Resin composition, cured material, structure, hardener, sealant, adhesive, semiconductor package and method for manufacturing semiconductor package

Abstract

A resin composition comprising an epoxy resin (A), an amine compound (B), and an inorganic filler (D), wherein the amine compound (B) comprises a compound represented by the following formula (1). (In formula (1), R1 represents an organic group or halogen atom with a carbon number of 1 to 20 and a valence of 1, a is an integer from 0 to 3, and b is an integer from 1 to 3.)

Claims

1. A resin composition comprising an epoxy resin (A), an amine compound (B), and an inorganic filler (D), wherein the epoxy resin (A) comprises a glycidylamine type epoxy resin (A1-1) and a bisphenol type epoxy resin (A1-2), wherein the bisphenol type epoxy resin (A1-2) satisfies the following formula (I): 0.05 ≤ (molecular weight of the aromatic ring in one molecule / molecular weight of one molecule) ≤ 0.4 … (I) wherein the amine compound (B) comprises a compound represented by the following formula (1): [Chemical 1] (in formula (1), R1 represents an organic group or halogen atom with a carbon number of 1 to 20 and a valence of one, a is an integer from 0 to 3, and b is an integer from 1 to 3).

2. The resin composition of claim 1, wherein the amine compound (B) comprises an amine compound (B1-1) with a value Ip* of 6.0 ≤ Ip* ≤ 9.7 as determined by formula (II) below, and an amine compound (B1-2) with a value Ip* of 9.7 < Ip* ≤ 11.0 as determined by formula (II) below: [Formula 1] (In formula (II), Ip is the value of the free potential before correction, Ip* is the value of the free potential after correction using the substituent constant; a is the number of substituents bonded to the ortho position as observed from the amino group; b is the number of substituents bonded to the meta position as observed from the amino group; c is the number of substituents bonded to the para position as observed from the amino group; Es (AMD) is the stereoparameter evaluated based on the acid hydrolysis reaction rate of ortho-substituted benzylamine; σm is the substituent constant in Hammett's substituent constant when bonded to the meta position; σp is the substituent constant in Hammett when it is bonded to the para position.

3. The resin composition of claim 2, wherein the amine compound (B1-1) is a compound represented by the following formula (2) or the following formula (3): [Chemical 2] (in formula (2), R2 and R3 independently represent a monovalent organic group or halogen atom with carbon number 1 to 20, c and d are independent integers from 0 to 4, and X represents a divalent organic group or single bond) [Chemical 3] (in formula (3), R4 represents a monovalent organic group or halogen atom with carbon number 1 to 20, and e is an integer from 1 to 4).

4. The resin composition of claim 2, comprising an amine adduct (C1-1), wherein the amine adduct (C1-1) is a reaction product of the amine compound (B1-1) and a compound having a functional group capable of reacting with the amine compound (B1-1).

5. The resin composition of claim 1, wherein the mass ratio of the glycidylamine type epoxy resin (A1-1) to the bisphenol type epoxy resin (A1-2) is (A1-1):(A1-2) = 50:50 to 95:

5.

6. The resin composition of claim 2, wherein the mass ratio of the amine compound (B1-1) to the amine compound (B1-2) is (B1-1):(B1-2) = 10:90 to 90:

10.

7. A cured compound, which is a cured compound of the resin composition as claimed in claim 1.

8. The resin composition of claim 1, wherein the cured resin composition satisfies the following formula (i) at the maximum peak intensity Ia in the region of 1,420 to 1,440 cm⁻¹ and the maximum peak intensity Ib in the region of 1,450 to 1,550 cm⁻¹ in the infrared (IR) absorption spectrum: 0.24 ≤ Ia / Ib ≤ 0.4 … (i).

9. A cured compound, which is a cured compound of the resin composition as claimed in claim 8.

10. A structure having a first layer, a second layer, and a plurality of copper pillars connecting the first layer and the second layer, wherein the first layer and the second layer each comprise at least one selected from the group consisting of resin, silicon, ceramic, compound semiconductor, and glass, wherein the distance between adjacent copper pillars in the plurality of copper pillars is 150 μm or less, and a third layer is provided between the first layer and the second layer, which is respectively connected to the first layer and the second layer, wherein the third layer is a hardened material as claimed in claim 9.

11. A sealing material comprising a hardened material as claimed in claim 7 or 9.

12. The sealing material in claim 11 is a semiconductor sealing material.

13. An adhesive comprising a resin composition as claimed in any one of claims 1 to 6 and 8.

14. A semiconductor package comprising a hardened material as claimed in claim 7 or 9.

15. A method for manufacturing a semiconductor package, comprising the step of manufacturing the semiconductor package using a resin composition as described in any one of claims 1 to 6 and 8.