Heat dissipation device for halogen bulbs used in semiconductor equipment

Abstract

This invention discloses a heat dissipation device for halogen lamps used in semiconductor equipment. The device includes at least one halogen lamp, which is composed of a quartz shell, a filament, two molybdenum sheets, and a sealing section. The key feature is that the sealing section is formed of ceramic, and a heat dissipation vent is formed on the sealing section. Since the equipment has a forced cooling fan device, which is required to heat a large number of halogen lamps during the semiconductor epitaxial growth process, the heat dissipation effect of the sealing section can be improved, reducing the accumulation of a large amount of heat energy in the sealing section of the ceramic head, thereby extending the service life of the halogen lamp and increasing the production capacity of semiconductor wafers.

Description

Heat dissipation device for halogen bulbs used in semiconductor equipment Technical Field

[0001] This invention relates to a heat dissipation device for halogen bulbs used in semiconductor equipment, specifically involving an innovative ceramic head sealing part for halogen bulbs, which can be used to reduce the high temperature of the sealing part and extend the service life of the halogen bulb. Prior Technology

[0002] In the semiconductor wafer manufacturing process, epitaxial growth, a technique that grows new crystals on existing wafers to form new semiconductor layers, requires a large number of heating devices to supply heat to the reaction chamber to raise the temperature. Since the heating temperature during epitaxial growth can reach as high as 1000°C, it consumes a considerable amount of voltage. Therefore, it is urgent to find a way to effectively reduce the temperature of the halogen lamp sealing section in order to extend the life of the halogen lamp and save a lot of energy.

[0003] Please refer to Figure 4, which shows a heating device using multiple halogen lamps 100 in a previous epitaxial wafer setup to deliver heat energy into the reaction chamber and raise the temperature inside. The transparent quartz shell 101 of the halogen lamp 100 contains a high-strength filament 102. The end of the filament 102 is electrically connected to a molybdenum sheet 103, which is connected to a sealing portion 104. Since the sealing portion 104 of the ceramic head does not have any heat dissipation device, the temperature generated by the filament 102 during the epitaxial growth of semiconductor devices can reach as high as 1000°C. Although external circulating cooling fans are used to cool it down, the effect is not significant, which can easily damage or scrap the halogen lamps. Therefore, the consumption of halogen lamps is quite troublesome in the semiconductor device manufacturing process. In addition to cost considerations, the most important factor is that it affects the production process and reduces production capacity. Therefore, there is a great need for a solution to reduce halogen lamp consumption in order to maintain normal mass production of semiconductor wafers.

[0004] Based on years of experience and continuous testing and improvement, the creator has finally developed a heat dissipation device for halogen bulbs used in semiconductor equipment, which can eliminate the shortcomings of conventional products and improve efficiency. Summary of the Invention

[0005] The main purpose of this invention is to provide a heat dissipation device for halogen bulbs used in semiconductor equipment. It mainly consists of a high-intensity filament containing halogen gas. The end of the coil-shaped filament is connected to a sealing section with a heat dissipation vent to reduce the temperature of the molybdenum sheet connected to the end of the filament, thereby improving the heat dissipation effect of the sealing section and extending the service life of the halogen bulb.

[0006] To achieve the above objectives, the following technical means are employed in this work:

[0007] A heat dissipation device for a halogen lamp used in a semiconductor machine, the device comprising at least one halogen lamp, the halogen lamp comprising:

[0008] A quartz shell containing halogen gas;

[0009] A filament is installed inside the quartz housing;

[0010] A dimolybdenum sheet, electrically connected to the tail end of the filament; and

[0011] A sealing section is provided to seal part of the structure of the two molybdenum sheets. At least one heat dissipation vent is provided on the sealing section to reduce the temperature of the sealing section.

[0012] To provide your review committee with a better understanding of this work, the following diagrams are provided to illustrate it in detail: Simple Explanation of the Diagram

[0013]

[0014] Figure 1: A perspective view showing the halogen lamp of this embodiment.

[0015] Figure 2: An exploded view showing the halogen lamp of this embodiment.

[0016] Figure 3: A plan view showing the halogen lamp of this embodiment.

[0017] Figure 4: A three-dimensional view showing other commonly known halogen lamps. Implementation

[0018] Referring to Figures 1 to 3, the figures show the schematic diagram of a halogen lamp according to an embodiment of this invention. This halogen lamp 10 can be used to handle the large amount of heating required during the epitaxial growth of semiconductor wafers. The device includes a forced cooling fan and a transparent quartz shell 11 containing a high-intensity filament 12. Two molybdenum sheets 13 at the tail end of the filament 12 are connected to a sealing portion 14, which seals part of the molybdenum sheets 13 into a ceramic head. During the epitaxial growth of semiconductor devices, the high-intensity filament 12 containing halogen gas (such as iodine) within the quartz shell 11 generates considerable heat energy, resulting in a high temperature. The temperature can reach 1000℃. The two molybdenum sheets 13 electrically connected to the tail end of the filament 12 will cause the sealing part 14 of the ceramic head to generate high temperature. Therefore, the heat dissipation effect of the sealing part 14 is an important issue that must be strengthened. This is the main purpose of this invention. At least one heat dissipation port 141 is provided on the sealing part 14. In this embodiment, the heat dissipation port 141 is recessed into a U-shape. However, the described embodiment is only a part of the embodiment of this invention, not all of the embodiments. Other embodiments obtained by those skilled in the art based on the embodiments of this invention before making any progress are all within the scope of protection of this invention.

[0019] The heat dissipation vent 141 on the sealing part 14 can reduce the temperature of the molybdenum sheet 13, thereby improving the heat dissipation effect of the sealing part 14, reducing the heat energy accumulated in the ceramic head sealing part 14, and extending the service life of the halogen lamp 10.

[0020] The above-described halogen lamp 10 ceramic head sealing part 14 device is used in the semiconductor epitaxial growth process, which requires a considerable number of halogen lamps 10. The high temperature generated by the heating consumes a considerable amount of voltage. It saves a considerable amount of electrical energy in the semiconductor device manufacturing process, which is a rare innovative research in the industry.

[0021] In summary, this invention relates to a heat dissipation device for halogen bulbs used in semiconductor equipment. This innovative halogen lamp features a heat dissipation vent on its ceramic head seal, which reduces the temperature of the molybdenum sheet at the high-temperature filament end, thereby lowering the temperature of the ceramic head seal and extending the halogen lamp's lifespan. Its practical effectiveness is undeniable. Furthermore, this invention has never been publicly disclosed or published in other publications, thus meeting the requirements of patent law. Therefore, this patent application is filed in accordance with the law.

[0022]

[0023] (10): Halogen lamp

[0024] (11): Quartz shell

[0025] (12): Filament

[0026] (13): Molybdenum sheet

[0027] (14): Sealing part

[0028] (141): Heat dissipation port

[0029] (100): Halogen lamp

[0030] (101): Quartz shell

[0031] (102): Filament

[0032] (103): Molybdenum sheet

[0033] (104): Sealing section

Claims

1. A heat dissipation device for a halogen lamp used in a semiconductor machine, the device comprising at least one halogen lamp, the halogen lamp comprising: a quartz housing containing halogen gas; a filament installed inside the quartz housing; two molybdenum sheets electrically connected to the ends of the filament; and a sealing portion sealing a portion of the structure of the two molybdenum sheets, the sealing portion having at least one heat dissipation vent to reduce the temperature of the sealing portion.

2. The heat dissipation device for a halogen bulb used in a semiconductor machine as described in claim 1, wherein the heat dissipation opening of the sealing portion is U-shaped.

3. The heat dissipation device for a halogen bulb used in a semiconductor machine as described in claim 1, wherein the sealing portion is a ceramic head structure.

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