Optoelectronic module

Abstract

An optoelectronic module includes a heat dissipation substrate, a liquid metal heat dissipation module, a movable support platform, an image sensing module, and a silicon photonics chip. The liquid metal heat dissipation module is disposed on the heat dissipation substrate. The movable support platform is disposed on the liquid metal heat dissipation module. The image sensing module is disposed on the movable support platform. The silicon photonics chip is disposed on the liquid metal heat dissipation module. The liquid metal heat dissipation module has a liquid metal accommodating cavity, and the movable support platform and the silicon photonics chip overlap the liquid metal accommodating cavity.

Description

Optoelectronic module optoelectronic module Technical Field

[0001] This invention relates to an electronic device, and more particularly to an optoelectronic module. Prior Technology

[0002] Silicon photonics technology integrates optical waveguides, modulators, and photodetectors onto a silicon substrate for high-speed data transmission. On the other hand, existing optical sensing technologies utilize optical image stabilization or sensor shake compensation mechanisms to achieve image stability. Integrating a silicon photonics module with a movable sensor platform into a single design allows for simultaneous high-resolution image sensing and high-speed optical communication. However, this integrated design may suffer from issues such as localized overheating, image quality degradation, and reduced reliability. Summary of the Invention

[0003] According to an embodiment of this invention, a photoelectric module with high reliability is provided.

[0004] According to one embodiment of this invention, an optoelectronic module is provided, comprising a heat dissipation substrate, a liquid metal heat dissipation module, a movable support platform, an image sensing module, and a silicon photonics chip. The liquid metal heat dissipation module is disposed on the heat dissipation substrate. The movable support platform is disposed on the liquid metal heat dissipation module. The image sensing module is disposed on the movable support platform. The silicon photonics chip is disposed on the liquid metal heat dissipation module. The liquid metal heat dissipation module has a liquid metal accommodating cavity, and the movable support platform and the silicon photonics chip overlap the liquid metal accommodating cavity.

[0005] Based on the above, the optoelectronic module provided in this invention uses liquid metal to dissipate heat from components such as the movable support platform, image sensor, and silicon photonic chip module, thereby avoiding problems such as local overheating, image quality degradation, and reduced reliability of the optoelectronic module.

[0006] To make the above-mentioned features and advantages of this invention more apparent and understandable, specific embodiments are provided below, and detailed descriptions are given in conjunction with the accompanying drawings. Simple Explanation of the Diagram

[0007] Figure 1 shows a schematic diagram of an optoelectronic module according to an embodiment of the present invention. Figure 2 is a schematic cross-sectional view of the optoelectronic module in Figure 1. Implementation

[0008] Reference will now be made in detail to embodiments of this invention, which are illustrated in the accompanying drawings. Wherever possible, the same element symbols are used in the drawings and the description herein to refer to the same or similar parts.

[0009] Referring to Figures 1 and 2, Figure 1 shows a schematic diagram of an optoelectronic module according to an embodiment of the present invention, and Figure 2 is a cross-sectional schematic diagram of the optoelectronic module of Figure 1.

[0010] The optoelectronic module 1 includes a heat dissipation substrate HP, a liquid metal heat dissipation module 10, a silicon photonics chip module 20, a movable support platform 30, and an image sensing module 40. The liquid metal heat dissipation module 10 is disposed on the heat dissipation substrate HP. The silicon photonics chip module 20 includes a silicon photonics chip 201, integrated circuitry 202, and a printed circuit board 203, and is disposed on the liquid metal heat dissipation module 10. The movable support platform 30 is disposed on the liquid metal heat dissipation module 10. The image sensing module 40 includes a lens group 401 and an image sensor 402, and is disposed on the movable support platform 30, wherein the image sensor 402 is located between the lens group 401 and the movable support platform 30. The liquid metal heat dissipation module 10 has a liquid metal accommodating cavity 100, and the liquid metal accommodating cavity 100 overlaps the movable support platform 30 and the silicon photonics chip 201. Accordingly, when liquid metal is disposed in the liquid metal accommodating cavity 100, the liquid metal can be used to dissipate heat from components such as the movable support platform 30, image sensor 402, and silicon photonic chip module 20, thereby avoiding problems such as local overheating, image quality degradation, and reduced reliability of the optoelectronic module 1.

[0011] In this embodiment, the liquid metal heat dissipation module 10 further includes a first surface S1, a second surface S2, and a third surface S3. The movable support platform 30 is disposed on the first surface S1, and the silicon photonics wafer module 20 is disposed on the second surface S2. The first surface S1 and the second surface S2 are not coplanar. The third surface S3 is adjacent to the first surface S1 and the second surface S2, and is also adjacent to the movable support platform 30. The liquid metal accommodating cavity 100 is adjacent to the first surface S1, the second surface S2, and the third surface S3.

[0012] Since the first surface S1 and the second surface S2 are not coplanar and the third surface S3 is adjacent to the first surface S1 and the second surface S2, the second surface S2 and the third surface S3 can define a sufficiently large liquid metal accommodating cavity (first liquid metal accommodating cavity 100A). Since the first liquid metal accommodating cavity 100A is adjacent to the second surface S2 and the third surface S3, and the second liquid metal accommodating cavity 100B is adjacent to the first surface S1, the heat dissipation efficiency of the silicon photonics wafer module 20 disposed on the second surface S2, the movable support platform 30 disposed on the first surface S1 and adjacent to the third surface S3, and the image sensor 402 can be significantly improved.

[0013] In some embodiments, the optoelectronic module 1 may further include a controller and a temperature sensor (not shown), wherein the temperature sensor is used to sense the temperature of the silicon photonics chip module 20, and the controller is connected to the movable support platform 30 and the temperature sensor. The controller adjusts the stroke of the movable support platform 30 according to the temperature measured by the temperature sensor. Specifically, when the temperature sensor measures that the temperature of the silicon photonics chip module 20 is higher than a preset threshold, it can limit the maximum displacement of the movable support platform 30 or adjust its driving waveform to prevent the movable support platform 30 from generating more heat energy, which could cause the silicon photonics chip module 20 to experience abnormalities such as reduced reliability due to temperature rise.

[0014] In some embodiments, the temperature sensor can also measure the temperature of the image sensor 402 of the image sensing module 40. When the temperature sensor measures that the temperature of the image sensor 402 is higher than a preset threshold, it can limit the maximum displacement of the movable support platform 30 or adjust its driving waveform to prevent the movable support platform 30 from generating more heat energy, which could cause the image sensor 402 to experience abnormalities such as image quality degradation due to temperature rise.

[0015] In summary, the optoelectronic module provided by this novel embodiment utilizes liquid metal to dissipate heat from components such as the movable support platform, image sensor, and silicon photonics chip module, thus preventing problems such as localized overheating, image quality degradation, and reduced reliability. Furthermore, the optoelectronic module can adjust the stroke of the movable support platform according to its internal temperature, preventing the platform from generating more heat and further optimizing temperature control.

[0016] It will be apparent to those skilled in the art that various modifications and variations can be made to the disclosed embodiments without departing from the scope or spirit of this invention. In view of the foregoing, it is intended that this disclosure cover modifications and variations falling within the scope of the appended claims and their equivalents.

[0017] 1: Optoelectronic module 10: Liquid metal heat dissipation module 20: Silicon Photonics Chip Module 30: Movable support platform 40: Image Sensing Module 401: Lens Group 402: Image Sensor 100: Liquid metal accommodating cavity 100A: First liquid metal accommodating cavity 100B: Second liquid metal accommodating cavity 201: Silicon Photonics Chip 202: Integrated Circuits 203: Printed Circuit Board HP: Heat dissipation substrate S1: First surface S2: Second surface S3: Third Surface

Claims

1. An optoelectronic module, comprising: Heat dissipation substrate; A liquid metal heat dissipation module is disposed on the heat dissipation substrate; A movable support platform is configured on the liquid metal heat dissipation module; An image sensing module is disposed on the movable support platform; and a silicon photonics chip module is disposed on the liquid metal heat dissipation module, wherein the liquid metal heat dissipation module has a liquid metal accommodating cavity, and the liquid metal accommodating cavity overlaps the movable support platform and the silicon photonics chip module.

2. The optoelectronic module as claimed in claim 1, wherein the liquid metal heat dissipation module further has a first surface and a second surface, wherein the movable support platform is disposed on the first surface, the silicon photonic wafer module is disposed on the second surface, and the first surface and the second surface are not coplanar.

3. The optoelectronic module as claimed in claim 2, wherein the liquid metal heat dissipation module further has a third surface adjacent to the first surface and the second surface, and the third surface is adjacent to the movable support platform.

4. The optoelectronic module as claimed in claim 3, wherein the liquid metal accommodating cavity is adjacent to the first surface, the second surface and the third surface.

5. The optoelectronic module as claimed in claim 1 further includes a controller and a temperature sensor, wherein the temperature sensor is used to measure a first temperature of the silicon photonic wafer module, and the controller is connected to the movable support platform and the temperature sensor, and the controller adjusts the stroke of the movable support platform according to the first temperature.

6. The optoelectronic module as claimed in claim 5, wherein the temperature sensor is further configured to measure a second temperature of an image sensor of the image sensing module, and the controller adjusts the stroke of the movable support platform according to the second temperature.

7. The optoelectronic module as claimed in claim 1, wherein the silicon photonics wafer module includes a silicon photonics wafer, integrated circuitry, and a printed circuit board.

8. The optoelectronic module as claimed in claim 1, wherein the image sensing module includes a lens group and an image sensor, wherein the image sensor is located between the lens group and the movable support platform.

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