Cooling device

TWM686231UActive Publication Date: 2026-08-11COMPAL ELECTRONICS INC
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Patent Information

Application Number
TW115200732
Authority / Receiving Office
TW · TW
Patent Type
Utility models
Current Assignee / Owner
Filing Date
2026-01-22
Publication Date
2026-08-11
Estimated Expiration
2036-01-21

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    Figure TWG2TB001906158_003
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Abstract

A cooling device is disclosed for cooling a heat-generating component. The cooling device includes a cooling chamber and at least one driving member. The cooling chamber contains a heat dissipation medium and the heat-generating component. The driving member is disposed within the cooling chamber and immersed in the heat dissipation medium. The heat dissipation medium flows sequentially through the driving member and the heat-generating component in a flow direction, and the driving member causes the heat dissipation medium to form turbulence.
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Claims

1. A cooling device suitable for cooling a heat-generating component, the cooling device comprising: A cooling chamber containing a heat dissipation medium and the heat-generating component; and at least one drive member disposed in the cooling chamber and immersed in the heat dissipation medium, wherein the heat dissipation medium flows sequentially through the at least one drive member and the heat-generating component in a flow direction, and the at least one drive member causes the heat dissipation medium to form a turbulent flow.

2. The cooling device as claimed in claim 1 further includes a heat sink located in the cooling chamber and thermally connected to the heat-generating member, the at least one drive member being connected to the heat sink.

3. The cooling device as claimed in claim 2, wherein the heat sink includes a connecting plate and a plurality of fins connected to the connecting plate, and the at least one drive member is connected to at least one of the fins.

4. The cooling device as claimed in claim 2, wherein the heat-generating component is disposed on a circuit board, the at least one driving member includes a plurality of driving members, some of which are disposed on the circuit board and others of which are disposed on the heat sink.

5. The cooling device as claimed in claim 1, wherein the at least one drive member comprises a plurality of drive members arranged symmetrically.

6. The cooling device as claimed in claim 1, wherein the heating element is disposed on a circuit board, and the at least one driving element is disposed on the circuit board.

7. The cooling device as claimed in claim 1 further includes a cooling assembly connected to the cooling chamber, wherein the heat dissipation medium flows between the cooling assembly and the cooling chamber.

8. The cooling device as claimed in claim 7, wherein the cooling assembly includes an input pipe, an output pipe and a heat exchanger, the input pipe and the output pipe being connected to the heat exchanger and the cooling chamber.