Pusher of handler for testing electronic component

Abstract

This invention discloses a push rod for a processor used to test electronic components. The push rod of this invention includes: a cooling body, made of metal and integrally manufactured for cooling the electronic component under test; and at least one pressing member, detachably attached to the cooling body side, for applying pressure to the electronic component under test; the cooling body forms a first cooling flow path and a second cooling flow path for the flow of cooling fluid for cooling the electronic component under test. According to this invention, the temperature of the electronic component under test becomes more uniform, thereby improving the reliability of the test.

Description

[Technical Field]

[0001] This invention discloses a push rod for applying pressure to electronic components after they have been electrically connected to a processor and a tester. [Previous Technology]

[0002] Electronic components, including semiconductors, need to be tested by testing machines in order to screen out defective products during or after the production process.

[0003] The electrical connection between electronic components and the testing machine is achieved through the processor.

[0004] The electronic components that are moved into the processor are tested by the testing machine and then moved out of the processor.

[0005] In order to make electrical connection between electronic components and the testing machine, the processor has a push rod for pressurizing electronic components.

[0006] The push rod applies pressure to the electronic component being tested, thereby providing stability to the electrical connection between the electronic component and the testing machine.

[0007] Electronic components are used in a variety of temperature environments, so the temperature environment of the tested electronic components is an important physical factor in determining whether the electronic components are defective.

[0008] The temperature of the electronic components being tested needs to be carefully managed to keep it within acceptable limits.

[0009] Electronic components often generate heat during the testing process, which can disrupt the temperature environment. To prevent this problem, a technique for providing cooling to push rods has been disclosed in the past.

[0010] Korean Patent Publication No. 10-2016-0064964 discloses a technology for a push rod that has been given a cooling function (hereinafter referred to as "Prior Art").

[0011] The push rod is provided with a cooling space for the flow of cooling fluid.

[0012] The cooling space is provided with a cooling flow path, which has an inlet on one side and an outlet on the other side.

[0013] The cooling fluid flowing in the cooling path can reduce the temperature of electronic components to an appropriate level.

[0014] A cooling space can be combined with one pusher or with two or more even numbers of pushers.

[0015] Preferably, the cold air in the cooling space is evenly conducted to all the pushing parts.

[0016] However, in the prior art, the temperature on the inlet side is lower than the temperature on the outlet side.

[0017] Therefore, the more pressing parts are combined, the greater the temperature unevenness of each pressing part will be. [Prior Art Documents] [Patent Documents] (Patent Document 0001) Korean Patent Publication No. 10-2016-0064964 [Summary of the Invention]

[0018] The purpose of this invention is to provide a technology that allows cold air to be transmitted evenly regardless of the number of pushing parts.

[0019] The push rod of the processor for testing electronic components of the present invention includes: a cooling body, which is made of metal and is integrally manufactured for cooling the electronic component under test; and at least one pusher, which is detachably attached to the cooling body side to pressurize the electronic component under test; a first cooling flow path and a second cooling flow path are formed in the cooling body for the flow of cooling fluid for cooling the electronic component under test.

[0020] The first inlet for the cooling fluid to enter the first cooling flow path, the first outlet for the cooling fluid to exit the first cooling flow path, the second inlet for the cooling fluid to enter the second cooling flow path, and the second outlet for the cooling fluid to exit the second cooling flow path are configured at a first position spaced down from the upper end of the cooling body.

[0021] The first cooling flow path is configured at a second position below the first position and has a first curved section formed in a curved shape, the second cooling flow path is configured at the second position and has a second curved section formed in a curved shape, the second position being spaced upwards from the lower end of the cooling body by a certain distance.

[0022] The first curve section is formed by the cooling fluid spiraling from the outside to the inside in a manner with a decreasing radius of curvature, while the second curve section is formed by the cooling fluid spiraling from the inside to the outside in a manner with a increasing radius of curvature.

[0023] The first inlet and the second inlet are configured on opposite sides of each other, and the first outlet and the second outlet are configured on opposite sides of each other.

[0024] The first inlet and the first outlet are configured on opposite sides of each other.

[0025] It also includes a ceramic heater that heats the electronic component being tested, located between the cooling body and the pusher.

[0026] It also includes: a main heater, which heats the electronic component under test between the cooling body and the pusher; an auxiliary heater, which heats the electronic component under test between the cooling body and the main heater; and an isolator, which is disposed between the main heater and the auxiliary heater.

[0027] It also includes at least one heater for heating the electronic component being tested, wherein at least one heater is embedded in the cooling body and forms at least one heater slot that opens upwards.

[0028] The heater slot is formed in a longer vertical direction, and the lower end of the heater slot is higher than the second position.

[0029] According to the present invention, the lower surface of the cooling body has a uniform temperature distribution, thereby improving the reliability of the test.

Implementation Method

[0038] Preferred embodiments of the present invention will be described in conjunction with the accompanying drawings; however, for the sake of brevity, descriptions of well-known or repetitive structures will be omitted or shortened as much as possible. <First Embodiment>

[0039] The first figure is a schematic diagram of the push rod 100 of the first embodiment of the present invention.

[0040] The push rod 100 includes a cooling body 110 and a pusher 120.

[0041] The cooling body 110 is equipped for cooling the electronic components being tested.

[0042] The cooling body 110 is manufactured as a single unit.

[0043] For example, the cooling body 110 can be manufactured as a single unit using a 3D printing mechanism.

[0044] The cooling body 110 is equipped with a metal material with excellent thermal conductivity.

[0045] The second figure is a perspective view of the cooling body 110.

[0046] The cooling body 110 has a first cooling flow path 111 and a second cooling flow path 112.

[0047] As the processor operates, the low-temperature cooling fluid continues to flow in the first cooling flow path 111 and the second cooling flow path 112.

[0048] The cool air of the cooling fluid flowing in the first cooling flow path 111 and the second cooling flow path 112 is conducted to the electronic component under test via the cooling body 110 and the pusher 120.

[0049] In this embodiment, all areas of the cooling body 110 except for the first cooling flow path 111 and the second cooling flow path 112 are filled. The specific heat of the cooling body 110 is correspondingly larger, thereby reducing the rapid temperature changes caused by the heating of electronic components.

[0050] The first cooling flow path 111 is provided with a first inlet 111i, a first outlet 111o, a first descending section 111d, a first ascending section 111u and a first curved section 111c.

[0051] Cooling fluid is input at the first inlet 111i and output at the first outlet 111o.

[0052] The first inlet 111i and the first outlet 111o are configured to a first position P1 at the same height in the vertical direction.

[0053] The first position P1 is located at a distance from the upper end TT of the cooling body 110 downwards.

[0054] The first inlet 111i extends downwards from the upper end TT of the cooling body 110 at intervals.

[0055] The first inlet 111i and the first outlet 111o are configured on opposite sides of each other.

[0056] The first inlet 111i is disposed on one side of the cooling body 110, and the first outlet 111o is disposed on the opposite side.

[0057] The first descending section 111d is the section where the cooling fluid flowing in from the first inlet 111i descends.

[0058] The first rising section 111u is the section in which the cooling fluid rises upward toward the first outlet 111o.

[0059] The first curve segment 111c is configured between the first descending segment 111d and the first ascending segment 111u.

[0060] The first curve segment 111c connects the first descending segment 111d and the first ascending segment 111u.

[0061] The first curve segment 111c is configured at the second position P2.

[0062] Although the second position P2 is lower than the first position P1, it is spaced a distance higher than the lower end BT of the cooling body 110.

[0063] The first curve section 11c allows the cooling fluid to swirl from the outside to the inside in a curve with a gradually decreasing radius of curvature.

[0064] After the cooling fluid is input from the first inlet 111i, it descends towards the first curved section 111c in the first descending section 111d. After spiraling from the outside to the inside in the first curved section 111c, it rises in the first ascending section 111u and is output from the first outlet 111o.

[0065] During the flow of the cooling fluid in the first cooling flow path 111, the cooling body 110 takes away the cold air. Therefore, the temperature of the cooling fluid increases slightly from the first inlet 111i to the first outlet 111o.

[0066] When viewed from above in a plan view, the first descending section 111d is positioned closer to the edge of the cooling body 110 than the first ascending section 111u, and the first ascending section 111u is positioned closer to the center of the cooling body 110 than the first descending section 111d.

[0067] The second cooling flow path 112 is provided with a second inlet 112i, a second outlet 112o, a second descending section 112d, a second ascending section 112u, and a second curved section 112c.

[0068] Cooling fluid is input from the second inlet 112i and output from the second outlet 112o.

[0069] The second inlet 112i and the second outlet 112o are configured at the first position P1.

[0070] The first inlet 111i, the first outlet 111o, the second inlet 112i, and the second outlet 112o are in the same vertical position.

[0071] The second inlet 112i and the second outlet 112o are configured on opposite sides.

[0072] The second inlet 112i is disposed on the other side of the cooling body 110, and the second outlet is disposed on one side of the cooling body.

[0073] The second inlet 112i and the first outlet 111o are configured on the same side, and the second outlet 112o and the first inlet 111i are configured on the same side.

[0074] The first inlet 111i and the second inlet 112i are configured on opposite sides of each other, and the first outlet 111o and the second outlet 112o are also configured on opposite sides of each other.

[0075] The second descending section 112d is the section in which the cooling fluid flowing in from the second inlet 112i descends downwards.

[0076] The second rising section 112u is the section in which the cooling fluid rises upward toward the second outlet 112o.

[0077] The second curve segment 112c is positioned between the second descending segment 112d and the second ascending segment 112u.

[0078] The second curve segment 112c connects the second descending segment 112d and the second ascending segment 112u.

[0079] The second curve segment 112c is configured at the second position P2.

[0080] The second curve segment 112c and the first curve segment 111c are configured at the same height.

[0081] The second curve section 112c is formed by the cooling fluid circulating from the inside to the outside in a curve with a gradually increasing radius of curvature.

[0082] After the cooling fluid is input from the second inlet 112i, it descends towards the second curved section 112c in the second descending section 112d and then spirals outward from the inside in the second curved section 112c. After rising in the second rising section 112u, it is output from the second outlet 112o.

[0083] During the flow of the cooling fluid in the second cooling flow path 112, the cold air is captured by the cooling body 110. Therefore, the temperature of the cooling fluid increases slightly from the second inlet 112i to the second outlet 112o.

[0084] When viewed from above in a plan view, the second descending section 112d is positioned closer to the center of the cooling body 110 than the second ascending section 112u, and the second ascending section 112u is positioned closer to the edge of the cooling body 110 than the second descending section 112d.

[0085] The first cooling flow path 111 cools the edge side first, and the second cooling flow path 112 cools the center side first.

[0086] On the lower surface of the cooling body 110, the temperature on the edge side is uniform with very small deviation from the temperature in the center.

[0087] The configuration of the first cooling flow path 111 and the second cooling flow path 112 is such that the current temperature of the cooling fluid is complemented at the second position P2, so that all points on the lower surface of the cooling body 110 have a uniform temperature.

[0088] Even if multiple pushers 120 are combined into a cooling body 110, the uniformity of the cold air transmitted to each pusher 120 remains precise.

[0089] The first cooling flow path 111 and the second cooling flow path 112 are spaced down from the upper surface of the cooling body 110 and spaced up from the lower surface of the cooling body 110, so the upper and lower surfaces of the cooling body 110 are closed to the two cooling flow paths 111 and 112. This ensures the sealing of the two cooling flow paths 111 and 112.

[0090] The push rod 100, which needs to apply pressure to the electronic components, continuously bears vertical resistance with its direction upward.

[0091] If a portion of the cooling flow paths 111 and 112 are formed in an open manner in the vertical direction, a plurality of sealing tools for closing are required.

[0092] Multiple sealing tools are subjected to vertical resistance continuously, which shortens their lifespan.

[0093] This embodiment does not require a sealing tool, so the lifespan of the sealing tool will not determine the lifespan of the push rod.

[0094] Even if two cooling flow paths 111 and 112 are formed on a single cooling body 110, a single chiller can be used to supply cooling fluid to the two cooling flow paths 111 and 112.

[0095] As shown in the third figure, the processor may be equipped with a manifold M.

[0096] The cooling fluid supplied by the refrigeration unit C can be fed into the first inlet 111i and the second inlet 112i respectively after branching in the manifold M.

[0097] The electronic component being tested is pressurized by the pusher 120.

[0098] The pusher 120 transfers the cold air from the cooling body to the electronic component being tested.

[0099] Preferably, the pusher 120 is made of a metal material with good thermal conductivity.

[0100] The pusher 120 is detachably attached to the side of the cooling body 110.

[0101] The electronic components being tested are allowed to be of various specifications.

[0102] If the electronic component being tested is changed, the processor can be easily switched to test the changed electronic component simply by replacing the pusher 120.

[0103] A cooling body 110 may be combined with one or more pushers 120.

[0104] If multiple pushers 120 are combined into a cooling body 110, the uniformity of the pressure applied to the electronic components through the pusher 100 needs to be considered.

[0105] Therefore, it is preferable to have an even number of pushers 120 when a plurality of pushers 120 are combined into a cooling body 110. <Second Embodiment>

[0106] The push rod 100 of the second embodiment is provided with a heater 130.

[0107] The fourth figure is a perspective view of the cooling body 110 of the push rod 100 according to the second embodiment of the present invention.

[0108] In addition to the first cooling flow path 111 and the second cooling flow path 112, the cooling body 110 also has two heater slots 113.

[0109] Heater tanks 113, 113 only need to be equipped with one or more.

[0110] The heater 130 for heating the electronic component being tested is installed in the heater slots 113, 113 in an embedded manner.

[0111] The heater tank 113 is formed in a relatively long vertical direction.

[0112] The heater tank 113 is open to the upward, and the lower end of the heater tank 113 is higher than the second position P2.

[0113] The heater 130 is equipped with a rod-shaped part that is longer in the vertical direction.

[0114] The heater 130 prevents the electronic components from being overcooled by the cooling fluid.

[0115] Cooling fluid continuously flows through the first cooling flow path 111 and the second cooling flow path 112. Therefore, the electronic components will be over-cooled due to the heating state of the electronic components.

[0116] The heater 130 can operate before the electronic components are overcooled, thus helping to prevent the electronic components from being overcooled. <Third Embodiment>

[0117] As shown in Figure 5, the third embodiment is provided with a ceramic heater 130 with excellent heating performance.

[0118] The ceramic heater 130 is located between the cooling body 110 and the pusher 120.

[0119] An isolator 140 is provided between the cooling body 110 and the ceramic heater 130.

[0120] Isolator 140 can isolate the cooling body 110 from the ceramic heater 120.

[0121] The isolator 140 has the function of transferring the cold air from the cooling body 110 to the push member 120. For this purpose, it is better to use a metal material with good thermal conductivity for the isolator 140.

[0122] A mounting groove 121 for mounting the ceramic heater 120 is formed on the upper surface side of the pusher 120.

[0123] The ceramic heater 130 is installed in a structure that inserts into the mounting slot 121.

[0124] The isolator 140 and the mounting slot 121 prevent the ceramic heater 130 from being damaged by vertical resistance.

[0125] According to this embodiment, it is preferable to replace the ceramic heater 130 together with the pusher 120. <Fourth Embodiment>

[0126] As shown in Figure 6, the fourth embodiment includes a main heater 131 and an auxiliary heater 132.

[0127] An isolator 140 is provided between the main heater 131 and the auxiliary heater 132.

[0128] Isolator 140 enables the main heater 131 and the auxiliary heater 132 to be isolated from each other.

[0129] The main heater 131 is located between the isolator 140 and the pusher 120.

[0130] The upper surface of the pusher 120 has a mounting groove 121 that allows the main heater 131 to be inserted.

[0131] The auxiliary heater 132 is located between the cooling body 110 and the isolator 140.

[0132] A heater slot 113 for mounting the auxiliary heater 132 is formed on the lower surface side of the cooling body 110.

[0133] The isolator 140 has the function of transferring the cold air from the cooling body 110 to the pusher 120.

[0134] Both the main heater 131 and the auxiliary heater 132 can be equipped with mica electric heaters with heating performance slightly lower than that of the ceramic heater 130 in the third embodiment.

[0135] The auxiliary heater 132 can be controlled in such a way that it operates in an auxiliary mode when the heating performance of the main heater 131 is insufficient. <Fifth Embodiment>

[0136] In addition to the function of pressurizing the electronic component being tested, the push rod 100 also has the function of adsorbing and clamping the electronic component so as to move the electronic component.

[0137] The seventh figure is a perspective view of the cooling body 110 of the push rod 100 according to the fifth embodiment of the present invention.

[0138] In addition to the first cooling flow path 111 and the second cooling flow path 112, the cooling body 110 also forms a vacuum flow path 114.

[0139] The vacuum flow path 114 must not overlap with the first cooling flow path 111 and the second cooling flow path 122.

[0140] Of course, a vacuum hole corresponding to the vacuum flow path 114 is also formed in the pusher 120.

[0141] Vacuum pressure can be applied to electronic components through vacuum flow path 114 and vacuum hole.

[0142] For reference, as shown in Figure 8, by minimizing the height h of the cooling body 110, the first descending section 111d of the first cooling flow path 111 and the second descending section 112d of the second cooling flow path 112 can be formed in a shorter length. Based on the example in Figure 8, the cooling performance of the first curved section 111c and the second curved section 112c can be further improved.

[0143] The foregoing plurality of embodiments are merely preferred examples of the present invention, and many other application forms are possible. Therefore, the present invention should not be construed as limited to the contents described above. The scope of the present invention should be interpreted as the scope of the patent application and its equivalents. [Simplified Explanation of the Diagram]

[0030] The first figure is a schematic diagram of the push rod of the first embodiment of the present invention.

[0031] The second figure is a perspective view of the cooling body applicable to the push rod shown in the first figure.

[0032] The third figure is a reference diagram used to illustrate the system for supplying cooling fluid to the push rod shown in the first figure.

[0033] The fourth figure is a perspective view of the cooling body of the push rod applicable to the second embodiment of the present invention.

[0034] The fifth figure is a conceptual diagram of the push rod of the third embodiment of the present invention.

[0035] Figure 6 is a conceptual diagram of the push rod according to the fourth embodiment of the present invention.

[0036] Figure 7 is a perspective view of the cooling body of the push rod applicable to the fifth embodiment of the present invention.

[0037] Figure 8 is a reference diagram illustrating a preferred example of the cooling body of the push rod of the present invention. [Biomaterial Storage]

[0145] Domestic storage information (please note in order of storage institution, date, and number): None

[0146] Overseas Deposit Information (Please note in the order of deposit country, institution, date, and number) None

Claims

1. A push rod for a processor used to test electronic components, comprising: The cooling body is made of metal and is manufactured as a single unit to cool the electronic components being tested. And, at least one pressing member, detachably attached to the cooling body side, pressurizes the electronic component under test; the cooling body forms a first cooling flow path and a second cooling flow path for cooling fluid to flow through the electronic component under test, wherein a first inlet for cooling fluid to enter the first cooling flow path, a first outlet for cooling fluid to exit the first cooling flow path, a second inlet for cooling fluid to enter the second cooling flow path, and a second outlet for cooling fluid to exit the second cooling flow path are disposed at a first position spaced downward from the upper end of the cooling body, wherein the first cooling flow path is disposed at a second position below the first position and has a first curved section formed in a curved shape, the second cooling flow path is disposed at the second position and has a second curved section formed in a curved shape, the second position being spaced upward from the lower end of the cooling body.

2. The push rod of the processor for testing electronic components as described in claim 1, wherein the first curved section is formed such that the cooling fluid swirls from the outside to the inside with a decreasing radius of curvature, and the second curved section is formed such that the cooling fluid swirls from the inside to the outside with a increasing radius of curvature.

3. The push rod of the processor for testing electronic components as described in claim 1, wherein the first inlet and the second inlet are configured on opposite sides of each other, and the first outlet and the second outlet are configured on opposite sides of each other.

4. The push rod of a processor for testing electronic components as described in claim 1, wherein the first inlet and the first outlet are configured opposite to each other.

5. The push rod of the processing machine for testing electronic components as described in claim 1, further comprising a ceramic heater located between the cooling body and the pusher for heating the electronic component under test.

6. The push rod of the processor for testing electronic components as described in claim 1, further comprising: The main heater, located between the cooling body and the pusher, heats the electronic component being tested; A secondary heater, located between the cooling body and the main heater, heats the electronic component under test; and an isolator, disposed between the main heater and the secondary heater.

7. A push rod for a processor for testing electronic components as described in claim 1, further comprising at least one heater for heating the electronic component under test, wherein at least one heater is embedded in the cooling body and forms at least one heater slot that opens upwards.

8. The push rod of the processor for testing electronic components as described in claim 7, wherein the heater slot is formed to be longer in the vertical direction and the lower end of the heater slot is higher than the second position.

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