Resin composition and prepreg and metal clad laminate including the same

Abstract

A resin composition comprising a modified bismaleimide prepolymer, the modified bismaleimide prepolymer comprising alternating hard segments and soft segments, wherein the hard segments comprise bismaleimide monomers and the soft segments comprise bi-amino-terminated modified silicone resins.

Description

Technical Field

[0001] The present invention relates to a composition, and more particularly to a resin composition and a prepreg and a metal-coated laminate comprising the same. Prior Technology

[0002] Bismaleimide resin, as an advanced composite matrix resin, possesses excellent heat resistance and resistance to damp heat, and has already seen good applications in the field of high-performance copper foil substrates. However, the dielectric loss factor (Df) of bismaleimide resin-based copper foil substrates is not low enough, which limits their application in high-end electronic products.

[0003] In addition, with the technological evolution of integrated circuits, the number and density of chips on copper foil substrates have also increased. Therefore, the requirements for low warpage and low thermal expansion characteristics of copper foil substrate materials are more stringent.

[0004] Based on the above, a resin composition has been developed for preparing copper foil substrates with low dielectric loss factor and low thermal expansion coefficient to meet the needs of high-end electronic products, which is a goal that those skilled in the art are eager to develop. Summary of the Invention

[0005] The present invention provides a resin composition having a reduced dielectric loss factor and a reduced coefficient of thermal expansion.

[0006] The resin composition of the present invention includes a modified bismaleimide prepolymer, which comprises alternating hard segments and soft segments, wherein the hard segments comprise bismaleimide monomers and the soft segments comprise bi-terminated amino-modified silicone resins.

[0007] In one embodiment of the present invention, the ratio of the mole number of maleic anhydride groups in the bismaleimine monomer to the mole number of amino groups in the bisamine-terminated modified silica resin is 2:1.

[0008] In one embodiment of the present invention, the bismaleimine monomer has a structure represented by the following formula A: (Formula A) R1 represents a divalent aromatic group.

[0009] In one embodiment of the present invention, the dual-terminated amine-modified silicone resin has a structure represented by the following formula B: (Formula B) R4 and R5 each independently represent C1 to C10 alkyl groups, and m is an integer from 0 to 10.

[0010] In one embodiment of the present invention, the modified bismaleimide prepolymer has a structure represented by Formula 1: (Equation 1) in, R1 to R3 represent , where * indicates the bond position, R4 to R7 each independently represent C1 to C10 alkyl groups, and m, n, and p each independently represent integers from 0 to 10.

[0011] In one embodiment of the present invention, the number-average molecular weight of the modified bismaleimide prepolymer is from 1,500 g / mol to 2,000 g / mol, and the weight-average molecular weight is from 8,000 g / mol to 22,000 g / mol.

[0012] In one embodiment of the present invention, the resin composition comprises, by weight of the total resin composition, 5.0% to 12.0% of modified bismaleimide prepolymer; 26% to 33% of bismaleimide resin; 4.0% to 7.0% of epoxy resin; 14% to 15% of curing agent; 0.01% to 0.05% of accelerator; and 40% to 45% of inorganic filler.

[0013] The present invention also provides a prepreg comprising the above-described resin composition and a fibrous substrate.

[0014] The present invention also provides a metal-coated laminate, comprising the above-described prepreg and metal foil.

[0015] In one embodiment of the present invention, the metal-clad laminate has a dielectric loss factor of less than 0.0069 and a coefficient of thermal expansion of less than 3.9 ppm / °C.

[0016] Based on the above, the resin composition of the present invention, by using a modified bismaleimide prepolymer composed of alternating bismaleimide monomers and bi-terminated amino-modified silicone resins, can effectively reduce the dielectric loss factor and coefficient of thermal expansion of metal-clad laminates (e.g., copper foil substrates). Simple Explanation of the Diagram

[0017] Figure 1 is a gel permeation chromatography (GPC) analysis chromatogram according to an embodiment of the present invention. Figure 2 is a GPC analysis graph according to another embodiment of the present invention. Implementation

[0018] The following are embodiments that describe the contents of this invention in detail. The implementation details presented in the embodiments are for illustrative purposes only and are not intended to limit the scope of protection of this invention. Anyone skilled in the art can modify or change these implementation details according to the needs of actual implementation.

[0019] A range may be expressed herein as from “about” a specific value to “about” another specific value, or it may be directly expressed as a specific value and / or to another specific value. In expressing the range, another embodiment includes from that specific value and / or to another specific value. Similarly, when a value is expressed as an approximation by using the antecedent “about,” it will be understood that the specific value forms another embodiment. It will be further understood that each endpoint of a range may be obviously related to or unrelated to another endpoint.

[0020] In this document, non-limiting terms (such as: may, can, for example, or other similar terms) are non-essential or optional implementations, inclusions, additions, or existences.

[0021] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It will also be understood that terms (such as those defined in commonly used dictionaries) shall be interpreted as having the same meaning as in the relevant technical context and shall not be interpreted in an idealized or overly formal sense, unless expressly defined herein.

[0022] In this paper, a "divalent organic group" is an organic group with two bonding positions, and a "divalent organic group" can form two chemical bonds through these two bonding positions.

[0023] The term "amine equivalent" used in this article refers to the quotient of the molecular weight of an amine reactant divided by the number of active hydrogen atoms it contains, expressed in grams per mole (g / mol).

[0024] One embodiment of the resin composition of the present invention includes a modified bismaleimide prepolymer. In some embodiments, in addition to the modified bismaleimide prepolymer, the resin composition may also include a bismaleimide resin, an epoxy resin, a curing agent, an accelerator, and an inorganic filler. The various components described above will be described in detail below.

[0025] [<] [Modified bismaleimide prepolymer] [>]

[0026] According to an embodiment of the present invention, a modified bismaleimide prepolymer is synthesized by using bismaleimide monomer as the hard segment and a bi-terminated amino-modified silicone resin as the soft segment, resulting in an ordered alternating arrangement of the modified bismaleimide prepolymer. This orderly arrangement of the maleimide functional groups reduces the polarity distribution of the modified bismaleimide prepolymer, thereby reducing its electrical properties and decreasing its coefficient of thermal expansion.

[0027] In some embodiments, the bismaleimine monomer has a structure represented by the following formula A: (Formula A).

[0028] In formula A, R1 can represent a divalent organic group, such as a divalent aromatic group. For example, R1 is... , where * indicates the bond position.

[0029] Bisamine-terminated modified silicate resins are silicate resins whose two opposite ends have been modified with amine groups; they can also be called silicate diamines. In some embodiments, the bisamine-terminated modified silicate resin has a structure represented by the following formula B: (Formula B).

[0030] In formula B, R4 and R5 can each independently represent a C1 to C10 straight-chain alkyl group, and m can be an integer from 0 to 10. For example, R4 and R5 can each independently be methyl, ethyl, propyl, n-butyl, n-pentyl, n-hexyl, n-heptyl, n-octyl, n-nonyl, or n-decyl. In some embodiments, m is an integer from 1 to 5, such as 2, 3, or 4.

[0031] In some embodiments, the modified bismaleimide prepolymer has a structure represented by Formula 1: (Equation 1).

[0032] In Equation 1, R1 to R3 can each independently represent a divalent organic group, such as a divalent aromatic group. For example, R1 to R3 are... , where * indicates the bond position.

[0033] In Formula 1, R4 to R7 can each independently represent a C1 to C10 straight-chain alkyl group. For example, R4 to R7 can each be methyl, ethyl, propyl, n-butyl, n-pentyl, n-hexyl, n-heptyl, n-octyl, n-nonyl, or n-decyl. In some embodiments, R4 to R7 are all propyl.

[0034] In Equation 1, m, n, and p can each independently represent an integer from 0 to 10. In some embodiments, m, n, and p are each independently an integer from 1 to 5, for example, m, n, and p are each independently 2, 3, or 4.

[0035] In some embodiments, the amount of modified bismaleimide prepolymer added is from about 5.0% to 12.0% by weight, for example, about 7.0% by weight or about 10.0% by weight, based on the total weight of the resin composition. In some embodiments, the number-average molecular weight of the modified bismaleimide prepolymer is from about 1,500 g / mol to 2,000 g / mol. In some embodiments, the weight-average molecular weight of the modified bismaleimide prepolymer is from about 8,000 g / mol to 22,000 g / mol.

[0036] [<] [Preparation method of modified bismaleimide prepolymer] [>]

[0037] First, the bismaleimide resin is dissolved in a solvent. For example, the bismaleimide resin is bis(4-maleimidephenyl)methane. In some embodiments, the bismaleimide resin is at least one or a combination of the following products: BMI-1000, BMI-1000H, BMI-2300, and BMI-7000 supplied by DAIWA FINE CHEMICALS (TAIWAN) CO., LTD., and BMI-70 and BMI-80 supplied by K・I Chemical Industry Co., LTD. For example, propylene glycol methyl ether acetate can be used as a solvent. In some embodiments, the bismaleimide resin can be uniformly dispersed in the solvent by heating and stirring, wherein the temperature can be raised to about 100°C to 120°C, for example about 110°C, and stirring can be carried out for about 10 minutes to 30 minutes, for example about 15 minutes.

[0038] Next, a biamine-terminated modified silicate resin is added, and the temperature is raised to approximately 100°C to 150°C, for example, approximately 120°C. The reaction is continued with stirring for approximately 2 hours to 8 hours, for example, approximately 4 hours, to obtain a solution containing the modified bismaleimide prepolymer. In some embodiments, the biamine-terminated modified silicate resin includes a silicate diamine (amine equivalent of approximately 450 g / mol) supplied by Dow Chemical Company under the trade name BY16-853U, a silicate diamine (amine equivalent of approximately 220 g / mol) supplied by Shin-Etsu Chemical Co., Ltd. under the trade name KF-8012, or a combination thereof.

[0039] [<] [Dimaleimide resin] [>]

[0040] In some embodiments, the resin composition further includes a bismaleimide resin, which is an unmodified bismaleimide resin, unlike the modified bismaleimide prepolymer described above. In some embodiments, the amount of bismaleimide resin added, based on the total weight of the resin composition, is about 26% to 33% by weight, for example, about 28% by weight or about 31% by weight. In some embodiments, the bismaleimide resin includes at least one or a combination of BMI-1000, BMI-1000H, BMI-2300, BMI-7000, BMI-70, and BMI-80. []

[0041] [<] [epoxy resin] [>]

[0042] Epoxy resins may use, for example, naphthalene-based epoxy resins. Epoxy resins may, for example, be, but are not limited to, epoxy resins of the model 7050, HP4710, HP-4700, HP-6000, HP-7200, or N-695 manufactured by Dai Nippon Ink Chemical Industries (referred to as DIC); epoxy resin for C3500; epoxy resin model ESN475V or ESN485 made by Nippon Steel Chemical Co.; epoxy resin model YX4000 or YL7760 made by Mitsubishi Chemical Company, or epoxy resin model NPES-903, NPEL-128E, or NPEL-170 made by Nanya Plastics. The epoxy resin may, for example, be one or more of the above materials. In some embodiments, the addition of epoxy is from about 4.0% to 7.0% by weight, e.g., about 5.8% by weight, in terms of the total weight of the resin composition.

[0043] [<] [hardener] [>]

[0044] The hardener may include, for example, a benzoxazine-based hardener, 1,3,5-triallyl cyanurate (TAC), triallyl isocyanurate (TAIC; CAS code 1025-15-6), trimethylallyl isocyanurate, TMAIC), diallyl phthalate, divinylbenzene, triallyl 1,2,4-benzenetricarboxylate (1,2,4-triallyl trimellitate) and other suitable cross-linking hardeners. The above materials may be used alone or in combination. In some embodiments, the hardener is a hardener traded named KB-610F provided by Quinmen Corporation. In some embodiments, the addition of the hardener may be from about 14% to 15% by weight, e.g., about 14.7% by weight, in terms of the total weight of the resin composition.

[0045] [<] [Accelerator] [>]

[0046] To enhance system reactivity, the resin composition may also include an accelerator, such as an imidazole accelerator. For example, the accelerator may be 2-phenyl-4-methyl-5-hydroxymethylimidazole, but the invention is not limited to the examples given above. In some embodiments, the accelerator includes an accelerator supplied by Shikoku Chemical Co., Ltd. of Japan, traded under the name 2P4MHZ-PW. In some embodiments, the amount of accelerator added may be from about 0.01% to 0.05% by weight, for example, about 0.03% by weight, based on the total weight of the resin composition.

[0047] [<] [Inorganic packing] [>]

[0048] In some embodiments, the resin composition may further include inorganic fillers. For example, the inorganic filler may be: silicon dioxide (SiO₂), titanium dioxide, aluminum hydroxide, aluminum oxide, magnesium hydroxide, magnesium oxide, calcium carbonate, boron oxide, calcium oxide, strontium titanate, barium titanate, calcium titanate, magnesium titanate, boron nitride, aluminum nitride, silicon carbide, cerium dioxide, or combinations thereof. In some embodiments, the silicon dioxide added as an inorganic filler may include spherical SiO₂. Spherical SiO₂ may be prepared using synthetic methods to reduce electrical properties and maintain flowability and filler properties. The average particle size D50 of the inorganic filler may be about 2.0 μm to 3.0 μm. The amount of inorganic filler added, based on the total weight of the resin composition, may be about 40% to 45% by weight, for example, about 41% by weight. In some embodiments, when the non-volatile components in the resin composition are set to 100% by weight, the content of the inorganic filler may be about 70% to 80% by weight. In some embodiments, the inorganic filler is synthetic SiO2, model EQH1003-SKD, purchased from Sanji Corporation.

[0049] It should be noted that the resin composition of the present invention can be processed into prepregs and metal-clad laminates (e.g., copper clad laminates, CCLs) according to actual design requirements, and the prepregs and metal-clad laminates made using the resin composition of the present invention can have a reduced coefficient of thermal expansion (CTE) and a reduced dielectric loss factor (Df). In some embodiments, the CTE of the metal-clad laminate (or prepreg) made of the resin composition is about 4.0 ppm / °C or less, for example, about 3.9 ppm / °C or less. In some embodiments, the Df of the metal-clad laminate (or prepreg) made of the resin composition is less than about 0.0070, for example, less than about 0.0069, for example, about 0.0068.

[0050] In some embodiments, the dielectric constant (Dk) of the metal-coated laminate (or prepreg) made of the resin composition is between about 3.70 and 3.75, for example, about 3.71 or about 3.74. In some embodiments, the glass transition temperature (Tg) of the metal-coated laminate (or prepreg) made of the resin composition can reach above 318°C, and even up to about 322°C. In some embodiments, the peel strength of the metal-coated laminate (or prepreg) made of the resin composition can even reach about 4.66 lb / in. In some embodiments, the water absorption rate of the metal-coated laminate (or prepreg) made of the resin composition after heating in a pressure cooker at 120°C and 2 atm for 120 minutes is less than about 0.45% by weight, and even less than about 0.31% by weight.

[0051] The resin composition of the present invention will be described in detail below by way of experimental examples. However, the following experimental examples are not intended to limit the present invention. []

[0052] [<] [Experimental Example] [>]

[0053] To demonstrate that the resin composition proposed in this invention can effectively reduce the Df and CTE of metal-clad laminates, experimental examples are provided below for further illustration. []

[0054] [<] [Modified bismaleimide prepolymer] [The synthesis of] [>]

[0055] Examples 1-2 illustrate the synthesis of modified bismaleimide prepolymers.

[0056] [<] [Synthesis example] [1>]

[0057] 50.0 g of bis(4-maleiminophenyl)methane (molecular weight 358 g / mol) and 117.8 g of propylene glycol methyl ether acetate (as solvent) were added to a round-bottom flask. The mixture was heated to approximately 110°C and stirred for 15 minutes to ensure a more uniform dispersion of the bis(4-maleiminophenyl)methane in the propylene glycol methyl ether acetate. Next, 62.8 g of siloxane diamine with an amino equivalent of 450 g / mol was added, and the mixture was heated to approximately 120°C and stirred for another 4 hours to obtain a solution of the modified prepolymer of Synthesis Example 1.

[0058] Calculations show that in the modified prepolymer of Synthetic Example 1, the ratio of the mole number of maleic anhydride groups in the bismaleimine monomer to the mole number of amino groups in the bisamine-terminated modified silica resin is 2*50 / 358:62.8 / 450=2:1.

[0059] The modified prepolymer solution from Synthesis Example 1 was analyzed by gel permeation chromatography (GPC), resulting in the GPC chromatogram shown in Figure 1. The horizontal axis represents minutes (min). The number average molecular weight (Mn) was measured to be 1,614, and the weight average molecular weight (Mw) was 9,446. The ratio of weight average molecular weight to number average molecular weight was approximately 5.85. The number average and weight average molecular weights were measured using a gel permeation chromatograph (GPC) calibrated with standard molecular weight polystyrene (PS). The flow rate was set to approximately 1.0 mL / min, and tetrahydrofuran (THF) was used as the mobile phase.

[0060] The modified prepolymer of Synthetic Example 1 may include the modified bismaleimide prepolymer shown in Formula 1: (Equation 1) Where R1 to R3 represent , where * indicates the bond position, R4 to R7 are C3 alkyl groups, m is 3, n is 3, and p is 2.

[0061] [<] [Synthesis example] [2>]

[0062] 20.0 g of bis(4-maleiminophenyl)methane and 142.8 g of propylene glycol methyl ether acetate were added to a round-bottom flask, and the mixture was heated to approximately 110 °C and stirred for 15 minutes. Then, 122.8 g of siloxane diamine with an amino equivalent of 2,200 g / mol was added, and the mixture was heated to approximately 120 °C and stirred for another 4 hours to obtain a solution of the modified prepolymer of Synthesis Example 2.

[0063] Calculations show that in the modified prepolymer of Synthetic Example 2, the ratio of the mole number of maleic anhydride groups in the bismaleimine monomer to the mole number of amino groups in the bisamine-terminated modified silica resin is 2*20 / 358:122.8 / 2200=2:1.

[0064] The solution of the modified prepolymer of Synthesis Example 2 was subjected to GPC analysis, and the GPC analysis spectrum shown in Figure 2 was obtained. The number average molecular weight was approximately 1,835, the weight average molecular weight was approximately 20,378, and the ratio of the weight average molecular weight to the number average molecular weight was approximately 11.1.

[0065] The modified prepolymer of Synthetic Example 2 may include the modified bismaleimide prepolymer shown in Formula 1 above, wherein R1 to R3 represent , where * indicates the bond position, R4 to R7 are C3 alkyl groups, m is 5, n is 5, and p is 4.

[0066] [<] [Manufacturing of metal-clad laminates] [>]

[0067] The manufacturing method of a metal-clad laminate is illustrated below. According to the formulation composition (unit: grams) in Table 1 below, the resin composition is dissolved in a suitable solvent and mixed to prepare a resin varnish. The metal-clad laminate, for example, a copper foil substrate, is then prepared using conventional methods. In some embodiments, the solvents mentioned above may include, but are not limited to: toluene, methyl isobutyl ketone (MIBK), methyl ethyl ketone (MEK), dimethylacetamide (DMAC), dimethylformamide (DMF), proprylene glycol monomethyl ether (PM), or co-solvents including the above.

[0068] The aforementioned conventional method for preparing a metal-clad laminate may include, for example, the following steps: Impregnating a fibrous substrate (e.g., fiberglass cloth of type 2116 purchased from Nan Ya Plastics Co., Ltd.) in the aforementioned resin varnish at room temperature, and then drying it at approximately 170°C (impregnation machine temperature) for several minutes, obtaining a dried prepreg by adjusting and controlling the drying time. Subsequently, stacking eight prepreg sheets layer by layer between two metal foils (e.g., 35 μm thick copper foil), maintaining a constant temperature of 25 kg / cm² at a pressure of, for example, 85°C for 20 minutes, then heating to 250°C at a heating rate of 3°C / min, and maintaining a constant temperature for another 120 minutes, followed by slow cooling to 130°C to obtain a metal-clad laminate (e.g., copper foil substrate) approximately 0.8 mm thick. Afterwards, the metal-clad laminate is used to evaluate various properties.

[0069] [<] [Evaluation Method] [>]

[0070] The metal-clad laminates (e.g., copper foil substrates) produced in each example and comparative example were evaluated according to the following methods, and the results are listed in Table 1.

[0071] [a.] Glass transfer temperature () [glass transition temperature] [,] [Tg] [)]

[0072] The tests were performed using a dynamic mechanical analyzer (DMA).

[0073] [b.] Coefficient of thermal expansion () [coefficient of thermal expansion] [,] [CTE] [)] []

[0074] The tests were performed using a thermomechanical analysis (TMA) system according to the IPC TM-650 2.4.24 standard.

[0075] [c.] Peel strength () Peeling strength [)]

[0076] The test was conducted using a universal tensile testing machine in accordance with IPC TM-650 2.4.8 standard.

[0077] [d.] Water absorption rate () [%] [)]

[0078] Place a 5cm x 5cm square sample in an oven at approximately 105℃ for an appropriate measurement time (e.g., approximately 2 hours), then place the sample in a pressure cooker. The pressure cooker environment is approximately 2 atm x 120℃. After approximately 120 minutes in the pressure cooker, record the water absorption rate as the weight difference of the sample before and after pressure cooking divided by the initial weight of the sample multiplied by 100%.

[0079] [e.] [Heat resistance]

[0080] The sample was heated in a pressure cooker at 120°C and 2 atm for 120 minutes, and then immersed in a soldering furnace at 288±5°C. The time required for the board to explode was recorded. A time exceeding 10 minutes was indicated as "OK", and a time less than 10 minutes was indicated as "NG".

[0081] [f.] [Dielectric constant ()] [dielectric constant] [,] [Dk] [)]

[0082] The test method involves taking a 5cm x 5cm square test piece of copper foil substrate with the copper foil removed, drying it in an oven at approximately 105°C for about 2 hours, measuring the thickness with a thickness gauge, and then clamping the test piece into an impedance analyzer (Agilent E4991A) to measure the dielectric constant Dk data at 3 points and taking the average value.

[0083] [g.] Dielectric loss () [dissipation factor] [,] [Df] [)]

[0084] The test method involves taking a 5cm x 5cm square test piece of copper foil substrate with the ketone foil removed, drying it in an oven at approximately 105°C for about 2 hours, measuring the thickness with a thickness gauge, and then clamping the test piece into an impedance analyzer (Agilent E4991A) to measure the consumption coefficient Df data at 3 points and taking the average value.

[0085] [<] [Evaluation Results] [>]

[0086] [Table 1] [Formulation composition and evaluation results of examples and comparative examples] [Resin Composition] [Example] [1] [Example] [2] [Comparative Example] formula composition Epoxy resin NC-7300 5.88 5.88 5.88 BMI resin 50P 20.58 20.58 20.58 BMI-1000 7.08 10.8 11.76 Modified prepolymer Synthesis example 1 10.56 - - Synthesis example 2 - 6.84 - Silicone resin FZ-3736 - - 5.88 hardener KB-610F 14.7 14.7 14.7 Accelerator 2P4MHZ-PW 0.03 0.03 0.03 Inorganic packing EQH1003-SKD 41.17 41.17 41.17 evaluate result Tg (°C) 318 322 320 CTE (ppm / ℃) 3.83 3.67 4.22 Peel strength (lb / in) 2.05 4.66 3.54 Water absorption rate (%) 0.45% 0.31% 0.52% Heat resistance (@PCT 2 hr, 288℃) OK OK OK Dk (10GHz) 3.71 3.74 3.72 Df (10GHz) 0.00676 0.00687 0.00931

[0087] [<] [surface] [1] [Recipe information in the text] [>]

[0088] In the comparative examples, example 1 and example 2, the epoxy resin used was a resin supplied by Nippon Kayaku Co., Ltd. with the trade name NC-7300 series.

[0089] In Comparative Examples, Example 1 and Example 2, the bismaleimide (BMI) resin used was a resin supplied by Yamato Chemical Co., Ltd. with the trade name BMI-1000 and a resin supplied by KI Chemical Co., Ltd. with the trade name BMI-50P.

[0090] In Examples 1 and 2, the modified prepolymers used were the prepolymers prepared in Synthesis Example 1 and Synthesis Example 2, respectively.

[0091] In the comparative example, the silicone resin used was a resin supplied by Dow Chemical Company under the trade name FZ-3736.

[0092] In the comparative examples, example 1 and example 2, the hardener used was a hardener with the trade name KB-610F supplied by Kunmeng Company.

[0093] In the comparative examples, example 1 and example 2, the accelerator used was a accelerator with the trade name 2P4MHZ-PW provided by Shikoku Chemical Industry Co., Ltd. of Japan, which has the structure represented by the following formula 2. (Equation 2)

[0094] In Comparative Examples, Example 1, and Example 2, the inorganic packing used was EQH1003-SKD, a packing supplied by Sanji Corporation.

[0095] As can be seen from the experimental results in Table 1, compared with the comparative example that did not use the modified bismaleimide prepolymer of the present invention, Example 1 using the prepolymer of Synthesis Example 1 and Example 2 using the prepolymer of Synthesis Example 1 both have a Df of less than 0.0069 and a CTE of less than 3.9 ppm / °C, and their Dk, Tg, peel strength, water absorption and heat resistance all meet the requirements.

[0096] In summary, the resin composition of the present invention, by using a modified bismaleimide prepolymer composed of alternating bismaleimide monomers and bi-terminated amino-modified silicone resins, can effectively reduce the Df and CTE of metal-clad laminates.

[0097] [[] [Industrial Utilization] []]

[0098] The resin composition of the present invention can be applied directly or indirectly to copper foil substrates and can be further processed into other electronic components or electronic products (e.g., circuit boards) for civilian, industrial or suitable applications.

[0099] Although the present invention has been disclosed above by way of embodiments, it is not intended to limit the present invention. Anyone skilled in the art can make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

[0100] none

Claims

1. A resin composition comprising: A modified bismaleimide prepolymer comprising alternating hard and soft segments, wherein: the hard segments comprise bismaleimide monomers, and the soft segments comprise bi-terminated amino-modified silicone resins, wherein the modified bismaleimide prepolymer has a structure represented by Formula 1: (Formula 1) where R1 to R3 represent, * represents the bond position, R4 to R7 each independently represent C1 to C10 alkyl groups, and m, n, and p each independently represent integers from 0 to 10.

2. The resin composition as claimed in claim 1, wherein the modified bismaleimide prepolymer has a number-average molecular weight of 1,500 g / mol to 2,000 g / mol and a weight-average molecular weight of 8,000 g / mol to 22,000 g / mol.

3. The resin composition as claimed in claim 1, wherein, based on the total weight of the resin composition, the resin composition comprises: 5.0% to 12.0% by weight of the modified bismaleimide prepolymer; 26% to 33% by weight of the bismaleimide resin; 4.0% to 7.0% by weight of the epoxy resin; 14% to 15% by weight of the hardener; 0.01% to 0.05% by weight of the accelerator; and 40% to 45% by weight of the inorganic filler.

4. A prepreg comprising a resin composition as described in any one of claims 1 to 3 and a fibrous substrate.

5. A metal-clad laminate comprising a prepreg as described in claim 4 and a metal foil.

6. The metal-clad laminate as claimed in claim 5, wherein the metal-clad laminate has a dielectric loss factor of less than 0.0069 and a coefficient of thermal expansion of less than 3.9 ppm / °C.

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