Water-cooled storage device

Abstract

This invention provides a water-cooled storage device, which consists of a base with an air inlet on one side, a storage module including a circuit board and a plurality of storage elements, the circuit board being disposed above the base, a heat-conducting element abutting above the storage elements, a heat dissipation module including a heat dissipation body disposed above the heat-conducting element, the heat dissipation body being fixed to the base and clamping the storage module and the heat-conducting element, an air duct being formed between the heat dissipation body and the heat-conducting element, a fin portion being disposed inside the air duct, one end of the air duct being connected to the air inlet, and the other end of the air duct forming an air outlet, a water-cooled liquid being contained inside the heat dissipation body, and a fan being disposed above the heat dissipation body corresponding to the air outlet.

Description

Water-cooled storage device Water-cooled storage device Technical Field

[0001] This invention relates to a storage device that uses a water-cooled liquid for heat conduction. Prior Technology

[0002] With the rapid development of applications such as high-performance computing, artificial intelligence, big data analysis, and high-speed data transmission, the demand for data access speed and bandwidth in computer systems continues to increase. To meet the requirements of high bandwidth and high-speed transmission, the operating frequency of storage devices and memory modules is gradually increasing. For example, solid-state drives (SSDs) and high-bandwidth memory modules generate a lot of heat under high-speed data read and write conditions. Especially when the system performs high-load computing, continuous read and write, or large-scale data exchange for a long time, the temperature of the internal control chip, cache chip, and related circuits of the storage device will rise rapidly.

[0003] In conventional technology, storage devices often employ air cooling for heat dissipation. This involves placing metal heat sinks, graphite heat sinks, or extruded aluminum fins on the surface of a solid-state drive (SSD), and using a system fan to circulate air and remove heat from the device surface. This type of pure air-cooling architecture is relatively simple in structure, low in cost, and easy to install, and is therefore widely used in conventional computer equipment.

[0004] However, as the performance of storage devices continues to improve, their power consumption and heat generation also increase accordingly, and traditional air cooling methods are gradually facing the problem of insufficient heat dissipation capacity. Especially in high-density chassis, miniaturized mainframes, or environments with limited air circulation, heat tends to accumulate around the storage device, preventing the device temperature from dropping effectively. When storage devices are exposed to high temperatures for extended periods, it may lead to decreased transmission performance, reduced system stability, and even trigger frequency reduction protection mechanisms, affecting overall operating efficiency. In addition, high temperatures may also accelerate the aging of electronic components, thereby affecting the lifespan and reliability of the storage device.

[0005] On the other hand, to improve heat dissipation efficiency, some high-performance computer systems have begun to adopt water cooling technology. Traditional water cooling systems typically include components such as water blocks, water pumps, radiators, cooling fans, and coolant circulation pipes. The heat generated by the heat source is transferred to the radiator through the flow of coolant, and then the heat is dissipated by the fan. Compared with pure air cooling architecture, water cooling systems usually have better heat transfer efficiency and can effectively reduce the operating temperature of high-power components.

[0006] However, conventional water-cooling systems are mostly designed for major heat sources such as central processing units or graphics processing units. When applied to storage devices, they usually require additional dedicated water-cooling modules. Such systems often require external water pumps and radiators, as well as coolant circulation pipelines, making the overall system structure more complex and increasing the size of the device and the required installation space. For electronic devices that emphasize thinness, miniaturization, or high integration, these additional configurations may limit space utilization and increase assembly difficulties.

[0007] Furthermore, traditional water-cooling systems involve multiple mechanical and fluid components, making their installation and maintenance relatively complex. Users need to consider issues such as coolant replenishment, pipe sealing, and water pump operation. If leaks, blockages, or water pump failures occur after prolonged operation, they may damage electronic components. Additionally, the extra water pump and radiator may increase system power consumption and overall cost, limiting their adoption in certain application scenarios.

[0008] In summary, conventional storage device cooling technology mainly relies on air cooling, while some high-performance systems adopt traditional water cooling architecture. However, as the heat generation of new-generation high-performance storage devices continues to increase, conventional pure air cooling architecture is gradually facing insufficient heat dissipation capacity, while traditional water cooling systems have problems such as large size, complex structure and high space occupation. Summary of the Invention

[0009] One of the purposes of this invention is to provide a storage device with water cooling, which combines water cooling with the storage device and sets up heat-conducting elements to form an air duct to improve the heat dissipation performance of the storage device.

[0010] To achieve the aforementioned objectives and effects, this invention provides a water-cooled storage device comprising a base, a storage module, a heat-conducting element, and a heat dissipation module. An air inlet is provided on one side of the base. The storage module includes a circuit board disposed above the base, and a plurality of storage elements disposed above the circuit board. The heat-conducting element abuts against the storage elements. The heat dissipation module includes a heat dissipation body disposed above the heat-conducting element. The heat dissipation body is fixed to the base and clamps the storage module and the heat-conducting element. An air duct is provided between the heat dissipation body and the heat-conducting element. One end of the air duct is connected to the air inlet, and the other end of the air duct passes through the top of the heat dissipation body to form an air outlet. The heat dissipation body contains a water-cooled liquid and a fan, which is positioned above the heat dissipation body corresponding to the air outlet. An external fluid enters the air duct through the air inlet. As the external fluid passes through the air duct, it cools the heat-conducting element and the water-cooled liquid in the heat dissipation body. At the same time, the heat dissipation body cools the heat-conducting element by the water-cooled liquid. The external fluid then flows out of the air outlet and is delivered to the fan. This device provides a storage device with water-cooled heat dissipation to improve the overall heat dissipation efficiency.

[0011] In one embodiment of this invention, two extension members are provided on one side of the heat dissipation body.

[0012] In one embodiment of this invention, a decorative panel is disposed above the fan, the fan is sandwiched between the two extension members, and the decorative panel is disposed above the two extension members corresponding to the fan.

[0013] In one embodiment of this invention, a fin portion is provided above the heat-conducting element on the inner side of the air duct.

[0014] In one embodiment of this invention, the thermally conductive element comprises copper, aluminum, gold, or silver.

[0015] In one embodiment of this invention, the heat-conducting element is a heat pipe.

[0016] In one embodiment of this invention, each of the storage elements is a flash memory.

[0017] In one embodiment of this invention, the base is fixed to the heat dissipation body by a fastener.

[0018] In one embodiment of this invention, the fan is electrically connected to the circuit board.

[0019] In one embodiment of this invention, the water-cooling liquid comprises water. Simple Explanation of the Diagram

[0020] Figure 1: It is an exploded structural diagram of one embodiment of this invention; Figures 2A to 2B: These are structural and cross-sectional schematic diagrams of one embodiment of this invention; Figure 3: This is an exploded structural diagram of another embodiment of this invention; and Figure 4: It is a schematic diagram of the structure of the device in another embodiment of this creation. Implementation

[0021] To make the purpose, technical solution, and advantages of this invention clearer, the present application will be further described in detail below with reference to specific embodiments and accompanying drawings. It should be understood that these descriptions are merely exemplary and not intended to limit the scope of this application. Furthermore, descriptions of prior art structures and techniques are omitted in the following description to avoid unnecessarily obscuring the concepts of this application.

[0022] The accompanying drawings are not drawn to scale, and some details have been enlarged / omitted for clarity. The shapes of the various regions and layers shown in the drawings, as well as their relative sizes and positions, are merely illustrative and may deviate from reality due to manufacturing tolerances or technical limitations. Furthermore, those skilled in the art can design regions / layers with different shapes, sizes, and relative positions as needed.

[0023] In the descriptions herein, terms such as "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Furthermore, the technical features involved in different embodiments of this application should be compatible with each other as long as they do not conflict with one another.

[0024] In view of the problems of the above-mentioned prior art, this invention provides an air inlet through one side of a base, a storage module including a circuit board disposed above the base, a heat-conducting element abutting above the storage elements included in the storage module, a heat dissipation module including a heat dissipation body disposed above the heat-conducting element, a fin portion disposed between the heat dissipation body and the heat-conducting element to form an air duct, one end of the air duct connecting to the air inlet, the other end of the air duct passing through the top of the heat dissipation body to form an air outlet, a water-cooled liquid being contained inside the heat dissipation body, and a fan disposed above the air outlet corresponding to the heat dissipation body. This structure solves the problem of insufficient heat dissipation efficiency of prior art storage devices.

[0025] Please refer to Figure 1 and Figures 2A to 2B. Figure 1 is an exploded view of one embodiment of the present invention, and Figures 2A to 2B are structural and cross-sectional schematic diagrams of one embodiment of the present invention. This embodiment is the first embodiment, which is a water-cooled heat dissipation storage device 1, which includes a base 10, a storage module 20, a heat-conducting element 30 and a heat dissipation module 40. The base 10 and the heat dissipation module 40 sandwich the storage module 20 and the heat-conducting element 30.

[0026] Continuing from the above, an air inlet 102 is provided on one side of the base 10. The storage module 20 includes a circuit board 22 and a plurality of storage elements. The circuit board 22 is disposed above the base 10, and the storage elements 24 are disposed above the circuit board 22 and electrically connected.

[0027] Continuing from the above, the heat-conducting element 30 abuts against the storage elements 24, and a fin portion 32 is provided above the heat-conducting element 30 to conduct the heat generated by the storage elements 24 and improve the overall heat dissipation efficiency.

[0028] Continuing from the above, the heat dissipation module 40 includes a heat dissipation body 42 and a fan 44. The heat dissipation body 42 is disposed above the heat-conducting element 30 and is fixed to the base 10. The storage module 20 and the heat-conducting element 30 are sandwiched between the heat dissipation body 42 and the base 10. An air duct 302 is formed between the heat dissipation body 42 and the heat-conducting element 30. The fin portion 32 is located inside the air duct 302. One end of the air duct 302 is connected to the air inlet 102. The other end of 02 passes through the top of the heat dissipation body 42 to form an air outlet 424. An accommodating space 422 is provided inside the heat dissipation body 42 for accommodating a water-cooled liquid L1. The fan 44 is disposed above the heat dissipation body 42 corresponding to the air outlet 424. Furthermore, the fan 44 is embedded in the air outlet 424. The fan 44 is used to draw gas from the inside of the air duct 302, so that the gas passes through the air duct 302 and correspondingly dissipates heat from the heat-conducting element 30 and the heat dissipation body 42.

[0029] In one embodiment, the fin portion 32 has an airflow channel with a predetermined flow channel shape to increase the contact area and contact time, thereby improving heat exchange efficiency.

[0030] In one embodiment, the heat dissipation body 42 uses a light-transmitting material, which may be glass or acrylic, and is not limited thereto.

[0031] In one embodiment, the material of the heat-conducting element 30 includes copper, aluminum, gold or silver, but is not limited thereto. The material of the heat-conducting element 30 may also be any combination of copper, aluminum, gold or silver.

[0032] In one embodiment, the thermally conductive element 30 is a heat pipe for rapidly conducting the heat energy emitted by the storage elements 24.

[0033] In one embodiment, each of the storage elements 24 is a flash memory, and the corresponding storage module 20 is a solid-state drive (SSD).

[0034] In one embodiment, the fan 44 is electrically connected to the circuit board 22, through which the circuit board 22 provides power to the fan 44 when an external electronic device is connected.

[0035] In one embodiment, the water-cooling liquid L1 contains water. Further, the components of the water-cooling liquid L1 may be water, ethylene glycol or propylene glycol, and functional additives, such as rust inhibitors and defoamers.

[0036] Referring again to Figure 1 and Figures 2A to 2B, this embodiment is an operational relationship of the above embodiments. As shown in the figures, in this embodiment, an external fluid A1 enters the air duct 302 formed by the heat-conducting element 30 and the heat dissipation body 42 through the air inlet 102 of the base 10. The external fluid A1 passes through the air duct 302, thereby cooling the water-cooled liquid L1 of the heat-conducting element 30 and the heat dissipation body 42. At the same time, the water-cooled liquid L1 of the heat dissipation body 42 cools the heat-conducting element 30. The external fluid A1 flows out of the air outlet 424 and is delivered by the fan 44 to the water-cooled storage device 1.

[0037] Continuing from the above, the external fluid A1 can be ambient air, and under the action of pressure difference or airflow, it enters the air duct 302 defined by the heat-conducting element 30 and the heat dissipation body 42. The air duct 302 has an airflow channel with a predetermined flow channel shape, which can extend along the surface of the heat-conducting element 30 and the heat dissipation body 42 to increase the contact area and contact time between the external fluid A1 and each element, thereby improving the heat exchange efficiency.

[0038] Continuing from the above, the heat-conducting element 30 conducts some of the heat energy to the heat dissipation body 42, and the heat dissipation body 42 removes heat through the circulation of the water-cooled liquid L1 to form a liquid cooling heat dissipation mechanism.

[0039] Continuing from the above, when the external fluid A1 flows through the air duct 302, it can directly exchange heat with the outer surfaces of the heat-conducting element 30 and the heat dissipation body 42, causing the external fluid A1 to absorb its surface heat energy and rise in temperature, thereby reducing the temperature of the heat-conducting element 30 and the heat dissipation body 42. At the same time, the water-cooled liquid L1 flowing inside the heat dissipation body 42 can also continuously absorb the heat energy from the heat-conducting element 30 and conduct the heat to other areas or heat dissipation structures through liquid circulation. In this way, the heat dissipation system can simultaneously utilize air cooling and liquid cooling mechanisms to improve the overall cooling efficiency.

[0040] Continuing from the above, after the external fluid A1 completes the heat exchange, it flows to the air outlet 424 located on the other side of the heat sink 42 and is discharged from the air outlet 424. The fan 44 generates negative pressure or thrust by rotating to drive the external fluid A1 to flow in the air duct 302, thereby improving the airflow circulation efficiency and heat dissipation effect. The fan 44 can adjust its speed according to the system temperature state to control the flow rate and velocity of the external fluid A1.

[0041] In this embodiment, the external fluid A1 flows within the air duct 302 and exchanges heat with the heat-conducting element 30, the fin portion 32, and the heat dissipation body 42. At the same time, the water-cooled liquid L1 within the heat dissipation body 42 performs liquid cooling, forming a composite heat dissipation mechanism that combines air cooling and liquid cooling to improve heat removal efficiency and system operation stability.

[0042] Please refer to Figures 3 and 4. Figure 3 is an exploded view of another embodiment of the present invention, and Figure 4 is a schematic diagram of the device structure of another embodiment of the present invention. As shown in the figures, this embodiment is based on the above embodiments. In this embodiment, two extension members 426 are extended from one side of the heat dissipation body 42, and a decorative plate 46 is provided above the fan 44. Furthermore, the fan 44 is sandwiched between the two extension members 426, and the decorative plate 46 is provided above the two extension members 426 corresponding to the fan 44.

[0043] Continuing from the above, the decorative panel 46 can protect the fan 44 from impact damage. The decorative panel 46 can guide the airflow of the external fluid A1 delivered by the fan 44, preventing the fan 44 from spraying the high-temperature external fluid A1 onto other electronic components or causing the external fluid A1 to flow back.

[0044] Continuing from the above, a decorative panel 46 is provided on the outer side of the fan 44. The decorative panel 46 is fixed above the heat sink body 42 to cover at least part of the fan 44. The decorative panel 46 may be a plate-shaped structure, a cover structure, or a protective component with a flow-guiding profile. The material of the decorative panel 46 includes metal, plastic, composite material, or other materials with structural strength to provide external protection for the fan 44.

[0045] Continuing from the above, the decorative panel 46 can serve as a protective structure to reduce the probability of external forces directly contacting the blades or drive structure of the fan 44, thereby preventing the fan 44 from deforming, being damaged, or malfunctioning due to collisions, contact with foreign objects, or external impacts, thus improving the reliability and service life of the fan 44 during long-term operation.

[0046] Continuing from the above, the surface, side, or interior of the decorative panel 46 may be formed with a flow guide surface, flow guide groove, flow guide hole, or inclined structure to guide and restrict the flow direction of the external fluid A1 delivered by the fan 44. When the fan 44 delivers the high-temperature external fluid A1 after heat exchange to the outside, the decorative panel 46 can change the airflow diffusion direction, so that the external fluid A1 is discharged in a predetermined direction, thereby avoiding the high-temperature airflow from blowing directly onto the adjacent electronic components, reducing the impact of the high-temperature airflow on other electronic components, and improving the overall airflow distribution inside the device (such as the housing).

[0047] Continuing from the above, the decorative panel 46 can suppress the formation of eddies or backflow of external fluid A1 in local areas. By adjusting its shape and position, the decorative panel 46 can effectively guide airflow away from the air intake area to reduce the phenomenon of hot air backflow, thereby improving the overall heat dissipation efficiency.

[0048] In one embodiment, the base 10 further uses a fastener 12 to fix the heat dissipation body 42. The number of fasteners 12 can be multiple and is not limited thereto.

[0049] In one embodiment, the fastener 12 may be a threaded part, such as a screw or nut. Those skilled in the art should be able to select a suitable fastening method according to the environment, and therefore it is not limited thereto.

[0050] In summary, this invention utilizes a heat-conducting element to conduct heat generated by the storage module. A finned portion is positioned above the heat-conducting element, and a heat dissipation module containing water-cooled liquid is further positioned above the heat-conducting element, forming an airflow channel with the heat-conducting element. Through the water-cooled heat dissipation module and the heat-conducting element, external fluid flows within this airflow channel, exchanging heat with the heat-conducting element and the heat dissipation module. Simultaneously, the heat dissipation module absorbs the heat conducted by the heat-conducting element using water-cooled liquid, forming a composite heat dissipation mechanism that combines air cooling and liquid cooling. This improves heat removal efficiency and system operational stability, solving the problem of insufficient heat dissipation efficiency in conventional storage devices.

[0051] 1: Storage device with water cooling 10: Base 102: Air Inlet 12: Fasteners 20: Storage Module 22: Circuit board 24: Storage element 30: Thermal conductive element 302: Air Duct 32: Fin section 40: Heat dissipation module 42: Heatsink 422: Storage space 424: Air vent 426: Extension 44: Fan 46: Decorative panel A1: External fluid L1: Water-cooled liquid

Claims

1. A water-cooled storage device, comprising: a base with an air inlet on one side; a storage module comprising: a circuit board disposed above the base; and a plurality of storage elements disposed above the circuit board; a heat-conducting element abutting the upper part of the storage elements, the heat-conducting element having a fin portion disposed above it; and a heat dissipation module comprising: a heat dissipation body disposed above the heat-conducting element, the heat dissipation body being fixed to the base, an air duct forming between the heat dissipation body and the heat-conducting element, one end of the air duct being connected to the air inlet, and an air outlet being disposed at the other end of the air duct, the fin portion being located inside the air duct, and a water-cooled liquid being contained inside the heat dissipation body; and a fan disposed above the heat dissipation body corresponding to the air outlet; wherein... An external fluid enters the air duct through the air inlet. The external fluid passes through the air duct and the fin portion, thereby cooling the heat-conducting element and the water-cooling liquid of the heat dissipation body. At the same time, the heat dissipation body cools the heat-conducting element by the water-cooling liquid. The external fluid then flows out of the air outlet and is delivered to the fan.

2. The water-cooled storage device as described in claim 1, wherein two extension members are provided on one side of the heat dissipation body.

3. The water-cooled storage device as described in claim 2, wherein a decorative panel is disposed above the fan, the fan is sandwiched between the two extension members, and the decorative panel is disposed above the two extension members corresponding to the fan.

4. The water-cooled storage device as described in claim 1, wherein the heat-conducting element comprises copper, aluminum, gold or silver.

5. The water-cooled storage device as described in claim 1, wherein the heat-conducting element is a heat pipe.

6. The water-cooled storage device as described in claim 1, wherein each of the storage elements is a flash memory.

7. The water-cooled storage device as described in claim 1, wherein the base secures the heat dissipation body with a fastener.

8. The water-cooled storage device as described in claim 1, wherein the fan is electrically connected to the circuit board.

9. The water-cooled storage device as described in claim 1, wherein the water-cooling liquid comprises water.

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