Wafer box with open-top filter replacement mechanism

Abstract

This invention relates to an open-top filter replacement mechanism for a wafer cassette, comprising a wafer stage, a multi-axis moving device, a suction and discharge device, a pick-and-place ring device, a pick-and-place cover device, and a cover-rotating device. The wafer stage carries a wafer cassette. The multi-axis moving device includes a plurality of moving components, each disposed on the wafer stage. The suction and discharge device, the pick-and-place ring device, the pick-and-place cover device, and the cover-rotating device are all disposed on these moving components. The wafer stage moves the wafer cassette to a preset position, and the multi-axis moving device moves the suction and discharge device, the pick-and-place ring device, the pick-and-place cover device, and the cover-rotating device to the preset position according to a replacement sequence. This automated replacement method improves the replacement efficiency of the open-top filter structure.

Description

Wafer box with open-top filter replacement mechanism Technical Field

[0001] This invention relates to a wafer cassette replacement mechanism, and more particularly to a wafer cassette open-top filter replacement mechanism. Prior Technology

[0002] In the prior art, a semiconductor wafer cassette is known, primarily used to house and protect wafers. The semiconductor wafer cassette includes a housing with at least one air inlet, and the air inlet is equipped with one or more filters. The filters are used to filter or block air impurities, particles, or contaminants entering the wafer cassette. Typically, the filters are equipped with an isolator. To obtain the filters, the isolator must first be removed. The filters and the isolator form a filtration structure, which maintains the quality of the wafers during storage or transportation.

[0003] In the aforementioned prior art, the isolator was fixedly installed at the air inlet. When the filter needed replacement or inspection, the wafer cassette typically had to be sent back to the original manufacturer for manual disassembly and inspection. This method was not only cumbersome but also relatively labor-intensive and time-consuming. Especially with increased semiconductor production and the growing number of wafer cassettes used, the labor costs for related maintenance work also increased. Furthermore, human error could affect the judgment during manual replacement and inspection. Summary of the Invention

[0004] In view of the shortcomings of the prior art, the main objective of this invention is to provide a wafer cassette open-cover filter replacement mechanism, which improves the replacement efficiency of the open-cover filter structure by using an automated replacement mechanism.

[0005] To achieve the above objectives, the main technical means adopted is to include the aforementioned wafer cassette's open-top filter replacement mechanism as follows: A wafer stage, used to support a wafer cassette; A multi-axis moving device having a plurality of moving components, which are movably disposed on the side and above the wafer stage; A suction and discharge device is provided on one of these moving components; A pick-and-place ring device is disposed on one side adjacent to the pick-and-place device; A cover-removing device is disposed on one side adjacent to the pressurizing device; and A cover-turning device is installed on one side adjacent to the cover-removing device; The wafer stage moves the wafer cassette to a preset position, and the multi-axis moving device moves the suction and release device, the pick-and-place ring device, the pick-and-place cover device, and the cover-turning device to the preset position respectively according to a replacement step sequence.

[0006] As described above, the wafer cassette's open-top filter replacement mechanism of this novel device includes a wafer stage; the multi-axis moving device comprises a plurality of moving components, which are movably disposed on the side and top of the wafer stage. When the wafer stage carries the wafer cassette with the filter structure to be replaced, the multi-axis moving device drives the suction and release device, the pick-and-place ring device, the pick-and-place cover device, and the cover-rotating device to move to the preset position according to a replacement step sequence. This automated replacement method effectively improves the filter structure replacement efficiency of the wafer cassette. Simple Explanation of the Diagram

[0007] Figure 1 is a block diagram of the replacement mechanism according to a preferred embodiment of the present invention; Figure 2 is a perspective view of the replacement mechanism according to a preferred embodiment of the present invention; Figure 3 is another perspective view of the replacement mechanism of a preferred embodiment of the present invention; Figure 4 is a side view of the replacement mechanism according to a preferred embodiment of the present invention; Figure 5 is a partial structural diagram of the replacement mechanism according to a preferred embodiment of the present invention; Figure 6 is a partial schematic diagram of the replacement mechanism and wafer cassette according to a preferred embodiment of the present invention; Figure 7 is another partial schematic diagram of the replacement mechanism and wafer cassette of a preferred embodiment of the present invention; Figure 8 is an enlarged view of region A in Figure 7; Figure 9 is an enlarged view of region B in Figure 7; Figure 10 is an enlarged schematic diagram of region C in Figure 7; and Figure 11 is a flowchart of the replacement method according to a preferred embodiment of the present invention. Implementation

[0008] Regarding a preferred embodiment of this invention, please refer to Figure 1, which provides a wafer cassette with an open-top filter replacement mechanism 1. The mechanism includes a wafer stage 11, a multi-axis moving device 12, a suction / discharge device 13, a pick-and-place ring device 14, a pick-and-place cover device 15, and a cover-rotating device 16. The wafer stage 11 supports a wafer cassette 20. The multi-axis moving device 12 includes a plurality of moving components, which are movably disposed on the side and top of the wafer stage 11. The suction / discharge device 13 is disposed on one of the moving components. The pick-and-place ring device 14 is disposed on one side adjacent to the suction / discharge device 13. The pick-and-place cover device 15 is disposed on one side adjacent to the pick-and-place ring device 14. The cover-rotating device 16 is disposed on one side adjacent to the pick-and-place cover device 15. The wafer stage 11 moves the wafer cassette 20 to a preset position 100. The multi-axis moving device 12 moves the suction and release device 13, the pick-and-place ring device 14, the pick-and-place cover device 15, and the cover rotating device 16 to the preset position 100 respectively according to a replacement step sequence. In this embodiment, the preset position 100 corresponds to the replacement position of the wafer cassette 20 where the filter structure needs to be replaced.

[0009] Please refer to Figures 2 to 6 together. In this embodiment, the wafer cassette 20 has a wafer cassette body 21, a filter 22, a ring 23, and a cover 24. The wafer cassette body 21 has at least one vent 210 located on the upper surface of the wafer cassette body 21. The filter 22 is placed inside the vent 210, and the ring 23 is placed on the filter 22 inside the vent 210. The cover 24 is locked inside the vent 210 and presses against the ring 23. In this embodiment, the filter structure that needs to be replaced in the wafer cassette 20 can be composed of the filter 22, the ring 23, and the cover 24.

[0010] As described above, the vent 210 of the wafer housing 21 further has an extended side hole 2100 on both sides, which communicates with the vent 210. The cover 24 also has an outwardly extending fixing protrusion 241 on both sides. When the cover 24 is assembled into the vent 210, the fixing protrusion 241 of the cover 24 is fitted into the side hole 2100 for fixation.

[0011] In this embodiment, please refer to Figures 2 and 3 again. The wafer stage 11 includes a platform 111 and a platform driver 112. The platform 111 is disposed on the platform driver 112. The platform 111 is used to support the wafer cassette 20. The platform driver 112 drives the platform 111 to move linearly. The platform 111 can reciprocate along a first direction X.

[0012] Furthermore, the multi-axis moving device 12 is used to drive the suction and release device 13, the pick-and-place ring device 14, the pick-and-place cover device 15, and the cover-rotating device 16 to move along three axes (i.e., X-axis, Y-axis, and Z-axis). The moving components of the multi-axis moving device 12 include a first moving component 121, a second moving component 122, and a third moving component 123. The first moving component 121 is disposed on the side of the wafer stage 11, the second moving component 122 is disposed on top of the first moving component 121, and the third moving component 123 is disposed on top of the second moving component 122, and the third moving component 123 is also located above the wafer stage 11. The suction and release device 13, the pick-and-place ring device 14, the pick-and-place cover device 15, and the cover-turning device 16 are all arranged side by side on the third moving assembly 123, and the above structures are all located above the wafer stage 11.

[0013] As described above, the first moving component 121 includes a first slide rail 1211, a first sliding member 1212, and a moving bracket 1213. The first slide rail 1211 is located on one side of the wafer stage 11 and extends horizontally parallel to the side of the wafer stage 11. The first sliding member 1212 is slidably disposed on the first slide rail 1211. The moving bracket 1213 is disposed on the first sliding member 1212, and a portion of the frame of the moving bracket 1213 extends above the wafer stage 11. The extension direction of the frame of the moving bracket 1213 is perpendicular to the extension direction of the first slide rail 1211. The first sliding member 1212 drives the moving bracket 1213 to move along the first slide rail 1211. The second moving component 122 is disposed on the moving bracket 1213. The first sliding member 1212 drives the movable support 1213 to move along the first direction X. Both the movable support 1213 and the wafer stage 11 can reciprocate along the first direction X.

[0014] Furthermore, the second moving assembly 122 includes a second slide rail 1221, a second sliding member 1222, a moving plate 1223, and a second driving member 1224. A portion of the frame of the moving bracket 1213 extends above the wafer stage 11, and the second slide rail 1221 extends along this portion. The second sliding member 1222 is slidably disposed on the second slide rail 1221, and the moving plate 1223 is disposed on the second sliding member 1222. The second driving member 1224 drives the second sliding member 1222 to move, and the second sliding member 1222 drives the moving plate 1223 to move along the second slide rail 1221. The third moving assembly 123 is disposed on the moving plate 1223. The second sliding member 1222 drives the moving plate 1223 to move along a second direction Y, where the first direction X and the second direction Y are perpendicular to each other.

[0015] Furthermore, the third moving component 123 includes a third slide rail 1231, a third sliding member 1232, a lifting plate 1233, and a third driving member 1234. The third slide rail 1231 is disposed on the moving plate 1223 and extends toward the wafer stage 11. The third sliding member 1232 is slidably disposed on the third slide rail 1231. The lifting plate 1233 is disposed on the third sliding member 1232. The third driving member 1234 drives the third sliding member 1232 to move, and the third sliding member 1232 drives the lifting plate 1233 to move along the third slide rail 1231. The third sliding member 1232 drives the lifting plate 1233 to move along a third third direction Z, which is perpendicular to the second direction Y.

[0016] Please refer to Figures 6 to 10. In this embodiment, the multi-axis moving device 12 drives the suction and release device 13, the pick-and-place ring device 14, the pick-and-place cover device 15, and the rotating cover device 16 to respectively operate on the filter structure of the wafer cassette. The suction and release device 13 is used to suction out the filter screen 22 from the vent hole 210 or place the filter screen 22 into the vent hole 210. The pick-and-place ring device 14 is used to remove the ring 23 from the vent hole 210 or place the ring 23 into the vent hole 210. The pick-and-place cover device 15 is used to remove the cover 24 from the vent hole 210 or place the cover 24 into the vent hole 210. The rotating cover device 16 is used to unlock the cover 24 from the vent hole 210 or lock the cover 24 into the vent hole 210.

[0017] Please refer to Figures 7 and 8. The suction and discharge device 13 includes a suction and discharge component 131 and a first lifting component 132. The first lifting component 132 is disposed on the lifting plate 1233 of the third moving assembly 123. The suction and discharge component 131 is disposed on the side of the first lifting component 132 away from the lifting plate 1233. The first lifting component 132 raises or lowers the suction and discharge component 131, driving one end of the suction and discharge component 131 into the vent hole 210 of the wafer cassette 20. One end of the suction and discharge component 131 can be used to adsorb the filter screen 22 inside the vent hole 210. In addition, one end of the suction and discharge component 131 can also be used to adsorb new filter screen 22 and place it directly into the vent hole 210 for filter screen 22 replacement.

[0018] Please refer to Figures 7 and 8. The ring-picking and dispensing device 14 includes a ring-picking assembly 141, an opening / closing member 142, and a first lifting member 132. The first lifting member 132 is disposed on the lifting plate 1233 of the third moving assembly 123. The opening / closing member 142 is disposed on the first lifting member 132. The opening / closing member 142 and the suction / dispensing member 131 share the same first lifting member 132. The ring-picking assembly 141 is connected to the opening / closing member 142. The first lifting member 132 drives the opening / closing member 142 and the ring-picking assembly 141 to rise or fall. The ring-picking assembly 141 has a first ring-picking member 1411 and a second ring-picking member 1412. The opening / closing member 142 drives the first ring-picking member 1411 and the second ring-picking member 1412 to separate or move closer to each other. In addition, the first ring-taking member 1411 and the second ring-taking member 1412 of the ring-taking device 14 can also move through the side holes 2100 on both sides of the vent hole 210, and the first ring-taking member 1411 and the second ring-taking member 1412 can take and put the ring 23.

[0019] Please refer to Figures 7 and 9. The cover-removing device 15 includes a cover-removing assembly 151, a clamping drive 152, and a second lifting member 153. The second lifting member 153 is disposed on the lifting plate 1233 of the third moving assembly 123. The clamping drive 152 is disposed on the second lifting member 153. The cover-removing assembly 151 is connected to the clamping drive 152. The second lifting member 153 drives the clamping drive 152 and the cover-removing assembly 151 to rise or fall. The cover-removing assembly 151 has a first clamp 1511 and a second clamp 1512. The clamping drive 152 drives the first clamp 1511 and the second clamp 1512 to separate from each other or move closer to each other. In addition, the first clamp 1511 and the second clamp 1512 of the cover-taking and placing device 15 can also move through the side holes 2100 on both sides of the vent hole 210, and the first clamp 1511 and the second clamp 1512 can take and place the cover 24.

[0020] Please refer to Figures 7 and 10. The cover-opening device 16 includes a cover-opening assembly 161, a cover-opening drive 162, and a third lifting member 163. The third lifting member 163 is disposed on the lifting plate 1233 of the third moving assembly 123. The cover-opening drive 162 is disposed on the third lifting member 163. The cover-opening assembly 161 is connected to the cover-opening drive 162. The third lifting member 163 drives the cover-opening drive 162 and the cover-opening assembly 161 to rise or fall. The cover-opening assembly 161 has a plurality of rotating members 1611. The cover-opening drive 162 drives the rotating members 1611 to rotate clockwise to unlock the cover 24 or rotate counterclockwise to lock the cover 24.

[0021] Please refer to Figure 11. This embodiment illustrates the method for replacing the filter in a wafer cassette with an open cover. A wafer cassette 20 is taken out. The wafer cassette 20 has a wafer cassette body 21, a filter screen 22, a ring 23, and a cover 24. The wafer cassette body 21 has at least one vent hole 210. The filter screen 22 is placed inside the vent hole 210. The ring 23 is placed on the filter screen 22 inside the vent hole 210. The cover 24 is locked inside the vent hole 210 and presses against the ring 23. Please also refer to Figure 2. The following describes the replacement steps of the replacement mechanism 1, including:

[0022] In step S100: the wafer stage 11 is moved to the preset position 100, wherein the wafer stage 11 carries the wafer cassette 20. The wafer stage 11 moves the vent 210 of the wafer cassette 20 to the preset position 100, so that the multi-axis moving device 12 can subsequently move the suction and release device 13, the pick-and-place ring device 14, the pick-and-place cover device 15, and the cover rotating device 16 to the preset position 100 in the order of the replacement steps, so that the above devices can respectively perform replacement operations on the filter 22, the ring 23, and the cover 24 of the wafer cassette 20.

[0023] In step S200: The multi-axis moving device 12 drives the rotating cover device 16 to move to the preset position 100, and the plurality of rotating parts 1611 of the rotating cover device 16 abut against the cover 24, and the cover 24 is rotated clockwise to unlock it, thus unlocking the cover 24 from the vent 210.

[0024] In step S300: The multi-axis moving device 12 drives the cover-picking and placing device 15 to move to the preset position 100, and the cover-picking and placing device 15 is used to remove the cover 24 from the vent hole 210. After the clamping and placing drive member 152 moves the first clamp 1511 and the second clamp 1512 through the side holes 2100 on both sides of the vent hole 210, the first clamp 1511 and the second clamp 1512 move closer to each other inward, clamping the two sides of the cover 24. Then, the second lifting member 153 is driven again to move the first clamp 1511 and the second clamp 1512 and the clamped cover 24 away from the vent hole 210.

[0025] In step S400: The multi-axis moving device 12 drives the ring picking and placing device 14 to move to the preset position 100, and the ring picking and placing device 14 is used to remove the ring 23 from the vent 210. The opening and closing device 142 drives the first ring picking device 1411 and the second ring picking device 1412 to move closer to each other. After the first ring picking device 1411 and the second ring picking device 1412 pass through the middle of the ring 23, the opening and closing device drives the first ring picking device 1411 and the second ring picking device 1412 to move away from each other. The outer sides of the first ring picking device 1411 and the second ring picking device 1412 can be supported on the inner side of the ring 23. The first lifting device 132 is driven again to move the first ring picking device 1411 and the second ring picking device 1412 and the opened ring 23 away from the vent 210.

[0026] In step S500: The multi-axis moving device 12 drives the suction and release device 13 to the preset position 100, and the suction and release device 13 adsorbs the filter screen 22 away from the vent 210. The first lifting member 132 drives one end of the suction and release member 131 into the vent 210, and the suction and release member 131 can be used to adsorb the filter screen 22 inside the vent 210. The first lifting member 132 is driven again to move the suction and release member 131 and the adsorbed filter screen 22 away from the vent 210.

[0027] In step S600: The suction and release device 13 adsorbs another filter sheet 22 (i.e., a new filter sheet) and places it into the vent 210. The first lifting member 132 drives the suction and release member 131 and the new filter sheet 22 it adsorbs into the vent 210. The suction and release member 131 no longer attracts the new filter sheet 22, thus placing the new filter sheet 22 into the vent 210.

[0028] In step S700: The multi-axis moving device 12 again moves the ring picking and placing device 14 to the preset position 100, and the ring picking and placing device 14 places another ring 23 (i.e., a new ring) on ​​another filter screen 22 in the vent 210. The opening and closing member 142 drives the first ring picking member 1411 and the second ring picking member 1412 to move away from each other and support the new ring 23 on the inner side. After the first ring picking member 1411 and the second ring picking member 1412 move through the side holes 2100 on both sides of the vent 210, the first ring picking member 1411 and the second ring picking member 1412 move inward and move closer to each other, so that the new ring 23 is separated from the first ring picking member 1411 and the second ring picking member 1412, and the new ring 23 is placed in the vent 210. The first lifting component 132 is driven again to move the first ring-retrieving component 1411 and the second ring-retrieving component 1412 away from the vent 210.

[0029] In step S800: The multi-axis moving device 12 again moves the cover-taking and placing device 15 to the preset position 100, and the cover-taking and placing device 15 places the cover 24 in the vent hole 210. The opening / closing member 142 drives the first and second grabbing ring members 1411 and 1412 to clamp the cover 24. The clamping and placing drive member 152 moves the first and second clamping ring members 1511 and 1512 through the side holes 2100 on both sides of the vent hole 210. The first and second clamping ring members 1511 and 1512 then move inwards away from each other, causing the cover 24 to disengage from the clamping rings and be placed inside the vent hole 210. The second lifting member 153 is then driven again to move the first and second clamping ring members 1511 and 1512 away from the vent hole 210.

[0030] In step S900: The multi-axis moving device 12 drives the rotating cover device 16 to move to the preset position 100 again, and the plurality of rotating parts 1611 of the rotating cover device 16 abut against the cover 24, and the cover 24 is rotated and locked in the counterclockwise direction, thus locking the cover 24 in the vent 210.

[0031] This embodiment completes the replacement of the wafer cassette's open-top filter replacement mechanism through the above steps S100 to S900. This embodiment does not limit the actual operation steps and sequence of the above-mentioned multi-axis moving device 12, suction and release device 13, pick-and-place ring device 14, pick-and-place cover device 15, and rotating cover device 16, which can be adjusted according to the user's needs.

[0032] In summary, this invention provides a wafer cassette with an open-top filter replacement mechanism and method. Through the structural configuration of the wafer stage, the multi-axis moving device, the suction and discharge device, the pick-and-place ring device, the pick-and-place cover device, and the cover-turning device, the wafer stage supports the wafer cassette. The multi-axis moving device drives the suction and discharge device, the pick-and-place ring device, the pick-and-place cover device, and the cover-turning device to move above the wafer cassette according to the replacement steps. This automated replacement method effectively improves the replacement efficiency of the open-top filter structure.

[0033] 1: Replacement mechanism 100: Preset position 11: Wafer stage 111: Platform 112: Platform Drivers 12: Multi-axis moving device 121: First moving component 1211: First slide rail 1212: First slider 1213: Mobile stand 122: Second moving component 1221: Second slide rail 1222: Second slider 1223: Mobile board 1224: Second drive unit 123: Third moving component 1231: Third slide rail 1232: Third sliding component 1233:Lifting plate 1234: Third drive unit 13: Suction and discharge device 131: Suction and release components 132: First lifting component 14: Pick-up and drop-off ring device 141: Ring retrieval assembly 1411: First ring-removing component 1412: Second ring-taking component 142: Opening / closing component 15: Cover removal and placement device 151: Cap Removal Assembly 1511: First clamping piece 1512: Second clamping piece 152: Clamping and placing the drive unit 153: Second lifting component 16: Turn-on device 161: Lid opening assembly 1611: Rotating component 162: Lid opening drive component 163: Third lifting component 20: Wafer Box 21: Wafer Box 210: Vent 2100: Side hole 22: Filter screen 23: Ring component 24: Cover piece 241: Fixed convex part X: First direction Y: Second direction Z: Third-party direction

Claims

1. A cover-opening filter replacement mechanism for a wafer cassette, comprising: A wafer stage is used to support a wafer box; A multi-axis moving device includes a plurality of moving components, which are movably disposed on the side and above of the wafer stage; a pick-and-place device is disposed on one of the moving components; a pick-and-place ring device is disposed on one side adjacent to the pick-and-place device; a pick-and-place cover device is disposed on one side adjacent to the pick-and-place ring device; and a cover-turning device is disposed on one side adjacent to the pick-and-place cover device; wherein the wafer stage moves the wafer cassette to a preset position, and the multi-axis moving device moves the pick-and-place device, the pick-and-place ring device, the pick-and-place cover device, and the cover-turning device to the preset position respectively according to a replacement step sequence.

2. The wafer cassette with an open-top filter replacement mechanism as described in claim 1, the wafer cassette having a wafer cassette body, a filter screen, a ring, and a cover, the wafer cassette body having at least one vent hole, the filter screen being placed inside the vent hole, the ring being placed on the filter screen inside the vent hole, the cover being locked inside the vent hole and pressing against the ring, wherein the suction / release device is used to suction out the filter screen from the vent hole or place the filter screen into the vent hole; the ring removal / release device is used to remove the ring from the vent hole or place the ring into the vent hole; the cover removal / release device is used to remove the cover from the vent hole or place the cover into the vent hole; and the cover rotation device is used to unlock the cover from the vent hole or lock the cover into the vent hole.

3. The wafer cassette with open-top filter replacement mechanism as described in claim 2, wherein the suction and discharge device includes a suction and discharge component and a first lifting component, the suction and discharge component being disposed on one side of the first lifting component, wherein the first lifting component raises or lowers the suction and discharge component, driving one end of the suction and discharge component into the vent of the wafer cassette.

4. The wafer cassette opening-type filter replacement mechanism as described in claim 2, wherein the ring picking device includes a ring picking assembly, an opening and closing member and a first lifting member, the opening and closing member is disposed on the first lifting member, the ring picking assembly is connected to the opening and closing member, wherein the first lifting member drives the opening and closing member and the ring picking assembly to rise or fall, the ring picking assembly has a first ring picking member and a second ring picking member, and the opening and closing member drives the first ring picking member and the second ring picking member to separate from each other or move closer to each other.

5. The wafer cassette opening filter replacement mechanism as described in claim 2, wherein the cover removal and placement device includes a cover removal assembly, a clamping drive and a second lifting member, the clamping drive is disposed on the second lifting member, the cover removal assembly is connected to the clamping drive, wherein the second lifting member drives the clamping drive and the cover removal assembly to rise or fall, the cover removal assembly has a first clamp and a second clamp, and the clamping drive drives the first clamp and the second clamp to separate from each other or move closer to each other.

6. The wafer cassette opening filter replacement mechanism as described in claim 2, wherein the opening device includes an opening assembly, an opening drive and a third lifting member, the opening drive is disposed on the third lifting member, the opening assembly is connected to the opening drive, wherein the third lifting member drives the opening drive and the opening assembly to lift or lower, the opening assembly has a plurality of rotating members, and the opening drive drives the rotating members to rotate clockwise to unlock the cover or counterclockwise to lock the cover.

7. The wafer cassette opening filter replacement mechanism as described in claim 2, wherein the moving components of the multi-axis moving device include a first moving component, a second moving component and a third moving component; the first moving component is disposed on the side of the wafer stage, the second moving component is disposed on the first moving component and is located above the wafer stage, and the third moving component is disposed on the second moving component and is located above the wafer stage.

8. The wafer cassette opening filter replacement mechanism as described in claim 7, wherein the first moving component includes a first slide rail, a first sliding member and a moving bracket, the first sliding member is slidably disposed on the first slide rail, the moving bracket is disposed on the first sliding member, wherein the first sliding member drives the moving bracket to move along the first slide rail, and the second moving component is disposed on the moving bracket.

9. The wafer cassette cover-type filter replacement mechanism as described in claim 8, wherein the second moving component includes a second slide rail, a second sliding member, a moving plate, and a second driving member, the second slide rail extends along the frame of the moving bracket, the second sliding member is slidably disposed on the second slide rail, the moving plate is disposed on the second sliding member, the second driving member drives the second sliding member to move, wherein the second sliding member drives the moving plate to move along the second slide rail, and the third moving component is disposed on the moving plate.

10. The wafer cassette cover-type filter replacement mechanism as described in claim 9, wherein the third moving component includes a third slide rail, a third sliding member, a lifting plate, and a third driving member, the third slide rail being disposed on the moving plate and extending toward the wafer stage, the third sliding member being slidably disposed on the third slide rail, the lifting plate being disposed on the third sliding member, and the third driving member driving the third sliding member to move, wherein the third sliding member drives the lifting plate to move along the third slide rail.

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