Immersion cooling system, server, and guiding assembly

Abstract

An immersion cooling system, a server, and a guiding assembly thereof. The immersion cooling system includes a housing and a guiding assembly. The housing includes a receiving portion. The guiding assembly includes a heat sink, a guiding housing, and a guiding tube. The heat sink is located in the receiving portion. The guiding housing is connected to the heat sink, and a channel is formed between the guiding housing and the heat sink. The guiding housing has a guiding port and a connecting port on opposite sides. The connecting port connects to the first receiving portion. One end of the guiding tube connects to the guiding port to communicate with the channel, and the other end protrudes from the guiding housing.

Claims

1. An immersion cooling system, comprising: a housing including a receiving portion; and at least one guiding assembly, each of the at least one guiding assembly comprising: a heat sink located in the receiving portion; a guiding housing connected to the heat sink, a channel forming between the guiding housing and the heat sink, the guiding housing having a guiding port and a communicating port on opposite sides; and a guiding tube, one end connected to the guiding port to communicate with the channel, and the other end protruding from the guiding housing; wherein, The channel includes a compression section and an expansion section, the expansion section being located between the compression section and the guide port; the width of the compression section is smaller than the width of the guide port, and the width of the expansion section gradually increases from the compression section toward the guide port.

2. The immersion cooling system as described in claim 1, wherein, The heat sink includes an evaporator plate and a frame, the evaporator plate being connected to the frame and the guide housing being connected to the frame.

3. The immersion cooling system as described in claim 2, wherein, The guide housing includes a plate body, an assembly frame and two side frames, with the two sides of the assembly frame respectively connected to the two side frames, and the guide port located on the assembly frame.

4. The immersion cooling system as described in claim 3, wherein, The plate body is an arc-shaped plate, with one concave surface facing the channel.

5. The immersion cooling system as described in claim 3, wherein, The assembly frame has a first guide surface and a second guide surface, which extend from the guide opening to the two side frames respectively.

6. The immersion cooling system as described in claim 5, wherein, The width of the expansion section connecting to the guide port is greater than or equal to the width of the guide port.

7. The immersion cooling system as described in claim 6, wherein, The plate body has a third guide surface in the expansion section. The distance from one side of the third guide surface adjacent to the guide port to the evaporator plate is greater than the distance from the other side of the third guide surface to the evaporator plate.

8. The immersion cooling system as described in claim 6, wherein, The assembly frame has a first length, the evaporator plate has a second length in the direction from the guide port to the connection port, and the two side frames have a third length in the direction from the guide port to the connection port. The second length is substantially equal to the third length, and the third length is less than the first length.

9. The immersion cooling system as described in claim 3, wherein, The guide housing has a connecting recess, the frame has a connecting protrusion, the connecting recess is connected to the connecting protrusion, and the connecting recess is located in the channel.

10. The immersion cooling system as described in claim 1, wherein, The accommodating portion includes a first accommodating portion and a second accommodating portion, the heat sink is located in the first accommodating portion, and the other end of the guide tube is connected to the second accommodating portion.

11. The immersion cooling system as described in claim 10, wherein, The heat sink includes an evaporator plate and a frame, a guide housing is connected to the frame, the evaporator plate corresponds to the channel; and the guide housing has a connecting recess, the frame has a connecting protrusion, the connecting recess is connected to the connecting protrusion, and the connecting recess is located away from the channel.

12. The immersion cooling system as described in claim 10, wherein, The guide housing includes a plate body, an assembly frame and two side frames, the two sides of the assembly frame are respectively connected to the two side frames, the guide opening is located in the assembly frame; and the assembly frame has a first guide surface and a second guide surface, the first guide surface and the second guide surface extend from the guide opening to the two side frames respectively.

13. The immersion cooling system as described in claim 1, wherein, The accommodating portion includes a first accommodating portion and a second accommodating portion, with the guide tube protruding from the first accommodating portion and extending into the second accommodating portion; the immersion cooling system further includes a condensation heat dissipation device, which includes: a heat exchange module; and a water-cooled pipe, one end of which is connected to the housing and located in the second accommodating portion, and the other end of which is connected to the heat exchange module.

14. A guiding assembly adapted to guide a working fluid in a receiving portion of a housing, the guiding assembly comprising: a heat sink located in the receiving portion; a guiding housing connected to the heat sink, a channel forming between the guiding housing and the heat sink, the guiding housing having a guiding port and a communicating port on opposite sides; wherein, The guide housing includes a plate body, an assembly frame and two side frames, with the two sides of the assembly frame respectively connected to the two side frames, and the guide port located on the assembly frame; and a guide tube, one end of which is connected to the guide port to communicate with the channel, and the other end protruding from the guide housing; wherein, the channel includes a compression section and an expansion section, the expansion section being located between the compression section and the guide port; the width of the compression section is smaller than the width of the guide port, and the width of the expansion section gradually increases from the compression section toward the guide port.

15. The guidance component as described in claim 14, wherein, The plate body is an arc-shaped plate, with one concave surface facing the channel.

16. The guidance component as described in claim 14, wherein, The assembly frame has a first guide surface and a second guide surface, which extend from the guide opening to the two side frames respectively.

17. The guidance component as described in claim 14, wherein, The guide housing has a connection recess that is located within the channel.

18. A server, comprising: a housing having an opening and at least one mounting hole, the opening and the at least one mounting hole being located on opposite sides of the housing; and at least one guide assembly, each of the at least one guide assembly comprising: A heat sink; A guide housing is connected to the heat sink, and a channel is formed between the guide housing and the heat sink. The guide housing has a guide port and a communication port on its two opposite sides. The device includes a guide tube, one end of which is connected to the guide port to communicate with the channel, and the other end protruding from the guide housing; and a circuit board, which is fixed inside the housing and connected to the heat sink; wherein the channel includes a compression section and an expansion section, the expansion section being located between the compression section and the guide port; the width of the compression section is smaller than the width of the guide port, and the width of the expansion section gradually increases from the compression section toward the guide port.

19. The server as described in claim 18, wherein, The heat sink includes an evaporator plate and a frame, the evaporator plate being connected to the frame and the guide housing being connected to the frame.

20. The server as described in claim 18, wherein, The guide housing includes a plate body, an assembly frame and two side frames, with the two sides of the assembly frame respectively connected to the two side frames, and the guide port located on the assembly frame.

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