System and method for using liquid

Abstract

This invention provides a system and method for using liquid. The system includes a cavity, a temperature adjustment module and a pressure adjustment module disposed in the cavity, a convection generating device disposed in the cavity, and a liquid injection device connected to the outside of the cavity. The liquid injection device includes a first liquid carrying portion and at least one liquid metering device, through which the liquid in the first liquid carrying portion is injected into the cavity. The method is used in electronic component manufacturing processes and includes the following steps: (1) providing a system as described above; (2) injecting the liquid into the cavity by the liquid injection device; (3) using the temperature adjustment module and the pressure adjustment module to convert the liquid injected into the cavity into a gas at a specific temperature and a specific pressure; and (4) the gas contacting a reaction portion on at least one material surface in the cavity and reacting with the reaction portion. The convection generating device causes the gas to convect or diffuse and is uniformly distributed throughout the cavity and contacts the reaction portion on each of the at least one material surface.

Claims

1. A system using a liquid, configured to include: a cavity; a temperature regulating module disposed in the cavity; a pressure regulating module disposed in the cavity; at least one flow generating device disposed in the cavity; and a liquid injection device connected to the outside of the cavity, the device including at least one first liquid carrying portion disposed outside the cavity and at least one liquid metering device connected to the at least one first liquid carrying portion; wherein... The liquid in the at least one first liquid carrier is injected into the cavity by means of the at least one liquid metering device; wherein the liquid injected into the cavity is vaporized into a gas by means of the temperature adjustment module and the pressure adjustment module; wherein the gas is convected or diffused by means of the at least one convection generating device and is evenly distributed in the cavity.

2. The system using liquid as described in claim 1, wherein the at least one pair of flow generating devices includes a circulating fan.

3. The system for using liquid as described in claim 1, further comprising at least one nozzle connected to the at least one liquid meter, the at least one nozzle being disposed in the cavity.

4. A system using liquids as described in claim 1, wherein the at least one liquid metering device comprises at least one of a flow control valve, a metering pump, or a combination thereof.

5. The system using liquid as described in claim 1, further comprising at least one second liquid carrier disposed within the cavity, wherein the at least one second liquid carrier receives liquid from the at least one liquid meter.

6. A system using a liquid as described in claim 1, wherein the liquid or the gas acts as a redox agent.

7. A system using a liquid as described in claim 1, wherein the liquid comprises at least one of formic acid, water, or a combination thereof.

8. The system using liquid as described in claim 1, wherein the at least one pair of flow generating devices contacts the gas on at least one material surface having a reaction section within the cavity.

9. The system using a liquid as described in claim 8, wherein the reaction section comprises at least one or a combination of a section to be reduced, a section to be oxidized, a section to be cleaned, and a section to be dissolved.

10. A system using a liquid as described in claim 8, wherein the at least one substance comprises at least one inner wall of a cavity, at least one frame, at least one platform, at least one carrier plate, solder, soldering object, at least one electronic component, or a combination thereof.

11. The system using a liquid as described in claim 10, wherein if the liquid and / or the gas is corrosive, the inner wall of the at least one cavity and / or the surface of the at least one material has a material resistant to corrosion by the liquid or the gas.

12. A method of using a liquid in an electronic component manufacturing process, the method comprising the steps of: (1) providing a system for using a liquid as described in any one of claims 1 to 11; (2) injecting the liquid into a cavity by a liquid injection device; (3) controlling the liquid injected into the cavity to be converted into a gas at a temperature and a pressure by a temperature adjustment module and a pressure adjustment module; and (4) contacting a reaction portion on at least one surface of a material in the cavity and causing the reaction portion to undergo a reaction; wherein, The cavity is provided with at least one flow generating device, so that the gas is evenly distributed throughout the cavity and contacts the reaction part on the surface of each of the at least one material.

13. The method of using a liquid as described in claim 12, wherein step (2) further comprises a sub-step (2a): the liquid placed in at least one first liquid carrier is injected into the cavity in a controlled manner by at least one liquid meter, wherein the at least one first liquid carrier is disposed outside the cavity.

14. The method of using liquid as described in claim 13, wherein step (2) further comprises another sub-step (2b): injecting or placing a predetermined amount of the liquid into at least one second liquid carrier, wherein the at least one second liquid carrier is disposed in the cavity.

15. The method of using a liquid as described in claim 13 or 14, wherein the amount of liquid and / or the predetermined amount of liquid used is adjusted according to the volume of the cavity or the temperature and pressure in the cavity.

16. The method of using a liquid as described in claim 12, wherein in step (2), the liquid is injected into the cavity as a pure substance.

17. The method of using a liquid as described in claim 12, wherein in step (2), the liquid is injected into the cavity via at least one nozzle in a liquid or atomized form.

18. The method of using liquid as described in claim 12, wherein steps (2) to (4) are repeated as required by the process.

19. The method of using a liquid as described in claim 12, wherein the liquid comprises at least one of formic acid, water, or a combination thereof.

20. The method of using a liquid as described in claim 12, wherein the reaction section comprises at least one or a combination of a section to be reduced, a section to be oxidized, a section to be cleaned, and a section to be dissolved.

21. The method of using a liquid as described in claim 12, wherein the at least one substance comprises at least one inner wall of a cavity, at least one frame, at least one platform, at least one carrier, solder, soldering object, at least one of the electronic components, or a combination thereof.

22. The method of using a liquid as described in claim 12, wherein the electronic component process is a reflow soldering operation.

23. The method of using liquid as described in claim 22, wherein, depending on the reflow result, steps (2) to (4) are repeated at least once during the reflow operation.

24. The method of using a liquid as described in claim 12 or 22, wherein the reaction section is the section to be reduced and the reaction is a reduction reaction.

25. The method of using a liquid as described in claim 12 or 22, wherein the liquid and / or the gas is used as a redox agent.

26. The method of using a liquid as described in claim 25, wherein the redox agent is formic acid.

27. The method of using a liquid as described in claim 12, wherein the reaction section is the section to be dissolved and the reaction is dissolution.

28. The method of using a liquid as described in claim 12, wherein the reaction section is the section to be cleaned and the reaction is cleaning.

29. The method of using a liquid as described in claim 12, wherein the liquid and / or the gas is used as a cleaning agent.

30. The method of using a liquid as described in claim 29, wherein the cleaning agent is water.

31. A method for using a liquid in a reflow soldering operation, the method comprising the steps of: (A) providing a system for using a liquid as described in any one of claims 1 to 11; (B) placing at least one solder into a cavity and initiating a reflow soldering operation, wherein the reflow soldering operation further comprises the steps of: a. controlling the cavity to an activation temperature range by a temperature adjustment module, the activation temperature range causing a reduction reaction in a portion of the at least one solder to be reduced; b. controlling the cavity to sequentially heat to a reflow soldering temperature range where the solder melts and to cool after reflow by the temperature adjustment module. Temperature range; (C) Injecting the liquid into the cavity by a liquid injection device; (D) Controlling the cavity to a temperature and a pressure by the temperature adjustment module and a pressure adjustment module to convert the liquid injected into the cavity into a gas, through which the gas contacts the part to be reduced on the surface of at least one solder in the cavity, and when the cavity enters the activation temperature range, so that the gas performs the reduction reaction on the part to be reduced; and (E) The temperature adjustment module causes the cavity to sequentially re-enter the solder reflow temperature range and the cooling temperature range after reflow; wherein... The cavity is provided with at least one flow generating device, so that the gas is evenly distributed throughout the cavity and contacts the part to be reduced on each of the at least one solder surface.

32. The method of using a liquid in a reflow operation as described in claim 31, wherein the activation temperature range refers to the temperature range at which the active components in the flux are activated or / and the temperature range at which the gas causes the reduction reaction in the part to be reduced.

33. The method of using liquid in a reflow operation as described in claim 31, wherein the part to be reduced is a solder oxide layer formed before the reflow operation.

34. The method of using liquid in reflow operations as described in claim 31, wherein the reflow temperature range for which the solder melts refers to the temperature above which the solder transforms into a molten liquid state.

35. The method of using liquid in reflow operations as described in claim 31, wherein the cooling temperature range refers to the temperature below which the solder transforms into a molten liquid state.

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