LED packaging module

Abstract

A light-emitting diode (LED) packaging module includes a redistributed circuit layer, multiple light-emitting units, and multiple lens units. The redistributed circuit layer has multiple exposed first electrical connection pads. The light-emitting units are located on the surface of the redistributed circuit layer. Each light-emitting unit has an LED, a P-type electrode, and an N-type electrode. The LED has a light-emitting surface and an electrode surface that are opposite to each other. The P-type electrode and the N-type electrode are located on the electrode surface and connected to the corresponding first electrical connection pads of the redistributed circuit layer. The lens units are correspondingly located above the light-emitting surfaces of the LEDs. By integrating the light-emitting units through the redistributed circuit layer, the effect of simultaneously transferring multiple LEDs is achieved.

Claims

1. A light-emitting diode (LED) packaging module, comprising: a redistribution layer having a plurality of exposed first electrical connection pads; a plurality of light-emitting units located on the surface of the redistribution layer, each light-emitting unit having an LED, a P-type electrode, and an N-type electrode, the LED having a light-emitting surface and an electrode surface opposite to each other, the P-type electrode and the N-type electrode being located on the electrode surface and connected to the corresponding first electrical connection pads of the redistribution layer; Multiple lens units are located above the light-emitting surfaces of the light-emitting diodes; and a carrier unit includes a transparent carrier plate and multiple sets of reflective units located within the transparent carrier plate and corresponding to each light-emitting unit. The transparent carrier plate has a top surface and a bottom surface that are opposite to each other. The light-emitting units are connected to the bottom surface of the transparent carrier plate via the light-emitting surface, and the lens units are connected to the top surface of the transparent carrier plate. Each reflective unit has two spaced reflective layers that extend from the top surface to the bottom surface of the transparent carrier plate and are located outside the corresponding light-emitting unit.

2. The light-emitting diode packaging module as described in claim 1, wherein, These lens units are selected from arc-shaped microlenses or cylindrical superlenses.

3. The light-emitting diode packaging module as described in claim 1, wherein, The carrier unit also includes a light-transmitting contact layer located on the bottom surface of the transparent carrier plate, through which the light-emitting units are connected to the transparent carrier plate.

4. The light-emitting diode packaging module as claimed in claim 1 further includes an insulating layer located between the transparent carrier and the redistribution layer, and covering the exposed surfaces of the light-emitting units.

5. The light-emitting diode packaging module as described in claim 1, wherein, The redistributed circuit layer also has a plurality of second electrical connection pads exposed on a surface opposite to the light-emitting units. The light-emitting diode package module also includes a plurality of first solder pads and a plurality of second solder pads connected to the second electrical connection pads. The first solder pads and the second solder pads are respectively electrically connected to the P-type electrodes and N-type electrodes via the redistributed circuit layer.

6. The light-emitting diode packaging module as described in claim 5, wherein, Each of the P-type electrodes and each of the N-type electrodes of the light-emitting units are respectively connected to a first solder pad and a second solder pad.

7. The light-emitting diode packaging module as described in claim 5, wherein, The light-emitting units are arranged in an array along a first direction and a second direction that intersect each other in a positive direction. The light-emitting units arranged along the first direction are either arranged in the same direction or in a mirror direction. The N-type electrodes of at least two of the light-emitting units arranged in the same direction or in a mirror direction are electrically connected to each other via the redistributed circuit layer and connected to the same second pad.

8. The light-emitting diode packaging module as described in claim 7, wherein, The N-type electrodes of each light-emitting unit are electrically connected to each other to form a common cathode structure.

9. The light-emitting diode packaging module as claimed in claim 5 further includes a substrate unit having an intermediate plate and multiple sets of electrical connection portions. The intermediate plate has a top surface and a bottom surface that are opposite to each other, and multiple through holes that pass through the bottom surface and the top surface and are arranged regularly. Each set of electrical connection portions corresponds to each through hole and has a connecting post located in the corresponding through hole, an electrical connection piece extending from the connecting post to the top surface, and a solder block located on the bottom surface of the intermediate plate and corresponding to the connecting post. The electrical connection pieces are spaced apart from each other and arranged in parallel, and are respectively connected to the corresponding second electrical connection pads of the redistribution circuit layer, thereby electrically connecting to the P-type electrode and the N-type electrode of the corresponding light-emitting unit.

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