Portable hybrid heat dissipation module, high heat flux electronic device, and test method thereof

Abstract

A portable hybrid heat dissipation module, a high heat flux electronic device, and a testing method thereof are provided. The portable hybrid heat dissipation module includes a boiling-enhanced coating plate, a housing, and a cooling mechanism. The boiling-enhanced coating plate includes a boiling-enhanced coating. The housing forms a two-phase chamber, and the boiling-enhanced coating plate is combined with the housing to seal the two-phase chamber. The cooling mechanism is disposed in the housing corresponding to the two-phase chamber.

Claims

1. A portable hybrid heat dissipation module, comprising: a boiling-enhanced coating plate; a housing having a two-phase chamber, wherein the boiling-enhanced coating plate is detachably coupled to the housing to seal the two-phase chamber; and a cooling mechanism disposed on the housing corresponding to the two-phase chamber.

2. The portable hybrid heat dissipation module as claimed in claim 1, wherein the cooling mechanism includes a coolant inlet, a coolant outlet and a coolant flow space, the coolant inlet and the coolant outlet are formed in the housing, and the coolant flow space communicates with the coolant inlet and the coolant outlet and is adjacent to or located within the dual-phase chamber.

3. The portable hybrid cooling module as claimed in claim 1, wherein the cooling mechanism includes a plurality of first fins disposed on the housing and located outside the dual-phase cavity.

4. The portable hybrid cooling module as described in claim 3, wherein the cooling mechanism further includes a plurality of second fins disposed in the housing and located within the dual-phase chamber.

5. The portable hybrid heat dissipation module as claimed in claim 1 further includes a sealing ring, wherein the housing has an opening communicating with the dual-phase chamber, and the sealing ring is disposed around the opening between the housing and the boiling-enhanced coating plate.

6. The portable hybrid heat dissipation module as claimed in claim 5, wherein the housing has a groove surrounding the cavity opening, and the sealing ring is disposed in the groove.

7. The portable hybrid heat dissipation module as described in claim 1 further includes a fluid inlet, wherein the fluid inlet is disposed in the housing and communicates with the dual-phase chamber, and the fluid inlet allows working fluid to flow into the dual-phase chamber.

8. The portable hybrid heat dissipation module as described in claim 7 further includes a control valve, wherein the control valve is disposed on the housing corresponding to the fluid inlet to control the communication between the two-phase chamber and the outside through the fluid inlet.

9. The portable hybrid cooling module as described in claim 7, wherein the fluid inlet can selectively serve as a gate for regulating the internal pressure of the two-phase chamber.

10. The portable hybrid heat dissipation module as claimed in claim 1 further includes a bonding member for bonding the housing and the boiling-enhanced coating plate, thereby making the two-phase chamber an airtight space.

11. The portable hybrid heat dissipation module as claimed in claim 10, wherein the boiling-enhanced coating plate includes a boiling-enhanced coating and a frame, wherein the frame supports the boiling-enhanced coating and the coupling secures the frame to the housing.

12. The portable hybrid heat dissipation module as described in claim 10, wherein the connector comprises screws, fasteners, or a combination thereof.

13. A high heat flux electronic device comprising: a portable hybrid heat dissipation module as claimed in claim 1; and high heat flux electronic components, combined with the boiling-enhanced coating plate and located outside the housing.

14. The high heat flux electronic device as claimed in claim 13, wherein the portable hybrid heat dissipation module further includes a fluid inlet disposed in the housing and communicating with the two-phase chamber, and the fluid inlet can selectively serve as a regulating gate for the internal pressure of the two-phase chamber.

15. The high heat flux electronic device as claimed in claim 13, wherein the boiling-enhanced coating plate includes a boiling-enhanced coating and a frame, the frame supporting the boiling-enhanced coating and fixing it to the housing, and the high heat flux electronic device is coupled to the boiling-enhanced coating.

16. A method for testing a portable hybrid heat dissipation module, comprising: using a portable hybrid heat dissipation module as claimed in claim 1; bonding the boiling-enhanced coating plate to the housing to seal the two-phase chamber; injecting working fluid into the two-phase chamber; heating the boiling-enhanced coating plate with a predetermined amount of heat; and measuring the temperature of the boiling-enhanced coating plate to determine the heat dissipation performance of the boiling-enhanced coating plate.

17. The detection method as claimed in claim 16, wherein in the step of injecting the working fluid, the amount of the working fluid injected is less than 75% of the volume of the biphasic chamber.

18. The detection method as claimed in claim 16, wherein the step of injecting the working fluid comprises injecting a dielectric fluid, semiconducting fluid, or conductive fluid with a boiling point temperature of 45 degrees Celsius or higher and 250 degrees Celsius or lower at atmospheric pressure.

19. The detection method as described in claim 18, wherein the step of injecting the working fluid comprises injecting a liquid fluorinated liquid, water, propylene glycol or ethylene glycol.

20. The detection method as described in claim 16 further includes: adjusting the boiling point temperature of the working fluid by adjusting the pressure in the two-phase chamber.

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