Substrate inspection system and substrate inspection method

Abstract

This invention proposes a substrate inspection system, comprising: an image acquisition device for acquiring an image of a substrate; a storage element for storing multiple modules; and a processor coupled to the image acquisition device and the storage element for accessing and executing the modules stored in the storage element. The modules include: an image processing module for processing the image to obtain at least one hole contour image; and a drilling analysis module for: calculating the roundness and eccentricity of the at least one hole contour image; filtering the at least one hole contour image based on the roundness and eccentricity to obtain a filtering result; and obtaining drilling coordinate information of the substrate based on the filtering result.

Claims

1. A substrate inspection system, comprising: An image acquisition device for acquiring an image of a substrate; A storage element for storing multiple modules; The system also includes a processor coupled to the image acquisition device and the storage element for accessing and executing modules stored in the storage element, the modules including: an image processing module for performing image processing on the image to obtain at least one hole contour image; and a drilling analysis module for: calculating a roundness and an eccentricity of the at least one hole contour image; filtering the at least one hole contour image based on the roundness and the eccentricity to obtain a filtering result, wherein filtering the at least one hole contour image based on the roundness and the eccentricity includes: determining a first absolute difference between the roundness corresponding to each of the at least one hole contour image and a first threshold; filtering the at least one hole contour image based on the first absolute difference; and obtaining drilling coordinate information of the substrate based on the filtering result, wherein when the filtering result corresponds to at least one drilling image in the image, the first absolute difference corresponding to the at least one drilling image is less than or equal to 0.

01.

2. The substrate inspection system as claimed in claim 1, wherein the image processing module is further configured to: perform a noise reduction process on the image to obtain a noise-reduced image; perform a contrast enhancement process on the noise-reduced image to obtain a contrast-enhanced image; and perform an image binarization process on the contrast-enhanced image to obtain the at least one hole contour image.

3. The substrate inspection system as claimed in claim 1, wherein screening the at least one aperture contour image based on the roundness and the eccentricity includes: Determine the second absolute difference between the eccentricity corresponding to each of the at least one aperture contour images and a second threshold. And the at least one borehole profile image is filtered according to the second absolute difference to obtain the filtering result, wherein when the filtering result corresponds to at least one borehole image in the image, the second absolute difference corresponding to the at least one borehole image is less than or equal to 0.

01.

4. The substrate detection system as claimed in claim 1, wherein the first threshold is 1.

5. The substrate inspection system as claimed in claim 3, wherein the second threshold is 0.

6. The substrate inspection system as claimed in claim 1, wherein when the screening result corresponds to at least one drill image in the image, the drill analysis module is further configured to: determine a drill skew information of the first drill image based on a major and minor axis information of the first drill image in the at least one drill image.

7. The substrate inspection system of claim 1, wherein when the screening result corresponds to at least one drill image in the image, the drill analysis module is further configured to: obtain a pad (PAD) image corresponding to a first drill image in the at least one drill image; calculate a center distance between the first drill image and the corresponding pad image; and determine a drill offset information of the first drill image based on the center distance.

8. The substrate inspection system of claim 1, wherein when the screening result corresponds to the at least one drill image in the image, obtaining the drill coordinate information of the substrate based on the screening result includes: A center coordinate of the first borehole image is calculated based on the intensity value of each pixel in the first borehole image of the at least one borehole image.

9. A substrate testing method, comprising: An image of a substrate is obtained; an image processing step is performed on the image to obtain at least one hole contour image; a roundness and an eccentricity of the at least one hole contour image are calculated respectively; the at least one hole contour image is filtered according to the roundness and the eccentricity to obtain a filtering result, wherein filtering the at least one hole contour image according to the roundness and the eccentricity includes: determining a first absolute difference between the roundness corresponding to each of the at least one hole contour images and a first threshold; filtering the at least one hole contour image according to the first absolute difference; and obtaining drilling coordinate information of the substrate according to the filtering result, wherein when the filtering result corresponds to at least one drilling image in the image, the first absolute difference corresponding to the at least one drilling image is less than or equal to 0.

01.

10. The substrate inspection method as described in claim 9, further comprising: The image is subjected to a noise reduction process to obtain a noise-reduced image; the noise-reduced image is subjected to a contrast enhancement process to obtain a contrast-enhanced image; and the contrast-enhanced image is subjected to an image binarization process to obtain the at least one aperture contour image.

11. The substrate inspection method as claimed in claim 9, wherein screening the at least one aperture contour image based on the roundness and the eccentricity includes: Determine the second absolute difference between the eccentricity corresponding to each of the at least one aperture contour images and a second threshold. And the at least one borehole profile image is filtered according to the second absolute difference to obtain the filtering result, wherein when the filtering result corresponds to at least one borehole image in the image, the second absolute difference corresponding to the at least one borehole image is less than or equal to 0.

01.

12. The substrate detection method as claimed in claim 9, wherein the first threshold is 1.

13. The substrate detection method as claimed in claim 11, wherein the second threshold is 0.

14. The substrate inspection method as described in claim 9 further includes: When the filtering result corresponds to at least one borehole image in the image, a borehole skew information of the first borehole image is determined based on the major and minor axis information of the first borehole image in the at least one borehole image.

15. The substrate inspection method as described in claim 9, further comprising: When the filtering result corresponds to at least one borehole image in the image, obtain a pad (PAD) image corresponding to the first borehole image in the at least one borehole image; calculate a center distance between the first borehole image and the corresponding pad image; and determine a borehole offset information of the first borehole image based on the center distance.

16. The substrate inspection method as described in claim 9 further includes: When the filtering result corresponds to at least one borehole image in the image, a center coordinate of the first borehole image is calculated based on the intensity value of each pixel in the first borehole image of the at least one borehole image.

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