Energy Patch

Abstract

An energy patch, suitable for application to an object, comprises a carrier layer, an adhesive layer, a printed layer, and a chip. The carrier layer includes a first surface and a second surface opposite to each other, and can generate far-infrared rays, terahertz waves, magnetic fields, or negative ions. The adhesive layer is disposed on the first surface of the carrier layer and is used to adhere to the object. The printed layer is disposed on the second surface of the carrier layer and can generate far-infrared rays, terahertz waves, magnetic fields, or negative ions. The chip is disposed on either the first or second surface of the carrier layer. In addition to the carrier layer, the printed layer and the chip of this novel energy patch can also produce the same or different functions as the carrier layer, thus possessing multiple different functions or stronger effects, thereby improving consumer well-being.

Description

Energy Patch Technical Field

[0001] This invention relates to a patch, and more particularly to an energy patch that can promote blood circulation. Prior Technology

[0002] Modern people are prone to poor blood circulation due to sedentary lifestyles, lack of exercise, smoking, and other unhealthy habits or factors. Poor blood circulation can lead to other problems, such as cold hands and feet.

[0003] To promote blood circulation, a solution has been developed that involves wearing a device that generates far-infrared rays, terahertz waves, magnetic fields, or negative ions.

[0004] For example, an energy patch capable of generating far-infrared rays, terahertz waves, magnetic fields, or negative ions can be attached to the wearable device to endow it with these functionalities. Such energy patches are typically made by incorporating effective materials, such as germanium stone that generates negative ions, in powder form into the patch itself. Existing energy patches often suffer from limitations such as limited functionality or weak functional intensity, requiring further improvement. Summary of the Invention

[0005] Therefore, the purpose of this invention is to provide an energy patch with a novel structural design.

[0006] Therefore, this novel energy patch is suitable for being attached to an object and includes a carrier layer, an adhesive layer, a printing layer, and a chip.

[0007] The carrier layer includes a first surface and a second surface that are opposite to each other, and can generate far-infrared rays, terahertz waves, magnetic fields or negative ions.

[0008] The bonding layer is disposed on the first surface of the carrier layer and is suitable for being attached to the object.

[0009] The printed layer is disposed on the second surface of the carrier layer and can generate far-infrared rays, terahertz waves, magnetic fields or negative ions.

[0010] The wafer is disposed on the first surface or the second surface of the carrier layer.

[0011] The advantage of this new invention is that, in addition to the carrier layer, the printed layer and the chip can also produce the same or different functions as the carrier layer. Therefore, the new energy patch can have a variety of different functions or stronger effects, thereby improving the well-being of consumers. Simple Explanation of the Diagram

[0012] Other features and effects of this invention will be clearly presented in the embodiments with reference to the drawings, wherein: Figure 1 is an exploded perspective view illustrating a first embodiment of the novel energy patch; Figure 2 is an incomplete and partially cut cross-sectional view illustrating the first embodiment; Figure 3 is an exploded perspective view illustrating a second embodiment of the novel energy patch; and Figure 4 is an incomplete and partially cut cross-sectional view illustrating the second embodiment. Implementation

[0013] Referring to Figures 1 and 2, a first embodiment of this novel energy patch is suitable for attaching to an object 9. The object 9 can be, for example, a hat, clothes, pants, gloves, scarf, shoes, or other wearable items.

[0014] This first embodiment includes a carrier layer 1, an adhesive layer 2 and a printing layer 3 disposed on two opposite sides of the carrier layer 1, and a wafer 4 disposed between the adhesive layer 2 and the carrier layer 1.

[0015] The carrier layer 1 includes titanium, germanium, zinc, magnet, graphene or tourmaline, and can be used to generate far-infrared rays (generated by titanium, germanium, zinc or graphene), terahertz waves (generated by tourmaline), magnetic fields (generated by magnet) or negative ions (generated by tourmaline).

[0016] In this first embodiment, the carrier layer 1 is a square-shaped fiber cloth comprising titanium, germanium, zinc, magnet, graphene, or tourmaline. Specifically, in this first embodiment, titanium, germanium, zinc, magnet, graphene, or tourmaline is ground into powder, then the powder is mixed into a spinning solution to form fibers, and then the fibers are made into a fiber cloth. In other embodiments of this invention, titanium, germanium, zinc, magnet, graphene, or tourmaline can also be ground into powder and then sprayed / coated onto a fabric before being cut to serve as the carrier layer 1. In other embodiments of this invention, the carrier layer 1 can also be circular, square, or other geometric shapes besides circular, or have different patterns, such as a cloud shape.

[0017] Since the carrier layer 1 is a piece of cloth, it is flat and sheet-like, and includes a first surface 11 and a second surface 12 that are opposite to each other.

[0018] The shape of the adhesive layer 2 corresponds to the shape of the carrier layer 1. The adhesive layer 2 is disposed on the first surface 11 of the carrier layer 1 and completely covers the first surface 11. The adhesive layer 2 is suitable for being attached to the object 9. In this first embodiment, the adhesive layer 2 is a double-sided adhesive sheet, and a release paper (not shown) is disposed on the side of the adhesive layer 2 opposite to the first surface 11.

[0019] In other embodiments of this invention, the bonding layer 2 may also be a layered structure formed by adhesive or hot melt adhesive, or a piece of self-adhesive fabric or Velcro bonded or sewn to the first surface 11 of the carrier layer 1. The bonding layer 2 may vary depending on the material of the object 9, and is not limited to the examples described above.

[0020] The printed layer 3 corresponds to the shape of the carrier layer 1 and is disposed on the second surface 12 of the carrier layer 1. The printed layer 3 is composed of a printing material. The printing material includes titanium, germanium, zinc, magnet, graphene, or tourmaline, as well as a printing component. The printing component is ink, adhesive, or polymer material. Since the printed layer 3 includes titanium, germanium, zinc, magnet, graphene, or tourmaline, the printed layer 3 can generate far-infrared rays, terahertz waves, magnetic fields, or negative ions through the titanium, germanium, zinc, magnet, graphene, or tourmaline.

[0021] In this first embodiment, titanium, germanium, zinc, magnet, graphene or tourmaline are ground into powder, and pigments (which can be omitted) are added as needed and then mixed with polymer materials. The printed layer 3 with a certain thickness and fully covering the second surface 12 is printed by 3D printing technology.

[0022] In other embodiments of this invention, titanium, germanium, zinc, magnet, graphene, or tourmaline can be ground into powder and mixed with ink or adhesive, then printed to create a planar pattern formed by the ink or a micro-embossed pattern formed by the adhesive. In this embodiment, the printed layer 3 can only partially cover the second surface 12 of the carrier layer 1.

[0023] In this first embodiment, the wafer 4 is disposed between the first surface 11 of the carrier layer 1 and the bonding layer 2. The size of the wafer 4 is smaller than the size of the carrier layer 1 and smaller than the size of the bonding layer 2. Therefore, the wafer 4 is covered by the carrier layer 1 and the bonding layer 2, and is encapsulated between the carrier layer 1 and the bonding layer 2. In the manufacturing process of this first embodiment, the wafer 4 is first placed on the bonding layer 2 for adhesion and positioning, and then the carrier layer 1 and the bonding layer 2 are adhered together.

[0024] In this first embodiment, the chip 4 is a terahertz chip, quantum chip, radio wave resonance chip, bio-information chip, magnetic chip, far-infrared chip, or negative ion chip. Therefore, the chip 4 can generate far-infrared rays, terahertz waves, magnetic fields, or negative ions. In other embodiments of this invention, the chip 4 can also be a sensing chip 4, such as an NFC chip, RFID chip, or IC chip (Mifare chip), etc., which can be configured according to needs to enable this first embodiment to have more diversified functions, but the implementation is not limited to the above types.

[0025] In the manufacturing of this novel material, materials with different functions can be selected according to actual needs. For example, the carrier layer 1 includes germanium, which can generate far-infrared rays, while the printed layer 3 includes magnets, which can generate magnetic fields, and the wafer 4 can be a terahertz wafer. In this way, the novel material has three different functions: simultaneously generating far-infrared rays, magnetic fields, and terahertz waves.

[0026] For another example, when the carrier layer 1, the printed layer 3, and the wafer 4 are made of materials with the same function, such as the carrier layer 1 and the printed layer 3 both containing magnets, and the wafer 4 being a magnetic wafer, then this new invention has the effect of enhancing the magnetic field generation function (that is, the generated magnetic field strength is stronger) compared to the prior art.

[0027] In other embodiments of this invention, the carrier layer 1 may also include one or all of titanium, germanium, zinc, magnet, graphene or tourmaline, and the printed layer 3 may also include one or all of titanium, germanium, zinc, magnet, graphene or tourmaline.

[0028] Referring to Figures 3 and 4, a second embodiment of this novel energy patch is similar to the first embodiment, except that the chip 4 is disposed on the second surface 12 of the carrier layer 1 and located between the carrier layer 1 and the printed layer 3. Specifically, the chip 4 is covered by the carrier layer 1 and the printed layer 3, and is encased between the carrier layer 1 and the printed layer 3.

[0029] In summary, in addition to the carrier layer 1, the printed layer 3 and the chip 4 of this novel energy patch can also produce the same or different functions as the carrier layer 1. Therefore, this novel energy patch can have a variety of different functions or stronger effects, which can increase the well-being of consumers and thus truly achieve the purpose of this novel patch.

[0030] However, the above description is merely an embodiment of this invention and should not be construed as limiting the scope of implementation of this invention. Any simple equivalent changes and modifications made in accordance with the scope of the patent application and the contents of the patent specification shall still fall within the scope of this invention.

[0031] 1: Carrier layer 11: First Surface 12: Second Surface 2: Adhesive layer 3: Printed layer 4: Chip 9:Object

Claims

1. An energy patch suitable for attachment on an object, comprising: a carrier layer including a first surface and a second surface opposite to each other, and capable of generating far-infrared rays, terahertz waves, magnetic fields or negative ions; an adhesive layer disposed on the first surface of the carrier layer and suitable for attachment on the object; a printing layer disposed on the second surface of the carrier layer and capable of generating far-infrared rays, terahertz waves, magnetic fields or negative ions; and a chip disposed on the first surface or the second surface of the carrier layer.

2. The energy patch as described in claim 1, wherein, The carrier layer includes titanium, germanium, zinc, magnet, graphene, or tourmaline.

3. The energy patch as described in claim 1, wherein, The printed layer is made of a printing material, which may include titanium, germanium, zinc, magnet, graphene or tourmaline.

4. The energy patch as described in claim 1, wherein, The chip can be a terahertz chip, quantum chip, radio wave resonance chip, bio-information chip, magnetic chip, far-infrared chip, or negative ion chip.

5. The energy patch as described in claim 1, wherein, This chip is a sensor chip.

6. The energy patch as described in claim 1, wherein, The wafer is disposed on the first surface and covered by an adhesive layer, located between the carrier layer and the adhesive layer.

7. The energy patch as described in claim 1, wherein, The wafer is disposed on the second surface and covered by the printed layer, located between the carrier layer and the printed layer.

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