Headphone electroplating device

The headphone electroplating apparatus addresses deformation issues by applying balanced force to both surfaces of the part, ensuring even metal adhesion and stable assembly, enhancing production yield and reliability.

TWM685317UActive Publication Date: 2026-07-11LUXSHARE PRECISION ACCESSORY SUZHOU LTD
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Patent Information

Application Number
TW115203397
Authority / Receiving Office
TW · TW
Patent Type
Utility models
Current Assignee / Owner
Priority Date
2026-03-12
Filing Date
2026-04-17
Publication Date
2026-07-11
Estimated Expiration
2036-04-16

AI Technical Summary

Technical Problem

Existing headphone manufacturing processes face issues with parts deformation during electroplating due to clamping, affecting the quality of the electroplated layer and subsequent assembly, leading to reduced production yield and product reliability.

Method used

An electroplating apparatus for headphones with a clamping member that applies balanced force to both surfaces of the part to be electroplated, using elastic clamping members with grooves and protrusions to ensure even adhesion of the metal layer and prevent deformation, facilitating stable clamping and assembly.

Benefits of technology

The solution ensures even adhesion of the metal layer, prevents deformation, and improves production yield and product reliability by maintaining the part's stability during electroplating and assembly.

✦ Generated by Eureka AI based on patent content.

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  • Figure IMG-2_DRAW_04_A0101_DRAWINGS_1
    Figure IMG-2_DRAW_04_A0101_DRAWINGS_1
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Abstract

This application relates to an earphone electroplating apparatus for electroplating earphone parts. The part to be electroplated has a clamping portion, which has a first surface and a second surface opposite each other along a first direction, the first direction being its thickness direction. The earphone electroplating apparatus includes a suspension member and a clamping member. The suspension member is used to connect to an external fixing device, and the clamping member is connected to the suspension member. The clamping member includes two opposing clamping portions, which respectively press against the first surface and the second surface. Through the above technical solution, the clamping forces of the two clamping portions act simultaneously at the connection point and maintain force balance, thereby avoiding deformation caused by applying pressure only to the outer wall, ensuring that the metal elements in the electroplating solution are uniformly adhered to the surface of the part to be electroplated, and guaranteeing the quality of the electroplated layer.
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Description

Headphone electroplating device Technical Field

[0001] This application relates to the field of electroplating equipment technology, and in particular to an electroplating equipment for headphones. Prior Technology

[0002] In the manufacturing of headphone products, in order to achieve specific functions of plastic products, such as the conductivity of connectors, it is usually necessary to electroplate some plastic products.

[0003] In related technologies, clamping devices are typically used to hold and fix the outer wall of the part to be electroplated. However, some parts to be electroplated have hollow cavities, which can easily cause deformation during clamping. This not only affects the quality of the electroplated layer but also makes subsequent assembly difficult due to deformation, reducing production yield and product reliability. Summary of the Invention

[0004] Therefore, it is necessary to provide an earphone electroplating device to address the problem that the parts to be electroplated are easily deformed during the clamping process.

[0005] An electroplating apparatus for earphones is provided for electroplating earphone parts to be electroplated. The parts to be electroplated are provided with a clamping portion, the clamping portion having a first surface and a second surface opposite to each other along a first direction, the first direction being the thickness direction of the clamping portion; the earphone electroplating apparatus includes: Suspension components are used to connect to external fixing devices; A clamping member is connected to a suspension member; the clamping member includes two clamping parts, which are arranged opposite to each other and can respectively press against the first surface and the second surface.

[0006] In one embodiment, the earphone electroplating device includes a plurality of spaced-apart clamping members, each clamping a portion to be clamped.

[0007] In one embodiment, the clamping part includes: The clamping section is configured to press against the clamped part; The transition section has a first end and a second end, the first end being connected to one end of the clamping section and the second end being connected to the suspension member; In this case, the distance between the second ends of the two transition segments is greater than the distance between the first ends.

[0008] In one embodiment, one of the clamped portion and the clamping segment is provided with a groove, and the other is provided with a matching protrusion that can be engaged in the groove.

[0009] In one embodiment, the free end of the clamping section is configured as a guide section, which is gradually inclined away from the transition section and away from the opposite clamping part.

[0010] In one embodiment, the clamping section is provided with a clearance structure, which is located between the guide section and the transition section.

[0011] In one embodiment, the first end is connected to the clamping segment by an arc transition, and / or the second end is connected to the suspension member by an arc transition.

[0012] In one embodiment, the transition section is arranged parallel to the suspension member; and / or, the transition section and the clamping section have an angle between them.

[0013] In one embodiment, the clamping member is made of an elastic material and has an initial state and a clamping state. When the clamping member is in the initial state, the distance between the two clamping parts is less than the thickness of the clamped part. When the clamping member is in the clamping state, the clamping parts press against the clamped part.

[0014] In one embodiment, the surface of the clamping part used to press against the clamped part is provided with an anti-slip structure.

[0015] In the aforementioned headphone electroplating device, the clamping member is connected to the suspension member. The two clamping parts of the clamping member press against the first and second surfaces of the clamped part, respectively. The two clamping parts cooperate to hold the part to be electroplated. This configuration ensures that the clamping force provided by the two clamping parts acts simultaneously at the connection point between the clamped part and the clamping member, resulting in force balance at this point. This avoids deformation of the part to be electroplated due to pressure applied only to the outer wall of the part, allowing the metal elements in the electroplating solution to adhere evenly to the surface of the part, ensuring the quality of the electroplated layer. Simultaneously, it facilitates subsequent assembly of the part to be electroplated, improving production yield and product reliability. Simple Explanation of the Diagram

[0016] Figure 1 is a schematic diagram of the structure of an earphone electroplating device provided in an embodiment of this application; Figure 2 is a partial enlarged view of point A in the device shown in Figure 1. Implementation

[0017] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0018] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0019] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "plural" appears, "plural" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0020] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," "fixing," etc., shall be interpreted broadly. For example, they may refer to a fixed connection, a detachable connection, or an integral part; a mechanical connection or an electrical connection; a direct connection or an indirect connection through an intermediate medium; or the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0021] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "under," and "below" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0022] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0023] Referring to Figures 1 and 2, one embodiment of this application provides an earphone electroplating apparatus for electroplating an earphone part 100 to be electroplated. The part 100 to be electroplated has a clamping portion 110. The clamping portion 110 has a first surface 111 and a second surface 112 opposite to each other along a first direction, the first direction being the thickness direction of the clamping portion 110. The earphone electroplating apparatus includes a suspension member 10 and a clamping member 20. The suspension member 10 is used to connect to an external fixing device. The clamping member 20 is connected to the suspension member 10. The clamping member 20 includes two clamping portions 21, which are arranged opposite to each other and can respectively press against the first surface 111 and the second surface 112. The X direction is the first direction.

[0024] Applying the technical solution of this application, the clamping member 20 is connected to the suspension member 10. The two clamping portions 21 of the clamping member 20 respectively press against the first surface 111 and the second surface 112 of the clamped portion 110. The two clamping portions 21 cooperate to clamp the part to be electroplated 100. With this configuration, the clamping force provided by the two clamping portions 21 acts simultaneously on the connection between the clamped portion 110 and the clamping member 20, and the force is balanced at the connection. This avoids deformation of the part to be electroplated 100 caused by applying pressure only to the outer wall of the part to be electroplated, thereby allowing the metal elements in the electroplating solution to adhere evenly to the surface of the part to be electroplated 100, ensuring the quality of the electroplated layer. At the same time, it facilitates the subsequent assembly of the part to be electroplated 100, improving production yield and product reliability.

[0025] In some embodiments, the suspension member 10 is provided with a suspension hole 11, which is used to connect to an external fixing device.

[0026] In some embodiments, the part to be electroplated 100 is a connector inside the earphone. The connector is made of electroplating grade plastic material, and usually the plastic part is molded into a connector before electroplating.

[0027] In some embodiments, the workpiece 100 to be electroplated is provided with a chamber 120, the first surface 111 and the second surface 112 are the inner sidewall and the outer sidewall of the chamber 120, respectively, and the thickness direction of the clamped part 110 is also the radial direction of the chamber 120.

[0028] In related technologies, when the clamping device grips the workpiece 100 to be electroplated, causing the workpiece 100 to deform, the electroplating layer adheres to the workpiece 100, leading to the workpiece 100 solidifying and forming. After the clamping device is removed, the deformation cannot be reset, resulting in deformation of the sidewall of the workpiece 100. However, in this application, because the inner and outer sidewalls of the clamped part 110 are subjected to balanced forces, the clamped part 110 does not deform towards the center of the chamber 120, and the workpiece 100 can be normally assembled after solidification.

[0029] Referring to Figures 1 and 2, the headphone electroplating device includes a plurality of spaced-apart clamping members 20, each clamping a portion 110. This arrangement, with the clamping members 20 clamping at different positions on the clamped portion 110, improves the stability of the part to be electroplated 100, ensuring more even fixation during electroplating and effectively preventing the part 100 from swaying or tilting in the electroplating solution due to liquid flow or its own gravity, thus enhancing clamping stability.

[0030] In some embodiments, the headphone electroplating device includes two clamping members 20, which are respectively connected to different positions of the workpiece 100 to be electroplated, such that the connection point between one clamping member 20 and the workpiece 100 is a positive electrode, and the connection point between the other clamping member 20 and the workpiece 100 is a negative electrode, thereby forming a conductive circuit between the headphone electroplating device and the workpiece 100. When energized, metal elements will adhere to the surface of the workpiece 100.

[0031] Specifically, the clamping member 20 is made of an elastic material and has an initial state and a clamping state. When the clamping member 20 is in the initial state, the distance between the two clamping parts 21 is less than the thickness of the clamped part 110. When the clamping member 20 is in the clamping state, the clamping parts 21 press against the clamped part 110. With this configuration, the clamping member 20 itself has the function of elastic clamping, eliminating the need for additional springs or fasteners, simplifying the structure of the headphone electroplating device and reducing manufacturing costs. When it is necessary to clamp the part to be electroplated 100, simply open the two clamping parts 21 so that the clamped part 110 of the part to be electroplated 100 can be inserted. The clamping member 20 automatically clamps the part to be electroplated 100 by its own elastic restoring force, making the operation simple and quick. Furthermore, since the distance between the two clamping parts 21 is less than the thickness of the clamped part 110 in the initial state, the clamping member 20 always maintains a certain elastic deformation in the clamping state, thereby generating a continuous clamping force. This continuous elastic pressure enables the workpiece 100 to remain stable throughout the electroplating process.

[0032] Referring to Figures 1 and 2, the clamping part 21 includes a clamping section 211 and a transition section 212. The clamping section 211 is configured to press against the clamped part 110. The transition section 212 has a first end 2121 and a second end 2122. The first end 2121 is connected to one end of the clamping section 211, and the second end 2122 is connected to the suspension member 10. The distance between the second ends 2122 of the two transition sections 212 is greater than the distance between the first ends 2121. This configuration allows the transition section 212 to provide a certain elastic deformation space, making the clamping process smoother and increasing the deformation range of the clamping section 211, thus improving the versatility of the headphone electroplating device. At the same time, the transition section 212 can also generate a certain restoring force, ensuring that the clamping part 21 can continuously and stably press against the clamped part 110.

[0033] Referring to Figure 2, one of the clamped part 110 and the clamping section 211 is provided with a groove 31, and the other is provided with a matching protrusion 32, which can be engaged into the groove 31. This arrangement improves the stability of the connection between the clamping part 21 and the workpiece 100 to be electroplated, effectively preventing accidental displacement of the workpiece 100 during the electroplating process, ensuring that the workpiece 100 is always kept in the preset position, and improving the reliability of the connection between the clamping part 21 and the workpiece 100 to be electroplated. At the same time, it facilitates the processing and manufacturing of the workpiece 100 to be electroplated and the clamping part 21 without the need for additional parts, reducing the complexity and manufacturing cost of the headphone electroplating device. Furthermore, the matching structure of the groove 31 and the protrusion 32 is simple and facilitates the connection between the workpiece 100 to be electroplated and the clamping part 21. At the same time, after the protrusion 32 is inserted into the groove 31, the two can form a multi-directional limiting effect, which can not only restrict the rotation of the electroplated part 100 in the circumferential direction, but also effectively prevent its movement in the vertical direction.

[0034] Specifically, during the actual clamping process, after the clamping part 21 is opened, it moves on the surface of the clamped part 110. When the groove 31 aligns with the protrusion 32, the clamping member 20 relies on its own elastic restoring force to bring the groove 31 and the protrusion 32 closer together, thereby causing the protrusion 32 to engage in the groove 31. This design eliminates the need for complex adjustments or additional fastening tools, improving clamping efficiency and ease of operation.

[0035] In some embodiments, the workpiece to be electroplated 100 is provided with a groove 31, and the clamping part 21 is provided with a corresponding protrusion 32.

[0036] In other embodiments, the clamping part 21 is provided with a groove 31, and the workpiece to be electroplated 100 is provided with a matching protrusion 32.

[0037] In some embodiments, the clamping segment 211 engages with the first surface 111 through the groove 31 and the protrusion 32; the clamping segment 211 engages with the second surface 112 through the groove 31 and the protrusion 32.

[0038] In some embodiments, the clamping part 21 is provided with an anti-slip structure on the surface of the clamped part 110 used to press against it. With this configuration, the anti-slip structure can significantly increase the coefficient of friction between the clamping part 21 and the clamped part 110, and even under the lubrication of the electroplating solution, it can effectively prevent the workpiece 100 to be electroplated from sliding relative to the clamping part 21 during the clamping process, thus ensuring the stability and reliability of the clamping.

[0039] In some embodiments, the anti-slip structure is an array of raised structures.

[0040] Referring to Figure 2, the free end of the clamping section 211 is configured as a guide section 213. The guide section 213 is gradually inclined away from the transition section 212 and away from the opposite clamping part 21. With this configuration, during the clamping process, when the clamping part 21 approaches the workpiece 100 to be electroplated, the guide section 213 can first contact the edge of the clamped part 110, and guide the clamping part 21 to gradually slide into the correct position through its inclined surface, realizing the smooth introduction and precise positioning of the clamping part 21, greatly simplifying the clamping operation.

[0041] In some embodiments, the ends of the guide segments 213 away from the transition segments 212 are free ends. The distance between the free ends of the two guide segments 213 is greater than the thickness of the clamped portion 110, and the distance between the grooves 31 or protrusions 32 on at least two clamping portions 21 is less than the thickness of the clamped portion 110. That is, when a groove 31 is provided on the clamping portion 21, the distance between the two grooves 31 is less than the thickness of the clamped portion 110. When a protrusion 32 is provided on the clamping portion 21, the distance between the two protrusions 32 is less than the thickness of the clamped portion 110. With this configuration, during the clamping of the workpiece 100 to be electroplated, the operator places the two free ends on the first surface 111 and the second surface 112 of the clamped portion 110, respectively, and then pushes the headphone electroplating device to slide. The two clamping portions 21 are automatically opened by the clamped portion 110. When the grooves 31 and protrusions 32 engage, the connection between the clamping member 20 and the workpiece 100 to be electroplated is completed.

[0042] In some embodiments, the clamped portion 110 is further provided with a guide portion 113, which is located above the groove 31 or protrusion 32 of the clamped portion 110. The thickness of the guide portion 113 gradually increases along the direction approaching the groove 31 or protrusion 32. This arrangement allows the guide portion 113 to guide the movement of the guide segment 213. The guide portion 113 and the guide segment 213 cooperate with each other, further improving the smoothness and accuracy of the movement of the clamping portion 21.

[0043] In some embodiments, both the first surface 111 and the second surface 112 of the clamped portion 110 are provided with guide portions 113.

[0044] Referring to Figure 2, the clamping section 211 is provided with a clearance structure 2111, which is located between the guide section 213 and the transition section 212. This arrangement prevents the clamping section 211 from interfering with the clamped part 110 during clamping, thereby reducing the possibility of the clamping section 211 scratching the clamped part 110. Simultaneously, the clearance structure 2111 can accommodate any minor deformation or excess material that may occur in the clamped part 110, ensuring that the clamping part 21 can smoothly enter its position without stress concentration due to compression.

[0045] In some embodiments, the avoidance structure 2111 is an arc-shaped structure, which facilitates the processing of the avoidance structure 2111. Specifically, the avoidance structure 2111 can be machined on the clamping section 211 by bending it.

[0046] In some embodiments, the avoidance structure 2111 is an avoidance groove.

[0047] Referring to Figure 2, the first end 2121 is connected to the clamping section 211 by a rounded transition, and the second end 2122 is connected to the suspension component 10 by a rounded transition. The rounded transition can effectively eliminate the stress concentration phenomenon that is prone to occur at sharp corners or right angles. When the clamping component 20 undergoes repeated deformation during use, the rounded transition can make the stress evenly distributed, significantly improving the fatigue resistance and service life of the clamping component 20.

[0048] Referring to Figures 1 and 2, the transition section 212 is arranged parallel to the suspension member 10, and there is an angle between the transition section 212 and the clamping section 211. This arrangement facilitates the processing of the transition section 212. At the same time, the transition section 212 is easy to deform, thereby further improving the smoothness of the clamping process.

[0049] In some embodiments, the angle between the transition section 212 and the suspension member 10 is less than 90°.

[0050] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0051] The embodiments described above are merely examples of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the scope of protection of this application. Therefore, the scope of protection of this patent application should be determined by the appended claims.

[0052] 10: Suspension components 11: Hanging hole 20: Clamping component 21: Clamping part 211: Clamping Section 2111: Avoidance Structure 212: Transition Section 2121: First End 2122: Second end 213: Guide Section 31: Groove 32: Protrusion 100: Parts to be electroplated 110: The clamped part 111: First Surface 112: Second Surface 113: Guiding section 120: Chamber

Claims

1. An electroplating apparatus for headphones, used to electroplat a headphone component to be electroplated, the component to be electroplated having a clamping portion, wherein, The clamped portion has a first surface and a second surface opposite each other along a first direction, the first direction being the thickness direction of the clamped portion; the headphone electroplating device includes: a suspension member for connecting to an external fixing device; a clamping member connected to the suspension member; the clamping member includes two clamping portions, the two clamping portions being disposed opposite each other and capable of pressing against the first surface and the second surface respectively.

2. The headphone electroplating apparatus as claimed in claim 1, wherein, The headphone electroplating device includes a plurality of spaced-apart clamping members, each clamping the clamped portion.

3. The headphone electroplating apparatus as claimed in claim 1, wherein, The clamping part includes: a clamping section configured to press against the clamped part; a transition section having a first end and a second end, the first end being connected to one end of the clamping section and the second end being connected to the suspension member; wherein the distance between the second ends of the two transition sections is greater than the distance between the first ends.

4. The headphone electroplating apparatus as described in claim 3, wherein, One of the clamped part and the clamping segment is provided with a groove, and the other is provided with a matching protrusion that can be inserted into the groove.

5. The headphone electroplating apparatus as described in claim 3, wherein, The free end of the clamping section is configured as a guide section, which is inclined gradually away from the transition section and away from the opposite clamping part.

6. The headphone electroplating apparatus as claimed in claim 5, wherein, The clamping section is provided with a clearance structure, which is located between the guide section and the transition section.

7. The headphone electroplating apparatus as claimed in claim 3, wherein, The first end is connected to the clamping section by an arc transition, and / or the second end is connected to the suspension member by an arc transition.

8. The headphone electroplating apparatus as claimed in claim 3, wherein, The transition section is arranged parallel to the suspension member; and / or, the transition section and the clamping section have an angle between them.

9. The headphone electroplating apparatus as claimed in claim 1, wherein, The clamping member is made of an elastic material and has an initial state and a clamping state. When the clamping member is in the initial state, the distance between the two clamping parts is less than the thickness of the clamped part. When the clamping member is in the clamping state, the clamping parts press against the clamped part.

10. The headphone electroplating apparatus as claimed in claim 1, wherein, The clamping part, which is used to press against the surface of the clamped part, is provided with an anti-slip structure.