Resin compositions and products thereof

Abstract

This invention discloses a resin composition and articles thereof. The resin composition according to the invention comprises 100 parts by weight of maleimide resin, 5 to 20 parts by weight of a styrene polymer having amine groups, and 10 to 30 parts by weight of a compound having the structure shown in formula (1). Furthermore, the articles according to the invention are made from the aforementioned resin composition and include prepregs, resin films, laminates, printed circuit boards, or cured insulators, and are improved in at least one of the following properties: dielectric loss, glass transition temperature, Z-axis thermal expansion coefficient, X-axis thermal expansion coefficient, copper foil pull strength, carrier copper pull strength, in-board adhesive flow, filler shading, T300 heat resistance, PCT (5 hours), and PCT (3 hours).

Claims

1. A resin composition comprising: 100 parts by weight of maleimide resin; 5 to 20 parts by weight of a styrene polymer containing amine groups; And 10 to 30 parts by weight of compounds having the structure shown in formula (1); Formula (1) Wherein, X represents a covalent bond, -C(CH3)2-, -CH(CH3)-, -CH2-, -SO2-, -S- or -O-; Q1 and Q2 each independently represent aliphatic hydrocarbon groups containing unsaturated carbon-carbon double bonds from C2 to C6; J1 and J2 each independently represent a diphenyl phosphate functional group or a diphenylphosphooxy functional group.

2. The resin composition according to claim 1, wherein, The maleimide resin includes 4,4'-diphenylmethane bismaleimide, benzyl maleimide oligomer, biphenyl aralkyl type bismaleimide, maleimide containing indane structure, m-epylphenyl bismaleimide, bisphenol A diphenyl ether bismaleimide, 3,3'-dimethyl-5,5'-diethyl-4,4'-diphenylmethane bismaleimide, 4-methyl-1,3-epylphenyl bismaleimide, 1,6-bismaleimide-(2,2,4-trimethyl)hexane, 2,3-dimethylbenzenemaleimide, 2,6-dimethylbenzenemaleimide, N-phenylmaleimide, maleimide resin containing C5 to C50 aliphatic long-chain structure, or combinations thereof.

3. The resin composition according to claim 2, wherein, The maleimide resin containing the indene structure includes the maleimide resin shown in formula (2), the maleimide resin shown in formula (3), or a combination thereof: Formula (2) In formula (2), Ra, Rb, Rc, Rd, R11, R12, and R13 are each independently a hydrogen atom or a C1 to C4 alkyl group; m1, m3, and m4 are each independently an integer from 0 to 4; m2 is an integer from 0 to 3; n1 is the number of repeating units and is a value from 1 to 20; X1 and X2 are each independently a C1 to C4 divalent alkyl group; Formula (3) In formula (3), Re, Rf, Rg, Rh, Ri, Rj, Rk, R21, R22, R23, R24, R25 and R26 are each independently hydrogen atoms or C1 to C4 alkyl groups; m4, m6, m8 and m10 are each independently integers from 0 to 4; m5, m7 and m9 are each independently integers from 0 to 3; n2 and n3 are the number of repeating units, each of which is an independent value from 0 to 20, and n2+n3 is an independent value from 0.5 to 20; X3, X4, X5 and X6 are each independently divalent alkyl groups from C1 to C4.

4. The resin composition according to claim 1, wherein, The styrene-based polymers with amino groups include amino-modified hydrogenated styrene-butadiene copolymers, amino-modified hydrogenated styrene-isoprene copolymers, amino-modified hydrogenated styrene-butadiene-styrene copolymers, amino-modified hydrogenated styrene-isoprene-styrene copolymers, amino-modified hydrogenated styrene-isobutylene-styrene copolymers, or combinations thereof.

5. The resin composition according to claim 1, wherein, The compound having the structure shown in formula (1) has the structure shown in formula (1-1), formula (1-2) or formula (1-3): Formula (1-1) Formula (1-2) Formula (1-3).

6. The resin composition according to claim 1 further comprises a vinyl crosslinking agent, a maleimide triazine resin, a styrene maleic anhydride resin, an epoxy resin, a phenolic resin, a benzoxazine resin, a cyanate ester resin, a polyester resin, a polyamide resin, a polyimide resin, or a combination thereof.

7. The resin composition according to claim 1 further comprises an amine curing agent, an inorganic filler, a curing accelerator, a polymerization inhibitor, a colorant, a solvent, a toughening agent, a silane coupling agent, or a combination thereof.

8. An article made from the resin composition of claim 1, comprising a prepreg, resin film, laminate, printed circuit board, or cured insulator.

9. The article of claim 8, having one, more, or all of the following characteristics: a dielectric loss less than or equal to 0.00280, measured at a frequency of 10 GHz using the method described in JIS C2565; a glass transition temperature greater than or equal to 260°C, measured using a dynamic mechanical analyzer as described in IPC-TM-650 2.4.24.4; a Z-axis coefficient of thermal expansion less than or equal to 1.50%, measured using a thermomechanical analyzer as described in IPC-TM-650 2.4.24.5; an X-axis coefficient of thermal expansion less than or equal to 9.0 ppm / °C, measured using the method described in IPC-TM-650 2.4.24.5; and a copper foil tensile strength greater than or equal to 2.50 lb / in, measured using the method described in IPC-TM-650 2.4.

8. The carrier copper pull force measured by the method described in 2.4.8 is greater than or equal to 2.50 lb / in; the in-board adhesive flow of the product is greater than or equal to 3.0 mm; the inner layer circuit board with no copper surface obtained from the product passes the adhesive filling shadow test; the non-explosion time measured by a thermomechanical analyzer according to the method described in IPC-TM-650 2.4.24.1 is greater than or equal to 130 minutes; the heat resistance test after 5 hours of moisture absorption according to the method described in IPC-TM-650 2.6.16.1 and IPC-TM-650 2.4.23 does not result in explosion; and the heat resistance test after 3 hours of moisture absorption according to the method described in IPC-TM-650 2.6.16.1 and IPC-TM-650 2.4.23 does not result in explosion.

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