Microphone module, speaker module and communication device

Abstract

A microphone module includes a support structure and a microphone assembly. The support structure includes a support portion and two support portions connected to the support portion. The microphone assembly includes a microphone body portion and two mounting portions. The microphone body portion is suspended from the support portion, and the two mounting portions are respectively connected to opposite sides of the microphone body portion and respectively mounted on the two support portions. Additionally, a speaker module and a communication device are also mentioned.

Description

[Technical Field]

[0001] The present invention relates to an acoustic module and a communication device having the same, and more particularly to a microphone module, a speaker module and a communication device having the same. [Previous Technology]

[0002] Telephones, conference machines, and other communication devices include microphones and speakers. The microphone's pickup quality and the speaker's playback quality can be adjusted and optimized through software, while the impact of speaker vibration on pickup and playback quality can only be suppressed through structural design. However, current communication devices on the market do not adequately address this vibration problem through structural design. [Summary of the Invention]

[0003] The present invention provides a microphone module, a speaker module and a communication device, which can effectively suppress the impact of speaker vibration on the sound reception quality and the sound broadcast quality.

[0004] The microphone module of the present invention includes a support structure and a microphone assembly. The support structure includes a support portion and two support portions, the two support portions being connected to the support portion. The microphone assembly includes a microphone body portion and two mounting portions, the microphone body portion being suspended from the support portion, and the two mounting portions being respectively connected to opposite sides of the microphone body portion and respectively mounted on the two support portions.

[0005] In one embodiment of the present invention, each of the above-mentioned support portions has a limiting recess, and each hanging portion is limited to the limiting recess of the corresponding support portion.

[0006] In one embodiment of the present invention, each of the above-mentioned hanging parts has two stop flanges, and each support part is stopped between the two stop flanges of the corresponding hanging part.

[0007] In one embodiment of the present invention, the microphone body includes a housing and a microphone, two mounting parts are connected to opposite sides of the housing, and the microphone is disposed inside the housing.

[0008] In one embodiment of the present invention, the two mounting parts described above are integrally formed and connected to the housing.

[0009] In one embodiment of the present invention, a horizontal axis passes through the two mounting portions along the width direction of the microphone assembly, and in the vertical direction of the microphone assembly, the horizontal axis does not pass through the geometric center of the microphone.

[0010] In one embodiment of the present invention, a horizontal axis passes through the two mounting portions along the width direction of the microphone assembly, and in the front-rear direction of the microphone assembly, the horizontal axis does not pass through the geometric center of the microphone body portion.

[0011] In one embodiment of the present invention, the microphone module further includes a sealing member and a covering structure, the sealing member being compressed between the covering structure and the support portion and defining a sealing area, the microphone assembly being located within the sealing area.

[0012] The speaker module of the present invention includes a support structure, a speaker assembly, and a locking accessory. The support structure includes a support portion and an assembly portion, the assembly portion being connected to the support portion. The speaker assembly is disposed on the support portion and includes a speaker body portion and a buffer structure. The buffer structure includes a buffer portion located on a first surface of the speaker body portion, and the assembly portion passing through the buffer portion. The locking accessory is locked to the assembly portion, and the buffer portion is sandwiched between the locking accessory and the first surface of the speaker body portion.

[0013] In one embodiment of the present invention, there are multiple assembly parts, buffer parts and locking accessories, the assembly parts are respectively disposed on the buffer parts, and the locking accessories are respectively locked to the assembly parts.

[0014] In one embodiment of the present invention, the above-mentioned buffer structure includes a buffer layer, which is located on a second surface of the speaker body relative to the first surface and connected to the buffer portion, and is sandwiched between the second surface of the speaker body and the support portion.

[0015] In one embodiment of the present invention, the periphery of the speaker body portion has an assembly notch, and the buffer portion and the buffer layer are connected to each other through the assembly notch.

[0016] In one embodiment of the present invention, the above-mentioned speaker module further includes a cover structure and an annular sealing structure. The support portion has an annular flange, the annular flange defines a sound cavity region, the speaker assembly is located in the sound cavity region, the annular sealing structure has a groove, the annular flange is embedded in the groove, and the annular sealing structure is compressed between the cover structure and the annular flange.

[0017] In one embodiment of the present invention, the above-mentioned speaker module further includes a covering structure, a rear acoustic cavity is formed between the covering structure and the buffer structure, and a front acoustic cavity is formed between the buffer structure and the support portion.

[0018] The communication device of the present invention includes a first cover, a microphone module, and a speaker module. The microphone module includes a support structure and a microphone assembly. The support structure is formed on the first cover and includes a support portion and two support portions connected to the support portion. The microphone assembly includes a microphone body portion and two hanging portions. The microphone body portion is suspended on the support portion, and the two hanging portions are respectively connected to opposite sides of the microphone body portion and respectively hung on the two support portions. The speaker module includes another support structure, a speaker assembly, and a locking attachment. The other support structure is formed on the first cover and includes another support portion and an assembly portion connected to the other support portion. The speaker assembly is disposed on the other support portion and includes a speaker body portion and a buffer structure. The buffer structure includes a buffer portion located on a first surface of the speaker body portion. The assembly portion passes through the buffer portion, and the locking attachment is locked to the assembly portion. The buffer portion is sandwiched between the locking attachment and the first surface of the speaker body portion.

[0019] In one embodiment of the present invention, the above-mentioned communication device further includes a second cover body assembled on the first cover body, and the microphone module further includes a sealing member and a covering structure formed on the second cover body. The sealing member is compressed between the covering structure and the support portion and defines a sealing area, and the microphone assembly is located within the sealing area.

[0020] In one embodiment of the present invention, the speaker module described above is located outside the sealed area.

[0021] In one embodiment of the present invention, the above-mentioned communication device further includes a second cover body assembled on the first cover body, and the speaker module further includes a covering structure and an annular sealing structure. The covering structure is formed on the second cover body, the supporting portion has an annular flange, the annular flange defines a sound cavity region, the speaker assembly is located in the sound cavity region, the annular sealing structure has a groove, the annular flange is embedded in the groove, and the annular sealing structure is compressed between the covering structure and the annular flange.

[0022] In one embodiment of the present invention, the microphone module described above is located outside the acoustic cavity region.

[0023] In one embodiment of the present invention, the above-mentioned communication device further includes a second cover, the second cover being assembled on the first cover, and the speaker module further includes a covering structure, the covering structure being formed on the second cover, a rear acoustic cavity being formed between the covering structure and the buffer structure, and a front acoustic cavity being formed between the buffer structure and another support portion.

[0024] Based on the above, in the microphone module of the present invention, the microphone body is suspended on the support portion by two opposing mounting portions, creating a gap between the microphone body and the support portion, thereby reducing the contact area between the microphone body and the support portion and suppressing vibrations transmitted from the support portion to the microphone body. Furthermore, in the speaker module of the present invention, the buffer portion of the buffer structure is sandwiched between the locking accessory and the speaker body and adjacent to the assembly portion, so that vibrations transmitted from the speaker body to the locking accessory and the assembly portion can be suppressed by the buffering effect of the buffer portion. Accordingly, the impact of speaker module vibration on sound reception and playback quality can be effectively suppressed.

Implementation Method

[0026] FIG1 is a perspective view of a communication device according to an embodiment of the present invention. FIG2 is an exploded view of the communication device of FIG1. ​​FIG3 is a partial bottom view of some components of the communication device of FIG2. Referring to FIG1 to FIG3, the communication device 100 of this embodiment includes a first cover 110, a second cover 120, a microphone module 130, and a speaker module 140. The second cover 120 and the first cover 110 are assembled together to form the outer shell of the communication device 100, for accommodating the microphone module 130 and the speaker module 140.

[0027] Figure 4 is a partial enlarged view of the communication device in Figure 3. Figure 5 is a front view of the microphone module in Figure 4. Figure 6 is a perspective view of the microphone assembly in Figure 5. Referring to Figures 3 to 6, the microphone module 130 of this embodiment includes a support structure 132 and a microphone assembly 134. The support structure 132 is integrally formed on the first cover 110, that is, the support structure 132 is a part of the first cover 110. The support structure 132 includes a support portion 1321 and two support portions 1322, which are integrally formed and connected to the support portion 1321. The microphone assembly 134 includes a microphone body portion 1341 and two hanging portions 1342, which are respectively connected to opposite sides of the microphone body portion 1341 and respectively hung on the two support portions 1322, so that the microphone body portion 1341 is suspended on the support portion 1321.

[0028] FIG7 is a cross-sectional view of the communication device of FIG1 along line II. As described above, in the microphone module 130 of this embodiment, the microphone body 1341 is suspended on the support portion 1321 by two opposing hanging portions 1342, so that there is a gap G between the microphone body 1341 and the support portion 1321 as shown in FIG5 and FIG7, thereby reducing the contact area between the microphone body 1341 and the support portion 1321, and suppressing the vibration transmitted to the microphone body 1341 through the support portion 1321. Accordingly, the influence of the vibration of the speaker module 140 on the sound reception quality of the microphone module 130 can be effectively suppressed.

[0029] In detail, as shown in FIG. 4, each support portion 1322 of this embodiment has a limiting notch 1322a, and each hanging portion 1342 is limited within the limiting notch 1322a of the corresponding support portion 1322. Accordingly, each support portion 1322 fixes the microphone assembly 134 in the front-rear direction D1 by limiting the hanging portion 1342 with its limiting notch 1322a. In addition, as shown in FIG. 4, each hanging portion 1342 of this embodiment has two stop flanges 1342a, and each support portion 1322 is stopped between the two stop flanges 1342a of the corresponding hanging portion 1342. Accordingly, each support portion 1322 fixes the microphone assembly 134 in the width direction D2 by stopping with its stopped flanges 1342a.

[0030] Figure 8 is a perspective view of the microphone module of Figure 4. Referring to Figures 5, 7, and 8, in this embodiment, the microphone body 1341 includes a housing 1341a and a microphone 1341b. Two mounting parts 1342 are integrally formed and connected to opposite sides of the housing 1341a, and the microphone 1341b is disposed within the housing 1341a. A horizontal axis A passes through the two mounting parts 1342 along the width direction D2 of the microphone assembly 134. In the vertical direction D3 of the microphone assembly 134, as shown in Figure 8, the horizontal axis A does not pass through the geometric center C1 of the microphone 1341b. Furthermore, in the front-rear direction D1 of the microphone assembly 134, as shown in Figure 5, the horizontal axis A does not pass through the geometric center C2 of the microphone body 1341.

[0031] Referring to Figures 2, 3, and 7, further, the microphone module 130 of this embodiment includes a sealing member 136 and a covering structure 138. The sealing member 136 is made of, for example, ethylene-vinyl acetate copolymer (EVA) or other suitable sealing materials. The covering structure 138 is integrally formed on the second cover 120, that is, the covering structure 138 is part of the second cover 120. The covering structure 138 is used to stop and fix the microphone assembly 134 in the vertical direction D3. The sealing member 136 is compressed between the covering structure 138 and the support portion 1321 and defines a sealing region R1 (shown in Figure 3), the microphone assembly 134 is located within the sealing region R1, and the speaker module 140 is located outside the sealing region R1. Accordingly, the microphone assembly 134 can be prevented from receiving external noise.

[0032] Figure 9 is a partial perspective view of the communication device of Figure 3. Figure 10 illustrates a partial structure of the speaker module of Figure 9. Figure 11 is a perspective view of the speaker assembly of Figure 9. Referring to Figures 3, 9, and 10, the speaker module 140 of this embodiment includes a support structure 142, a speaker assembly 144, and a plurality of locking accessories 146. The support structure 142 is integrally formed on the first cover 110, that is, the support structure 142 is a part of the first cover 110. The support structure 142 includes a support portion 1421 and a plurality of assembly portions 1422, the assembly portions 1422 being connected to the support portion 1421.

[0033] Figure 12 is a bottom view of the buffer structure of Figure 11. Figure 13 is a side view of the buffer structure of Figure 12. Referring to Figures 9 to 13, the speaker assembly 144 is disposed on the support portion 1421 and includes a speaker body portion 1441 and a buffer structure 1442. The periphery of the speaker body portion 1441 has a first surface 1441a and a second surface 1441b opposite to each other and has a plurality of assembly notches 1441c. The buffer structure 1442 is made of, for example, rubber or other suitable buffer material and includes a plurality of buffer portions 1442a and a buffer layer 1442b. The buffer portions 1442a are located on the first surface 1441a of the speaker body portion 1441, and the buffer layer 1442b is located on the second surface 1441b of the speaker body portion 1441 and is integrally connected to the buffer portions 1442a through an assembly notch 1441c. The periphery of the speaker body portion 1441 is sandwiched between the buffer portions 1442a and the buffer layer 1442b. The buffer layer 1442b is sandwiched between the second surface 1441b of the speaker body portion 1441 and the support portion 1421.

[0034] The buffer structure 1442 has a plurality of through holes H, which extend from the buffer portions 1442a to the buffer layer 1442b. The assembly portions 1422 are inserted into the through holes H and pass through the buffer portions 1442a respectively. The locking portions 1461 of the locking attachments 146 are locked to the assembly portions 1422 respectively. The buffer portions 1442a are sandwiched between the head 1462 of the locking attachments 146 and the first surface 1441a of the speaker body portion 1441.

[0035] As described above, in the speaker module 140 of this embodiment, the buffer portion 1442a of the buffer structure 1442 is sandwiched between the locking attachment 146 and the speaker body portion 1441 and adjacent to the assembly portion 1422, so that the vibration transmitted from the speaker body portion 1441 to the locking attachment 146 and the assembly portion 1422 can be suppressed by the buffering effect of the buffer portion 1442a. Furthermore, the buffer layer 1442b of the buffer structure 1442 is sandwiched between the speaker body portion 1441 and the support portion 1421 and has an airtight effect. Accordingly, the influence of the vibration of the speaker body portion 1441 on the sound reception quality of the microphone module 130 and the sound playback quality of the speaker module 140 can be effectively suppressed.

[0036] FIG14 is a cross-sectional view of the communication device of FIG1 along line II-II. Referring to FIG14, in detail, the speaker module 140 of this embodiment further includes a cover structure 148, which is integrally formed on the second cover 120, that is, the cover structure 148 is a part of the second cover 120. A rear acoustic cavity 140a is formed between the cover structure 148 and the buffer structure 1442, and a front acoustic cavity 140b is formed between the buffer structure 1442 and the support portion 1421. The rear acoustic cavity 140a and the front acoustic cavity 140b are independent of each other by means of the airtight effect provided by the buffer layer 1442b of the buffer structure 1442. As described above, the rear acoustic cavity 140a and the front acoustic cavity 140b are separated in the speaker module 140 by the buffer structure 1442, and the effective volume of the rear acoustic cavity 140a and the front acoustic cavity 140b can be accurately optimized according to the acoustic design requirements. Furthermore, by using the covering structure 148 integrally formed on the second cover 120 and the supporting portion 1421 integrally formed on the first cover 110 to define the rear sound cavity 140a and the front sound cavity 140b as described above, there is no need to design an additional sound cavity shell, thus saving manufacturing and assembly costs.

[0037] Figures 15 and 16 are perspective views of a partial structure of the speaker module of Figure 14. Figure 17 is an enlarged partial cross-sectional view of the speaker module of Figure 15. Referring to Figures 2, 3, and Figures 15 to 17, the speaker module 140 of this embodiment further includes an annular sealing structure 149. The support portion 1421 has an annular flange 1421a, which defines a sound cavity region R2 (labeled in Figures 2 and 3). The speaker assembly 144 is located within the sound cavity region R2, and the microphone module 130 is located outside the sound cavity region R2. That is, the speaker assembly 144 is located inside the annular flange 1421a and surrounded by the annular flange 1421a, while the microphone module 130 is located outside the annular flange 1421a. The annular sealing structure 149 is made of, for example, rubber or other suitable sealing material and has a groove 1491 (shown in FIG. 17). An annular flange 1421a is embedded in the groove 1491, and the annular sealing structure 149 is compressed between the cover structure 148 and the annular flange 1421a. Accordingly, the annular sealing structure 149 and the annular flange 1421a are in contact with each other through three contact surfaces S (shown in FIG. 17), which can effectively seal the rear acoustic cavity 140a and the front acoustic cavity 140b in the acoustic cavity region R2.

[0038] Figures 18A to 18C are test diagrams of the broadcasting effect of the communication device in Figure 1. Figures 18D and 18E are test diagrams of the reception effect of the communication device in Figure 1. Figures 18F to 18H are test diagrams of the reception and broadcasting effect of the communication device in Figure 1. As shown in Figure 18A, for the SPK FR of speaker module 140, the curve is smooth from 300Hz to 1.5KHz and there is no obvious dip after 7KHz. As shown in Figure 18B, for the SPK THD of speaker module 140, vibration is significantly and effectively suppressed, especially the distortion is significantly reduced in the 1-3KHz range. As shown in Figure 18C, for the SPK R&B of speaker module 140, vibration is significantly and effectively suppressed, and the overall vibration is reduced from 100Hz to 700Hz (most obvious at 600Hz). As shown in Figure 18D, for the MIC FR of microphone module 130, the overall curve is smooth, and there is no obvious dip or peek after 2KHz. As shown in Figure 18E, the MIC THD of microphone module 130 significantly and effectively suppresses vibration, especially with a substantial reduction in distortion at 3-4kHz. As shown in Figure 18F, the Echo FR of speaker module 140 and microphone module 130 exhibits a smooth curve without noticeable dips or peeks. As shown in Figure 18G, the Echo THD of speaker module 140 and microphone module 130 significantly and effectively suppresses vibration, with overall distortion significantly reduced in the mid-frequency range. As shown in Figure 18H, the Echo R&B of speaker module 140 and microphone module 130 significantly and effectively suppresses vibration, with overall R&B distortion significantly reduced.

[0039] In summary, in the microphone module of the present invention, the microphone body is suspended from the support portion by two opposing mounting portions, creating a gap between the microphone body and the support portion. This reduces the contact area between the microphone body and the support portion, thereby suppressing vibrations transmitted from the support portion to the microphone body. Furthermore, the buffer layer of the buffer structure is sandwiched between the speaker body and the support portion, providing an airtight effect. In addition, in the speaker module of the present invention, the buffer portion of the buffer structure is sandwiched between the locking accessory and the speaker body and adjacent to the assembly portion, allowing vibrations transmitted from the speaker body to the locking accessory and the assembly portion to be suppressed by the buffering effect of the buffer portion. Accordingly, the impact of speaker module vibration on sound reception and playback quality can be effectively suppressed. [Simplified Explanation of the Diagram]

[0025] FIG1 is a perspective view of a communication device according to an embodiment of the present invention. FIG2 is an exploded view of the communication device of FIG1. ​​FIG3 is a partial lower view of some components of the communication device of FIG2. FIG4 is a partial enlarged view of the communication device of FIG3. FIG5 is a front view of the microphone module of FIG4. FIG6 is a perspective view of the microphone assembly of FIG5. FIG7 is a cross-sectional view of the communication device of FIG1 along line II. FIG8 is a perspective view of the microphone module of FIG4. FIG9 is a partial perspective view of the communication device of FIG3. FIG10 illustrates a partial structure of the speaker module of FIG9. FIG11 is a perspective view of the speaker assembly of FIG9. FIG12 is a lower view of the buffer structure of FIG11. FIG13 is a side view of the buffer structure of FIG12. FIG14 is a cross-sectional view of the communication device of FIG1 along line II-II. FIG15 and FIG16 are perspective views of the partial structure of the speaker module of FIG14. FIG17 is a partial enlarged cross-sectional view of the speaker module of FIG15. FIG18A to FIG18C are test diagrams of the sound effect of the communication device of FIG1. Figures 18D and 18E are test diagrams of the radio reception effect of the communication device in Figure 1. Figures 18F to 18H are test diagrams of the radio reception and broadcasting effect of the communication device in Figure 1.

Claims

1. A microphone module, comprising: A support structure includes a support portion and two support portions, wherein the two support portions are connected to the support portion; and a microphone assembly includes a microphone body portion and two hanging portions, wherein the microphone body portion is suspended from the support portion, and the two hanging portions are respectively connected to opposite sides of the microphone body portion and respectively hung on the two support portions, wherein each support portion has a limiting notch, and each hanging portion is limited within the limiting notch of the corresponding support portion.

2. The microphone module as claimed in claim 1, wherein each of the mounting portions has two stop flanges, and each of the support portions is stopped between the two stop flanges of the corresponding mounting portion.

3. The microphone module as claimed in claim 1, wherein the microphone body includes a housing and a microphone, the two mounting portions are connected to opposite sides of the housing, and the microphone is disposed within the housing.

4. The microphone module as claimed in claim 3, wherein the two mounting parts are integrally formed and connected to the housing.

5. The microphone module as claimed in claim 3, wherein a horizontal axis passes through the two mounting portions along the width direction of the microphone assembly, and the horizontal axis does not pass through the geometric center of the microphone in the vertical direction of the microphone assembly.

6. The microphone module as claimed in claim 1, wherein a horizontal axis passes through the two mounting portions along the width direction of the microphone assembly, and in the front-rear direction of the microphone assembly, the horizontal axis does not pass through the geometric center of the microphone body portion.

7. The microphone module as claimed in claim 1 further includes a seal and a cover structure, wherein the seal is compressed between the cover structure and the carrier and defines a sealed area, and the microphone assembly is located within the sealed area.

8. A communication device, comprising: A first cover; a microphone module including a support structure and a microphone assembly, wherein the support structure is formed in the first cover and includes a support portion and two support portions connected to the support portion, the microphone assembly including a microphone body portion and two hanging portions, the microphone body portion being suspended from the support portion, the two hanging portions being respectively connected to opposite sides of the microphone body portion and respectively hanging on the two support portions, each support portion having a limiting notch, each hanging portion being limited within the limiting notch of the corresponding support portion; and a speaker module including... Another support structure, a speaker assembly, and a locking accessory are provided, wherein the other support structure is formed on the first cover and includes another support portion and an assembly portion connected to the other support portion, the speaker assembly is disposed on the other support portion and includes a speaker body portion and a buffer structure, the buffer structure including a buffer portion located on a first surface of the speaker body portion, the assembly portion passing through the buffer portion, the locking accessory being locked to the assembly portion, and the buffer portion being sandwiched between the locking accessory and the first surface of the speaker body portion.

9. The communication device as claimed in claim 8 further includes a second cover, wherein the second cover is assembled to the first cover, and the microphone module further includes a seal and a covering structure formed in the second cover, the seal being compressed between the covering structure and the carrier and defining a sealed area, the microphone assembly being located within the sealed area.

10. The communication device as claimed in claim 9, wherein the speaker module is located outside the sealed area.

11. The communication device as described in claim 8 further includes a second cover, wherein the second cover is assembled to the first cover, and the speaker module further includes a covering structure and an annular sealing structure, the covering structure being formed in the second cover, the carrier having an annular flange defining a sound cavity region, the speaker assembly being located in the sound cavity region, the annular sealing structure having a groove, the annular flange being fitted into the groove, and the annular sealing structure being compressed between the covering structure and the annular flange.

12. The communication device as claimed in claim 11, wherein the microphone module is located outside the acoustic cavity region.

13. The communication device as described in claim 8 further includes a second cover, wherein the second cover is assembled to the first cover, and the speaker module further includes a covering structure formed in the second cover, wherein a rear acoustic cavity is formed between the covering structure and the buffer structure, and a front acoustic cavity is formed between the buffer structure and the other support portion.

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