Cleaner device

Abstract

A cleaning apparatus according to an embodiment of the present invention may include: a camera unit for photographing the surface of a planar substrate including a wafer or a mask; a laser unit for irradiating a laser beam at the target location when the target location with foreign matter is confirmed through the camera unit; a cleaning unit for spraying gas at the target location and its surrounding area; and a suction unit for sucking up the suspended matter generated by the laser unit and / or the cleaning unit.

Description

Technical Field

[0001] The present invention relates to a cleaning device, and more specifically, a cleaning device that removes foreign matter while cooling a planar substrate including a wafer or a mask. Prior Art

[0002] Recently, under the trend of enhanced functionality and improved portability of electronic devices, semiconductor devices mainly use stacked semiconductor devices that stack a plurality of semiconductor wafers or semiconductor packages through the use of bonding technology.

[0003] Among them, a bump refers to an external connection terminal made of a metal material that conducts electricity on the wafer surface. The bump serves as a channel for electrically connecting the circuits of different semiconductor wafers.

[0004] However, if foreign matter adheres to the surface of the wafer or the bump during the manufacturing process of the stacked semiconductor device, problems will occur during the stacking process or the operation process. In the past, when bumps were damaged during the manufacturing process of the stacked semiconductor device, foreign matter was manually removed, or directly discarded without performing the foreign matter removal operation, so there were problems of reduced product yield and huge losses in manufacturing costs.

[0005] In addition, even in the case of a mask (including a photomask), a cleaning device that needs to be further improved is required. Summary of the Invention

[0006] Problems to be Solved by the Invention

[0007] An embodiment of the present invention is proposed to solve the above problems, and the object of the present invention is to provide a cleaning device capable of removing foreign matter adhering to the surface and bumps of a planar substrate including a wafer or a mask.

[0008] In addition, the object of the present invention is to provide a cleaning device capable of cooling the surface of a planar substrate including a wafer or a mask while removing foreign matter.

[0009] In addition, the object of the present invention is to provide a cleaning device that prevents suspended matter generated during the foreign matter removal process from remaining on the surface of a planar substrate including a wafer or a mask.

[0010] In addition, the object of the present invention is to provide a cleaning device that can remove foreign matter in different ways according to the type of foreign matter.

[0011] Means for Solving the Problem

[0012] To solve the problems described above, embodiments of the present invention may provide a cleaning device, which includes: a camera unit that captures the surface of a planar substrate including a wafer or a mask; a laser unit that irradiates a laser beam to a target position when the target position where a foreign object is attached is confirmed through the camera unit; a cleaning unit that sprays a gas to the target position and its peripheral portion; and a suction unit that sucks the suspended matter generated by the laser unit and / or the cleaning unit.

[0013] Preferably, the cleaning unit desorbs the foreign object during the process of rapidly contracting and then rapidly expanding the foreign object by physically colliding with the foreign object.

[0014] Preferably, the cleaning unit is configured to remove organic foreign objects, and the laser unit is configured to remove foreign objects including organic foreign objects that cannot be removed by the cleaning unit.

[0015] Preferably, the cleaning unit is configured to: during the processing of removing foreign objects using the laser unit, cool the planar substrate by spraying solid carbon dioxide to prevent thermal damage to the planar substrate, and at the same time blow away the suspended matter generated when removing the foreign objects.

[0016] Preferably, the cleaning device further includes: an objective lens unit disposed on the optical path where the optical axis of the laser unit coincides with the optical axis of the camera unit.

[0017] Preferably, an inhalation part is formed on one side of the suction unit, and the inhalation part is recessed inward and has a circular cross-section to suck the suspended matter in the radial direction.

[0018] Preferably, the center of the inner diameter of the inhalation part is disposed on the optical path of the camera unit, and the cleaning unit is configured to face the inhalation part and spray solid carbon dioxide to the inhalation part during the operation of the suction unit.

[0019] Advantages of the Invention

[0020] According to the means for solving the problem of the present invention described above, various effects including the following matters can be expected. However, the present invention does not necessarily have to achieve all the following effects to be established.

[0021] The cleaning device according to an embodiment of the present invention can remove foreign substances adhering to the surface of a flat substrate including a wafer or a mask and bumps, which can improve the yield of products and reduce the loss cost caused by waste.

[0022] In addition, the present invention cools the surface of the flat substrate including the wafer or the mask while removing foreign substances, thereby preventing damage caused by heat.

[0023] In addition, the present invention can prevent errors caused by suspended matter by preventing the suspended matter generated during the foreign substance removal process from remaining on the surface of the flat substrate including the wafer or the mask.

[0024] In addition, the present invention removes foreign substances in different ways according to the type of foreign substances, thereby effectively removing each foreign substance. Brief Description of the Drawings

[0025] FIG. 1 is a schematic diagram of a cleaning device according to an embodiment of the present invention. FIG. 2 is a schematic diagram of a part of the cleaning device in FIG. 1 enlarged. FIGS. 3A to 3C are pictures revealing organic foreign substances adhering to the surface of a flat substrate including a wafer or a mask. FIGS. 4A to 4C are pictures revealing metal foreign substances adhering to the surface of a flat substrate including a wafer or a mask. FIG. 5 is a schematic diagram revealing the operation mode of the laser unit in FIG. 1. FIG. 6 is a schematic diagram revealing the operation mode of the cleaning unit in FIG. 1. FIG. 7 is a picture comparing the surface states of a flat substrate including a wafer or a mask before and after the operation of the suction unit in FIG. 1. FIG. 8 is a top view schematic diagram of FIG. 2. Embodiments

[0026] To fully understand the structure and effects of the present disclosure, preferred embodiments of the present disclosure will be described with reference to the drawings. However, the present disclosure is not limited to the embodiments disclosed below, can be implemented in various forms, and can be variously deformed. Hereinafter, when describing the present invention, if it is determined that the relevant known functions that are obvious to those skilled in the art may unnecessarily obscure the gist of the present invention, the detailed description thereof will be omitted.

[0027] Terms such as "first" and "second" can be used to describe various components, but the components are not limited to these terms. These terms are only used for the purpose of distinguishing one component from other components. For example, without departing from the scope of the claims of the present disclosure, the first component can be referred to as the second component, and similarly, the second component can also be referred to as the first component.

[0028] In this application, it should be understood that terms such as "comprising" or "having" are used to specify the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, but do not preclude the presence or possibility of addition of one or more other features or numbers, steps, operations, components, parts, or combinations thereof in advance.

[0029] The terms used in this application are only used to describe specific embodiments and are not used to limit the present invention. Unless otherwise clearly indicated in the context, expressions in the singular form include the plural form. Terms used in the embodiments of the present disclosure should be construed as having the meanings well-known to those of ordinary skill in the art unless otherwise defined.

[0030] Hereinafter, specific embodiments of the present invention will be described in detail with reference to the drawings.

[0031] FIG. 1 is a schematic diagram of a cleaning device according to an embodiment of the present invention, and FIG. 2 is a schematic diagram of a part of the cleaning device in FIG. 1 enlarged. The present invention may include a detection unit (not shown), a moving unit (not shown), a camera unit 100, a laser unit 200, an objective lens unit 300, a cleaning unit 400, a suction unit 500, etc.

[0032] The detection unit can detect contamination, foreign matter C (as shown in FIGS. 5 and 6), and defects on the surface of a planar substrate W including a wafer or a mask. Among them, the foreign matter C may include metal foreign matter, organic foreign matter, etc. The mask includes a photo mask, etc. Foreign matter in the air may adhere to the mask. When the foreign matter C is detected, the detection unit can send address data including the coordinates of the target position where the detected foreign matter C is located to the moving unit. The moving unit that has received the address data can move to the corresponding coordinates. In addition, the position of the moving unit can be manually adjusted by an operator. In one embodiment, the moving unit can move the camera unit 100, the laser unit 200, the objective lens unit 300, the cleaning unit 400, the suction unit 500, etc.

[0033] The camera unit 100 can capture the surface of the planar substrate W including a wafer or a mask. In one embodiment, the camera unit 100 can perform the capture by magnifying the surface of the planar substrate W including a wafer or a mask at a prescribed magnification. The camera unit 100 can obtain a captured image (picture) by guiding illumination light reflected from a foreign object C or the like through an image lens (not shown). At this time, the camera unit 100 is electrically connected to a display device such as a monitor, so that the captured image can be sent to the display device in real time.

[0034] The laser unit 200 generates a laser beam L having a preset wavelength, pulse width, and output conditions (as shown in FIG. 5). The laser unit 200 can generate a single-pulse or multi-pulse laser beam L. Such a laser beam L can be appropriately selected according to a foreign object C or the like. The laser beam L emitted through the laser unit 200 can be a single beam.

[0035] In one embodiment, the present invention can further include a beam shaping unit (not shown), a laser scanning unit 210, and the like. The beam shaping unit can control the shape and size of the laser beam L. The laser scanning unit 210 can adjust the optical axis of the laser beam L so that the laser beam L can be irradiated to a preset position.

[0036] In addition, the objective lens unit 300 can condense the laser beam L. In one embodiment, the objective lens unit 300 can be disposed on the optical path where the optical axis of the laser unit 200 coincides with the optical axis of the camera unit 100. As a result, the device uses a single objective lens unit 300 that is used in common by the laser unit 200 and the camera unit 100. For this purpose, the objective lens unit 300 can include a rotator unit (not shown), in which a plurality of lenses for the camera unit having different magnifications and a lens for the laser unit 200 are arranged. In one embodiment, the rotator unit has a plurality of lenses arranged in a row so that the lenses can be replaced linearly. This can enable the laser unit 200 to irradiate the same position as the position captured by the camera unit 100.

[0037] FIGS. 3A to 3C and FIGS. 4A to 4C are pictures of organic foreign objects and metal foreign objects attached to the surface of the planar substrate W including a wafer or a mask and bumps B captured by the camera unit 100. In one embodiment according to the present invention, the organic foreign objects can be removed by the cleaning unit 400, and the foreign object C including organic foreign objects and metal foreign objects that cannot be removed by the cleaning unit 400 is preferably removed by the laser unit 200.

[0038] In one embodiment, when the laser unit 200 confirms the target position with the foreign object C attached thereto through the camera unit 100, the laser beam L can be irradiated onto the target position. FIG. 5 is a schematic diagram showing the operation mode of the laser unit 200 of FIG. 1. Referring to FIG. 5, when the size of the foreign object is larger than the specified size, the laser beam L can move linearly from one point of the foreign object to another point and be scanned and irradiated. On the other hand, when the foreign object C is attached to a certain point, the laser beam L can be point-irradiated at the corresponding point. At this time, the foreign object C irradiated by the laser unit 200 can include a metal residue film, a metal foreign object, an organic foreign object, etc. In addition, suspended matter may be generated during the process of removing the foreign object C using the laser beam L.

[0039] FIG. 6 is a schematic diagram showing the operation mode of the cleaning unit 400 of FIG. 1. Referring to FIG. 6, the cleaning unit 400 can include a nozzle 410 capable of spraying gas. In one embodiment, the cleaning unit 400 can spray gas onto the target position and its peripheral part. Among them, the gas can be a cooling gas. In one embodiment, the cooling gas is sprayed under high pressure and can include solid CO2 pellets. In addition, the CO2 pellets P are preferably solid carbon dioxide (dry ice) with a size ranging from several micrometers to several tens of micrometers.

[0040] In one embodiment, the cleaning unit 400 can desorb the foreign object C during the process of rapidly contracting and then rapidly expanding the foreign object C by physically colliding with the foreign object C. At this time, the foreign object C is preferably an organic foreign object.

[0041] Specifically describing the desorption process of the foreign object C, the CO2 pellets P with a temperature in the range of -70°C to -80°C collide with the foreign object C and freeze the foreign object. In this process, the foreign object C rapidly contracts and generates cracks due to the temperature difference with the surrounding environment. At this time, the rapidly sprayed CO2 pellets P may partially flow into the gaps between the cracks of the foreign object C. Or, the CO2 pellets P may partially flow into the gap between the foreign object C and the planar substrate W including a wafer or a mask. And, in one embodiment, the CO2 pellets P introduced into the interior of the foreign object C can sublime and the volume expands by more than 800 times.

[0042] On the other hand, since the CO₂ particles P sublimate into gas at room temperature, secondary pollution caused by the cooling gas itself can be prevented. When the CO₂ particles P expand, foreign matter C may be fragmented by the expansion force or separated from the surface of the flat substrate W including the wafer or mask. The cleaning unit 400 can repeat this process to remove the foreign matter C adhering to the surface of the flat substrate W including the wafer or mask. On the other hand, suspended matter may be generated during the process of the cleaning unit 400 removing the foreign matter C.

[0043] According to an embodiment of the present invention, during the processing of removing foreign matter using the laser unit 200, the cleaning unit 400 can cool the flat substrate W including the wafer or mask by spraying solid carbon dioxide to prevent thermal damage to the flat substrate W including the wafer or mask, and at the same time blow away the suspended matter generated when removing the foreign matter.

[0044] In one embodiment, during the processing of removing foreign matter using the laser unit 200, the suction unit 500 and the cleaning unit 400 can operate simultaneously. In one embodiment, through the internal experimental results of the inventors, it has been confirmed that the above-mentioned CO₂ particles P are suitable for use as a cooling gas and a blowing gas. As a result, preferably, the suction unit 500 according to an embodiment does not include a separate blowing nozzle.

[0045] FIG. 7 is a picture comparing the surface state of the flat substrate W including the wafer or mask before and after the operation of the suction unit 500 in FIG. 1. Referring to FIG. 7, it can be confirmed that before the operation of the suction unit 500, suspended matter remains on the surface of the flat substrate W including the wafer or mask.

[0046] In one embodiment, the suction unit 500 can inhale the suspended matter generated by the laser unit 200 and / or the cleaning unit 400. At this time, the suction unit 500 operates simultaneously with the laser unit 200 and / or the cleaning unit 400 to prevent the suspended matter from adhering to the surface of the flat substrate W including the wafer or mask again. At this time, the suction unit 500 can be disposed between the objective lens unit 300 and the flat substrate W including the wafer or mask. The distance between the suction unit 500 and the flat substrate W including the wafer or mask is preferably within a preset range.

[0047] In addition, the suction unit 500 may include a suction part 510 for inhaling the air at the target position and its peripheral part (as shown in FIG. 8). In one embodiment, the suction part 510 can be formed on one side of the suction unit 500.

[0048] FIG. 8 is a top view schematic diagram of a cleaning device according to an embodiment of the present invention. Referring to FIG. 8, the suction part 510 is recessed inwardly of the suction unit 500 and may have a circular cross-section to suck in the suspension in a radial direction. The suction part 510 can improve the suction performance by generating an isotropic flow of the suspension.

[0049] On the other hand, the inner diameter of the suction part 510 refers to the inner diameter of the circle formed by the cross-section of the suction part 510. In one embodiment, the target position may be located at the inner diameter of the suction part 510. That is, the center of the inner diameter of the suction part 510 may be disposed on the optical axis of the objective lens part 300 or on the optical path of the objective lens part 300. Alternatively, the center of the inner diameter of the suction part 510 may be disposed on the optical path of the camera unit 100. Preferably, according to an embodiment, the inner diameter (second diameter) of the suction part 510 is the same as or greater than the outer diameter (first diameter) of the objective lens part 300. Additionally, all or a part of the lower part of the objective lens part 300 may be disposed within the suction part 510.

[0050] Referring again to FIG. 8, the cleaning unit 400 may be configured to face the suction part 510 and, when the suction unit 500 operates, spray carbon dioxide in the form of dry ice toward the suction part 510. For example, the cleaning unit 400 may be disposed on one side of the opening of the suction part 510. At this time, the cleaning unit 400 can generate an anisotropic air flow to guide the suspension to the suction part 510 side.

[0051] In addition, as described above, during the processing of removing foreign matter using the laser unit 200, the cleaning unit 400 can cool the surface of the planar substrate W including the wafer or the mask by spraying a cooling gas. For example, the cooling gas sprayed by the cleaning unit 400 can be reflected onto the surface of the planar substrate W including the wafer or the mask and guided to the suction part 510 side.

[0052] Above, the preferred embodiments of the present invention have been described by way of examples, but the scope of the present invention is not limited to the specific embodiments as described above, and appropriate changes can be made within the scope described in the claims.

[0053] 100: Camera unit 200: Laser unit 210: Laser scanning part 300: Objective lens part 400: Cleaning unit 410: Nozzle 500: Suction unit 510: Suction part W: Flat substrate C: Foreign object L: Laser beam B: Bump P: CO2 particles

Claims

1. A cleaning apparatus, comprising: A camera unit for photographing the surface of a planar substrate, including a wafer or mask; a laser unit for irradiating a laser beam at a target location where a foreign object is attached, once the target location is confirmed through the camera unit; a cleaning unit for spraying gas at the target location and its surrounding area; and a suction unit for sucking up suspended matter generated by the laser unit and / or the cleaning unit; a suction section is formed on one side of the suction unit, the suction section being recessed into the inner side of the suction unit and having a circular cross-section to suck up suspended matter in a radial direction; the inner diameter center of the suction section is disposed on the optical path of the camera unit.

2. The cleaning apparatus as described in claim 1, wherein, The cleaning unit removes foreign objects by physically colliding with them, causing them to rapidly shrink and then expand again.

3. The cleaning apparatus as described in claim 1, wherein, The cleaning unit is configured to remove organic foreign matter, and the laser unit is configured to remove foreign matter including organic foreign matter that the cleaning unit cannot remove.

4. The cleaning apparatus as described in claim 1, wherein, The cleaning unit is configured to: cool the planar substrate by spraying solid carbon dioxide during the process of removing foreign matter using the laser unit to prevent thermal damage to the planar substrate, and at the same time blow away the suspended matter generated during the removal of foreign matter.

5. The cleaning apparatus as described in claim 1, further comprising: The objective lens is positioned on the optical path where the optical axis of the laser unit coincides with the optical axis of the camera unit.

6. The cleaning apparatus as described in claim 1, wherein, The cleaning unit is configured to face the inhalation unit and spray solid carbon dioxide into the inhalation unit during operation of the suction unit.

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