Stacked integrated heat spreader

Abstract

This invention provides a stacked integrated heat sink for protecting a chip on a substrate. The stacked integrated heat sink includes a frame and a top cover. The frame is disposed on the substrate and surrounds the chip. The top cover is stacked on the frame, and the bottom surface of the top cover is thermally coupled to the chip. The top cover is selected from the group consisting of ceramic, metal composite, metal / ceramic composite, and combinations thereof, and has a coefficient of thermal expansion ranging from / K to / K.

Description

Stacked integrated heat sink Stacked Integrated heat spreader Technical Field

[0001] This case relates to a radiator structure, particularly a stacked integrated radiator, which combines a top cover and a frame with different coefficients of thermal expansion in a stacked manner to optimize heat dissipation performance while solving the problems of thermal expansion deformation and cost. Prior Technology

[0002] An integrated heat spreader (HIS) is a heat dissipation technology used for semiconductor chips. It typically utilizes a metal cover made of materials such as copper, directly mounted on the chip surface to disperse and conduct the heat generated by the chip, transferring heat more effectively to the heatsink and fan, thereby improving the hardware's heat dissipation performance and reliability.

[0003] Typically, integrated heatsinks connect to the chip via a thermal interface material (TIM) at the bottom, and connect to various heat dissipation products such as fins and water-cooling plates at the top via the same TIM. However, with the increasing processing speed of chips, the TIM material at the bottom of integrated heatsinks has gradually shifted from traditional thermal paste to metallized thermal interface technology. Furthermore, as AI chip sizes increase, the heat dissipation area required by integrated heatsinks also increases. However, due to the large coefficient of thermal expansion of copper, increasing the size of integrated heatsinks exacerbates bending issues and may even cause the chip to crack under pressure. Although increasing the thickness of the integrated heatsink can improve its strength and resistance to deformation, it reduces heat transfer efficiency.

[0004] To address the aforementioned thermal expansion issue, a common approach in the market is to use materials with lower coefficients of thermal expansion to construct integrated heat sinks. Common low-coefficient materials, such as ceramics, ceramic-metal composites, metal composites, and diamond, with varying manufacturing processes and proportions, typically have coefficients of thermal expansion of [value missing]. / K to However, these related materials all suffer from difficulties in processing, increased costs several times over, and challenges in mass production. Because integrated heat sinks are three-dimensional structures and involve electronic packaging processes, their dimensions require extremely precise precision. For ceramic products obtained through conventional sintering processes, the dimensions often cannot meet the precision requirements of integrated heat sinks, thus necessitating CNC machining. However, ceramics are hard and brittle, requiring diamond tools and slow processing. Therefore, ceramic machining is expensive, has relatively poor yield rates, and is slow.

[0005] In view of this, it is necessary to provide a stacked integrated heat sink that combines a top cover and a frame with different coefficients of thermal expansion in a stacked manner to optimize heat dissipation performance while solving the problems of thermal expansion deformation and cost. Summary of the Invention

[0006] The purpose of this invention is to provide a stacked integrated heat sink that combines a top cover and a frame with different coefficients of thermal expansion in a stacked manner to optimize heat dissipation performance while solving the problems of thermal expansion deformation and cost.

[0007] Another objective of this project is to provide a stacked integrated heatsink, eliminating the need for a single-piece structure to improve manufacturability and enhance commercial viability. The stacked integrated heatsink consists of a top cover and a frame. The top cover contacts the chip; therefore, a material with a low coefficient of thermal expansion is selected, such as one with a coefficient of thermal expansion ranging from... / K to / K, especially / K to / K is preferred. The frame material has low requirements for thermal expansion coefficient, and can be metal, plastic, etc. Furthermore, since the top cover is used for direct contact with the chip, holes can be made in the hot areas of the chip and then filled with metal to enhance local heat conduction. Alternatively, through-holes, copper layers, or short fins can be directly generated to improve heat dissipation performance. When the top cover is made of copper, a copper layer thickness between 1 μm and 1000 μm does not affect the expansion coefficient of the top cover. On the other hand, the assembly of the top cover and frame can be achieved through bonding, sintering, welding, injection molding, and casting. Multiple frames can be molded and then combined with the top cover to form the stacked integrated heatsink of this project. The top cover and frame can be molded separately as parts and then joined through low-temperature bonding, high-temperature direct welding, solder paste application, laser spot welding, etc. The top cover can also be molded first, and then the frame material can be processed through injection molding, casting, pressing, etc., and molded to form the stacked integrated heatsink of this project. Of course, the shape of the frame relative to the cover can vary depending on the actual application requirements; it can be larger than the cover, flush with it, or smaller, designed according to the needs. When the frame is made of polymer material, the polymer material can be molded in a mold using an injection molding machine and simultaneously bonded to the cover. For a two-piece structure of cover and frame, the cover can have notches on its outer periphery to correspond to the connecting parts on the inner periphery of the frame, achieving a mating design that strengthens the bond between the two materials. Of course, this application is not limited to this.

[0008] To achieve the aforementioned objective, this invention provides a stacked integrated heat sink for protecting a chip on a substrate. The stacked integrated heat sink includes a frame and a top cover. The frame is disposed on the substrate and surrounds the chip. The top cover is stacked on the frame, and the bottom surface of the top cover is thermally coupled to the chip. The top cover is selected from the group consisting of ceramics, metal composites, metal / ceramic composites, and combinations thereof, and has a coefficient of thermal expansion ranging from [insert range here]. / K to Between / K.

[0009] In one embodiment, the coefficient of thermal expansion of the upper cover is in the range of... / K to / K.

[0010] In one embodiment, the frame and the top cover are joined by means of welding, bonding, sintering, injection molding, or casting.

[0011] In one embodiment, the top cover includes a metal-filled area that is spatially opposite to the wafer and thermally coupled to the wafer to enhance local thermal conductivity.

[0012] In one embodiment, the top cover includes at least one copper layer disposed on the top surface and / or bottom surface of the top cover.

[0013] In one embodiment, the copper layer thickness ranges from 1 μm to 1000 μm.

[0014] In one embodiment, the top cover includes a plurality of fins disposed on the top surface of the top cover and assembled and thermally coupled to the chip to enhance heat dissipation performance.

[0015] In one embodiment, the top cover includes a plurality of through holes penetrating the top and bottom surfaces of the top cover to enhance heat dissipation performance.

[0016] In one embodiment, the frame and the top cover are molded separately and then joined together by low-temperature bonding or high-temperature welding.

[0017] In one embodiment, after the top cover is formed, the frame is then formed onto the top cover by means of injection, pouring or pressing with a mold through heated material.

[0018] In one embodiment, the frame is injection molded and forms a plurality of connectors that connect to the outer periphery of the cover.

[0019] In one embodiment, the cover includes a plurality of notches disposed on the outer periphery of the cover, spatially engaging with the plurality of connectors, wherein the plurality of notches and the plurality of connectors engage with each other.

[0020] In one embodiment, each of the plurality of notches further includes a chamfered structure between itself and the top surface of the cover, and each of the plurality of connectors includes a protrusion that is spatially opposite to the chamfered structure and fits tightly against the corresponding chamfered structure.

[0021] In one embodiment, the frame further includes a support platform that is spatially opposite to the outer periphery of the cover and recessed downward from the top surface of the frame, wherein the connector protrudes from the outside to the inside through the support platform.

[0022] In one embodiment, the outer periphery of the support platform has the same outline as the outer periphery of the top cover.

[0023] In one embodiment, a plurality of connectors are disposed on a support platform and are higher than the top surface of the frame.

[0024] In one embodiment, the bottom surface of the top cover is thermally coupled to the chip through a thermal interface material layer. Simple Explanation of the Diagram

[0025] The following detailed description of the case and the schematic diagrams of the embodiments are intended to enable those skilled in the art to better understand the above content, and are not intended to limit the case.

[0026] Figure 1 is a schematic diagram illustrating the application of a stacked integrated heat sink to a wafer on a substrate in the first embodiment of this invention.

[0027] Figure 2A shows an exploded view of the stacked integrated heat sink in the first embodiment.

[0028] Figure 2B shows a top view of the stacked integrated heat sink in the first embodiment.

[0029] Figure 3 illustrates a demonstration of the assembly process for the stacked integrated heat sink in this case.

[0030] Figure 4 illustrates another assembly process for the stacked integrated heat sink in this case.

[0031] Figure 5A shows a cross-sectional view of the stacked integrated heat sink in the second embodiment of this case.

[0032] Figure 5B shows a top view of the stacked integrated heat sink in the second embodiment of this case.

[0033] Figure 6A shows a cross-sectional view of the stacked integrated heat sink in the third embodiment of this case.

[0034] Figure 6B shows a top view of the stacked integrated heat sink in the third embodiment of this case.

[0035] Figure 7A is a cross-sectional view showing the stacked integrated heat sink in the fourth embodiment of this case.

[0036] Figure 7B shows a top view of the stacked integrated heat sink in the fourth embodiment of this case.

[0037] Figure 8A is a cross-sectional view showing the stacked integrated heat sink in the fifth embodiment of this case.

[0038] Figure 8B shows a top view of the stacked integrated heat sink in the fifth embodiment of this case.

[0039] Figure 9A is a perspective view showing the stacked integrated heat sink in the sixth embodiment of this case.

[0040] Figure 9B is an exploded view showing the structure of the stacked integrated heat sink in the sixth embodiment of this case.

[0041] Figure 9C is a cross-sectional view of the stacked integrated heat sink in the sixth embodiment of this case. Implementation

[0042] Some typical embodiments embodying the features and advantages of this invention will be described in detail in the following description. It should be understood that this invention can have various variations in different forms, all of which do not depart from the scope of this invention, and the descriptions and drawings herein are essentially for illustrative purposes and not for limiting this invention. For example, if the following disclosure describes a first feature disposed on or above a second feature, it indicates that it includes embodiments where the first and second features are in direct contact, and also includes embodiments where additional features can be disposed between the first and second features, so that the first and second features may not be in direct contact. Furthermore, different embodiments in this disclosure may use repeated reference numerals and / or markings. These repetitions are for simplification and clarity and are not intended to limit the relationships between the various embodiments and / or the described appearance structures. Moreover, to facilitate the description of the relationship between one component or feature and another (plural) component or feature in the drawings, spatially related terms such as "top," "bottom," "upper," "lower," and similar terms may be used. In addition to the orientations illustrated in the diagrams, spatially related terms are used to cover different orientations of the device in use or operation. The device may also be positioned otherwise (e.g., rotated 90 degrees or located in other orientations), and the descriptions of the spatially related terms used will be interpreted accordingly. Furthermore, when a component is referred to as "connected to" or "coupled to" another component, it may be directly connected to or coupled to the other component, or there may be intervening components. Although the numerical ranges and parameters of the broad scope of this disclosure are approximate, the values ​​are stated as precisely as possible in specific examples. Additionally, it is understood that while terms such as "first," "second," etc., may be used in the claims to describe different components, these components should not be limited by these terms, and the components described accordingly in the embodiments are represented by different component symbols. These terms are used to distinguish different components. For example, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component without departing from the scope of the embodiments. The term "and / or" as thus used includes any or all combinations of one or more of the related listed items.

[0043] Figure 1 is a schematic diagram illustrating the application of the stacked integrated heat sink in the first embodiment of this invention to a wafer on a substrate. Figure 2A is an exploded view of the stacked integrated heat sink in the first embodiment. Figure 2B is a top view of the stacked integrated heat sink in the first embodiment. In this embodiment, the stacked integrated heat sink 1 is used to protect the wafer 8 on the substrate 9. The stacked integrated heat sink 1 includes a frame 10 and a top cover 20. The frame 10 is disposed on the substrate 9 and surrounds the wafer 8. The top cover 20 is stacked on the frame 10, and the bottom surface 21 of the top cover 20 is thermally coupled to the wafer 8. In the stacked view, the top cover 20 at least partially overlaps with the frame 10, thereby providing support for the top cover 20. In this embodiment, the top cover 20 is selected from the group consisting of ceramics, metal composites, metal / ceramic composites, and combinations thereof, and has a coefficient of thermal expansion ranging from... / K to Between / K. Ideally, the coefficient of thermal expansion of the top cover should be within the range of / K. / K to / K, similar to the coefficient of thermal expansion of chip 8, provides heat dissipation performance while avoiding bending problems caused by differences in thermal expansion. In this embodiment, the top cover 20 is, for example, a plate made of high thermal conductivity aluminum nitride ceramic, which has good thermal conductivity. Furthermore, compared to a one-piece structure, the two-piece design of the frame 10 and the top cover 20 of the stacked integrated heat sink 1 in this case helps to improve manufacturability and enhances the feasibility of commercialization. In this embodiment, the frame 10 is arranged around the outer periphery of chip 8, on which the top cover 20 is stacked and provides support. Since the material of the frame 10 has low requirements for the coefficient of thermal expansion, metal, plastic, etc. can be selected. Of course, this case is not limited to this.

[0044] In addition, in this embodiment, the bottom surface 21 of the top cover 20 is thermally coupled to the top surface of the chip 8 through a thermal interface material layer 7. The top surface 22 of the top cover 20 can also be thermally coupled to the heat dissipation element 6 through another thermal interface material layer 7' to enhance the heat dissipation performance of the stacked integrated heat sink 1 on the chip 8. Of course, this embodiment is not limited to this.

[0045] On the other hand, in this embodiment, the assembly of the top cover 20 and the frame 10 can be carried out through methods such as bonding, sintering, welding, injection molding, and casting. Figure 3 illustrates an example of the assembly process of the stacked integrated heat sink of this invention. In this embodiment, the pre-formed top cover 20 and the pre-formed frame 10 are first provided in steps S01 and S02, respectively. Then, in step S03, the top cover 20 and the frame 10 are joined by adhesive bonding or high-temperature welding. Thus, the assembly of the stacked integrated heat sink 1 of this invention can be completed in step S04. In other words, the top cover 20 and the frame 10 of the stacked integrated heat sink 1 can be pre-formed as parts and then joined by methods such as low-temperature bonding, high-temperature direct welding, solder paste application, and laser spot welding. Of course, this invention is not limited to this.

[0046] Figure 4 illustrates another assembly process of the stacked integrated heat sink of this invention. In this embodiment, a pre-formed upper cover 20 is first provided in step S11. Next, in step S12, the upper cover 20 is placed into a molded die. Subsequently, in step S13, the raw material of the frame 10 can be directly molded and combined with the upper cover 20 by means of heating and softening, injection molding, extrusion, or casting. Thus, the assembly of the stacked integrated heat sink 1 of this invention can be completed in step S14. In other words, the upper cover 20 of the stacked integrated heat sink 1 can also be first formed into an object, and then the frame material can be processed by means of injection molding, casting, or pressing, and the frame 10 can be formed in conjunction with a mold to form the stacked integrated heat sink 1 of this invention. In other embodiments, the frame 10 may also be a multi-piece design, connected to a portion of the outer periphery of the top cover 20 via injection molding. As long as the frame 10 can provide sufficient support for the top cover 20, the arrangement of the frame 10 is not limited to completely surrounding the entire outer periphery of the chip 8. Of course, the shape of the frame 10 relative to the top cover 20 can also vary according to actual application requirements; it can be larger than the top cover 20, flush with it, or smaller, designed according to needs. This invention is not limited to this.

[0047] Figures 5A and 5B are schematic diagrams illustrating the stacked integrated heat sink in the second embodiment of this invention. In this embodiment, the stacked integrated heat sink 1a is similar to the stacked integrated heat sink 1 shown in Figures 1, 2A, and 2B, and the same component labels represent the same components, structures, and functions, which will not be described again here. In this embodiment, the upper cover 20 of the stacked integrated heat sink 1a is, for example, a plate made of a ceramic material with a low coefficient of thermal expansion, and further includes a metal-filled area 23 penetrating the bottom surface 21 and the top surface 22. The metal-filled area 23 is, for example, filled with a metal material with high thermal conductivity. Spatially relative to the chip 8 (see Figure 1), the metal-filled area 23 is thermally coupled to the chip 8, which can further enhance local heat conduction.

[0048] Figures 6A and 6B are schematic diagrams illustrating the stacked integrated heat sink in the third embodiment of this invention. In this embodiment, the stacked integrated heat sink 1b is similar to the stacked integrated heat sink 1 shown in Figures 1, 2A, and 2B, and the same component reference numerals represent the same components, structures, and functions, which will not be described again here. In this embodiment, the upper cover 20 of the stacked integrated heat sink 1b is, for example, a plate made of a ceramic material with a low coefficient of thermal expansion, and further includes at least one copper layer 24 disposed on the top surface 22 and / or the bottom surface 21 of the upper cover 20. The thickness of the copper layer ranges from 1 μm to 1000 μm. The placement of the copper layer 24 does not affect the coefficient of thermal expansion of the upper cover 20, but it can enhance the heat dissipation performance of the stacked integrated heat sink 1b for the chip 8. In other embodiments, the pattern of the copper layer 24 can be varied according to actual application requirements, and a special patterned copper layer 24 can be made by copper plating process to increase the heat dissipation effect. Of course, this invention is not limited to this.

[0049] Figures 7A and 7B are schematic diagrams illustrating the stacked integrated heat sink in the fourth embodiment of this invention. In this embodiment, the stacked integrated heat sink 1c is similar to the stacked integrated heat sink 1 shown in Figures 1, 2A, and 2B, and the same component reference numerals represent the same components, structures, and functions, which will not be described again here. In this embodiment, the upper cover 20 of the stacked integrated heat sink 1c further includes a plurality of fins 25 disposed on the top surface 22 of the upper cover 20 and thermally coupled to the chip 8 to enhance heat dissipation performance. In other embodiments, the plurality of fins 25 can be patterned using a copper-clad process to increase heat dissipation effect. Of course, this invention is not limited to this.

[0050] Figures 8A and 8B are schematic diagrams illustrating the stacked integrated heat sink in the fifth embodiment of this invention. In this embodiment, the stacked integrated heat sink 1d is similar to the stacked integrated heat sink 1 shown in Figures 1, 2A, and 2B, and the same component labels represent the same components, structures, and functions, which will not be described again here. In this embodiment, the upper cover 20 of the stacked integrated heat sink 1d further includes a plurality of through holes 26 penetrating the top surface 22 and bottom surface 21 of the upper cover 20 to enhance heat dissipation performance. The number and size of the plurality of through holes 26 can be adjusted according to the actual application to effectively improve thermal conductivity. Of course, this invention is not limited to this.

[0051] Figures 9A to 9C are schematic diagrams illustrating the stacked integrated heat sink in the sixth embodiment of this invention. In this embodiment, the stacked integrated heat sink 1e is similar to the stacked integrated heat sink 1 shown in Figures 1, 2A, and 2B, and the same component reference numerals represent the same components, structures, and functions, which will not be described again here. In this embodiment, the stacked integrated heat sink 1e is also a two-piece structure consisting of a top cover 20 and a frame 10. The frame 10 is further formed by injection molding to form a plurality of connectors 11 that connect to the outer periphery of the top cover 20. In this embodiment, the top cover includes a plurality of notches 27 disposed on the outer periphery of the top cover 20, which spatially engage with the plurality of connectors 11, thereby strengthening the connection between the top cover 20 and the frame 10. In this embodiment, the frame 10 further includes a support platform 12, which is spatially opposite to the outer periphery of the cover 20 and recessed downward from the top surface of the frame 10, forming a gap with respect to the top surface of the frame 10, and assembling to accommodate and support the cover 20. In this embodiment, the connector 11 further protrudes from the outside to the inside through the support platform 12. The outer periphery of the support platform 12 has the same contour as the outer periphery of the cover 20. In addition, a plurality of connectors 11 are disposed on the support platform 12 and are higher than the top surface of the frame 10. Therefore, when the frame 10 is injection molded and combined with the cover 20, the frame 10 is paired with the notch 27 of the cover 20 through the connectors 11 on the support platform 12, which can provide better bonding force between the frame 10 and the cover 20.

[0052] In this embodiment, each of the plurality of notches 27 further includes a chamfered structure 271 between itself and the top surface 22 of the cover 20, and each of the plurality of connectors 11 includes a protrusion 111 spatially opposite to the chamfered structure 271. When the frame 10 is injection molded to form the plurality of connectors 11 connecting to the outer periphery of the cover 20, the protrusion 111 fits tightly with the corresponding chamfered structure 271, increasing the contact area between the cover 20 and the frame 10, and further providing better bonding force. Of course, within the dimensional accuracy allowed by injection molding, the size and shape of the chamfered structure 271 and the protrusion 111 can be adjusted according to actual application requirements. By increasing the contact area between them, the bonding force between the frame 10 and the cover 20 is further improved. In another embodiment, the structure of the notches 27 and connectors 11 can be omitted, and the frame 10 can be formed by other means before being combined with the cover 20. The frame 10 supports the outer periphery of the top cover 20 via the support platform 12, thus enabling the top cover 20 to provide sufficient heat dissipation for the chip 8 (see Figure 1). Of course, the number, size, shape, and arrangement of the connectors 11 and the notches 27 can be adjusted according to actual application requirements. This case is not limited to this.

[0053] As can be seen from the above, the stacked integrated heat sinks 1, 1a, 1b, 1c, 1d, and 1e in this case all exclude the one-piece structure and are manufactured by stacking the top cover 20 and the frame 10. The stacking method can be achieved by room temperature bonding, high temperature hot sintering, or injection molding, depending on the requirements. Moreover, the top cover 20 and the frame 10 do not need to be made of the same material and can be freely selected according to function or price. The material of the top cover 20 can be made of a high thermal conductivity ceramic plate without a metal layer, or a special pattern can be designed through a metal layer, or even a fin pattern can be made through a copper-clad process to increase the heat dissipation effect. The top cover 20 for heat dissipation can also be provided with a variable number of through holes to improve conductivity. On the other hand, when the top cover 20 and the frame 10 are made of different materials, the assembly of the top cover 20 and the frame 10 can be further strengthened by the combination of engaging elements such as the connector 11 and the notch 27. Of course, this case is not limited to this. And I will not go into details.

[0054] In summary, this invention provides a stacked integrated heatsink that combines a top cover and a frame with different coefficients of thermal expansion in a stacked manner to optimize heat dissipation while addressing thermal expansion deformation and cost issues. This stacked integrated heatsink eliminates the need for a single-piece structure, improving manufacturability and enhancing commercial feasibility. The stacked integrated heatsink consists of a top cover and a frame. The top cover contacts the chip; therefore, a material with a low coefficient of thermal expansion is selected, such as one with a coefficient of thermal expansion ranging from... / K to / K, especially / K to / K is preferred. The frame material has low requirements for thermal expansion coefficient, and can be metal, plastic, etc. Furthermore, since the top cover is used for direct contact with the chip, holes can be made in the hot areas of the chip and then filled with metal to enhance local heat conduction. Alternatively, through-holes, copper layers, or short fins can be directly generated to improve heat dissipation performance. When the top cover is made of copper, a copper layer thickness between 1 μm and 1000 μm does not affect the expansion coefficient of the top cover. On the other hand, the assembly of the top cover and frame can be achieved through bonding, sintering, welding, injection molding, and casting. Multiple frames can be molded and then combined with the top cover to form the stacked integrated heatsink of this project. The top cover and frame can be molded separately as parts and then joined through low-temperature bonding, high-temperature direct welding, solder paste application, laser spot welding, etc. The top cover can also be molded first, and then the frame material can be processed through injection molding, casting, pressing, etc., and molded to form the stacked integrated heatsink of this project. Of course, the shape of the frame relative to the cover can vary depending on the actual application requirements; it can be larger than the cover, flush with it, or smaller, designed according to the needs. When the frame is made of polymer material, the polymer material can be molded in a mold using an injection molding machine and simultaneously bonded to the cover. For a two-piece structure of cover and frame, the cover can have notches on its outer periphery to correspond to the connecting parts on the inner periphery of the frame, achieving a mating design that strengthens the bond between the two materials. Of course, this application is not limited to this.

[0055] This case can be modified in various ways by a person skilled in this technology, but all of them are still within the scope of the patent application.

[0056] 1, 1a, 1b, 1c, 1d, 1e: Stacked integrated heat sinks 6: Heat dissipation components 7, 7': Thermal interface material layer 8: Chip 9:Substrate 10: Framework 11: Connector 111: Protruding part 12: Support Platform 20: Top Cover 21: Bottom 22: Top surface 23: Metal Filling Area 24: Copper layer 25: Fins 26: Through hole 27: Gap 271: Chamfered Structure S01~S04, S11~S14: Steps

Claims

1. A stacked integrated heat sink for protecting a chip on a substrate, comprising: A frame is disposed on the substrate and surrounds the chip; And a top cover, stacked on the frame, with one bottom surface of the top cover thermally coupled to the chip.

2. The stacked integrated heat sink as claimed in claim 1, wherein the top cover is made of one of the group consisting of ceramic, metal composite, metal / ceramic composite and combinations thereof, and has a coefficient of thermal expansion in the range of / K to / K.

3. The stacked integrated heat sink as claimed in claim 1, wherein the coefficient of thermal expansion of the top cover is in the range of / K to / K.

4. The stacked integrated heat sink as claimed in claim 1, wherein the frame and the top cover are joined by means of welding, bonding, sintering, injection molding, casting, etc.

5. The stacked integrated heat sink as claimed in claim 1, wherein the top cover includes a metal-filled area that is spatially opposite to the chip and thermally coupled to the chip.

6. The stacked integrated heat sink as claimed in claim 1, wherein the top cover includes at least one copper layer disposed on a top surface and / or the bottom surface of the top cover.

7. The stacked integrated heat sink as claimed in claim 6, wherein the copper layer thickness ranges from 1 μm to 1000 μm.

8. The stacked integrated heat sink as claimed in claim 1, wherein the top cover includes a plurality of fins disposed on a top surface of the top cover and assembled and thermally coupled to the chip.

9. The stacked integrated heat sink as claimed in claim 1, wherein the top cover includes a plurality of through holes penetrating a top surface and a bottom surface of the top cover.

10. The stacked integrated heat sink as claimed in claim 1, wherein the frame and the top cover are respectively molded and then joined together by low-temperature bonding or high-temperature welding.

11. The stacked integrated heat sink as claimed in claim 1, wherein after the top cover is formed, the frame is further formed on the top cover by means of a mold through a heated material, such as injection, casting or pressing.

12. The stacked integrated heat sink as claimed in claim 1, wherein the frame is injection molded and forms a plurality of connectors to connect the outer periphery of the top cover.

13. The stacked integrated heat sink as claimed in claim 12, wherein the top cover includes a plurality of notches disposed on the outer periphery of the top cover for spatially engaging with the plurality of connectors, wherein the plurality of notches engage with the plurality of connectors.

14. The stacked integrated heat sink as claimed in claim 13, wherein each of the plurality of notches further includes a chamfered structure between itself and a top surface of the top cover, and each of the plurality of connectors includes a protrusion spatially opposite the chamfered structure, the protrusion being tightly fitted to the corresponding chamfered structure.

15. The stacked integrated heat sink as claimed in claim 12, wherein the frame further includes a support platform spatially opposite the outer periphery of the top cover and recessed downward from a top surface of the frame, wherein the connector protrudes from the outside to the inside through the support platform.

16. The stacked integrated heat sink as claimed in claim 15, wherein the outer periphery of the support platform has the same profile as the outer periphery of the top cover.

17. The stacked integrated heat sink as claimed in claim 15, wherein the plurality of connectors are disposed on the support platform and above the top surface of the frame.

18. The stacked integrated heat sink as claimed in claim 1, wherein the bottom surface of the top cover is thermally coupled to the chip through a thermal interface material layer.

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