optical transceiver module

Abstract

An optical transceiver module includes a circuit board, a photonic integrated circuit, and a rib. The circuit board includes opposing first and second surfaces and a recess. The photonic integrated circuit is mounted on the first surface, with its sides flush with or protruding from the edge of the recess, or adjacent to but not extending to the edge of the recess. The rib is connected to the second surface and is positioned corresponding to the photonic integrated circuit. The coefficient of thermal expansion of the rib is less than that of the circuit board. The rib partially overlaps with the photonic integrated circuit, and the length of the long side of the rib is greater than the length of the photonic integrated circuit. The rib design avoids stress concentration caused by thermal deformation, which can lead to deformation and damage of the photonic integrated circuit; furthermore, the module is easy to assemble and for electrical measurements, improving product yield.

Claims

1. An optical transceiver module, comprising: a circuit board including a first surface, a second surface opposite to the first surface, and a recess formed on the first surface, the recess having a first edge on the first surface of the circuit board; a photonic integrated circuit mounted on the first surface of the circuit board, and including a first side surface, the first side surface being flush with or protruding from the first edge of the recess; and a rib connected to the second surface of the circuit board, the coefficient of thermal expansion (CTE) of the rib being less than the coefficient of thermal expansion of the circuit board, wherein... The rib overlaps with the photonic integrated circuit in a stacking direction extending from the first surface of the circuit board to the second surface. The rib includes a long side having a length measured in a length direction intersecting the stacking direction. The length of the rib is greater than the length of the photonic integrated circuit measured in that length direction.

2. The optical transceiver module as described in claim 1, wherein, The coefficient of thermal expansion of the protruding rib is close to that of the photonic integrated circuit.

3. The optical transceiver module as described in claim 1, wherein, The photonic integrated circuit is a flip-chip.

4. The optical transceiver module as described in claim 1, wherein, A portion of the photonic integrated circuit is located above the recess.

5. The optical transceiver module as described in claim 1, wherein, A portion of the photonic integrated circuit is suspended in the recess.

6. The optical transceiver module as described in claim 1, wherein, The recess of the circuit board includes a through hole extending from the first surface to the second surface.

7. The optical transceiver module as described in claim 6, wherein, The recess on the second surface of the circuit board also has a second edge, the long side of the convex rib is adjacent to the second edge of the recess, and the distance between the long side and the second edge is greater than or equal to 0 μm and less than or equal to the width of the convex rib measured in a width direction intersecting the stacking direction.

8. The optical transceiver module as claimed in claim 1, wherein, The photonic integrated circuit also includes a third side and a fourth side opposite to each other in the longitudinal direction, with the protruding rib spanning the third side and the fourth side.

9. The optical transceiver module as claimed in claim 1, wherein, The convex rib has a thickness measured in the stacking direction.

10. An optical transceiver module, comprising: a circuit board including a first surface, a second surface opposite to the first surface, and a recess formed on the first surface, the recess having a first edge on the first surface of the circuit board; a photonic integrated circuit mounted on the first surface of the circuit board and including a first side surface, the first side surface being adjacent to but not extending to the first edge of the recess; and a rib connected to the second surface of the circuit board, the coefficient of thermal expansion (CTE) of the rib being less than the coefficient of thermal expansion of the circuit board, wherein... The rib overlaps with the photonic integrated circuit in a stacking direction extending from the first surface of the circuit board to the second surface. The rib includes a long side having a length measured in a length direction intersecting the stacking direction, and the length of the long side is greater than the length of the photonic integrated circuit measured in that length direction.

11. The optical transceiver module as described in claim 10, wherein, The distance between the first side of the photonic integrated circuit and the first edge of the recess is greater than 0 μm and not greater than 50 μm.

12. The optical transceiver module as claimed in claim 10, wherein, The photonic integrated circuit is a flip-chip.

13. The optical transceiver module as described in claim 10, wherein, The recess of the circuit board includes a through hole extending from the first surface to the second surface.

14. The optical transceiver module as claimed in claim 13, wherein, The recess on the second surface of the circuit board also includes a second edge, the long side of the convex rib is adjacent to the second edge of the recess, and the distance between the long side of the convex rib and the second edge of the recess is greater than or equal to 0 μm and less than or equal to the width of the convex rib measured in a width direction intersecting the stacking direction.

15. The optical transceiver module as claimed in claim 10, wherein, The photonic integrated circuit includes a third side and a fourth side opposite to each other in the longitudinal direction, and the protruding rib spans the third side and the fourth side.

16. The optical transceiver module as claimed in claim 10, wherein, The coefficient of thermal expansion of the protruding rib is close to that of the photonic integrated circuit.

17. The optical transceiver module as claimed in claim 10, wherein, The convex rib has a thickness measured in the stacking direction.

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