Warpage measurement device and warpage measurement method

Abstract

This invention discloses a warpage measurement device and a warpage measurement method. The warpage measurement device includes an imaging platform, a light source module, and a detection module. The imaging platform includes a reference plane and a stage. The reference plane has an imaging area. The stage is configured to position a test object such that a test surface of the test object faces the reference plane, and a gap with a variable height is defined between the test surface and the reference plane. The light source module emits a detection light along an optical path. The detection light passes through the gap and forms a light and shadow profile corresponding to the test surface in the imaging area. The optical path forms an angle with respect to the reference plane. The detection module faces the imaging area to acquire a profile image of the light and shadow profile, and the detection module analyzes the profile image to output a detection result.

Claims

1. A warpage measurement device, comprising: an imaging platform including a reference plane and a stage, the reference plane having an imaging region, the stage being configured to position a test object such that a test surface of the test object faces the reference plane, and a gap having a variable height is defined between the test surface and the reference plane; a light source module disposed on one side of the imaging platform for emitting a detection light along an optical path, the detection light passing through the gap and forming a light and shadow profile corresponding to the test surface in the imaging region; wherein, The optical path forms an angle with respect to the reference plane; and a detection module is disposed on the side of the imaging platform away from the light source module, the detection module facing the imaging area to obtain a contour image of the light and shadow contour, and the detection module analyzes the contour image to issue a detection result.

2. The warpage measurement device as described in claim 1, wherein, The detection module calculates the actual height of the gap from one dimension of the contour image based on a predetermined angle of the included angle, and uses this as the detection result.

3. The warpage measurement device as described in claim 2, wherein, The detection module obtains the detection result based on the relationship: H=b*tan(θ); where H is the actual height, θ is the predetermined angle, and b is the width of the light and shadow of the contour image in the one dimension.

4. The warpage measurement device as described in claim 2, wherein, The predetermined angle is no greater than 45 degrees.

5. The warpage measurement device as claimed in claim 1, wherein, The light source module includes: a light-emitting element capable of emitting light; and a collimating lens disposed on one side of the light-emitting element, wherein the collimating lens converts the light into the detection light.

6. A warpage measurement method comprising the following steps: positioning a test object on an imaging platform, such that a test surface of the test object faces a reference plane of the imaging platform, and a gap with a variable height is formed between the test object and the reference plane; establishing an optical path, the optical path forming an angle with respect to the reference plane; emitting a detection light along the optical path, the detection light passing through the gap and forming a light and shadow profile corresponding to the test surface on an imaging area of ​​the reference plane; and acquiring a profile image of the light and shadow profile; analyzing the profile image to issue a detection result.

7. The warpage measurement method as described in claim 6, wherein, The method further includes the following steps in issuing the detection result: calculating an actual height of the gap from a dimension of the contour image based on a predetermined angle of the included angle to obtain the detection result.

8. The warpage measurement method as described in claim 7, wherein, The detection result is obtained by the formula: H=b*tan(θ); where H is the actual height, θ is the predetermined angle, and b is the width of the light and shadow of the contour image in the one dimension.

9. The warpage measurement method as described in claim 7, wherein, The predetermined angle is no greater than 45 degrees.

10. The warpage measurement method as described in claim 6, wherein, The method further includes the following steps during the emission of the detection light: emitting a light source using a light-emitting element; and converting the light source into the detection light using a collimating lens.

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