Bonding equipment and method thereof

Abstract

This invention discloses a bonding apparatus and method, which mainly provides a bonding apparatus including a sensing device and a pick-and-place device, so as to use the sensing device to sense and acquire position information of the fiber optic connector and the optical chip, and use the pick-and-place device to align and bond the fiber optic connector to the optical chip according to the position information, thereby improving bonding efficiency.

Claims

1. A bonding device for bonding an optical fiber connector to an optical wafer, comprising: A sensing device for sensing and acquiring position information of the fiber optic connector and the optical chip; The sensing device includes a plurality of sensing units for sensing and acquiring position information of at least three surfaces of the fiber optic connector and the optical chip, based on the position information.

2. The coupling device as described in claim 1, wherein, The sensing unit is a laser sensor.

3. The coupling device as described in claim 1, wherein, The fiber optic connector is a fiber optic array unit, and the optical chip is an optical engine die or a photonic integrated circuit element.

4. The coupling device as described in claim 1, wherein, The sensing device further includes at least one processing unit for processing the position information of the fiber optic connector and the optical chip obtained by the sensing unit, so as to calculate and obtain the offset angle of the surface of the fiber optic connector to be joined to the optical chip relative to the horizontal plane, and the offset angle of the surface of the optical chip to be joined to the fiber optic connector relative to the horizontal plane, so as to provide the pick-and-place device as alignment information for joining the fiber optic connector and the optical chip.

5. The coupling device as described in claim 1, wherein, The pick-and-place device is a six-axis robotic arm.

6. The coupling device as described in claim 1, wherein, The pick-and-place device includes a light-emitting unit for emitting a light beam to the optical chip to determine the position of maximum optical power of the optical chip.

7. A bonding method for bonding an optical fiber connector to an optical wafer, comprising: A bonding device including a sensing device and a pick-and-place device is provided to sense and acquire position information of the fiber optic connector and the optical chip using the sensing device; The fiber optic connector is aligned and joined to the optical chip by the pick-and-place device based on the position information, wherein the sensing device includes a plurality of sensing units for sensing and acquiring position information of at least three surfaces of the fiber optic connector and the optical chip, respectively.

8. The joining method as described in claim 7, wherein, The sensing unit is a laser sensor.

9. The joining method as described in claim 7, wherein, The fiber optic connector is a fiber optic array unit, and the optical chip is an optical engine die or a photonic integrated circuit element.

10. The joining method as described in claim 7, wherein, The sensing device further includes at least one processing unit for processing the position information of the fiber optic connector and the optical chip obtained by the sensing unit, so as to calculate and obtain the offset angle of the surface of the fiber optic connector to be joined to the optical chip relative to the horizontal plane, and the offset angle of the surface of the optical chip to be joined to the fiber optic connector relative to the horizontal plane, so as to provide the pick-and-place device as alignment information for joining the fiber optic connector and the optical chip.

11. The bonding method as described in claim 10 further includes displacing the fiber optic connector in the direction of the optical wafer using the pick-and-place device, so that the offset angle of the fiber optic connector is aligned with the offset angle of the optical wafer.

12. The joining method as described in claim 7, wherein, The pick-and-place device is a six-axis robotic arm.

13. The joining method as described in claim 7, wherein, The pick-and-place device includes a light-emitting unit for emitting a light beam to the optical chip to determine the position of maximum optical power of the optical chip.

14. The bonding method as described in claim 13 further includes causing the light-emitting unit of the pick-and-place device to emit a light beam through the fiber optic connector to the optical wafer, in order to identify the position of maximum optical power of the optical wafer, and causing the pick-and-place device to correspondingly bond the fiber optic connector to the optical wafer.

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