Substrate processing apparatus

Abstract

The substrate processing apparatus of the present invention includes a first substrate processing unit and a conveying mechanism. The first substrate processing unit processes substrates one by one by immersing vertically oriented substrates in a first processing liquid. The conveying mechanism receives horizontally oriented substrates, changes the orientation of the substrates from horizontal to vertical, and moves the vertically oriented substrates into the first substrate processing unit. The first substrate processing unit includes a processing tank and a substrate placement mechanism. The processing tank has a capacity corresponding to one substrate. Only one vertically oriented substrate is placed in the processing tank, and the first processing liquid is stored therein. The substrate placement mechanism receives substrates from the conveying mechanism and places only one vertically oriented substrate in the first processing liquid.

Description

Technical Field

[0001] This invention relates to a substrate processing apparatus. Prior Technology

[0002] Patent Document 1 describes a substrate processing apparatus comprising a processing unit, a processing tank, and a conveying device. The processing unit processes one substrate. The processing tank can simultaneously hold multiple substrates. The processing tank stores a processing solution for impregnating and processing the substrates. The conveying device can simultaneously convey substrates that do not reach the capacity of the processing tank. The conveying device can receive substrates from the processing tank and the processing unit. Furthermore, the conveying device can deliver substrates to the processing tank and the processing unit. [Previous Technical Documents] [Patent Literature]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2008-218906 Summary of the Invention

[0004] [The problem the invention aims to solve] However, in the substrate processing apparatus described in Patent Document 1, since the processing tank processes multiple substrates at the same time, microparticles may be transferred between the substrates being processed in the processing tank.

[0005] One of the objectives of this invention is to provide a substrate processing apparatus that can prevent the transfer of microparticles between substrates during processing. [Technical means to solve the problem]

[0006] According to one embodiment of the present invention, a substrate processing apparatus includes a first substrate processing unit and a conveying mechanism. The first substrate processing unit processes substrates one by one by immersing vertically oriented substrates in a first processing liquid. The conveying mechanism receives horizontally oriented substrates, changes the orientation of the substrates from horizontal to vertical, and moves the vertically oriented substrates into the first substrate processing unit. The first substrate processing unit includes a processing tank and a substrate placement mechanism. The processing tank has a capacity corresponding to one substrate. Only one vertically oriented substrate is placed in the processing tank, and the first processing liquid is stored therein. The substrate placement mechanism receives the substrates from the conveying mechanism and places only one vertically oriented substrate in the first processing liquid.

[0007] According to one embodiment of the present invention, the first substrate processing unit preferably further includes a chamber and a drying unit. The chamber houses the processing tank. The drying unit is preferably located within the chamber, where the substrate lifted from the processing tank is dried.

[0008] According to one aspect of the present invention, the substrate processing apparatus preferably includes a plurality of the aforementioned first substrate processing units. The plurality of first substrate processing units are preferably arranged along a first direction substantially parallel to the horizontal direction. The conveying mechanism preferably moves the vertically positioned substrate into each of the plurality of first substrate processing units by moving along a conveying path extending along the first direction.

[0009] According to one aspect of the present invention, the substrate processing apparatus preferably further includes a plurality of second substrate processing units. The plurality of second substrate processing units are preferably arranged along the first direction. Each of the plurality of second substrate processing units preferably processes the substrate one by one by spraying a second processing liquid onto the rotating, horizontally positioned substrate. The conveying mechanism preferably moves the horizontally positioned substrate into each of the plurality of second substrate processing units by moving the conveying path. The plurality of first substrate processing units are preferably disposed on one side of the conveying path in the second direction. The plurality of second substrate processing units are preferably disposed on the other side of the conveying path in the second direction. The second direction is preferably substantially orthogonal to the first direction.

[0010] According to one embodiment of the present invention, the substrate processing apparatus is preferably further equipped with a control device. The control device preferably controls the conveying mechanism, the first substrate processing unit, and the second substrate processing unit. The control device preferably causes one or more of the first substrate processing units and one or more of the second substrate processing units to sequentially perform a plurality of processes in a predetermined order by causing the conveying mechanism to transport the substrate.

[0011] According to one embodiment of the present invention, the substrate processing apparatus preferably further includes a second substrate processing unit and a control device. The second substrate processing unit preferably processes the substrates one by one by spraying a second processing liquid onto the rotating, horizontally positioned substrates. The control device preferably controls the conveying mechanism. The control device preferably controls the conveying mechanism in a manner that the substrates for which a processing time exceeding a predetermined time is set are moved into the first substrate processing unit. The control device preferably controls the conveying mechanism in a manner that the substrates for which a processing time below the predetermined time is set are moved into the second substrate processing unit.

[0012] According to at least one state of the present invention, the transfer of microparticles between substrates during processing can be prevented. Simple Explanation of the Diagram

[0013] Figure 1 is a top view showing a substrate processing apparatus according to an embodiment of the present invention. Figure 2 is a schematic cross-sectional view of the first substrate processing unit of the substrate processing apparatus of this embodiment. Figure 3 is a side view showing the lifting section of the first substrate processing unit in this embodiment. Figure 4 is a diagram showing the processing liquid supply unit of the substrate processing apparatus of this embodiment. Figure 5 is a schematic cross-sectional view of the second substrate processing unit of the substrate processing apparatus of this embodiment. Figure 6A is a side view showing the substrate being held in a horizontal position by the conveying mechanism of the substrate processing apparatus of this embodiment. Figure 6B is a top view showing the conveying mechanism holding the substrate in a horizontal position. Figure 7A is a side view showing the substrate being held vertically by the conveying mechanism of the substrate processing apparatus of this embodiment. Figure 7B is a top view showing the conveying mechanism holding the substrate in a vertical position. Figure 8 shows the state in which the transfer mechanism of the substrate processing apparatus of this embodiment delivers the substrate to the first substrate processing unit. Figure 9 shows the state in which the transfer mechanism of the substrate processing apparatus of this embodiment hands the substrate over to the second substrate processing unit. Figure 10 is a diagram showing the front section (substrate loading) of an example of a substrate processing method of the substrate processing apparatus of this embodiment. Figure 11 is a diagram showing a middle section (immersion of the substrate) of one example of a substrate processing method of the substrate processing apparatus of this embodiment. Figure 12 is a diagram showing the latter part (substrate removal) of an example of a substrate processing method of the substrate processing apparatus of this embodiment. Figure 13 is a flowchart showing the front section of another example of the substrate processing method of the substrate processing apparatus of this embodiment. Figure 14 is a flowchart showing the latter part of another example of the substrate processing method of the substrate processing apparatus of this embodiment. Implementation

[0014] The embodiments of the present invention will now be described with reference to the accompanying drawings. In the drawings, the same or equivalent parts are given the same reference numerals without being described repeatedly. Furthermore, for ease of understanding, the X-axis, Y-axis, and Z-axis are appropriately illustrated in the drawings. The X-axis, Y-axis, and Z-axis are orthogonal to each other; the X-axis and Y-axis are parallel to the horizontal direction, and the Z-axis is parallel to the vertical direction. Additionally, the "top view" shows the object observed from vertically above.

[0015] First, the substrate processing apparatus 1000 will be described with reference to FIG1. ​​FIG1 is a top view showing an embodiment of the substrate processing apparatus 1000 of the present invention. The substrate processing apparatus 1000 shown in FIG1 processes the substrate W by means of a processing liquid.

[0016] The substrate W may be, for example, a semiconductor wafer, a substrate for a liquid crystal display device, a substrate for a plasma display, a substrate for a field emission display (FED), a substrate for an optical disc, a substrate for a magnetic disk, a substrate for a magneto-optical disk, a substrate for a photomask, a ceramic substrate, or a substrate for a solar cell. The semiconductor wafer may have patterns for forming three-dimensional flash memory (e.g., three-dimensional NAND flash memory). In the following description, as an example, the substrate W is a semiconductor wafer.

[0017] The treatment solution is either a pharmaceutical solution or a cleaning solution. The pharmaceutical solution includes the pharmaceutical solution diluted with a diluent. The diluent is the same as the cleaning solution.

[0018] The solution may be an etching solution. Other solutions may include, for example, dilute hydrofluoric acid (DHF), hydrofluoric acid (HF), fluoronitric acid (a mixture of hydrofluoric acid and nitric acid (HNO3)), buffered hydrofluoric acid (BHF), ammonium fluoride, HFEG (a mixture of hydrofluoric acid and ethylene glycol), phosphoric acid (H3PO4), sulfuric acid, acetic acid, nitric acid, hydrochloric acid, ammonia, hydrogen peroxide solution, organic acids (e.g., citric acid, oxalic acid), organic bases (e.g., TMAH: tetramethylammonium hydroxide), sulfuric acid-hydrogen peroxide solution mixture (SPM), ammonia-hydrogen peroxide solution mixture (SC1), hydrochloric acid-hydrogen peroxide solution mixture (SC2), isopropanol (IPA), surfactants, corrosion inhibitors, or hydrophobic agents.

[0019] The cleaning solution may be, for example, deionized water, carbonated water, electrolyzed water, hydrogen water, ozone water, or hydrochloric acid diluted to a concentration of approximately 10 ppm to 100 ppm. The cleaning solution is used to rinse the substrate W of the cleaning solution, byproducts of the cleaning solution, and / or foreign matter. The rinsing process involves rinsing the substrate W of the cleaning solution, byproducts of the cleaning solution, and / or foreign matter.

[0020] The substrate processing apparatus 1000 includes a transfer unit 1, a processing unit 2, a substrate placement unit 3, and a control device 4.

[0021] The transfer unit 1 includes a conveying unit 11, a transfer robot 12, a plurality of containers 13 and a plurality of container placement platforms 14.

[0022] The processing unit 2 includes at least one first substrate processing unit 100n and a conveying mechanism 400. In the example of FIG1, the processing unit 2 includes a plurality of first substrate processing units 100n. In this specification, "n" included in the reference numerals indicates an integer of 1 or more. In the example of FIG1, n = 1 to 12. The plurality of first substrate processing units 100n are arranged along a first direction D1. The first direction D1 is substantially parallel to the horizontal direction.

[0023] Furthermore, the processing unit 2 preferably includes at least one second substrate processing unit 200k. In the example of FIG1, the processing unit 2 includes a plurality of second substrate processing units 200k. In this specification, the "k" included in the reference numerals indicates an integer of 1 or more. In the example of FIG1, k=1 to 4. The plurality of second substrate processing units 200k are arranged along the first direction D1.

[0024] Processing unit 2 has a transport path 300. A plurality of first substrate processing units 100n are disposed on one side of the transport path 300 in a second direction D2. A plurality of second substrate processing units 200k are disposed on the other side of the transport path 300 in the second direction D2. The second direction D2 is substantially orthogonal to the first direction D1. The second direction D2 is substantially parallel to the horizontal direction.

[0025] In the transfer unit 1, the container platform 14 is connected to the conveying unit 11. The container 13 is placed on the container platform 14. The container 13 holds a plurality of substrates W in a horizontal position.

[0026] In this specification, the horizontal orientation of substrate W indicates that substrate W is approximately parallel to the horizontal direction. However, the horizontal orientation of substrate W may also mean that substrate W is not strictly horizontal to the horizontal direction.

[0027] A transfer robot 12 is provided in the transfer section 11. The transfer robot 12 transfers the horizontally oriented substrate W from the container 13 to the substrate placement section 3. Also, the transfer robot 12 transfers the horizontally oriented substrate W from the substrate placement section 3 to the container 13.

[0028] The substrate mounting section 3 includes a mounting stage for mounting the substrate W in a horizontal position. The substrate mounting section 3 is disposed between the transfer section 11 and the transfer path 300. The substrate mounting section 3 is provided for transferring the substrate W between the transfer robot 12 and the transfer mechanism 400.

[0029] In processing unit 2, the first substrate processing unit 100n processes substrates W one by one by immersing vertically oriented substrates W in a first processing liquid. The first processing liquid is one example of the aforementioned processing liquid. Each of the plurality of first substrate processing units 100n includes a first chamber CH1n, a processing tank 103, and a substrate placement mechanism 141. The substrate placement mechanism 141 includes a substrate holding part 143, a support part 149, and a lifting part 155. These details will be described later.

[0030] The first chamber CH1n corresponds to one example of the "chamber" in this invention.

[0031] In this specification, the vertical orientation of substrate W indicates that substrate W is approximately parallel to the vertical direction. The vertical orientation of substrate W may also mean that substrate W is not strictly horizontal to the vertical direction.

[0032] Furthermore, the second substrate processing unit 200k processes substrate W one by one by spraying a second processing liquid onto the rotating, horizontally positioned substrate W. Each of the plurality of second substrate processing units 200k includes a second chamber CH2k. The second processing liquid is one example of the aforementioned processing liquid.

[0033] The transport path 300 is disposed between a region where a plurality of first substrate processing units 100n are disposed and a region where a plurality of second substrate processing units 200k are disposed. A transport mechanism 400 is disposed on the transport path 300. The transport path 300 extends along a first direction D1.

[0034] The conveying mechanism 400 receives the horizontally positioned substrate W from the substrate placement unit 3, changes the orientation of the substrate W from horizontal to vertical, and moves the vertically positioned substrate W into the first substrate processing unit 100n.

[0035] The conveying mechanism 400 takes out the vertically positioned substrate W from the first substrate processing unit 100n, changes the orientation of the substrate W from vertical to horizontal, and conveys the horizontally positioned substrate W to the substrate placement unit 3.

[0036] The conveying mechanism 400 receives the horizontally oriented substrate W from the substrate placement unit 3 and moves the horizontally oriented substrate W into the second substrate processing unit 200k.

[0037] The conveying mechanism 400 takes out the horizontally positioned substrate W from the second substrate processing unit 200k and conveys the horizontally positioned substrate W to the substrate placement unit 3.

[0038] The conveying mechanism 400 takes out the vertically positioned substrate W from the first substrate processing unit 100n, changes the orientation of the substrate W from vertical to horizontal, and moves the horizontally positioned substrate W into the second substrate processing unit 200k.

[0039] The conveying mechanism 400 takes out the horizontally positioned substrate W from the second substrate processing unit 200k, changes the position of the substrate W from horizontal to vertical, and moves the vertically positioned substrate W into the first substrate processing unit 100n.

[0040] The conveying mechanism 400 moves along the first direction D1 on the conveying path 300. By moving along the conveying path 300, the conveying mechanism 400 conveys the substrate W, which is in a vertical position and is intended for processing in each of the plurality of first substrate processing sections 100n. Therefore, according to this embodiment, by moving from one first substrate processing section 100n to another first substrate processing section 100n along the first direction D1 on the conveying path 300, the conveying mechanism 400 can rapidly convey the substrate W from one first substrate processing section 100n to another. As a result, particle adhesion to the substrate W can be suppressed.

[0041] Furthermore, the conveying mechanism 400, by moving along the conveying path 300, transports the horizontally positioned substrate W, which is the processing target of the second substrate processing unit 200k, to each of the plurality of second substrate processing units 200k. Therefore, according to this embodiment, the conveying mechanism 400, by moving along the first direction D1 from one second substrate processing unit 200k to another via the conveying path 300, can rapidly transport the substrate W from one second substrate processing unit 200k to another. As a result, the adhesion of particles to the substrate W can be suppressed.

[0042] Furthermore, there are no special restrictions on the posture of the substrate W during transport on transport route 300.

[0043] The control device 4 controls the transfer robot 12, the first substrate processing unit 100n, the second substrate processing unit 200k, and the conveying mechanism 400. The control device 4 is, for example, a computer. Specifically, the control device 4 includes a processor such as a CPU (Central Processing Unit). Furthermore, the control device 4 includes a memory device. The memory device stores data and computer programs. The memory device includes a main memory device such as semiconductor memory, and auxiliary memory devices such as semiconductor memory and hard disk drives. The processor of the control device 4 executes the computer program stored in the memory device of the control device 4 to control the transfer robot 12, the first substrate processing unit 100n, the second substrate processing unit 200k, and the conveying mechanism 400.

[0044] As described above with reference to FIG1, according to this embodiment, a plurality of first substrate processing units 100n are disposed on one side of the second direction D2 of the transport path 300. A plurality of second substrate processing units 200k are disposed on the other side of the second direction D2 of the transport path 300. Therefore, the transport mechanism 400 disposed in the transport path 300 can quickly transport the substrate W from the first substrate processing unit 100n to the second substrate processing unit 200k. Similarly, the transport mechanism 400 can quickly transport the substrate W from the second substrate processing unit 200k to the first substrate processing unit 100n. Therefore, the adhesion of particles to the substrate W can be suppressed.

[0045] Next, referring to FIG2, details of the first substrate processing unit 100n will be described. FIG2 is a schematic cross-sectional view showing the first substrate processing unit 100n. As shown in FIG2, the first substrate processing unit 100n includes a first chamber CH1n, a processing tank 103, a processing liquid supply unit 105, a drain unit 125, and a substrate placement mechanism 141. The first substrate processing unit 100n preferably further includes a drying unit 115. Furthermore, the first substrate processing unit 100n may also include a pressure reducing unit 131. Furthermore, the substrate processing apparatus 1000 includes at least one processing liquid supply unit 5m. In the example of FIG2, the substrate processing apparatus 1000 includes a plurality of processing liquid supply units 5m. In this specification, "m" included in the reference numerals indicates an integer greater than or equal to 0. In the example of FIG2, m = 0, 1.

[0046] The processing fluid supply unit 105 includes at least one valve 107m, at least one nozzle 111, and piping 113. In the example of Figure 2, the processing fluid supply unit 105 includes a plurality of valves 107m and a plurality of nozzles 111.

[0047] The drying unit 115 includes valve 117, valve 119, at least one nozzle 121, and piping 123. In the example of Figure 2, the drying unit 115 includes a plurality of nozzles 121.

[0048] The drain section 125 includes a valve 127 and a pipe 129. The pressure reducing section 131 includes an exhaust section 133 and a pipe 135.

[0049] The substrate placement mechanism 141 includes a substrate holding portion 143, a support portion 149, and a lifting portion 155. The substrate holding portion 143 includes a base portion 147 and a plurality of holding members 145. The support portion 149 includes a first support portion 151 and a second support portion 153.

[0050] The first chamber CH1n houses the processing tank 103, the substrate holding part 143, and the nozzles 111 and 121. The first chamber CH1n has, for example, a generally box-shaped form. The first chamber CH1n includes a cover 101. The cover 101 is disposed at the upper opening 102 of the first chamber CH1n. The cover 101 is openable and closable.

[0051] Furthermore, the first chamber CH1n includes a sidewall 110 generally parallel to the vertical direction Dz and a gate 106. The sidewall 110 has an opening 108. The opening 108 extends along the vertical direction Dz. The opening 108 (opening edge) has a shape corresponding to the substrate W in a vertical orientation. The gate 106 closes or opens the opening 108 by moving along the vertical direction Dz. That is, the gate 106 closes or opens the opening 108. For example, the gate 106 is driven by a drive unit (not shown). The drive unit includes, for example, a ball screw mechanism and a motor. Alternatively, the gate 106 can also open or close the opening 108 by moving in the first direction D1 (FIG. 1).

[0052] Treatment tank 103 stores the first treatment solution LQ1m. When "m=0", the first treatment solution LQ10 is displayed as a cleaning solution. When "m>0", the first treatment solution LQ1m is displayed as a medicinal solution. In this case, different values ​​of m indicate different types of medicinal solutions. The first treatment solution LQ11 is a medicinal solution.

[0053] Specifically, the processing tank 103 has a capacity corresponding to one substrate W. Only one substrate W in a vertical orientation is disposed in the processing tank 103. Therefore, in the processing tank 103, only one substrate W is processed by the first processing liquid LQ1m. As a result, according to this embodiment, the "transfer of microparticles between the substrates W during processing," which occurs when processing multiple substrates W simultaneously, can be suppressed.

[0054] Furthermore, in this embodiment, the processing tank 103 has a capacity corresponding to one substrate W. Therefore, when the first processing solution LQ1m is a chemical solution, compared to the case where the processing tank has a large capacity corresponding to the processing of multiple substrates W, it is easier to reduce the dissolved oxygen concentration of the first processing solution LQ1m and maintain the first processing solution LQ1m at a low dissolved oxygen concentration. Therefore, even if the processing volume (e.g., etching volume) of the substrate W of the first processing solution LQ1m is increased, deviations in the processing volume can be suppressed.

[0055] The processing fluid supply unit 105 supplies a first processing fluid LQ1m to the processing tank 103. Specifically, in the processing fluid supply unit 105, a plurality of nozzles 111 are disposed inside the processing tank 103. The plurality of nozzles 111 are connected to a piping 113. A valve 107m is disposed on the piping 113. The piping 113 is connected to the processing fluid supply unit 5m via the valve 107m. The processing fluid supply unit 5m supplies the first processing fluid LQ1m. Therefore, when the valve 107m is opened, the first processing fluid LQ1m is supplied to the plurality of nozzles 111 via the piping 113. As a result, the plurality of nozzles 111 supply the first processing fluid LQ1m to the processing tank 103.

[0056] In this embodiment, when one of the plurality of valves 107m is opened, the other valves 107m are closed. Therefore, when valve 1070 is opened, valve 1071 is closed, and the first processing liquid LQ10 (cleaning liquid) from the processing liquid supply unit 50 is sprayed from nozzle 111 into the processing tank 103. On the other hand, when valve 1071 is opened, valve 1070 is closed, and the first processing liquid LQ11 (medicinal solution) from the processing liquid supply unit 51 is sprayed from nozzle 111 into the processing tank 103.

[0057] The drying unit 115 dries the substrate W, which has been lifted from the processing tank 103, within the first chamber CH1n by supplying fluid into the first chamber CH1n. The fluid can be a gas or a liquid. Specifically, in the drying unit 115, a plurality of nozzles 121 are disposed inside the first chamber CH1n and outside the processing tank 103. The plurality of nozzles 121 are connected to a piping 123. Valves 117 and 119 are disposed on the piping 123. The piping 123 is connected to an organic solvent supply source TKA via valve 117. Furthermore, the piping 123 is connected to an inert gas supply source TKB via valve 119.

[0058] Therefore, when valve 117 is opened and valve 119 is closed, the vapor of the organic solvent is supplied from the organic solvent supply source TKA via piping 123 to a plurality of nozzles 121. As a result, the plurality of nozzles 121 supply the vapor of the organic solvent into the first chamber CH1n. In this specification, the organic solvent is water-soluble and has a surface tension less than that of the cleaning fluid. For example, the organic solvent is a low-carbon monohydric alcohol, ethylene glycol, or a lower ketone. Low-carbon monohydric alcohols are, for example, methanol, ethanol, or IPA (isopropanol). In this embodiment, the organic solvent is IPA.

[0059] On the other hand, when valve 117 is closed and valve 119 is opened, inert gas is supplied from the inert gas supply source TKB via piping 123 to a plurality of nozzles 121. As a result, the plurality of nozzles 121 supply inert gas into the first chamber CH1n. In this specification, the inert gas is nitrogen or argon. In this embodiment, the inert gas is nitrogen.

[0060] As described above with reference to FIG2, according to this embodiment, when the substrate W is immersed in the processing tank 103 in a state containing the first processing liquid LQ11 (medicinal solution), the substrate W is processed by the first processing liquid LQ11. Furthermore, when the substrate W is immersed in the processing tank 103 in a state containing the first processing liquid LQ10 (cleaning solution), the substrate W is cleaned by the first processing liquid LQ10. Moreover, when the substrate W is lifted from the processing tank 103, the drying section 115 dries the substrate W.

[0061] Therefore, in this embodiment, in the first chamber CH1n of the processing tank 103 that houses only one substrate W, the substrate W can be processed not only by the first processing liquid LQ1m, but also dried. As a result, the conveying mechanism 400 can immediately transfer substrates W processed by the first substrate processing unit 100n into other first substrate processing units 100n or second substrate processing units 200k. Therefore, the throughput of substrate W can be increased.

[0062] Furthermore, if the first substrate processing unit 100n does not have a drying section 115, the substrate W needs to be dried outside the first substrate processing unit 100n, which may prevent the yield of substrate W from being increased. However, it is a preferred example for the first substrate processing unit 100n to have a drying section 115. In this invention, the first substrate processing unit 100n may also not have a drying section 115.

[0063] Next, referring to Figure 2, the drain section 125 discharges the first treatment liquid LQ1m from the treatment tank 103. Specifically, the pipe 129 of the drain section 125 is connected to the bottom of the treatment tank 103. A valve 127 is provided on the pipe 129. When the valve 127 is opened, the first treatment liquid LQ1m in the treatment tank 103 is discharged through the pipe 129.

[0064] The pressure reduction unit 131 reduces the pressure in the first chamber CH1n to below atmospheric pressure. Specifically, the exhaust unit 133 of the pressure reduction unit 131 is connected to the first chamber CH1n via a pipe 135. The exhaust unit 133 reduces the pressure in the first chamber CH1n to below atmospheric pressure by venting the gas inside the first chamber CH1n. The exhaust unit 133 may include, for example, an exhaust pump.

[0065] The substrate placement mechanism 141 lowers the substrate W, immersing it in the first processing liquid LQ1m within the processing tank 103. Specifically, the substrate placement mechanism 141 receives the vertically positioned substrate W from the conveying mechanism 400 (FIG. 1) and places only one vertically positioned substrate W in the first processing liquid LQ1m of the processing tank 103. Alternatively, the substrate placement mechanism 141 raises the substrate W, lifting it from the first processing liquid LQ1m within the processing tank 103.

[0066] That is, the substrate placement mechanism 141 raises or lowers only one substrate W between the position inside the tank and the position outside the tank. The position inside the tank indicates the position of the substrate holding part 143 disposed inside the processing tank 103. Therefore, when the processing tank 103 contains the first processing liquid LQ1m, the position inside the tank indicates the position of the substrate W immersed in the first processing liquid LQ1m in the processing tank 103.

[0067] On the other hand, the "outside-tank position" indicates the position where the substrate holding part 143 is disposed outside the processing tank 103. That is, the "outside-tank position" indicates the position where the substrate holding part 143 is disposed above the processing tank 103. Therefore, when the processing tank 103 contains the first processing liquid LQ1m, the "outside-tank position" indicates the position where the substrate W is located above the processing tank 103 and the substrate W does not contact the first processing liquid LQ1m.

[0068] More specifically, in the substrate placement mechanism 141, the substrate holding portion 143 holds only one substrate W in a vertical position. The substrate holding portion 143 includes a base portion 147 and a plurality of holding members 145. The plurality of holding members 145 are fixed to the base portion 147. The plurality of holding members 145 hold only one substrate W in a vertical position. For example, the plurality of holding members 145 are protrusions that protrude from the base portion 147 in a first direction D1 (FIG. 1). Furthermore, the plurality of holding members 145 are arranged with gaps along the periphery of the substrate W, supporting a portion of the periphery of the substrate W from below. In addition, the configuration of the substrate holding portion 143 is not particularly limited as long as it can hold only one substrate W in a vertical position.

[0069] Furthermore, the support portion 149 is connected to the substrate holding portion 143. The support portion 149 supports the substrate holding portion 143. In the support portion 149, the first support portion 151 extends along the vertical direction Dz. The first support portion 151 is, for example, a generally columnar or generally plate-shaped member. The lower end of the first support portion 151 is connected to the base portion 147. The second support portion 153 extends along the second direction D2. One end of the second support portion 153 along the second direction D2 is connected to the upper end of the first support portion 151. The other end of the second support portion 153 along the second direction D2 is connected to the lifting portion 155. The second support portion 153 is, for example, a generally columnar or generally plate-shaped member.

[0070] Furthermore, the lifting unit 155 raises or lowers the support unit 149, thereby raising or lowering the substrate holding unit 143 connected to the support unit 149. As a result, the substrate W held by the substrate holding unit 143 rises or falls. Specifically, the lifting unit 155 lowers the support unit 149, causing the substrate holding unit 143 to fall, immersing the substrate W in the first processing liquid LQ1m of the processing tank 103. As a result, the substrate W is positioned inside the tank. Alternatively, the lifting unit 155 raises the support unit 149, causing the substrate holding unit 143 to rise, lifting the substrate W from the first processing liquid LQ1m of the processing tank 103. As a result, the substrate W is positioned outside the tank.

[0071] Next, referring to FIG3, details of the lifting part 155 will be described. FIG3 is a side view of the lifting part 155. As shown in FIG3, the lifting part 155 includes a ball screw mechanism 157 and a plurality of fixing members 175. The plurality of fixing members 175 fix the support part 149 to the ball screw mechanism 157. Therefore, the ball screw mechanism 157 raises or lowers the substrate holding part 143 by raising or lowering the support part 149. Specifically, the plurality of fixing members 175 fix one end of the second direction D2 of the second support part 153 and the other end to the ball screw mechanism 157. In addition, it is sufficient that the support part 149 is fixed to the ball screw mechanism 157, and the fixing method is not particularly limited.

[0072] In detail, the ball screw mechanism 157 includes a base 159, a plurality of guide rails 161, a screw shaft 163, a motor 165, a first bearing 167, a second bearing 169, a nut 171, and a slide 173.

[0073] The rotating shaft of motor 165 is connected to screw shaft 163. Motor 165 rotates screw shaft 163. Screw shaft 163 extends in the vertical direction Dz. The lower end of screw shaft 163 is supported by first bearing 167. The upper end of screw shaft 163 is supported by second bearing 169. First bearing 167 and second bearing 169 are fixed to base 159. Screw shaft 163 is screwed into nut 171, passing through nut 171.

[0074] Nut 171 is fixed to slide member 173. Slide member 173 is slidably connected to a plurality of guide rails 161 along the vertical direction Dz. The plurality of guide rails 161 extend along the vertical direction Dz. The plurality of guide rails 161 are fixed to base 159.

[0075] A plurality of fixing members 175 are fixed to the slider 173. Furthermore, the support part 149 (specifically the second support part 153) is fixed to the slider 173 by means of the plurality of fixing members 175.

[0076] When the motor 165 rotates, the screw shaft 163 rotates, and the slider 173 rises or falls along the plurality of guide rails 161. As a result, the support portion 149 fixed to the slider 173 rises or falls. Therefore, the substrate holding portion 143 (Fig. 2) connected to the support portion 149 rises or falls.

[0077] Next, referring to FIG4, details of the processing fluid supply unit 51 (FIG. 2) will be described. FIG4 is a diagram showing the processing fluid supply unit 51. As shown in FIG4, the processing fluid supply unit 51 includes a processing fluid tank 181, a pump 183, a heater 185, a filter 187, a plurality of circulation valves 189, circulation piping 191, a drug supply section 193, and a diluent supply section 199.

[0078] The upstream end 191a of the circulation piping 191 is connected to the treatment fluid tank 181, and the downstream end 191b of the circulation piping 191 is connected to the treatment fluid tank 181.

[0079] The first treatment solution LQ11 (chemical solution) in the treatment solution tank 181 is circulated through the treatment solution tank 181 and the circulation pipe 191. The circulation pipe 191 supplies the first treatment solution LQ11 to a plurality of treatment tanks 103 in a common manner. The first treatment solution LQ11 flowing in the circulation pipe 191 is supplied to the treatment tanks 103 through the pipe 113, which is branched and connected to the circulation pipe 191.

[0080] Specifically, as an example, a specified number of processing tanks 103 constitute a processing tank group 104. In the example of FIG4, a processing tank group 104 is composed of 3 processing tanks 103. Since the substrate processing apparatus 1000 shown in FIG1 has 12 processing tanks 103, the substrate processing apparatus 1000 has 4 processing tank groups 104. Furthermore, the circulation piping 191 supplies the first processing liquid LQ11 to the 4 processing tank groups 104.

[0081] More specifically, the circulation piping 191 includes a common piping 192 extending downstream from the treatment fluid tank 181, and a plurality of individual piping 194 branching from the common piping 192. The plurality of individual piping 194 branch from the common piping 192 at branch points 196. The upstream end 191a of the common piping 192 is connected to the treatment fluid tank 181. The downstream end 191b of each individual piping 194 is connected to the treatment fluid tank 181.

[0082] A plurality of individual pipes 194 correspond to a plurality of processing tank groups 104. Figure 4 shows the entirety of one individual pipe 194 and a portion of the remaining three individual pipes 194. One individual pipe 194 supplies the first processing fluid LQ11 to each processing tank 103 of one processing tank group 104, and the remaining three individual pipes 194 supply the first processing fluid LQ11 to each processing tank 103 of the remaining three processing tank groups 104.

[0083] Each individual pipe 194 is equipped with a circulation valve 189. By opening the circulation valve 189, the first treatment fluid LQ11 circulates in the individual pipe 194. Furthermore, the first treatment fluid LQ11 is supplied to each treatment tank 103 of the treatment tank group 104 through a plurality of pipes 113 branching from the individual pipes 194.

[0084] Pump 183 delivers the first processed liquid LQ11 from the processed liquid tank 181 to the circulation piping 191. Heater 185 adjusts the temperature of the first processed liquid LQ11 in the processed liquid tank 181 by heating the first processed liquid LQ11 flowing in the circulation piping 191. Filter 187 captures particles contained in the first processed liquid LQ11 flowing in the circulation piping 191. Pump 183, heater 185, and filter 187 are arranged in this order from upstream to downstream in the circulation piping 191 (specifically, the common piping 192).

[0085] Furthermore, the drug supply unit 193 supplies drug solution to the treatment liquid tank 181. The drug supply unit 193 includes a valve 195 and a pipe 197. When the valve 195 is opened, drug solution is supplied to the treatment liquid tank 181 through the pipe 197. The diluent supply unit 199 supplies diluent to the treatment liquid tank 181. The diluent supply unit 199 includes a valve 201 and a pipe 203. When the valve 201 is opened, diluent is supplied to the treatment liquid tank 181 through the pipe 203. As an example, the drug solution is diluted with the diluent to form the first treatment liquid LQ11.

[0086] Next, referring to FIG5, details of the second substrate processing unit 200k will be described. FIG5 is a schematic cross-sectional view showing the second substrate processing unit 200k. As shown in FIG5, the second substrate processing unit 200k includes a second chamber CH2k, a spin chuck 213, a spin motor 215, at least one processing liquid supply unit Aq, a nozzle moving unit 219, and a plurality of protective members 221. In the example of FIG5, the second substrate processing unit 200k includes a plurality of processing liquid supply units Aq. In this specification, the reference numeral "q" indicates an integer greater than or equal to 0. In the example of FIG5, q = 0, 1.

[0087] The processing fluid supply unit A0 includes a nozzle 223, a valve 233, and a pipe 235. The processing fluid supply unit A1 includes a nozzle 217, a valve 227, and a pipe 229.

[0088] The second chamber CH2k has a generally box-like shape. The second chamber CH2k houses the spin chuck 213, the spin motor 215, the nozzles 217 and 223, the nozzle moving part 219, and a plurality of protective components 221. Additionally, valves 227 and 233 can also be housed in the second chamber CH2k.

[0089] A spin chuck 213 holds the substrate W. Specifically, a spin motor 215 rotates the spin chuck 213 about a rotation axis AX1. Therefore, the spin chuck 213 holds the substrate W horizontally while rotating it about the rotation axis AX1. Specifically, the spin chuck 213 includes a plurality of chuck members 216 and a spin base 214. The spin base 214 is generally circular and supports the plurality of chuck members 216 in a horizontal position. The plurality of chuck members 216 hold the substrate W in a horizontal position. Alternatively, the spin chuck 213 may also be a vacuum chuck or a Bernoulli chuck utilizing the Bernoulli effect, without particular limitation.

[0090] The processing liquid supply unit Aq supplies the second processing liquid LQ2q to the substrate W. When "q=0", the second processing liquid LQ20 is displayed as a cleaning solution. When "q>0", the second processing liquid LQ2q is displayed as a chemical solution. In this case, different values ​​of q indicate different types of chemical solutions. The second processing liquid LQ21 is a chemical solution.

[0091] Specifically, the processing liquid supply unit A1 supplies a second processing liquid LQ21 (medicinal solution) to the substrate W. Within the processing liquid supply unit A1, a nozzle 217 sprays the second processing liquid LQ21 onto the substrate W. A nozzle moving unit 219 raises or lowers the nozzle 217, or rotates the nozzle 217 horizontally about the rotation axis AX2. The nozzle moving unit 219, for example, includes a ball screw mechanism and a motor that applies driving force to the ball screw mechanism to raise or lower the nozzle 217. Similarly, the nozzle moving unit 219, for example, includes a motor to rotate the nozzle 217 horizontally.

[0092] In detail, piping 229 is connected to nozzle 217. A valve 227 is disposed on piping 229. Valve 227 opens and closes the flow path of piping 229, switching the supply of the second processing liquid LQ21 to nozzle 217 and stopping the supply. When valve 227 opens the flow path of piping 229, nozzle 217 sprays the second processing liquid LQ21 onto substrate W.

[0093] Furthermore, the processing liquid supply unit A0 supplies a second processing liquid LQ20 (cleaning liquid) to the substrate W. Within the processing liquid supply unit A0, nozzle 223 sprays the second processing liquid LQ20 onto the substrate W. Specifically, piping 235 is connected to nozzle 223. A valve 233 is disposed on piping 235. Valve 233 opens and closes the flow path of piping 235, switching the supply of the second processing liquid LQ20 to nozzle 223 and stopping the supply. When valve 233 opens the flow path of piping 235, nozzle 223 sprays the second processing liquid LQ20 onto the substrate W.

[0094] Each protective component 221 has a generally cylindrical shape. Each protective component 221 receives the second processing liquid LQ2q discharged from the substrate W.

[0095] In the embodiment described above with reference to Figures 1 to 5, it is preferable that, when a relatively long period of chemical treatment is required, the substrate W is treated by the treatment tank 103 of the first substrate processing unit 100n. Therefore, compared to the case where the substrate W is rotated while the chemical treatment is performed by the second substrate processing unit 200k, the consumption of chemical solution can be reduced. The reason for the reduction in chemical solution consumption is that, in the first substrate processing unit 100n, the substrate W is treated by storing the chemical solution (first treatment solution LQ1m) in the treatment tank 103, so the continued ejection of the chemical solution (second treatment solution LQ2q) as in the second substrate processing unit 200k is not required. The continued ejection of chemical solution means that the chemical solution is continuously ejected from the nozzle 217 of the second substrate processing unit 200k.

[0096] Furthermore, preferably, when performing a relatively short-duration chemical treatment or a fine chemical treatment, the substrate W is treated while the chemical solution (second treatment solution LQ2q) is ejected from the nozzle 217 by the second substrate processing unit 200k. This is because, for a relatively short-duration chemical treatment, the amount of chemical solution consumed is less. Also, in the second substrate processing unit 200k, since the substrate W is treated by the chemical solution ejected from the nozzle 217, the treatment of the substrate W by the chemical solution mixed with particulate matter can be suppressed. Therefore, since the influence of particulate matter can be minimized, it is suitable for fine treatment of the substrate W. Furthermore, the adjustable flow rate of the chemical solution ejected from the nozzle 217 is also a reason for its suitability for fine treatment of the substrate W.

[0097] Furthermore, in the first substrate processing section 100n, since substrates W are processed one by one, microparticles are not transferred between substrates W during processing. However, since multiple substrates W are processed one by one in the same processing tank 103, the possibility that previous microparticles remain in the solution (first processing solution LQ1m) of the processing tank 103 is not zero. However, even in this case, compared with the processing tank that processes multiple substrates W uniformly, the number of residual microparticles is significantly reduced. Therefore, in the first substrate processing section 100n of this embodiment, the influence of microparticles can be significantly reduced.

[0098] Preferably, the control device 4 (FIG. 1) controls the conveying mechanism 400 to move the substrate W, which has been processed for a predetermined time T, into the first substrate processing unit 100n. Furthermore, the control device 4 controls the first substrate processing unit 100n to process the moved-in substrate W using the first processing liquid LQ1m. As a result, the first substrate processing unit 100n processes the substrate W, which has been processed for a predetermined time T, using the first processing liquid LQ1m. Therefore, the consumption of the first processing liquid LQ1m can be reduced.

[0099] On the other hand, the control device 4 controls the conveying mechanism 400 to move the substrate W, which has undergone a processing time of less than a predetermined time T, into the second substrate processing unit 200k. Furthermore, the control device 4 controls the second substrate processing unit 200k to process the moved-in substrate W using a second processing liquid LQ2q. As a result, the second substrate processing unit 200k processes the substrate W, which has undergone a processing time of less than a predetermined time T, using the second processing liquid LQ2q. Therefore, the consumption of the second processing liquid LQ2q can be suppressed, and fine processing can be performed.

[0100] Furthermore, in this embodiment, the first substrate processing unit 100n and the second substrate processing unit 200k are configured to process substrates W one by one. Therefore, compared to a substrate processing apparatus having a processing tank that uniformly processes multiple substrates W, the first substrate processing unit 100n and the second substrate processing unit 200k can be miniaturized, and the consumption of chemical solutions can be reduced.

[0101] Furthermore, in the substrate processing apparatus 1000 of this embodiment, not only is there a second substrate processing unit 200k that processes the substrate W by spraying liquid from the nozzle 217, but there is also a first substrate processing unit 100n that processes the substrate W by storing liquid in the processing tank 103. Therefore, compared to the case where all substrate processing units of the substrate processing apparatus are composed of the second substrate processing unit 200k, the liquid spraying capacity of the liquid supply unit 5m and the liquid supply unit Aq can be reduced. As a result, the liquid supply unit 5m and the liquid supply unit Aq can be miniaturized. In addition, if all substrate processing units of the substrate processing apparatus are composed of the second substrate processing unit 200k, then, for example, when all the second substrate processing units 200k are used simultaneously, a relatively large liquid spraying capacity may be required for the liquid supply unit 5m and the liquid supply unit Aq.

[0102] Next, referring to Figures 6A, 6B, 7A, and 7B, the details of the conveying mechanism 400 will be described. Figure 6A is a side view showing the conveying mechanism 400 holding the substrate W in a horizontal position, and Figure 6B is a top view showing the conveying mechanism 400 holding the substrate W in a horizontal position. Figure 7A is a side view showing the conveying mechanism 400 holding the substrate W in a vertical position, and Figure 7B is a top view showing the conveying mechanism 400 holding the substrate W in a vertical position.

[0103] As shown in Figures 6A and 6B, the conveying mechanism 400 includes a hand 401, an arm 403, and a base 405. The hand 401 holds the base plate W. The arm 403 supports the hand 401. The arm 403 causes the hand 401 to rotate about a rotation axis AX3. The rotation axis AX3 is approximately parallel to the horizontal direction. The base 405 supports the arm 403. The base 405 causes the arm 403 to rotate about a rotation axis AX4. The rotation axis AX4 is approximately parallel to the vertical direction Dz. Therefore, when the arm 403 rotates about the rotation axis AX4, the hand 401 supported by the arm 403 rotates about the rotation axis AX4. In this case, the hand 401 rotates approximately horizontally. Furthermore, the base 405 causes the arm 403 to rise or fall along the vertical direction Dz. Therefore, when the arm 403 rises or falls, the hand 401 supported by the arm 403 rises or falls.

[0104] Furthermore, the arm 403 extends radially Da relative to the axis of rotation AX4. The arm 403 also extends and retracts radially Da. Therefore, the arm 403 can move the hand 401 outwards radially Da, or move the hand 401 inwards radially Da.

[0105] The radial direction Da is approximately orthogonal to the axis of rotation AX4 and can take any direction within 360 degrees.

[0106] In detail, the hand 401 includes a plurality of gripping members 407, a plurality of finger parts 409, a hand base part 411, and a connecting member 413. The arm part 403 includes an arm base part 419, a telescopic part 417, and a support part 415. The base part 405 includes a body part 421 and a shaft part 423.

[0107] In the hand portion 401, a connecting member 413 connects the hand base portion 411 to the arm portion 403. Specifically, the connecting member 413 connects the hand base portion 411 to the support portion 415. The hand base portion 411 is attached to a member that extends radially by a direction Db relative to the center line AX5 of the hand base portion 411. A plurality of finger portions 409 are arranged at equal intervals along a circumferential direction Dc relative to the center line AX5. The plurality of finger portions 409 extend radially by a direction Db from the hand base portion 411. The finger portions 409 are retractable radially by a direction Db. That is, the finger portions 409 can extend outward toward the radial direction Db or retract inward toward the radial direction Db. For example, the finger portions 409 are driven by a cylinder. The finger portions 409 are, for example, generally columnar members.

[0108] The gripping member 407 is fixed to the radially Db-front end of the finger portion 409. Therefore, a plurality of gripping members 407 are arranged at equal intervals along the circumferential direction Dc. When the plurality of fingers 409 extend outward in the radial direction Db, the plurality of gripping members 407 move outward in the radial direction Db. On the other hand, when the plurality of fingers 409 retract inward in the radial direction Db, the plurality of gripping members 407 move inward in the radial direction Db.

[0109] Therefore, when the hand 401 holds the substrate W, the plurality of holding members 407 are moved outward in the radial direction Db, and then the plurality of holding members 407 are moved inward in the radial direction Db, so that the periphery of the substrate W is held by the plurality of holding members 407.

[0110] In the arm portion 403, the support portion 415 is connected to the hand base portion 411 via the connecting member 413. Therefore, the support portion 415 supports the hand portion 401. The support portion 415 is mounted at the radially Da forward end of the telescopic portion 417. The telescopic portion 417 extends radially Da from the arm base portion 419. The telescopic portion 417 can extend and retract freely along the radially Da. That is, the telescopic portion 417 can extend outward toward the radially Da or retract inward toward the radially Da. For example, the telescopic portion 417 is driven by a cylinder.

[0111] The arm base portion 419 causes the telescopic portion 417 to rotate about the rotation axis AX3. As a result, the support portion 415 rotates about the rotation axis AX3, and the hand portion 401 rotates about the rotation axis AX3. The telescopic portion 417 is, for example, a generally columnar member. For example, the arm base portion 419 has a motor, by which the telescopic portion 417 rotates about the rotation axis AX3.

[0112] In the base portion 405, a shaft portion 423 extends from the body portion 421 in the vertical direction Dz. The shaft portion 423 is, for example, generally cylindrical. The shaft portion 423 is connected to the arm base portion 419. Specifically, the upper end of the shaft portion 423 is connected to the arm base portion 419. Therefore, the shaft portion 423 supports the arm base portion 419. The body portion 421 raises or lowers the shaft portion 423. As a result, the arm base portion 419 raises or lowers. Therefore, the telescopic portion 417 and the support portion 415 raise or lower, and the hand portion 401 raises or lowers. The body portion 421 includes, for example, a ball screw mechanism and a motor that applies driving force to the ball screw mechanism in order to raise and lower the shaft portion 423.

[0113] Furthermore, the main body 421 causes the shaft 423 to rotate about the rotation axis AX4. As a result, the arm base 419 rotates about the rotation axis AX4. Therefore, the telescopic part 417 and the support part 415 rotate about the rotation axis AX4, and the hand part 401 rotates about the rotation axis AX4. For example, the main body 421 has a motor, by which the shaft 423 rotates about the rotation axis AX4.

[0114] As shown in Figures 6A and 6B, the hand 401 holds the substrate W in a horizontal position. Specifically, the hand 401 holds the substrate W in a horizontal position with the substrate W facing downwards.

[0115] Furthermore, when the arm 403 causes the hand 401 holding the substrate W in a horizontal position to rotate approximately 90 degrees around the rotation axis AX3, as shown in Figures 7A and 7B, the hand 401 holds the substrate W in a vertical position.

[0116] Furthermore, when the arm 403 causes the hand 401, which holds the substrate W in a vertical position, to rotate approximately 90 degrees around the rotation axis AX3, as shown in Figures 6A and 6B, the hand 401 holds the substrate W in a horizontal position.

[0117] In this embodiment, "hand 401 holding substrate W" and "hand 401 keeping substrate W" are the same meanings. Alternatively, "arm 403" can also hold substrate W in a horizontal position with substrate W facing upward.

[0118] Next, referring to Figures 6A to 8, the transfer of substrate W from the transfer mechanism 400 to the first substrate processing unit 100n will be described. Figure 8 is a diagram showing the state in which the transfer mechanism 400 delivers substrate W to the first substrate processing unit 100n.

[0119] As shown in Figures 6A and 6B, the conveying mechanism 400 receives the substrate W in a horizontal position. Furthermore, as shown in Figures 7A and 7B, the conveying mechanism 400 changes the orientation of the substrate W from horizontal to vertical.

[0120] Furthermore, as shown in Figure 8, the conveying mechanism 400 moves the vertically positioned substrate W into the first substrate processing unit 100n. Specifically, firstly, the gate 106 opens the opening 108 of the first chamber CH1n. Next, the arm 403 extends radially outward. Then, the hand 401 holding the vertically positioned substrate W enters the first chamber CH1n through the opening 108. The hand 401 then hands the vertically positioned substrate W to the substrate holding part 143 waiting in the first chamber CH1n. The substrate holding part 143 holds the substrate W in a vertical position. Thus, the conveying mechanism 400 moves the vertically positioned substrate W into the first substrate processing unit 100n.

[0121] For example, when the hand 401 enters the first chamber CH1n, the conveying mechanism 400 moves the hand 401 from a position offset from the substrate holding portion 143 in the first direction D1 (FIG. 1) into the first chamber CH1n. Subsequently, the conveying mechanism 400 moves the hand 401 in the first direction D1 as it approaches the substrate holding portion 143, delivering the substrate W to the substrate holding portion 143. Through this action, when the hand 401 enters the first chamber CH1n, it is prevented from contacting the substrate holding portion 143 in the radial direction Da (second direction D2).

[0122] Additionally, the hand 401 moves in the first direction D1 (Figure 1) by moving the conveying mechanism 400.

[0123] Next, referring to FIG9, the transfer of substrate W from the transfer mechanism 400 to the second substrate processing unit 200k will be described. FIG9 is a diagram showing the state in which the transfer mechanism 400 delivers substrate W to the second substrate processing unit 200k. As shown in FIG9, the transfer mechanism 400 transfers the horizontally positioned substrate W into the second substrate processing unit 200k.

[0124] Specifically, firstly, a gate (not shown) opens an opening (not shown) in the side wall of the second chamber CH2k. Next, the arm 403 extends radially outward. Then, a hand 401 holding the horizontally positioned substrate W enters the second chamber CH2k through the opening (not shown). The hand 401 then hands the horizontally positioned substrate W to a waiting spin chuck 213 within the second chamber CH2k. The spin chuck 213 holds the substrate W in a horizontal position. Thus, the transport mechanism 400 moves the horizontally positioned substrate W into the second substrate processing unit 200k.

[0125] Next, referring to Figures 10-12, an example of a substrate processing method will be described, showing the steps from loading the substrate W into the first substrate processing unit 100n, processing it, to unloading the substrate W. Figures 10-12 are diagrams showing an example of a substrate processing method. Figure 10 shows the loading of the substrate W. Figure 11 shows the immersion of the substrate W. Figure 12 shows the unloading of the substrate W. The substrate processing method is performed by the substrate processing apparatus 1000. Specifically, the control device 4 performs the substrate processing method by controlling the first substrate processing unit 100n, the second substrate processing unit 200k, and the conveying mechanism 400. As shown in Figures 10-12, the substrate processing method includes steps S1 to S9. Steps S1 to S9 are performed by the same first substrate processing unit 100n (e.g., the first substrate processing unit 1001).

[0126] First, in process S1, the gate 106 opens the opening 108. Then, the arm 403 of the conveying mechanism 400 extends in the second direction D2, and through the opening 108, the hand 401 holding the substrate W in a vertical position enters the first chamber CH1n. As a result, the substrate W is moved in from the first substrate processing section 100n. In this case, the substrate placement mechanism 141 keeps the substrate holding section 143 in standby position within the processing tank 103. That is, the substrate holding section 143 remains in standby position within the tank. In process S1, as an example, the first processing liquid LQ11 is not stored in the processing tank 103.

[0127] Next, in process S2, the substrate placement mechanism 141 raises the substrate holding part 143 from the processing tank 103 to an off-tank position, so that the substrate holding part 143 receives the substrate W in a vertical position from the hand part 401. Also, the nozzle 111 supplies the first processing liquid LQ11 to the processing tank 103. The first processing liquid LQ11 is a chemical solution.

[0128] Next, in step S3, the arm 403 of the conveying mechanism 400 retracts in the second direction D2, and the hand 401 retracts from inside the first chamber CH1n to outside the first chamber CH1n through the opening 108. After the hand 401 retracts, the gate 106 closes the opening 108. In step S3, the first processing liquid LQ11 is stored in the processing tank 103. Furthermore, the substrate holding part 143, which receives the vertically oriented substrate W, stands ready at an external position above the processing tank 103.

[0129] Next, as shown in FIG11, in process S4, the substrate placement mechanism 141 immerses the substrate W in the first processing liquid LQ11 by lowering the substrate holding part 143 of the substrate W, which is held vertically, from the position outside the tank into the processing tank 103. As a result, the substrate W is processed by the first processing liquid LQ11. In this case, the substrate holding part 143 is positioned inside the tank.

[0130] Next, in step S5, the draining unit 125 and the nozzle 111 replace the first processing liquid LQ11 in the processing tank 103 with the first processing liquid LQ10. In this case, the draining unit 125 discharges the first processing liquid LQ11 out of the processing tank 103, and the nozzle 111 supplies the first processing liquid LQ10 into the processing tank 103. The first processing liquid LQ10 is a cleaning liquid. Therefore, the substrate W held by the substrate holding unit 143 is cleaned by the first processing liquid LQ10. After the substrate W is cleaned by the first processing liquid LQ10, the draining unit 125 discharges the first processing liquid LQ10 out of the processing tank 103.

[0131] Next, in step S6, the substrate placement mechanism 141 lifts the substrate W from the processing tank 103 by raising the substrate holding part 143, which holds the substrate W in a vertical position, from inside the tank to outside the tank. Meanwhile, the nozzle 121 supplies vapor of an organic solvent (e.g., IPA) with a surface tension lower than that of the first processing liquid LQ10 (cleaning liquid) into the first chamber CH1n containing the lifted substrate W. As a result, the first processing liquid LQ10 adhering to the substrate W is replaced by the organic solvent, suppressing the collapse of the structures constituting the pattern on the substrate W and promoting the drying of the substrate W. Thus, in step S6, the substrate W is dried in the first chamber CH1n. Also, in step S6, as an example, the processing tank 103 is empty.

[0132] Preferably, after supplying organic solvent vapor to the first chamber CH1n, nozzle 121 supplies inert gas to the first chamber CH1n. This further promotes the drying of the substrate W. More preferably, the substrate W is dried while the first chamber CH1n is under reduced pressure via the depressurization unit 131 (FIG. 2). This further promotes the drying of the substrate W. For example, while the first chamber CH1n is under reduced pressure, nozzle 121 supplies organic solvent vapor to the first chamber CH1n. Alternatively, for example, while the first chamber CH1n is under reduced pressure, nozzle 121 supplies inert gas to the first chamber CH1n.

[0133] Next, as shown in Figure 12, in process S7, the gate 106 opens the opening 108. In this case, the substrate holding part 143 holds the dried substrate W in a position outside the groove of the first chamber CH1n. At the same time, the arm 403 of the conveying mechanism 400 extends in the second direction D2 and the hand 401 enters the first chamber CH1n through the opening 108.

[0134] Next, in process S8, the hand part 401 receives the dried substrate W from the substrate holding part 143. Furthermore, the substrate placement mechanism 141 lowers the substrate holding part 143 from its position outside the tank into the processing tank 103. As a result, the substrate holding part 143 is positioned inside the tank.

[0135] Next, in process S9, the arm 403 of the conveying mechanism 400 retracts in the second direction D2, and through the opening 108, the hand 401 holding the dried, vertically positioned substrate W retracts from inside the first chamber CH1n to outside the first chamber CH1n. As a result, the substrate W is removed from the first substrate processing section 100n. After the hand 401 retracts, the gate 106 closes the opening 108. The substrate processing method then ends.

[0136] Next, referring to Figures 1, 2, 8, 9, 13, and 14, other examples of the substrate processing method of this embodiment will be described. The substrate processing method is performed by the substrate processing apparatus 1000. Specifically, the control device 4 performs the substrate processing method by controlling the first substrate processing unit 100n, the second substrate processing unit 200k, and the conveying mechanism 400.

[0137] In the substrate processing method described with reference to Figures 13 and 14, as an example, the first substrate processing unit 1001 (first chamber CH11) of the plurality of first substrate processing units 100n in Figure 1 is used. That is, n=1. As another example, the second substrate processing unit 2001 (second chamber CH21) and the second substrate processing unit 2002 (second chamber CH22) of the plurality of second substrate processing units 200k in Figure 1 are used. That is, k=1 and 2.

[0138] Figures 13 and 14 are flowcharts of other examples of display substrate processing methods. As shown in Figures 13 and 14, the substrate processing method includes steps S21 to S40.

[0139] First, as shown in Figures 9 and 13, in process S21, the conveying mechanism 400 moves a horizontally oriented substrate W into the second chamber CH21 (k=1 in Figure 9) of the second substrate processing unit 2001 (k=1 in Figure 9).

[0140] Next, in process S22, the spin motor 215 starts the rotation of the substrate W by rotating the spin chuck 213.

[0141] Next, in step S23, nozzle 217 sprays a second processing liquid LQ21 (q=1 in FIG. 5) onto substrate W. The second processing liquid LQ21 is a chemical solution. Therefore, substrate W is treated with the second processing liquid LQ21. The chemical solution is, for example, hydrofluoric acid. In this case, for example, the oxide film formed on substrate W is removed by hydrofluoric acid. After a first specified time, nozzle 217 stops spraying the second processing liquid LQ21.

[0142] Next, in process S24, nozzle 223 sprays the second processing liquid LQ20 (q=0 in Figure 5) onto substrate W. The second processing liquid LQ20 is a cleaning solution. Therefore, substrate W is cleaned by the second processing liquid LQ20. After a second specified time, nozzle 223 stops spraying the second processing liquid LQ20.

[0143] Next, in process S25, the substrate W is dried by rotating the spin chuck 213 using the spin motor 215.

[0144] Next, in process S26, the spin motor 215 stops the rotation of the substrate W by stopping the rotation of the spin chuck 213.

[0145] Next, in process S27, the conveying mechanism 400 removes a horizontally positioned substrate W from the second chamber CH21.

[0146] Next, as shown in Figures 8 and 13, in process S28, the transfer mechanism 400 changes the orientation of one substrate W from a horizontal orientation to a vertical orientation and moves the substrate W into the first chamber CH11 (n=1 in Figure 8) of the first substrate processing unit 1001 (n=1 in Figure 8). In this case, the hand part 401 of the transfer mechanism 400 hands the vertically oriented substrate W to the substrate holding part 143 of the first substrate processing unit 1001.

[0147] Next, in step S29, the substrate placement mechanism 141 lowers the substrate holding portion 143, which holds a substrate W in a vertical position, and immerses the substrate W in the first processing liquid LQ11 (m=1 in FIG. 8) of the processing tank 103. The first processing liquid LQ11 is a chemical solution. Therefore, the substrate W is processed by the first processing liquid LQ11. The chemical solution is, for example, phosphoric acid. In this case, for example, the nitride film formed on the substrate W is etched by phosphoric acid. In step S29, at a third specified time, the substrate W is processed in the processing tank 103 by the first processing liquid LQ11.

[0148] Next, in process S30, the drain section 125 (Fig. 2) discharges the first processing liquid LQ11 from the processing tank 103, and the nozzle 111 supplies the first processing liquid LQ10 (m=0 in Fig. 8) to the processing tank 103. As a result, the first processing liquid LQ11 is replaced by the first processing liquid LQ10. Furthermore, the processing tank 103 cleans the substrate W using the first processing liquid LQ10, which is the cleaning solution.

[0149] Next, in process S31, the substrate placement mechanism 141 lifts the substrate W from the processing tank 103 by raising the substrate holding part 143 that holds a substrate W in a vertical position.

[0150] Next, in process S32, the drying section 115 dries the substrate W in the first chamber CH11.

[0151] Next, in process S33, the conveying mechanism 400 removes a vertically positioned substrate W from the first chamber CH11.

[0152] Next, as shown in Figures 9 and 14, in process S34, the transfer mechanism 400 changes the orientation of one substrate W from a vertical orientation to a horizontal orientation and moves the substrate W into the second chamber CH22 (k=2 in Figure 9) of the second substrate processing unit 2002 (k=2 in Figure 9). In this case, the hand 401 of the transfer mechanism 400 hands the horizontally oriented substrate W to the spin chuck 213 of the second substrate processing unit 2002.

[0153] Next, in process S35, the spin motor 215 starts the rotation of the substrate W by rotating the spin chuck 213.

[0154] Next, in step S36, nozzle 217 sprays a second processing liquid LQ22 (q=2 in FIG. 5) onto substrate W. The second processing liquid LQ22 is a chemical solution. Therefore, substrate W is treated with the second processing liquid LQ22. The chemical solution is, for example, SC1. In this case, for example, organic matter adhering to substrate W is removed. After a fourth specified time, nozzle 217 stops spraying the second processing liquid LQ22.

[0155] Next, in process S37, nozzle 223 sprays the second processing liquid LQ20 (q=0 in Figure 5) onto substrate W. The second processing liquid LQ20 is a cleaning solution. Therefore, substrate W is cleaned by the second processing liquid LQ20. After a 5-specified time, nozzle 223 stops spraying the second processing liquid LQ20.

[0156] Next, in process S38, the substrate W is dried by rotating the spin chuck 213 using the spin motor 215.

[0157] Next, in process S39, the spin motor 215 stops the rotation of the substrate W by stopping the rotation of the spin chuck 213.

[0158] Next, in process S40, the conveying mechanism 400 removes a horizontally positioned substrate W from the second chamber CH22. The substrate processing method then concludes.

[0159] In the substrate processing method described above with reference to Figures 13 and 14, the processing time (third specified time) of the first processing liquid LQ11 (medicinal solution) in the first chamber CH11 is longer than the processing time (first specified time) of the second processing liquid LQ21 (medicinal solution) in the second chamber CH21, and longer than the processing time (fourth specified time) of the second processing liquid LQ22 (medicinal solution) in the second chamber CH22. Therefore, according to this embodiment, compared to the case where the same medicinal solution as the first processing liquid LQ11 (medicinal solution) is processed in the second chamber CH2k, the consumption of medicinal solution can be reduced. The reason is that in the processing tank 103 of the first chamber CH11, the medicinal solution is not continuously sprayed out, but the substrate W is processed by the medicinal solution stored in the processing tank 103.

[0160] The embodiments of the present invention (including variations) have been described above with reference to the drawings. However, the present invention is not limited to the above embodiments and can be implemented in various ways without departing from its spirit. Furthermore, the plurality of constituent elements disclosed in the above embodiments can be appropriately modified. For example, a constituent element from all the constituent elements shown in one embodiment can be added to the constituent elements of another embodiment, or several constituent elements from all the constituent elements shown in one embodiment can be deleted from another embodiment.

[0161] Furthermore, the drawings are presented in a schematic manner to facilitate understanding of the invention. The thickness, length, number, and spacing of each component shown in the drawings may differ from the actual components for ease of drawing creation. Also, the configuration of each component shown in the above embodiments is an example and is not particularly limited. Of course, various modifications can be made within the scope of the effects of the invention without substantially departing from them.

[0162] (1) In the substrate processing apparatus 1000 shown in FIG1, the control device 4 can also transport the substrate W by the conveying mechanism 400, and two or more different first substrate processing units 100n can execute multiple processes in a predetermined order in sequence.

[0163] Furthermore, in the substrate processing apparatus 1000, the control device 4 can also transport the substrate W by the conveying mechanism 400, and two or more different second substrate processing units 200k can sequentially execute multiple processes in a predetermined order.

[0164] Furthermore, in the substrate processing apparatus 1000, the control device 4 can also transport the substrate W by the conveying mechanism 400, and the plurality of processes in a predetermined order can be executed sequentially by one or more first substrate processing units 100n and one or more second substrate processing units 200k. In this case, by utilizing the characteristics of the first substrate processing unit 100n (e.g., effective for long-term processing) and the characteristics of the second substrate processing unit 200k (e.g., effective for short-term processing or fine processing), the plurality of processes can be optimally allocated to the first substrate processing unit 100n and the second substrate processing unit 200k.

[0165] (2) In Figure 1, the substrate processing apparatus 1000 may also have a plurality of conveying mechanisms 400.

[0166] This invention relates to a substrate processing apparatus, which is industrially applicable.

[0167] 1: Transmission Section 2: Processing Department 3:Substrate mounting part 4: Control device 5m: Processing fluid supply unit 11:Transportation Department 12: Transport Robot 13: Container 14: Container placement platform 50: Processing fluid supply unit 51: Processing fluid supply unit 100n: First substrate processing unit 101: Cover 102: Upper opening 103: Processing tank 104: Processing Tank Cluster 105: Processing Fluid Supply Department 106: Gate 107m: Valve 108: Opening 110: Sidewall 111: Nozzle 113:Piping 115: Drying Section 117: Valve 119: Valve 121: Nozzle 123:Piping 125: Drainage part 127: Valve 129:Piping 131: Decompression Section 133: Exhaust section 135:Piping 141: Substrate configuration mechanism 143: Substrate holding section 145: Retaining Components 147: Base section 149: Support Department 151: First Support Department 153: Second Support Department 155: Lifting Unit 157: Ball screw mechanism 159: Base 161: Guide rail 163: Screw shaft 165: Motor 167: Bearing No. 1 169: Second bearing 171: Nut 173: Slider 175: Fixed components 181: Processing fluid tank 183: Pump 185: Heater 187: Filter 189: Circulation valve 191: Circulation piping 191a: Upstream end 191b: Downstream end 192: Common piping 193: Medicine Supply Department 194: Individual piping 195: Valve 196: Branch position 197:Piping 199: Diluent Supply Department 200k: Second substrate processing unit 201: Valve 203:Piping 213: Spin chuck 214: Spin base 215: Spin Motor 216: Clamping plate component 217: Nozzle 219: Nozzle moving part 221: Protective components 223: Nozzle 227: Valve 229:Piping 233: Valve 235:Piping 300:Transportation Road 400: Moving and Transporting Company 401: Hands 403: Arm 405: Base section 407: Holding components 409: Finger part 411: Hand base 413: Connecting components 415: Support Department 417: Telescopic section 419: Arm base 421: Ontology Department 423: Shaft 1000: Substrate processing apparatus 1001: First substrate processing unit 1070: Valve 1071: Valve 2001: Second Substrate Processing Division 2002: Second Substrate Processing Division A0: Processing Fluid Supply Department A1: Processing Fluid Supply Department AX1: Axis of rotation AX2: Rotation axis AX3: Rotation axis AX4: Axis of rotation AX5: Centerline Aq: Processing Fluid Supply Department CH11: First chamber CH1n: First chamber CH21: Second chamber CH22: Second chamber CH2k: Second chamber D1: Direction 1 D2: Second Direction Da: Radial Db: Radial Dc: Zhou Xiang Dz: Vertical direction LQ10: First treatment solution LQ11: First treatment solution LQ1m: First treatment solution LQ20: Second treatment solution LQ21: Second treatment solution LQ22: Second treatment solution LQ2q: Second treatment solution S1~S9, S21~S40: Process T: Scheduled time TKA: Organic solvent supply source TKB: Inert gas supply source W: substrate

Claims

1. A substrate processing apparatus comprising: a first substrate processing unit that processes substrates one by one by immersing vertically oriented substrates in a first processing liquid; and a transfer mechanism that receives horizontally oriented substrates, changes the orientation of the substrates from horizontal to vertical, and transfers the vertically oriented substrates into the first substrate processing unit; wherein the first substrate processing unit comprises: a processing tank having a capacity corresponding to one substrate, for holding only one vertically oriented substrate, and storing the first processing liquid; and a substrate placement mechanism that receives the substrates from the transfer mechanism and places only one vertically oriented substrate in the first processing liquid.

2. The substrate processing apparatus of claim 1, wherein the first substrate processing unit further comprises: a chamber that houses the processing tank; and a drying unit that dries the substrate lifted from the processing tank within the chamber.

3. The substrate processing apparatus of claim 1 or 2, comprising: a plurality of the aforementioned first substrate processing units; and the plurality of first substrate processing units arranged in a first direction substantially parallel to the horizontal direction; the conveying mechanism moves the aforementioned vertically positioned substrate into each of the plurality of first substrate processing units by moving a conveying path extending in the aforementioned first direction.

4. The substrate processing apparatus of claim 3 further comprises: a plurality of second substrate processing units arranged along the first direction; each of the plurality of second substrate processing units processing the substrate one by one by spraying a second processing liquid onto the rotating horizontally oriented substrate; the conveying mechanism moving the horizontally oriented substrate into each of the plurality of second substrate processing units by means of movement of the conveying path; the plurality of first substrate processing units disposed on one side of the conveying path in the second direction; the plurality of second substrate processing units disposed on the other side of the conveying path in the second direction; the second direction being substantially orthogonal to the first direction.

5. The substrate processing apparatus of claim 4 further comprises: a control device that controls the conveying mechanism, the first substrate processing unit and the second substrate processing unit; and the control device causes one or more of the first substrate processing units and one or more of the second substrate processing units to perform a plurality of processes in a predetermined order by causing the conveying mechanism to convey the substrate.

6. The substrate processing apparatus of claim 1 or 2, wherein the substrate processing apparatus further comprises: a second substrate processing unit that processes the substrates one by one by spraying a second processing liquid onto the substrates in the horizontally positioned rotating state; and a control device that controls the conveying mechanism; wherein the control device controls the conveying mechanism in such a way that the substrates having undergone a processing time exceeding a predetermined time are moved into the first substrate processing unit; and controls the conveying mechanism in such a way that the substrates having undergone a processing time less than the predetermined time are moved into the second substrate processing unit.

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