Condensation collection system

Abstract

This invention provides a condensation collection system, including a vortex gas splitting device and a condensation collection device. The vortex gas splitting device receives compressed gas and splits it into a cold gas stream and a hot gas stream; the condensation collection device includes a reaction gas inlet pipe, a reaction gas outlet pipe, and a condensation deposition chamber disposed between the two. The cold gas stream is introduced into the condensation deposition chamber, forming a condensation zone around it, allowing reaction products or byproducts in the reaction gas to naturally condense and deposit; the hot gas stream is introduced into the reaction gas inlet pipe and the reaction gas outlet pipe, forming a heating zone around them, maintaining gas flow and reaction efficiency. This invention utilizes the vortex splitting principle to achieve efficient distribution of cold and hot gas streams without the need for additional power or refrigerant, promoting byproduct deposition, improving heat exchange efficiency, maintaining gas flow stability, and achieving safe, energy-saving, and highly efficient condensation collection.

Description

Condensation Collection System CONDENSATION COLLECTION SYSTEM Technical Field

[0001] This invention relates to the fields of gas processing and chemical engineering, and in particular to a condensation collection system for separating and collecting reaction products or byproducts from reaction gases. More specifically, this invention provides a technology for achieving condensation deposition and thermal management of reaction products or byproducts in gases in a highly efficient, low-energy-consumption manner without the need for additional refrigerant by automatically generating cold and hot gas flow using a vortex gas splitter, combined with a condensation deposition chamber and a reaction gas conduit. Prior Technology

[0002] In existing technologies, gas condensation and byproduct collection typically rely on cooling media (such as liquid nitrogen or refrigerant) and external electrical control systems to maintain gas cooling and thermal management. However, such systems suffer from the following problems:

[0003] 1. High energy consumption: A continuous supply of cooling medium or power is required to maintain the condensation zone, increasing operating costs.

[0004] 2. Complex structure: Traditional condensing units usually contain multiple cooling pipes, pumps and additional control components, which makes maintenance and manufacturing difficult.

[0005] 3. Limited deposition efficiency: Reaction products or byproducts are prone to uneven deposition or adhesion on the pipe surface, affecting collection efficiency and airflow stability.

[0006] 4. Limited thermal management: The distribution of hot and cold airflows is not easy to control precisely, resulting in some airflows being too hot or too cold, reducing reaction efficiency.

[0007] Therefore, existing technologies cannot efficiently and stably complete the distribution of hot and cold airflows and the condensation and deposition of by-products without additional refrigerant and power control. In view of this, developing a high-efficiency condensation collection system that utilizes vortex gas diversion to naturally generate cold and hot airflows, combined with a condensation deposition chamber and conduit, has become an urgent technical challenge. Summary of the Invention

[0008] In view of the prior art described above, the purpose of this invention is to provide a condensation collection system to solve the problems faced in the prior art in this field.

[0009] To achieve the above objectives, this invention provides a condensation collection system comprising a vortex gas diversion device and a condensation collection device. The vortex gas diversion device has a compressed gas inlet, a cold gas outlet, and a hot gas outlet. The vortex gas diversion device receives compressed gas input from the compressed gas inlet and generates cold and hot gas flows. The condensation collection device includes a reaction gas inlet pipe, a reaction gas outlet pipe, and a condensation deposition chamber. The reaction gas inlet pipe is located at one end of the condensation collection device; the reaction gas outlet pipe is located at the other end of the condensation collection device; the condensation deposition chamber is located between the reaction gas inlet pipe and the reaction gas outlet pipe, allowing the reaction gas to enter through the reaction gas inlet pipe, pass through the condensation deposition chamber, and then exit through the reaction gas outlet pipe. The cold gas flow is introduced from the cold gas flow outlet to the cold gas enveloped area around the condensation deposition chamber to form a condensation area in the condensation deposition chamber. When the reaction gas passes through the condensation area, the reaction products or by-products contained in the reaction gas are condensed and deposited in the condensation area. The hot gas flow is introduced from the hot gas flow outlet to the hot gas enveloped area around the reaction gas inlet pipe and the reaction gas outlet pipe to form a heating area around the reaction gas inlet pipe and the reaction gas outlet pipe.

[0010] Preferably, the condensation deposition chamber system includes a conical condensation structure and a recessed condensation structure; the conical condensation structure is disposed on one side adjacent to the reactant gas inlet pipe; the recessed condensation structure is disposed on one side adjacent to the reactant gas outlet pipe.

[0011] Preferably, the condensation deposition chamber may include a plurality of spaced-apart cooling plates, with a gas flow channel formed between any two adjacent cooling plates. The direction of the gas flow channel is generally parallel to the direction from the reactant gas inlet pipe to the reactant gas outlet pipe.

[0012] Preferably, the condensation deposition chamber may include a spiral cooling structure, which is formed by a continuously coiled cooling wall to define a spiral flow channel. The reaction gas flows along the spiral flow channel from the reaction gas inlet pipe to the reaction gas outlet pipe, and an exhaust port is provided at the end of the spiral flow channel. The exhaust port is adjacent to and connected to the reaction gas outlet pipe.

[0013] Preferably, the condensation collection system may further include an airflow mixing device that connects the cold air envelope zone and the hot air envelope zone. After passing through the cold air envelope zone and the hot air envelope zone, the cold airflow and the hot airflow are mixed in the airflow mixing device to form a mixed airflow. The airflow mixing device then transmits the mixed airflow to the gas extraction device.

[0014] Preferably, the inner surface of the condensation deposition chamber may have a hydrophilic coating.

[0015] Preferably, the inner surfaces of the condensation deposition chamber, the reactant gas inlet pipe, and the reactant gas outlet pipe may have a high thermal conductivity coating.

[0016] Preferably, the inner surfaces of the reactant gas inlet tube and the reactant gas outlet tube may have a hydrophobic, low surface energy coating or a combination thereof.

[0017] As stated above, the condensation collection system of this invention has the following functions:

[0018] 1. High-efficiency condensation and thermal management: Utilizing the principle of eddy current diversion, cold and hot airflows are naturally generated. Without the need for additional power supply or refrigerant, a condensation zone can be formed in the condensation deposition chamber while maintaining the heating zone of the conduit.

[0019] 2. Enhanced deposition efficiency of reaction products or byproducts: The condensation deposition chamber structure and hydrophilic coating design can promote the uniform deposition of reaction products or byproducts of the reaction gases.

[0020] 3. Improved heat exchange rate and airflow stability: The high thermal conductivity coating on the duct surface and the spiral / cold conduction plate structure improve heat conduction efficiency; the airflow mixing device automatically balances the temperature and flow rate of hot and cold airflows to maintain stable airflow.

[0021] 4. Reduce adhesion of reactive gas conduits: Hydrophobic or low surface energy coatings reduce the adhesion of reaction products or byproducts on the inner surfaces of the reactive gas inlet and outlet pipes, thus reducing maintenance frequency.

[0022] 5. Simple structure, energy saving and safety: The system does not require additional refrigerant or complex cooling circuits, is easy to manufacture and maintain, and is suitable for industrial and laboratory applications. Simple Explanation of the Diagram

[0023] [Figure 1] is a schematic diagram of the condensation collection system of this invention. [Figure 2] is a first schematic diagram of the condensation collection device of the condensation collection system of this invention. [Figure 3] is a second schematic diagram of the condensation collection device of the condensation collection system of this invention. [Figure 4] is the third schematic diagram of the condensation collection device of the condensation collection system of this invention. Implementation

[0024] To facilitate understanding of the features, content, advantages, and effects of this creation, the creation is described in detail below with accompanying drawings and examples. The drawings used are for illustrative purposes only and may not represent the actual proportions and precise configurations of the creation after implementation. Therefore, the proportions and configurations of the accompanying drawings should not be used to interpret or limit the scope of the creation in actual implementation.

[0025] Please refer to Figure 1, which is a first schematic diagram of the condensation collection system of this invention. As shown in the figure, this invention provides a condensation collection system 100, which includes a vortex gas diversion device 110 and a condensation collection device 120. The vortex gas diversion device 110 has a compressed gas inlet end 111, a cold gas outlet end 112, and a hot gas outlet end 113. The condensation collection device 120 includes a reaction gas R inlet pipe 121, a reaction gas R outlet pipe 122, and a condensation deposition chamber 123.

[0026] Continuing on, the vortex gas splitter 110 receives compressed gas C input from the compressed gas inlet 111. The compressed gas C is preferably an inert gas such as nitrogen, argon, helium, or dry air, but this is not limited thereto. The vortex gas splitter 110 utilizes the gas rotation motion (vortex effect) to split the compressed gas C into two streams with different temperatures, thus generating a cold air stream and a hot air stream respectively.

[0027] The reaction gas inlet pipe 121 of the condensation collection device 120 is disposed at one end of the condensation collection device 120, and the reaction gas R outlet pipe 122 is disposed at the other end of the condensation collection device 120. The condensation deposition chamber 123 is disposed between the reaction gas inlet pipe 121 and the reaction gas outlet pipe 122, so that the reaction gas R enters through the reaction gas inlet pipe 121, passes through the condensation deposition chamber 123, and is discharged through the reaction gas outlet pipe 122.

[0028] It is worth mentioning that the cold airflow generated by the vortex gas diversion device 110 is introduced from the cold airflow output end 112 to the cold air covering area 1121 provided around the condensation deposition chamber 123, so as to form a condensation area LA in the condensation deposition chamber 123. Then, when the reaction gas R enters the condensation collection device 120 and passes through the condensation area LA, the reaction products or by-products contained in the reaction gas R are condensed and deposited in the condensation area LA. In other words, when the reaction products or by-products in the reaction gas R encounter a low temperature surface, they change from a gaseous state to a liquid or solid state and adhere to the surface of the condensation deposition chamber 123.

[0029] In addition, the hot gas flow is introduced from the hot gas flow outlet 113 to the hot gas enveloping area 1131 located around the reaction gas inlet pipe 121 and the reaction gas outlet pipe 122, so as to form a heating area HA around the reaction gas inlet pipe 121 and the reaction gas outlet pipe 122. This can prevent the reaction products or by-products contained in the reaction gas R from condensing or blocking prematurely in the reaction gas inlet pipe 121 and the reaction gas outlet pipe 122, and ensure that the reaction gas R flows smoothly in the system.

[0030] Please refer to Figure 2, which is a first schematic diagram of the condensation collection device of the condensation collection system of this invention. As shown in the figure, the condensation deposition chamber 123 in the condensation collection device 120 of this embodiment further includes a conical condensation structure 1231 and a recessed condensation structure 1232. The conical condensation structure 1231 is located on one side adjacent to the reactant gas inlet pipe 121. When the reactant gas R enters the condensation deposition chamber 123 from the reactant gas inlet pipe 121, the gas flow first contacts the conical condensation structure 1231. Due to the conical geometry, the reactant gas R generates local velocity changes and eddies when flowing here, making it easier for reaction products or byproducts in the reactant gas R to contact the surface of the condensation area LA and deposit. This design helps to improve the initial condensation efficiency, promotes uniform distribution of deposits, and prevents premature discharge outside the condensation deposition chamber 123.

[0031] On the other hand, the recessed condensation structure 1232 is disposed on one side adjacent to the reactant gas outlet pipe 122 to further capture reaction products or byproducts that have not yet been fully deposited when the reactant gas R is about to exit the condensation deposition chamber 123. The shape of the recessed condensation structure 1232 can form a local low-velocity region, which prolongs the residence time of the reactant gas R in the recess, increases the chance of deposition of reaction products or byproducts, and reduces the loss caused by the direct exit of the reactant gas R from the condensation deposition chamber 123. The combination of the conical and recessed structure configuration forms a progressive deposition process from the reactant gas R inlet end to the reactant gas R outlet end, maximizing the deposition efficiency in the condensation deposition chamber 123, while ensuring stable gas flow and preventing flow blockage or uneven gas flow.

[0032] This design can also be combined with the condensation zone LA formed by the cold airflow coverage area to maintain a suitable condensation temperature on the surface of the conical and recessed condensation structure 1232, further improving the deposition efficiency of reaction products or by-products. In addition, the heating zone HA formed around the reaction gas inlet pipe 121 and the reaction gas outlet pipe 122 by the hot airflow can maintain the gas flow in the pipes and avoid excessive deposition or condensation in the pipes, making the overall condensation collection system 100 operate efficiently and stably.

[0033] Please refer to Figure 3, which is a second schematic diagram of the condensation collection device of the condensation collection system of this invention. As shown in the figure, in this embodiment, multiple cold-conducting plates 1233 are arranged at intervals inside the condensation deposition chamber 123. A gas flow channel F1 is formed between every two adjacent cold-conducting plates 1233. The direction of the gas flow channel F1 is approximately parallel to the direction from the reaction gas inlet pipe 121 to the reaction gas outlet pipe 122, so that the reaction gas R can pass smoothly through the condensation deposition chamber 123 without generating excessive resistance.

[0034] After the reactive gas R enters the condensation and deposition chamber 123 through the reactive gas inlet pipe 121, it flows along the gas flow channel F1. When it contacts the surface of the cooling plate 1233, the reaction products or byproducts contained therein condense and deposit on the surface of the cooling plate 1233 due to the temperature difference. The spacing design of the cooling plate 1233 ensures that the gas flow channel F1 is sufficiently spacious to maintain a stable airflow, and also provides sufficient condensation surface area to improve deposition efficiency. Since the direction of the gas flow channel F1 is parallel to the direction of introduction to the reactive gas outlet pipe 122, the velocity distribution of the reactive gas R along the flow direction is relatively uniform, reducing local turbulence or dead zones in the airflow, and ensuring the uniformity and stability of the deposition process.

[0035] Furthermore, the cold-conducting plate 1233 can be selected with a wavy or other morphology to increase the surface area, further improving the heat exchange efficiency with the gas. The cold airflow surrounds the condensation deposition chamber 123 and interacts with the cold-conducting plate 1233, maintaining its low temperature and facilitating rapid condensation of the reaction products. The entire design ensures that the condensation deposition chamber 123 can efficiently promote the deposition of reaction products or byproducts without the need for additional power or refrigerant, while maintaining stable airflow and enhancing the reliability and efficiency of the system operation.

[0036] Please refer to Figure 4, which is a third schematic diagram of the condensation collection device of the condensation collection system of this invention. As shown in the figure, in this embodiment, a spiral cooling structure 1234 is provided in the condensation deposition chamber 123. The spiral cooling structure 1234 is formed by a continuously coiled cooling wall 1235, forming a continuous spiral flow channel F2 along the inside of the condensation deposition chamber 123. After the reaction gas R enters the condensation deposition chamber 123 through the reaction gas inlet pipe 121, it flows slowly along this spiral flow channel F2 and passes near the cooling surface provided by the cooling wall 1235. The reaction products or by-products contained in the reaction gas R gradually condense and deposit on the surface of the cooling wall 1235 under low temperature conditions.

[0037] The design of the spiral flow channel F2 ensures uniform gas distribution along the flow direction, increasing the contact time between the reactant gas R and the cooling surface, effectively improving the condensation and deposition efficiency. The spiral flow channel F2 is equipped with an exhaust port 1236, which is adjacent to and connected to the reactant gas outlet pipe 122, allowing the reactant gas R passing through the spiral flow channel F2 to smoothly exit the condensation and deposition chamber 123 while maintaining the stability and continuity of the airflow. Because the spiral cooling structure 1234 provides a high surface area for cooling contact, the cold airflow surrounding the condensation and deposition chamber 123 can rapidly reduce the gas temperature within the spiral flow channel F2, promoting the full deposition of reaction products or byproducts without causing airflow blockage.

[0038] The design of the entire spiral cooling structure 1234 makes the condensation deposition process efficient, uniform and controllable, and can achieve the functions of improving the deposition efficiency of reaction products or by-products, maintaining airflow stability and thermal management effect without the need for additional power supply or refrigerant.

[0039] As shown in Figure 1, in another embodiment, the condensation collection system 100 is further configured with an airflow mixing device 130 to connect the cold gas envelope zone 1121 and the hot gas envelope zone 1131. When the cold gas flows out of the cold gas envelope zone 1121 and the hot gas flows out of the hot gas envelope zone 1131, the two airflows enter the airflow mixing device 130 and naturally mix to form a uniform mixed airflow. The structure and airflow guidance design within the airflow mixing device 130 allow the cold and hot gases to fully contact and mix, making the temperature and flow rate of the mixed airflow more stable and uniform. The mixed airflow is then conveyed by the airflow mixing device 130 to the gas extraction device 200 to ensure smooth gas flow throughout the system, avoid local overheating or overcooling, and maintain the condensation efficiency and flow stability of the reaction gas R in the condensation deposition chamber 123. This airflow mixing process does not rely on additional refrigerant or power control, effectively regulating the airflow temperature and improving the overall operating efficiency and safety of the system. The gas extraction device 200 can be various pumps, fans, gas supply / power equipment, preferably a dry vacuum pump, but is not limited thereto.

[0040] It is worth mentioning that the inner surface of the condensation deposition chamber 123 can be coated with a hydrophilic coating to promote the condensation and deposition of reaction products or byproducts in the reactive gas R. When the reactive gas R enters the condensation deposition chamber 123 and passes through the condensation zone LA, the reaction products or byproducts, upon encountering the surface of the hydrophilic coating, will be more easily wetted and adhere to the inner wall of the condensation deposition chamber 123 due to the hydrophilicity of the surface, accelerating the formation of droplets or solid deposits. The hydrophilic coating not only enhances the condensation efficiency but also ensures that the deposits are evenly distributed on the surface of the condensation deposition chamber 123 after formation, avoiding local accumulation that could cause airflow blockage or uneven cooling. The coating can be made of corrosion-resistant, high and low temperature resistant, and compatible with the reactive gas R, such as oxide films or specially treated polymer coatings, to ensure that stable hydrophilicity and condensation effects are maintained during long-term operation, thereby improving the deposition efficiency and reliability of the overall condensation collection system 100.

[0041] On the other hand, the inner surfaces of the condensation deposition chamber 123, the reactant gas inlet pipe 121, and the reactant gas outlet pipe 122 can be coated with a high thermal conductivity coating to improve heat transfer efficiency. When a cold gas flow is introduced into the condensation deposition chamber 123 to form a condensation zone LA, the high thermal conductivity coating can accelerate the rapid transfer of cold energy from the inner wall of the condensation deposition chamber 123 to the area through which the reactant gas R flows, allowing the reaction products or byproducts in the reactant gas R to condense and deposit more quickly and uniformly. Similarly, when a hot gas flow covers the reactant gas inlet pipe 121 and the reactant gas outlet pipe 122, the high thermal conductivity coating can effectively transfer heat energy to the gas flow area, maintaining the flowability and reaction efficiency of the reactant gas R. This high thermal conductivity coating is usually made of materials with excellent thermal conductivity, resistance to high and low temperatures, and high chemical stability, such as metal oxides, carbon-based materials, or modified ceramic films, to ensure that the heat exchange efficiency does not decrease during long-term operation. Through this coating, the entire condensation collection system 100 can achieve highly efficient distribution of cold and heat energy and management of the deposition of reaction products or byproducts without relying on an additional power source or refrigerant.

[0042] Furthermore, the inner surfaces of the reactant gas inlet pipe 121 and the reactant gas outlet pipe 122 can be coated with a hydrophobic coating, a low surface energy coating, or a combination of both to reduce the adhesion of reaction products, byproducts, or condensed moisture in the reactant gas R to the pipe walls. When the reactant gas R flows from the reactant gas inlet pipe 121 into the condensation deposition chamber 123 and through the reactant gas outlet pipe 122, this coating reduces the contact area between tiny droplets, particles, reaction products, or byproducts in the gas and the pipe walls of the reactant gas inlet pipe 121 and the reactant gas outlet pipe 122, making them easier to expel with the gas flow and preventing accumulation inside the reactant gas inlet pipe 121 and the reactant gas outlet pipe 122, thus avoiding blockage or reduced gas flow efficiency. The hydrophobic or low surface energy coating can be made of polytetrafluoroethylene (PTFE), silicone fluorides, fluorinated polymers, or other materials with similar chemical stability and low wettability, and can be uniformly coated on the inner surfaces of the reactant gas inlet pipe 121 and the reactant gas outlet pipe 122 by spraying, dipping, or chemical bonding. Through this coating, the entire condensation collection system 100 can maintain unobstructed gas channels during the deposition of reaction products or by-products, ensuring smooth flow of reaction gas R, thereby improving condensation collection efficiency and system stability without relying on additional mechanical cleaning or external power.

[0043] As mentioned above, this invention utilizes the principle of eddy current distribution to achieve efficient distribution of hot and cold airflow without the need for additional power or refrigerant. This promotes the deposition of reaction products or byproducts, improves heat exchange efficiency, maintains airflow stability, and achieves safe, energy-saving, and highly efficient condensation and collection.

[0044] The embodiments described above are merely for illustrating the technical ideas and features of this invention. Their purpose is to enable those skilled in this art to understand the content of this invention and implement it accordingly. They should not be used to limit the patent scope of this invention. That is, any equivalent changes or modifications made in accordance with the spirit disclosed in this invention should still be covered within the patent scope of this invention.

[0045] 100: Condensation Collection System 110: Vortex Gas Diverter 111: Compressed gas inlet end 112: Cold air outlet end 1121: Air-conditioned area 113: Hot airflow outlet end 1131: Hot air envelope area 120: Condensation Collection Device 121: Reaction gas inlet tube 122: Reaction gas outlet tube 123: Condensation Deposition Chamber 1231: Conical condensation structure 1232: Recessed condensation structure 1233: Cooling plate 1234: Spiral cooling structure 1235: Cooling wall 1236: Exhaust port 130: Airflow mixing device 200: Gas extraction device C: Compressed gas F1: Gas flow channel F2: Spiral Flow Channel HA: Heating area LA: Condensation area R: Reaction gas

Claims

1. A condensation collection system, comprising: a vortex gas splitting device having a compressed gas inlet, a cold gas outlet, and a hot gas outlet, the vortex gas splitting device receiving compressed gas input from the compressed gas inlet and generating a cold gas outlet and a hot gas outlet; and a condensation collection device comprising: a reaction gas inlet pipe disposed at one end of the condensation collection device; a reaction gas outlet pipe disposed at the other end of the condensation collection device; and a condensation deposition chamber disposed between the reaction gas inlet pipe and the reaction gas outlet pipe, for the reaction gas to enter through the reaction gas inlet pipe, pass through the condensation deposition chamber, and then exit through the reaction gas outlet pipe; wherein... The cold gas flow is introduced from the cold gas flow outlet to a cold gas enveloped area surrounding the condensation deposition chamber, so as to form a condensation area in the condensation deposition chamber. When the reaction gas passes through the condensation area, the reaction products or by-products contained in the reaction gas are condensed and deposited in the condensation area. The hot gas flow is introduced from the hot gas flow outlet to a hot gas enveloped area surrounding the reaction gas inlet pipe and the reaction gas outlet pipe, respectively, so as to form a heating area around the reaction gas inlet pipe and the reaction gas outlet pipe.

2. The condensation collection system as claimed in claim 1, wherein the condensation deposition chamber comprises: a conical condensation structure disposed on one side adjacent to the reactant gas inlet pipe; and a recessed condensation structure disposed on one side adjacent to the reactant gas outlet pipe.

3. The condensation collection system as claimed in claim 1, wherein the condensation deposition chamber comprises a plurality of spaced-apart cooling plates, and a gas flow channel is formed between any two adjacent cooling plates, the direction of which is generally parallel to the direction from the reactant gas inlet pipe to the reactant gas outlet pipe.

4. The condensation collection system as claimed in claim 1, wherein the condensation deposition chamber includes a spiral cooling structure formed by a continuously coiled cooling wall to define a spiral flow channel, the reaction gas system flows along the spiral flow channel from the reaction gas inlet pipe to the reaction gas outlet pipe, and an exhaust port is provided at the end of the spiral flow channel, the exhaust port being adjacent to and communicating with the reaction gas outlet pipe.

5. The condensation collection system as described in claim 1, further comprising an airflow mixing device connected to the cold air envelope zone and the hot air envelope zone, wherein the cold airflow and the hot airflow are mixed in the airflow mixing device after passing through the cold air envelope zone and the hot air envelope zone to form a mixed airflow, and the airflow mixing device conveys the mixed airflow to a gas extraction device.

6. The condensation collection system as claimed in claim 1, wherein the inner surface of the condensation deposition chamber has a hydrophilic coating.

7. The condensation collection system as claimed in claim 1, wherein the inner surfaces of the condensation deposition chamber, the reactant gas inlet pipe, and the reactant gas outlet pipe are coated with a high thermal conductivity coating.

8. The condensation collection system as claimed in claim 1, wherein the inner surfaces of the reactant gas inlet pipe and the reactant gas outlet pipe are provided with a hydrophobic, low surface energy coating or a combination thereof.

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