Electronic device and chip carrier heat sink

Abstract

An electronic device includes a chip carrier, a chip, an integrated heat sink, and a chip carrier heat sink. The chip is disposed on the chip carrier. The integrated heat sink is disposed on the chip carrier, covers and thermally coupled to the chip. The chip carrier heat sink is disposed around the integrated heat sink and includes a main body portion, the main body portion including an opening exposing the integrated heat sink, and the chip carrier heat sink overlaps and is thermally coupled to the chip carrier. A portion of the heat emitted by the chip is dissipated through the integrated heat sink, and another portion of the heat emitted by the chip is transferred to the chip carrier heat sink through the chip carrier.

Claims

1. An electronic device comprising: A chip carrier; a chip disposed on the chip carrier; an integrated heat sink (IHS) disposed on the chip carrier, covering and thermally coupled to the chip; and a chip carrier heat sink disposed around the integrated heat sink and including a main body, wherein the main body includes an opening exposing the integrated heat sink, the chip carrier heat sink overlapping and thermally coupled to the chip carrier, wherein a portion of the heat emitted by the chip is dissipated through the integrated heat sink, and another portion of the heat emitted by the chip is transferred to the chip carrier heat sink through the chip carrier.

2. The electronic device as claimed in claim 1, wherein the chip carrier heat sink is spaced apart from the integrated heat sink.

3. The electronic device as claimed in claim 1, wherein the main body includes a top plate and a plurality of walls erected on the top plate, the top plate and the walls together forming a bottom recess, the top plate including the opening communicating with the bottom recess, and the wafer carrier and the wafer located in the bottom recess.

4. The electronic device as claimed in claim 3, wherein a first top surface of the integrated heat sink is coplanar with a second top surface of the top plate.

5. The electronic device as claimed in claim 3, wherein the chip carrier heat sink includes at least one fin portion extending from the body portion.

6. The electronic device as claimed in claim 3, wherein the wafer carrier heat sink further includes a first thermally conductive element located between the top plate of the body and the wafer carrier.

7. The electronic device as claimed in claim 3 further includes a circuit board, wherein the chip carrier is disposed on the circuit board, and the walls of the body portion are thermally coupled to the circuit board.

8. The electronic device as claimed in claim 7, wherein the chip carrier heat sink further includes a second heat-conducting element located between the walls of the body and the circuit board.

9. The electronic device of claim 1, wherein the integrated heat sink includes a plurality of recesses recessed at the edges, and the wafer carrier heat sink includes a plurality of protrusions extending toward the opening, the protrusions corresponding to the recesses.

10. A wafer carrier heat sink, suitable for a wafer carrier, wherein a wafer and an integrated heat sink are disposed on the wafer carrier, the integrated heat sink covering and thermally coupled to the wafer, the wafer carrier heat sink comprising: A main body includes an opening. When the chip carrier heat sink is disposed on the chip carrier, the chip carrier heat sink is located around the integrated heat sink. The opening exposes the integrated heat sink. The chip carrier heat sink overlaps and is thermally coupled to the chip carrier. A portion of the heat emitted by the chip is suitable for heat dissipation through the integrated heat sink, and another portion of the heat emitted by the chip is suitable for transfer to the chip carrier heat sink through the chip carrier.

11. The wafer carrier heat sink of claim 10, wherein the main body includes a top plate and a plurality of walls erected on the top plate, wherein the top plate and the walls together form a bottom recess, the top plate including an opening communicating with the bottom recess.

12. The wafer carrier heat sink as claimed in claim 11 further includes a first thermally conductive element located between the top plate of the main body and the wafer carrier.

13. The chip carrier heat sink as claimed in claim 10 further includes at least one fin portion extending from the body portion.

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