Double-sided die pressed packaging structure and method manufacturing the same

Abstract

This invention discloses a double-sided die-molded package structure and its manufacturing method. The double-sided die-molded package structure includes a conductive substrate, two wafer elements, a molding layer, and two patterned metal layers. The conductive substrate includes a first surface and a second surface opposite to each other. The two wafer elements are respectively disposed on the first surface and the second surface of the conductive substrate, forming electrical and thermal conductivity with the conductive substrate. The molding layer covers the two wafer elements, and the two patterned metal layers are formed on the molding layer. One patterned metal layer forms electrical and thermal conductivity with one of the wafer elements, and the other patterned metal layer forms electrical and thermal conductivity with the other wafer element.

Claims

1. A double-sided molding packaging structure, comprising: A conductive substrate includes a first surface and a second surface that are opposite to each other; Two chip elements are respectively disposed on the first surface and the second surface of the conductive substrate, and the two chip elements are electrically and thermally connected to the conductive substrate; a molding layer covers the two chip elements; and two patterned metal layers are formed on the molding layer; wherein one of the patterned metal layers is electrically and thermally connected to one of the chip elements, and the other patterned metal layer is electrically and thermally connected to the other chip element. The conductive substrate includes a substrate, a first conductive layer and a second conductive layer formed on two opposing surfaces of the substrate, and a plurality of first vias disposed between the first conductive layer and the second conductive layer; the molding layer is provided with a plurality of second vias, a portion of which extend from one of the wafer elements to one of the patterned metal layers, and another portion of which extend from another wafer element to another patterned metal layer; one of the first vias, one of the second vias and one of the second vias located on the other side correspond to each other and form a heat dissipation channel, the extension direction of which is substantially parallel to a thickness direction of the double-sided molding package structure.

2. The double-sided molding packaging structure as described in claim 1, wherein, One of the wafer elements is bonded to the first conductive layer, and the other wafer element is bonded to the second conductive layer.

3. The double-sided molding packaging structure as described in claim 2, wherein, One of the wafer elements is bonded to the first conductive layer via a solder layer, and the other wafer element is bonded to the second conductive layer via another solder layer.

4. The double-sided molding packaging structure as described in claim 2, wherein, One of the chip elements has a plurality of conductive regions exposed in the molding layer and in contact with one of the patterned metal layers, and the other chip element has a plurality of conductive regions exposed in the molding layer and in contact with another patterned metal layer.

5. The double-sided molding packaging structure as described in claim 4, wherein, A portion of the plurality of the second vias extends from one of the conductive regions of one of the wafer elements to one of the patterned metal layers, and another portion of the plurality of the second vias extends from another of the conductive regions of another wafer element to another patterned metal layer.

6. The double-sided molding packaging structure as described in claim 1, wherein, One of these patterned metal layers includes multiple metal electrodes spaced apart and having different polarities.

7. The double-sided molding packaging structure as described in claim 1, wherein, One patterned metal layer completely covers one outer surface of the molding layer, and another patterned metal layer partially covers another outer surface of the molding layer, with a plurality of recessed structures formed on the two patterned metal layers.

8. The double-sided molding packaging structure as described in claim 2, wherein, The material of the two patterned metal layers contains copper.

9. The double-sided molding packaging structure as described in claim 1, wherein, The patterned metal layer is further applied to the side surface of the molding layer.

10. The double-sided molding packaging structure as described in claim 1, wherein, The double-sided die-casting package structure further includes at least one insulating component, which is formed between the conductive substrate and the wafer element.

11. A method for manufacturing a double-sided molded packaging structure, comprising the following steps: Provide a conductive substrate; A wafer element is attached to a first surface of the conductive substrate, so that the wafer element and the conductive substrate are electrically and thermally connected; another wafer element is attached to a second surface of the conductive substrate opposite to the first surface, so that the other wafer element and the conductive substrate are electrically and thermally connected; a molding layer is formed to cover the two wafer elements; and two patterned metal layers are formed on the molding layer, wherein one patterned metal layer is electrically and thermally connected to one of the wafer elements, and the other patterned metal layer is electrically and thermally connected to the other wafer element. The conductive substrate includes a substrate, a first conductive layer and a second conductive layer formed on two opposing surfaces of the substrate, and a plurality of first vias disposed between the first conductive layer and the second conductive layer; the molding layer is provided with a plurality of second vias, a portion of which extend from one of the wafer elements to one of the patterned metal layers, and another portion of which extend from another wafer element to another patterned metal layer; one of the first vias, one of the second vias and one of the second vias located on the other side correspond to each other and form a heat dissipation channel, the extension direction of which is substantially parallel to a thickness direction of the double-sided molding package structure.

12. The method for manufacturing a double-sided molded packaging structure as described in claim 11, wherein, The process of attaching the wafer element to the first surface of the conductive substrate includes forming a solder layer on the first surface and then attaching the wafer element to the first surface through the solder layer.

13. The method for manufacturing a double-sided molded packaging structure as described in claim 11, wherein, The process of attaching another wafer element to the second surface of the conductive substrate includes forming another solder layer on the second surface and then attaching another wafer element to the second surface through another solder layer.

14. The method for manufacturing a double-sided molded packaging structure as described in claim 13, wherein, Prior to the process of attaching the wafer element to the first surface via the solder layer, the process further includes forming at least one insulating component on the first surface.

15. The method for manufacturing a double-sided molded packaging structure as described in claim 14, wherein, Prior to the process of attaching another wafer element to the second surface via another bonding layer, the process further includes forming at least one insulating component on the second surface.

16. A method for manufacturing a double-sided molded package structure as described in any one of claims 11 to 15, wherein, Following the process of forming two patterned metal layers on the molding layer, the process further includes cutting the double-sided die-cast package structure around the wafer elements.

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