Copolymer, method of manufacturing the same, resin composition and product of the same

Abstract

A copolymer comprising structural units derived from a phosphorus-containing compound of formula (1), structural units derived from diisopropylbenzene, and structural units derived from a vinylbenzyl indene resin. A method for preparing said copolymer. A resin composition comprising said copolymer and a crosslinking agent. An article made from said resin composition comprising a prepreg, a resin film, a laminate, or a printed circuit board. Formula (1)

Claims

1. A copolymer comprising: structural units derived from a phosphorus-containing compound of formula (1), structural units derived from diisopropylbenzene, and structural units derived from a vinylbenzyl indene resin, wherein, Based on a total weight of 100 parts by weight of the phosphorus-containing compound shown in Formula (1), diisopropenylbenzene, and the vinylbenzyl indene resin, the phosphorus-containing compound shown in Formula (1) is 15 to 25 parts by weight, the diisopropenylbenzene is 5 parts by weight, and the vinylbenzyl indene resin is 70 to 80 parts by weight.

2. The copolymer as described in claim 1, wherein, The vinylbenzyl indene resin contains structural units derived from vinylbenzyl chloride and structural units derived from indene, with a vinylbenzyl chloride:indene molar ratio of 1 to 2:

1.

3. The copolymer as described in claim 1, wherein, The vinylbenzylindene resin further contains structural units derived from 4,4'-bis(chloromethyl)biphenyl, with a molar ratio of vinylbenzyl chloride:indene:4,4'-bis(chloromethyl)biphenyl of 1 to 2:1:0.33 to 0.

56.

4. A copolymer comprising: a monomer unit of formula (1'), a monomer unit of formula (1''), or a combination thereof; a diisopropenylbenzene monomer unit of formula (2), a diisopropenylbenzene monomer unit of formula (2'), or a combination thereof; and a vinylbenzylindene monomer unit of formula (3), wherein, n1 is an integer greater than or equal to 0, n2 is an integer greater than or equal to 1, n3 is an integer greater than or equal to 0, and n1+n2+n3 is an integer from 1 to 3; and * represents the position of the bond between the individual units.

5. The copolymer as described in claim 4, wherein, The vinylbenzyl indene monomer unit shown in formula (3) includes the monomer unit shown in formula (3.1).

6. The copolymer as described in claim 4, wherein, The vinylbenzyl indene monomer unit shown in formula (3) includes the monomer unit shown in formula (3.2).

7. The copolymer as described in claim 1 or claim 4, wherein the adhesive solution made from the copolymer and solvent has a shelf life of 14 days or more.

8. The copolymer as described in any one of claims 1 to 6, wherein, The copolymer has a weight-average molecular weight between 1,000 and 15,000.

9. A method for preparing the copolymer as claimed in claim 1, comprising: dissolving a vinylbenzyl indene resin, a phosphorus-containing compound of formula (1) and diisopropylbenzene in a first solvent to obtain a first solution, and maintaining the temperature between 40°C and 70°C; dissolving a peroxide in a second solvent to obtain a second solution; and mixing the first solution and the second solution, and maintaining the temperature between 60°C and 120°C, and performing a free radical polymerization reaction for 1 hour to 6 hours to obtain the copolymer.

10. The preparation method as described in claim 9, wherein, The peroxide is present in a weight ratio of 1,250 ppm to 10,000 ppm relative to the total weight of vinylbenzyl indene resin, phosphorus-containing compound of formula (1), and diisopropylbenzene.

11. The preparation method as described in claim 9, wherein, The vinylbenzyl indene resin contains structural units derived from vinylbenzyl chloride and structural units derived from indene, with a vinylbenzyl chloride:indene molar ratio of 1 to 2:

1.

12. The preparation method as described in claim 11, wherein, The vinylbenzylindene resin further contains structural units derived from 4,4'-bis(chloromethyl)biphenyl, with a molar ratio of vinylbenzyl chloride:indene:4,4'-bis(chloromethyl)biphenyl of 1 to 2:1:0.33 to 0.

56.

13. A resin composition comprising: a copolymer as described in claim 1 or claim 4; and a crosslinking agent.

14. The resin composition as claimed in claim 13, wherein, The crosslinking agent contains polyphenylene ether, bismaleimide, polyolefin, divinyl diphenyl ethane, triallyl isocyanurate, or methacrylate.

15. The resin composition as claimed in claim 13 further comprises inorganic fillers, curing accelerators, polymerization inhibitors, flame retardants, colorants, toughening agents, core-shell rubbers, silane coupling agents, solvents, or combinations thereof.

16. An article made from the resin composition described in claims 13 to 15, comprising a prepreg, a resin film, a laminate, or a printed circuit board.

17. The article as described in claim 16 has at least one of the following characteristics: a dielectric loss of less than or equal to 0.0020 measured at a frequency of 10 GHz according to the method described in JIS C2565; a Z-axis thermal expansion coefficient of less than or equal to 1.0% measured according to the method described in IPC-TM-650 2.4.24.5; a copper foil tensile strength of greater than or equal to 1.9 lb / in measured according to the method described in IPC-TM-650 2.4.8; a flame retardancy rating of V-0 measured according to the method specified in UL94; and no board bursting after moisture absorption heat resistance test according to the methods described in IPC-TM-650 2.6.16.1 and IPC-TM-650 2.4.23.

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