim 1, wherein, The aforementioned substrate processing apparatus further includes a control device for performing a first processing and a second processing. The first processing controls the aforementioned decompression mechanism to decompress the interior of the aforementioned airtight container to a first pressure. The second processing controls the aforementioned decompression mechanism after the aforementioned first processing to decompress the interior of the aforementioned airtight container to a second pressure lower than the aforementioned first pressure. The aforementioned control device controls the aforementioned rotating member in the aforementioned second processing to rotate the aforementioned rotating member from the state of the aforementioned first processing by a predetermined angle.

4. The vacuum drying apparatus as described in claim 3, wherein, The aforementioned rotating member includes a plate member that is capable of rotating about a rotation axis and extends along the length direction of the aforementioned rotation axis.

5. The vacuum drying apparatus as described in claim 3, wherein, The aforementioned angle is 180 degrees.

6. The vacuum drying apparatus as described in claim 3, wherein, The aforementioned angle is 90 degrees.

7. The vacuum drying apparatus as described in claim 3, wherein, The aforementioned rotating member includes a column member that is capable of rotating about a rotation axis and extends along the length of the aforementioned rotation axis.

8. The vacuum drying apparatus as described in claim 7, wherein, The aforementioned column component is a polygonal column component with 3 or more N main faces, and the aforementioned specified angle is (360 / N) degrees.

9. The vacuum drying apparatus as described in claim 1, wherein, The aforementioned substrate processing apparatus includes two or more of the aforementioned rotating members.

10. The vacuum drying apparatus as described in claim 9, wherein, The aforementioned substrate processing apparatus further includes a control device for performing a first processing and a second processing. The first processing controls the aforementioned decompression mechanism to decompress the interior of the aforementioned airtight container to a first pressure. The second processing controls the aforementioned decompression mechanism after the aforementioned first processing to decompress the interior of the aforementioned airtight container to a second pressure lower than the aforementioned first pressure. The aforementioned control device controls the aforementioned two or more rotating members in the aforementioned second processing to rotate the aforementioned two or more rotating members from the state of the aforementioned first processing by the same predetermined angle.

11. The vacuum drying apparatus as described in claim 9, wherein, The aforementioned substrate processing apparatus further includes a control device for performing a first processing and a second processing. The first processing controls the aforementioned decompression mechanism to decompress the interior of the aforementioned airtight container to a first pressure. The second processing controls the aforementioned decompression mechanism after the aforementioned first processing to decompress the interior of the aforementioned airtight container to a second pressure lower than the aforementioned first pressure. The aforementioned control device controls the aforementioned two or more rotating members in the aforementioned second processing to rotate the aforementioned two or more rotating members from the state of the aforementioned first processing by an individually set angle.

12. The vacuum drying apparatus as described in claim 9, wherein, The aforementioned substrate holding portion has a planar region on which the aforementioned substrate is disposed. The aforementioned substrate processing apparatus further includes at least one rotating member that is rotatable relative to the aforementioned substrate holding portion and is different from the aforementioned two or more rotating members. The aforementioned at least one rotating member is disposed to the side of the aforementioned region.

13. The vacuum drying apparatus as described in any of claims 9 to 12, wherein, The aforementioned substrate holding portion has a planar region on which the aforementioned substrate is disposed, and the rotation axis of each of the aforementioned two or more rotating members extends parallel to a first direction along the aforementioned region. The aforementioned two or more rotating members are arranged in a second direction along the aforementioned region that intersects with the aforementioned first direction.

14. The vacuum drying apparatus as described in any of claims 9 to 12, wherein, The aforementioned substrate holding portion has a planar region on which the aforementioned substrate is disposed. The aforementioned two or more rotating members are four or more rotating members. The aforementioned four or more rotating members include: a first group consisting of at least two rotating members; and a second group consisting of at least two rotating members that are disposed at a position further away from the aforementioned region than the position on which the aforementioned first group is disposed, and that are different from the aforementioned at least two rotating members.

15. The vacuum drying apparatus as described in claim 11, wherein, The aforementioned substrate holding portion has a planar region on which the aforementioned substrate is disposed. The rotation axis of each of the aforementioned two or more rotating members extends parallel to a first direction along the aforementioned region. The aforementioned two or more rotating members are arranged in a second direction along the aforementioned region that intersects the aforementioned first direction. The aforementioned two or more rotating members include a first rotating member located at the outermost end of the aforementioned second direction and a second rotating member different from the aforementioned first rotating member. The aforementioned control device controls the aforementioned first rotating member so that the main surface of the aforementioned first rotating member forms a first angle relative to the aforementioned region, and controls the aforementioned second rotating member so that the main surface of the aforementioned second rotating member forms a second angle relative to the aforementioned region that is larger than the aforementioned first angle.

16. The vacuum drying apparatus as described in claim 1, wherein, The aforementioned rotating member has at least one opening.

17. The vacuum drying apparatus as described in claim 1, wherein, The aforementioned substrate processing apparatus also includes a nozzle for injecting gas into the aforementioned rotating member.

18. The vacuum drying apparatus as described in claim 1, wherein, The aforementioned substrate processing apparatus also includes a heating device for heating the aforementioned rotating member.

19. The vacuum drying apparatus as described in claim 1, wherein, The aforementioned substrate processing apparatus also includes an ultrasonic vibration device for imparting ultrasonic vibration to the aforementioned rotating member.

20. The vacuum drying apparatus as described in claim 1, wherein, The aforementioned rotating member has a hydrophobic component on at least a portion of its surface.

21. The vacuum drying apparatus as described in claim 20, wherein, The aforementioned hydrophobic component has a dynamic contact angle of 90 degrees or more relative to pure water.

22. The vacuum drying apparatus as described in claim 20 or 21, wherein, The retreat contact angle of the aforementioned hydrophobic component relative to pure water is less than 120 degrees.

23. A method for manufacturing an article, characterized in that the method includes a step of drying a solution film coated on a substrate using the vacuum drying apparatus described in claim 1.

24. A method for manufacturing an article, characterized in that a substrate coated with a solution film is placed on a substrate holding portion disposed inside an airtight container, the interior of the airtight container is depressurized to a first pressure higher than the vapor pressure of the solvent contained in the solution film, causing the solvent to evaporate, and during the process of depressurizing the interior of the airtight container from the first pressure to a second pressure lower than the vapor pressure of the solvent, or in the state of depressurization to the second pressure, a rotating member disposed at a position facing the solution film of the substrate is rotated.

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