Manufacturing method of package module

Abstract

A packaging module and its manufacturing method are disclosed. The main method involves first forming a shielding layer on the upper surface of a packaging unit with a packaging layer, and then setting a plurality of conductive elements on the lower surface of the packaging unit to avoid process obstruction caused by insufficient suction force of the robotic arm.

Description

Technical Field

[0001] This invention relates to a semiconductor packaging technology, and more particularly to a packaging module and its manufacturing method. Prior Technology

[0002] With the evolution of semiconductor technology, in order to improve electrical quality, most semiconductor products have shielding functions to prevent electromagnetic interference (EMI).

[0003] As shown in Figure 1, a conventional semiconductor package 1 consists of a semiconductor wafer 11 disposed on a package substrate 10, and then a package colloid 15 covering the semiconductor wafer 11. A metal layer 19 is formed on the outer surface of the package colloid 15 and the side surface of the package substrate 10, so as to protect the semiconductor wafer 11 from external EMI.

[0004] However, since conventional semiconductor package 1 first sets solder balls 18 on package substrate 10 and then forms metal layer 19, when the size of semiconductor package 1 is too large (e.g., larger than 7mm*7mm), the process is hindered due to insufficient suction force of robotic arm.

[0005] Therefore, how to overcome the problems of the aforementioned conventional technologies has become an urgent issue that needs to be addressed. Summary of the Invention

[0006] In view of the various deficiencies of the prior art, the present invention provides a packaging module disposed on a carrier plate having a plurality of openings, comprising: a plurality of packaging units, wherein each packaging unit is disposed on each of the openings and has opposing first and second surfaces and a side surface connecting the first and second surfaces; a shielding layer formed on the first surface and side surface of each packaging unit; and a plurality of conductive elements disposed on the second surface of each packaging unit and accommodated in the openings.

[0007] The present invention further provides a method for manufacturing a packaging module, comprising: providing a plurality of packaging units, wherein each packaging unit has a first surface and a second surface opposite to each other and a side surface connecting the first surface and the second surface; forming a shielding layer on the first surface and the side surface of each packaging unit; and after forming the shielding layer, disposing a plurality of conductive elements on the second surface of each packaging unit.

[0008] In the aforementioned packaging module and its manufacturing method, the packaging unit includes a substrate, electronic components disposed on the substrate, and a packaging layer covering the electronic components. The substrate is a packaging substrate with a core layer and a circuit layer, or a circuit structure without a core layer. The electronic components are active components, passive components, or a combination of both. The shielding layer is a metal layer.

[0009] In the aforementioned packaging module and its manufacturing method, the manufacturing method of the plurality of packaging units includes: providing an electronic module, which includes a plurality of substrates and electronic components disposed on each of the substrates, and forming a packaging layer covering the electronic components on the substrates; and cutting along each of the substrates to form the plurality of packaging units.

[0010] The aforementioned packaging module and its manufacturing method further include placing the plurality of packaging units onto a carrier to form the shielding layer on the first surface and side surface of each packaging unit. The carrier is an adhesive temporary carrier.

[0011] The aforementioned packaging module and its manufacturing method further include removing the plurality of packaging units from the carrier and reconfiguring them on the carrier plate, so as to provide a plurality of conductive elements on the second surface of each packaging unit. The carrier plate is formed with a plurality of openings, and each packaging unit is correspondingly disposed on each opening.

[0012] In the aforementioned packaging module and its manufacturing method, the shielding layer is formed by physical vapor deposition.

[0013] As can be seen from the above, the packaging module and its manufacturing method of the present invention mainly involve cutting multiple packaging units with packaging layers into individual units to control their size, forming a shielding layer on their upper surface, reconfiguring the multiple packaging units, and setting multiple conductive elements on their lower surface to avoid the problem of process obstruction caused by insufficient suction force of the robotic arm due to the excessive size of the conventional packaging units. Simple Explanation of the Diagram

[0014] Figure 1 is a cross-sectional schematic diagram of a conventional semiconductor package.

[0015] Figure 2 is a flowchart of the manufacturing method of the packaging module of the present invention.

[0016] Figures 3 to 7 are cross-sectional and planar schematic diagrams of the packaging module and its manufacturing method of the present invention. Implementation

[0017] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0018] It should be understood that the structures, proportions, sizes, etc., illustrated in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the conditions under which the present invention can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportional relationships, or adjustments to the size, without affecting the effects and objectives that the present invention can produce, should still fall within the scope of the technical content disclosed herein. Furthermore, the terms such as "above," "first," "second," and "a" used in this specification are only for clarity of description and are not intended to limit the scope of the present invention. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of the present invention.

[0019] Please refer to Figure 2, which is a flowchart of the manufacturing process of the packaging module of the present invention. Also refer to Figures 3 to 7, which are cross-sectional and planar schematic diagrams of the packaging module and its manufacturing process of the present invention.

[0020] As shown in Figures 2 and 3, in step S21, the packaging and order cutting operations are performed.

[0021] In this embodiment, an electronic module is first provided. This electronic module is, for example, a wafer architecture, comprising a plurality of substrates 30 and electronic components 31 disposed on each of the substrates 30. The substrate 30 may be, for example, a package substrate with a core layer and a circuit layer, or a coreless circuit structure, or other carrier unit suitable for carrying electronic components such as chips, such as a leadframe, without particular limitation. The electronic components 31 may be, for example, active components, passive components, or a combination of both. The active components may be, for example, semiconductor chips, and the passive components may be, for example, resistors, capacitors, and inductors. Specifically, the electronic components 31 may be electrically connected to the substrates 30 via flip-chip bonding, wire bonding, or other methods.

[0022] Next, a packaging process is performed to form a packaging layer 32 on the substrate 30 to encapsulate the electronic component. The packaging layer 32 is, for example, polyimide (PI), dry film, epoxy resin, etc.

[0023] Then, a cutting operation is performed, cutting along each substrate 30 to separate each substrate 30, thereby forming a plurality of packaging units 3, and effectively controlling the size of each packaging unit to avoid it being too large. Each packaging unit 3 has a first surface 3a and a second surface 3b opposite to each other and a side surface 3c connecting the first surface 3a and the second surface 3b.

[0024] As shown in Figures 2 and 4, in step S22, the complex packaging unit 3 is attached to a carrier 40, such as a wafer architecture. The carrier 40 is an adhesive temporary carrier, such as tape.

[0025] As shown in Figures 2 and 5, in step S23, a plating operation is performed to form a shielding layer 51 on the outer surface of the plurality of packaging units 3.

[0026] In this embodiment, through physical vapor deposition (e.g., sputtering), heavier inert gas (usually argon) ions are accelerated by an electric field to bombard the sputtering source material target (metal material), thereby causing the target material to be deposited on the outer surface (first surface 3a and side surface 3c) of the packaging unit 3 to form a shielding layer 51 (metal layer).

[0027] As shown in Figures 2 and 6, in step S24, the plurality of encapsulation units 3 with the shielding layer 51 formed on the outer surface are removed from the carrier 40, and the plurality of encapsulation units 3 are reconfigured on a carrier plate 60.

[0028] In this embodiment, the carrier plate 60 has a plurality of openings 600, and each of the encapsulation units 3 is correspondingly disposed on each of the openings 600.

[0029] As shown in Figures 2 and 7, in step S25, a ball-planting operation is performed to obtain the packaging module 7 of the present invention.

[0030] In this embodiment, a plurality of conductive elements 71, such as solder balls, are implanted on the second surface 3b of each packaging unit 3, and the plurality of conductive elements 71 are accommodated in the opening 600 so that the packaging unit 3 can be connected to an external device through the plurality of conductive elements 71.

[0031] The multiple encapsulation units 3 with the completed ball implantation can then be removed from the carrier plate 60 using a mobile device (e.g., a robotic arm).

[0032] Through the aforementioned manufacturing method, the present invention further discloses a packaging module 7, which is disposed on a carrier plate 60 having a plurality of openings 600, comprising: a plurality of packaging units 3, wherein each packaging unit 3 is disposed on each of the openings 600 and has a first surface 3a and a second surface 3b opposite to each other and a side surface 3c connecting the first surface 3a and the second surface 3b; a shielding layer 51, which is formed on the first surface 3a and the side surface 3c of each packaging unit 3; and a plurality of conductive elements 71, which are disposed on the second surface 3b of each packaging unit 3 and housed in the openings 600.

[0033] The packaging unit 3 includes a substrate 30, an electronic component 31 disposed on the substrate 30, and a packaging layer 32 covering the electronic component 31. The substrate 30 is, for example, a packaging substrate with a core layer and a circuit layer, or a circuit structure without a core layer. The electronic component 31 is, for example, an active component, a passive component, or a combination of both. The shielding layer 51 is a metal layer.

[0034] In summary, the packaging module and its manufacturing method of the present invention mainly involve cutting multiple packaging units with packaging layers to control their size, forming a shielding layer on their upper surface, reconfiguring the multiple packaging units, and setting multiple conductive elements on their lower surface. This avoids the problem of excessively large packaging unit size and insufficient suction force of the robotic arm caused by conventional packaging units that first set multiple conductive elements, then cut and form a shielding layer.

[0035] The above embodiments are illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be as set forth in the following patent claims.

[0036] 1: Semiconductor package 10: Packaging substrate 11: Semiconductor wafers 15: Encapsulating colloid 18: Welding ball 19: Metal layer 3: Packaging Unit 3a: First surface 3b: Second surface 3c: Side view 30:Substrate 31: Electronic components 32: Encapsulation layer 40: Bearing component 51: Shielding layer 60: Support plate 600: Opening 7: Packaging Module 71: Conductive elements S21~S25: Steps

Claims

1. A method for manufacturing a packaging module, comprising: An electronic module is provided, comprising a plurality of substrates and electronic components disposed on each of the substrates, and an encapsulation layer covering the electronic components is formed on the substrates, wherein the substrates are encapsulation substrates having a core layer and a circuit layer or a circuit structure without a core layer; the substrates are cut to form a plurality of encapsulation units, wherein each encapsulation unit has opposing first and second surfaces and a side surface connecting the first and second surfaces; the plurality of encapsulation units are placed on a carrier with their second surfaces, and a shielding layer is formed on the first surface and side surface of each encapsulation unit; after forming the shielding layer, the plurality of encapsulation units are removed from the carrier and repositioned on a carrier plate with their second surfaces, wherein the carrier plate has a plurality of openings, and the second surfaces of each encapsulation unit are correspondingly exposed on each of the openings; and a plurality of conductive elements are disposed on the second surfaces of each encapsulation unit in the openings.

2. The method for manufacturing the packaging module as described in claim 1, wherein, The carrier is a temporary carrier with adhesive properties.

3. The method for manufacturing the packaging module as described in claim 1, wherein, The shielding layer is formed by physical vapor deposition.

Images