Electronic device

Abstract

An electronic device includes a heating element and a heat dissipation structure. The heating element has a top surface. The heat dissipation structure is disposed above the heating element and connected to the top surface. The heat dissipation structure includes multiple connected plates, which are integrally formed and have a plurality of bends.

Description

Electronic devices ELECTRONIC DEVICE Technical Field

[0001] This invention relates to an electronic device, and more particularly to an electronic device including a heat dissipation structure. Prior Technology

[0002] Electronic devices generate heat during operation. Without an effective heat dissipation mechanism, this can lead to system overheating, performance degradation, or even damage. While common finned heat sinks offer some cooling performance, they still have several technical limitations, including: 1. Reliance on CNC machining, extrusion, and cutting processes, resulting in higher production costs. 2. Most finned heat sinks must be directly mounted on the heat-generating components or circuit boards, limiting installation flexibility. 3. The base size of the fins is limited by the constraints of other electronic components or device mechanisms, making it difficult to fully utilize the potential cooling area within the device. Based on these drawbacks, there is a need to develop a heat sink with a simple manufacturing process and high configuration flexibility for use in electronic devices with limited space or without active cooling devices. Summary of the Invention

[0003] This invention provides an electronic device whose heat dissipation structure can establish an effective heat conduction path and has high versatility.

[0004] The novel electronic device includes a heating element and a heat dissipation structure. The heating element has a top surface. The heat dissipation structure is disposed above the heating element and connected to the top surface. The heat dissipation structure includes multiple connected plates, which are integrally formed and have multiple bends.

[0005] In one embodiment of this invention, the aforementioned plurality of plates include a first plate, a second plate, and a third plate. The first plate is parallel to and covers the top surface. The first plate has a first side and a second side opposite to each other. The second plate is connected to the first side, and the third plate is connected to the side of the second plate away from the first plate.

[0006] In one embodiment of this novel invention, the third plate is parallel to the first plate and extends in a direction away from the second side.

[0007] In one embodiment of this novel invention, the aforementioned third plate is parallel to the first plate and extends above the first plate.

[0008] In one embodiment of this novel invention, the second plate is perpendicular to the first plate.

[0009] In one embodiment of this novel invention, the second plate is inclined relative to the first plate.

[0010] In one embodiment of this novel invention, the heat dissipation structure further includes a fourth plate connected to the second side.

[0011] In one embodiment of this novel invention, the fourth plate is perpendicular to the first plate, and the fourth plate, the first plate, and the second plate form a U-shape.

[0012] In one embodiment of this novel invention, the fourth plate is inclined to the first plate.

[0013] In one embodiment of this novel invention, the aforementioned heat dissipation structure further includes a fifth plate, which is connected to the side of the fourth plate away from the first plate.

[0014] In one embodiment of this novel invention, the fifth plate is parallel to the third plate, and the fifth plate and the third plate extend in opposite directions.

[0015] In one embodiment of this novel invention, the aforementioned heat dissipation structure further includes a sixth plate, connected to the side of the fifth plate away from the fourth plate.

[0016] In one embodiment of this invention, the electronic device further includes a circuit board, a heating element disposed on the circuit board, and the end of the heat dissipation structure away from the heating element does not overlap with the heating element in the normal direction of the circuit board surface.

[0017] In one embodiment of this invention, the electronic device further includes a heat-conducting element disposed between the top surface and the first plate.

[0018] In one embodiment of this invention, the electronic device further includes a housing, a heating element and a heat dissipation structure disposed within the housing, and a third plate fixed to the housing.

[0019] In one embodiment of this novel invention, the first plate, the second plate, and the third plate are flat plates.

[0020] In one embodiment of this invention, the heating element is a pluggable fiber optic transceiver module.

[0021] Based on the above, in the electronic device of this invention, the heat dissipation structure is positioned above the heat-generating element. The heat dissipation structure includes multiple interconnected plates, which are integrally formed and have multiple bends. In this way, the three-dimensional design of the heat dissipation structure can avoid the densely populated component areas on the circuit board and conduct heat to relatively low-temperature areas on the side or far end of the electronic device, achieving effective heat dissipation.

[0022] To make the above-mentioned features and advantages of this invention more apparent and understandable, specific embodiments are described below, along with detailed descriptions in conjunction with the accompanying drawings. Simple Explanation of the Diagram

[0023] Figure 1 is a perspective view of an electronic device according to an embodiment of the present invention. Figure 2 is a disassembly diagram of the electronic device in Figure 1. Figure 3 is a thermal simulation diagram of an electronic device according to an embodiment of the present invention. Figures 4 to 8 are perspective views of electronic devices according to other embodiments of the present invention. Implementation

[0024] Figure 1 is a perspective view of an electronic device according to an embodiment of the present invention. Figure 2 is a disassembled view of the electronic device of Figure 1. It should be noted that some unrelated structures on the circuit board in Figures 1 and 2 are omitted, and the electronic components can be appropriately configured according to actual needs, which is not limited to this invention.

[0025] Referring to Figures 1 and 2, the electronic device 100 of this embodiment includes a heating element 110 and a heat dissipation structure 120. The heating element 110 has a top surface 111 and a bottom surface 112. The heat dissipation structure 120 is disposed above the heating element 110 and connected to the top surface 111. The heat dissipation structure 120 includes multiple connected plates, which are integrally formed and have multiple bends. Here, the heat dissipation structure 120 is a sheet metal part, which is formed into a three-dimensional structure through bending and other processing methods. The heat dissipation structure 120 is, for example, an aluminum alloy sheet metal, but this embodiment is not limited to this. In other embodiments, the heat dissipation structure 120 may also be made of copper, copper alloy, high thermal conductivity composite material (e.g., graphite composite material), or high thermal conductivity engineering plastic, etc., to improve thermal conductivity or achieve a lightweight objective.

[0026] Specifically, in this embodiment, the heat dissipation structure 120 includes a first plate 121, a second plate 122 and a third plate 123. The first plate 121 is parallel to the top surface 111 and covers the top surface 111, but this is not the case.

[0027] In this embodiment, the second plate 122 is located between the first plate 121 and the third plate 123. Specifically, the first plate 121 has a first side S1 and a second side S2, the second plate 122 is connected to the first side S1, and the third plate 123 is connected to the side of the second plate 122 away from the first plate 121. The first plate 121, the second plate 122, and the third plate 123 are flat plates, and the third plate 123 is parallel to the first plate 121 and extends in a direction away from the second side S2, but this embodiment is not limited to this.

[0028] Here, the heating element 110 is a pluggable fiber optic transceiver module, namely an SFP (Small form-factor pluggable transceiver), which contains optoelectronic components, circuit boards, metal housings (Cage), and heat-conducting media inside the module, but this case is not limited to this.

[0029] In detail, in this embodiment, the electronic device 100 further includes a printed circuit board (PCB) 130, on which a heating element 110 is disposed, with its bottom surface 112 facing the surface 1301 of the PCB 130. The heat dissipation structure 120 has an end E1 away from the heating element 110, which does not overlap with the heating element 110 along the normal direction N1 of the surface 1301 of the PCB 130, wherein the normal direction N1 is perpendicular to the surface 1301 of the PCB 130. This design directs heat to relatively low-temperature areas (cold zones) on the sides or far ends of the electronic device 100.

[0030] In this embodiment, the second plate 122 is perpendicular to the first plate 121, and the first plate 121 and the third plate 123 are parallel to the surface 1301 of the circuit board 130, but this is not a limitation of the present invention.

[0031] In the above configuration, the heat dissipation structure 120 extends upward using the second plate 122 and laterally using the third plate 123. This laterally extended design is parallel to the circuit board 130, avoiding the dense component area on the circuit board 130, and dissipating the heat of the heat-generating component 110 to the relatively low-temperature area (cold zone) on the side or far end of the electronic device 100, thereby improving the heat dissipation efficiency of the heat-generating component 110, achieving effective heat diffusion, and performing well under natural convection conditions. Compared with general finned heat sinks, the heat dissipation structure 120 of this invention has a higher degree of geometric design freedom and system integration flexibility, and is suitable for electronic devices with limited space or without active heat dissipation components.

[0032] In this embodiment, the electronic device 100 further includes a housing 150, with a heating element 110 and a heat dissipation structure 120 disposed within the housing 150, and a third plate 123 fixed to the housing 150. However, this embodiment is not limited thereto. Here, the housing 150 is an upper housing, and the electronic device 100 also includes a base plate 160 disposed for assembly with the upper housing. It should be noted that the housing 150 and base plate 160 shown in Figures 1 and 2 are only schematically illustrated and are not intended to limit the scope of this embodiment.

[0033] In this embodiment, the heat dissipation structure 120 can establish a thermal coupling path with the housing 150 by being fixed to it or by being in close proximity to the housing 150, thereby achieving more effective heat dissipation. For example, the third plate 123 of the heat dissipation structure 120 is fixed to the inside of the housing 150 by thermal fusion to form a stable thermal coupling interface, but this is not a limitation. In other embodiments, the heat dissipation structure 120 can be disposed on the circuit board 130, or it can be installed on the housing 150 or the mid-frame structure by means of screws, thermally conductive tape, clips, welding, etc., and this is not a limitation.

[0034] Referring to Figure 2, in this embodiment, the electronic device 100 further includes a heat-conducting element 140, which is disposed between the top surface 111 of the heating element 110 and the first plate 121. The heat-conducting element 140 is a silicone sheet to form a continuous and effective heat conduction path. In other embodiments, the heat-conducting element 140 may also be replaced by filling the contact gap between the first plate 121 of the heat dissipation structure 120 and the heating element 110 with a material such as thermally conductive adhesive to improve stability or reduce assembly tolerance requirements.

[0035] Figure 3 is a thermal simulation diagram of an electronic device according to an embodiment of this invention. Due to the potentially poor heat convection effect under natural convection and the low thermal conductivity of air, conventional finned heat sinks are limited by their base size, making it difficult to effectively utilize module space. Referring to Figure 3, the heat dissipation structure 120 of this embodiment increases the contact volume with air, guiding heat to the side or far-end cooler areas of the electronic device 100, preventing heat accumulation near the heat-generating element 110. Experiments show that when using a conventional finned heat sink, the outer surface temperature of the heat-generating element 110 is 67.7°C. Using the heat dissipation structure 120 of this embodiment, the outer surface temperature of the heat-generating element 110 is reduced to 60.6°C, demonstrating that the electronic device 100 of this embodiment can establish an effective heat conduction path, and the heat dissipation structure 120 can effectively reduce the temperature of the heat-generating element 110, while also possessing high versatility, improving heat conduction efficiency and heat dissipation performance.

[0036] In the above embodiments, electronic device 100 is primarily used in network communication devices, but this invention can also be applied to other electronic devices, including but not limited to: 1. Internet of Things (IoT) devices: such as smart meters, environmental sensors, smart factory sensing nodes, etc. 2. Industrial computers and edge computing devices: such as DIN rail type industrial computers, edge AI processing boxes, embedded controllers, etc. 3. Power and energy control systems: such as solar inverters, battery management systems (BMS), grid modules, etc. 4. Image monitoring and processing equipment: such as network cameras, smart image processing boxes, etc. 5. Automotive electronic devices: such as vehicle communication modules, automotive IoT control boxes, etc. 6. Small servers and edge storage devices. 7. Medical instruments and equipment: such as handheld medical diagnostic instruments, portable data acquisition boxes, measurement modules, etc. 8. Consumer smart home appliance modules: smart door locks, smart audio hosts, home control boxes, etc. Most of the above devices are small in size and fanless in design, and may be installed in environments such as enclosed spaces, high-temperature outdoor areas, or environments that require quiet operation, so they rely heavily on heat dissipation mechanisms such as natural convection and coupling with the casing.

[0037] The heat dissipation structure of this invention can be customized according to the internal space configuration of the electronic device. By appropriately adjusting its shape or direction, it can extend to the lower-temperature air cooling zone to improve the heat dissipation efficiency under natural convection conditions. In some embodiments, heat dissipation fins can be added to the extended surface of the heat dissipation structure (e.g., the third plate), and further extended fins can be added to the fins to improve the convection efficiency of the cooling zone, but this is not a limitation. In some embodiments, the heat dissipation structure can be integrated with other heat dissipation modules, such as 1. using heat pipes to conduct heat to the distant cooling zone. 2. coordinating with internal flow field design (e.g., air ducts) to enhance heat exchange. 3. integrating a flow guide to improve the lateral guidance efficiency of cold airflow. In some embodiments, the heat dissipation structure can be integrated and modified with the structure of other modules: 1. the heat dissipation structure is integrated with the RF module or antenna cover into a single structure. 2. the heat dissipation structure is co-constructed with a metal EMI shield, which has both electromagnetic shielding and heat conduction functions.

[0038] Other embodiments will be listed below for illustration. It must be noted that the following embodiments use the component reference numerals and some content from the foregoing embodiments, with the same reference numerals representing the same or similar components, and descriptions of identical technical content omitted. For explanations of the omitted parts, please refer to the foregoing embodiments; these will not be repeated in the following embodiments.

[0039] Figures 4 to 8 are perspective views of electronic devices according to other embodiments of the present invention. It should be noted that the casing is omitted in Figures 4 to 8 to facilitate the display of internal components. Some irrelevant structures on the circuit board are omitted, and the electronic components can be configured as needed; this invention is not limited to this.

[0040] In Figures 4 to 8, electronic devices 100B, 100C, 100D, 100E, and 100F are slightly different from electronic device 100 in Figure 2. The main difference lies in the changes in the heat dissipation structures 120B, 120C, 120D, 120E, and 120F.

[0041] Please refer to Figure 4 first. In this embodiment, the heat dissipation structure 120B includes a first plate 121B, a second plate 122B, and a third plate 123B. The third plate 123B is parallel to the first plate 121B and extends above the first plate 121B. The heat dissipation structure 120B has an end E2 away from the heat-generating element 110. On the normal direction N1 of the surface 1301 of the circuit board 130, the end E2 does not overlap with the heat-generating element 110. This design can conduct heat to the relatively low-temperature area (cold area) on the side or far end of the electronic device 100B.

[0042] Referring to Figure 5, in this embodiment, the heat dissipation structure 120C includes a first plate 121C, a second plate 122C, a third plate 123C, and a fourth plate 124C. The fourth plate 124C is connected to the second side S2 of the first plate 121C. The fourth plate 124C is perpendicular to the first plate 121C, and the fourth plate 124C, the first plate 121C, and the second plate 122C form a U-shape. Furthermore, the heat dissipation structure 120C also includes a fifth plate 125C, connected to the side of the fourth plate 124C away from the first plate 121C. The fifth plate 125C is parallel to the third plate 123C, and the fifth plate 125C and the third plate 123C extend in opposite directions.

[0043] In other words, the heat dissipation structure 120C is double-sided, achieving heat conduction in the left and right directions. The heat dissipation structure 120C has ends E3 and E4 that are far away from the heat-generating element 110. On the normal direction N1 of the surface 1301 of the circuit board 130, ends E3 and E4 do not overlap with the heat-generating element 110. This design can conduct heat to the relatively low-temperature area (cold area) on the side or far end of the electronic device 100C.

[0044] Please refer to Figure 6. In this embodiment, the electronic device 100D differs slightly from the electronic device 100C in Figure 5. The main difference lies in the heat dissipation structure 120D, which includes a first plate 121D, a second plate 122D, a third plate 123D, a fourth plate 124D, and a fifth plate 125D. In this embodiment, the second plate 122D is inclined relative to the first plate 121D, and the fourth plate 124D is inclined relative to the first plate 121D, effectively avoiding interference elements on the circuit board 130. It should be noted that some unrelated structures on the circuit board 130 are omitted, and the electronic components can be appropriately adjusted and configured according to actual needs; this embodiment is not limited to this.

[0045] Please refer to Figure 7. In this embodiment, the electronic device 100E is slightly different from the electronic device 100C in Figure 5. The main difference is that the heat dissipation structure 120E includes a first plate 121E, a second plate 122E, a third plate 123E, a fourth plate 124E, a fifth plate 125E, and a sixth plate 126E.

[0046] In this embodiment, the fifth plate 125E is located between the fourth plate 124E and the sixth plate 126E, and the sixth plate 126E is connected to the side of the fifth plate 125E away from the fourth plate 124E. The sixth plate 126E can effectively conduct heat across regions to distant cold areas. It should be noted that some unrelated structures on the circuit board 130 are omitted, and the electronic components can be appropriately adjusted and configured according to actual needs; this embodiment is not limited to this.

[0047] Referring to Figure 8, in this embodiment, the heat dissipation structure 120F can be designed to simultaneously contact multiple heat-generating elements 110 and 110' for integrated heat conduction. Thus, the laterally extended design of the heat dissipation structure 120F, parallel to the circuit board 130, avoids densely populated component areas on the circuit board 130, integrating and guiding heat to relatively low-temperature areas (cold zones) on the side or far side of the electronic device 100F, achieving effective heat dissipation. In one embodiment, the heat-generating elements are, for example, multiple ICs, but this is not a limitation.

[0048] In summary, in this novel electronic device, the heat dissipation structure is positioned above the heat-generating components. The structure comprises multiple interconnected plates, integrally formed and exhibiting numerous bends. By designing the heat dissipation structure laterally parallel to the circuit board, it avoids densely populated component areas on the board, guiding heat to the sides or distant cooler areas of the electronic device, achieving effective heat dissipation. Compared to conventional finned heat sinks, this heat dissipation structure offers greater geometric design freedom and system integration flexibility, making it suitable for electronic devices with limited space or without active heat dissipation components. Furthermore, the heat dissipation structure can also form thermal coupling with the casing, allowing some heat to dissipate through the exterior of the casing, further enhancing overall thermal management performance.

[0049] Although the present invention has been disclosed above by way of embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the art can make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

[0050] 100, 100B, 100C, 100D, 100E, 100F: Electronic devices 110, 110': Heating element 111: Top surface 112: Bottom surface 120, 120B, 120C, 120D, 120E, 120F: Heat dissipation structure 121, 121B, 121C, 121D, 121E: First plate 122, 122B, 122C, 122D, 122E: Second plate 123, 123B, 123C, 123D, 123E: Third plate 124C, 124D, 124E: Fourth plate 125C, 125D, 125E: Fifth plate 126E: Sixth Plate 130: Circuit board 1301: Surface 150: Chassis 160: Base Plate E1, E2, E3, E4: End S1: First side S2: Second side N1: Normal direction

Claims

1. An electronic device comprising: The heating element has a top surface; A heat dissipation structure is disposed above the heat-generating element and connected to the top surface. The heat dissipation structure includes multiple connected plates, which are integrally formed and have multiple bends.

2. The electronic device of claim 1, wherein the plurality of plates includes a first plate, a second plate and a third plate, the first plate being parallel to and covering the top surface, the first plate having opposing first and second sides, the second plate being connected to the first side, and the third plate being connected to the side of the second plate away from the first plate.

3. The electronic device as claimed in claim 2, wherein the third plate is parallel to the first plate and extends in a direction away from the second side.

4. The electronic device as claimed in claim 2, wherein the third plate is parallel to the first plate and extends above the first plate.

5. The electronic device as claimed in claim 2, wherein the second plate is perpendicular to the first plate.

6. The electronic device as claimed in claim 2, wherein the second plate is inclined to the first plate.

7. The electronic device as claimed in claim 2, wherein the heat dissipation structure further includes a fourth plate connected to the second side.

8. The electronic device of claim 7, wherein the fourth plate is perpendicular to the first plate, and the fourth plate, the first plate, and the second plate are U-shaped.

9. The electronic device as claimed in claim 7, wherein the fourth plate is inclined to the first plate.

10. The electronic device of claim 7, wherein the heat dissipation structure further includes a fifth plate connected to the fourth plate on the side away from the first plate.

11. The electronic device of claim 10, wherein the fifth plate is parallel to the third plate and the fifth plate extends in opposite directions to the third plate.

12. The electronic device of claim 10, wherein the heat dissipation structure further includes a sixth plate connected to the fifth plate on the side away from the fourth plate.

13. The electronic device as claimed in claim 2 further includes a circuit board, wherein the heating element is disposed on the circuit board, and in the normal direction of the surface of the circuit board, the end of the heat dissipation structure away from the heating element does not overlap the heating element.

14. The electronic device as claimed in claim 2, further comprising a heat-conducting element disposed between the top surface and the first plate.

15. The electronic device as claimed in claim 2, further comprising a housing, wherein the heating element and the heat dissipation structure are disposed within the housing, and the third plate is fixed to the housing.

16. The electronic device as claimed in claim 2, wherein the first plate, the second plate and the third plate are flat plates.

17. The electronic device as claimed in claim 1, wherein the heating element is a pluggable fiber optic transceiver module.

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