Phosphorus-containing compound, method for preparing the same, cured product and manufacturing method of copper clad laminate

TWI943575BActive Publication Date: 2026-10-21NATIONAL CHUNG HSING UNIVERSITY
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Patent Information

Application Number
TW114127795
Authority / Receiving Office
TW · TW
Patent Type
Patents
Current Assignee / Owner
Filing Date
2025-07-22
Publication Date
2026-10-21
Estimated Expiration
2045-07-21

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    Figure TWG2TB001917312_003
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Abstract

This disclosure provides a phosphorus-containing compound having a structure as shown in Formula (I), where all symbols in Formula (I) are as defined in the specification. The method for preparing the phosphorus-containing compound of this disclosure includes performing a condensation reaction of an organophosphorus compound and an aromatic compound to obtain a condensation system, adding an organic solvent to the condensation system to perform a precipitation reaction to obtain a precursor, and performing a substitution reaction of the precursor with a substitution reactant to obtain the phosphorus-containing compound. This compound can be applied to the preparation of cured products and copper foil substrates. Consequently, the cured product of this disclosure exhibits good electrical properties and flame retardancy.
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Claims

1. A phosphorus-containing compound having one of the structures shown in formula (I): Formula (I); wherein, Y has one of the structures shown in formula (1) or formula (2): wherein X has one of the structures shown in formula (i), formula (ii), formula (iii) or formula (iv): wherein R1, R2, R3, R4, R5 and R6 are each independently a C1-C6 alkyl group, R7, R8 and R9 are each independently hydrogen, a C1-C6 alkyl group or a phenyl group, and R10 is a C1-C6 alkylene group.

2. A method for preparing a phosphorus-containing compound, comprising: reacting an organophosphorus compound and an aromatic compound in a condensation reaction to obtain a condensation system, wherein the organophosphorus compound has a structure as shown in formula (A) or formula (B), and the aromatic compound has a structure as shown in formula (C) or formula (D); adding an organic solvent to the condensation system to perform a precipitation reaction to obtain a precursor; and reacting the precursor with a substitution reactant to obtain a phosphorus-containing compound, wherein the substitution reactant has a structure as shown in formula (E), formula (F), formula (G), or formula (H), and the phosphorus-containing compound has a structure as shown in formula (I): Formula (I); wherein, Y has one of the structures shown in formula (1) or formula (2): wherein X has one of the structures shown in formula (i), formula (ii), formula (iii) or formula (iv): wherein R1, R2, R3, R4, R5 and R6 are each independently a C1-C6 alkyl group, R7, R8 and R9 are each independently hydrogen, a C1-C6 alkyl group or a phenyl group, and R10 is a C1-C6 alkylene group; wherein the organic solvent is ethanol or acetone.

3. The method for preparing the phosphorus-containing compound as claimed in claim 2, wherein the precursor has a phenolic group.

4. The method for preparing the phosphorus-containing compound as claimed in claim 2, wherein the precursor and the substitution reactant undergo a substitution reaction at a reaction temperature of 60°C to 95°C.

5. A cured product obtained by mixing a resin composition with a double bond initiator and then heating and curing, wherein the resin composition comprises a phosphorus-containing compound as described in claim 1 and a polyoxymethylene resin.

6. The cured product as claimed in claim 5, wherein the monophosphate content in the resin composition is from 0.5 wt% to 2.5 wt%.

7. The cured product as claimed in claim 5, wherein the double bond initiator is dicumyl peroxide, benzoyl peroxide, tert-butyl peroxide, di-tert-butyl peroxide, or a combination thereof.

8. The cured product as claimed in claim 5, wherein the double bond initiator is present in a weight percentage of 0.1 wt% to 1.5 wt% of the polyoxyethylene resin.

9. A method for preparing a copper foil substrate, comprising: mixing a phosphorus-containing compound as described in claim 1, a double bond initiator, and an impregnation solvent to form an impregnation solution, wherein the impregnation solvent is toluene or xylene; impregnating a plurality of fiberglass cloths in the impregnation solution to form a plurality of impregnated fiberglass cloths; flattening and drying the impregnated fiberglass cloths respectively to form a plurality of dry fiberglass cloths; stacking a stack of the dry fiberglass cloths to form a multilayer structure, wherein the stack number is 6 to 8; and covering a bottom surface and a top surface of the multilayer structure with two copper foils respectively, and hot-pressing them to form a copper foil substrate.

Citation Information

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