Heat dissipation structure

TWM686252UActive Publication Date: 2026-08-11ADVANCED SEMICON ENG INC
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Patent Information

Application Number
TW115201283
Authority / Receiving Office
TW · TW
Patent Type
Utility models
Current Assignee / Owner
Filing Date
2026-02-06
Publication Date
2026-08-11
Estimated Expiration
2036-02-05

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  • Figure TWG2TB001906179_001
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  • Figure TWG2TB001906179_003
    Figure TWG2TB001906179_003
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Abstract

A heat dissipation structure includes: a heat sink having a first surface facing a package and a second surface facing away from the package, at least one of the first and second surfaces being arc-shaped, and the first and second surfaces having curvatures that are not exactly the same as each other, the difference in curvature including at least differences in curvature magnitude, curvature distribution, or bending direction. This heat dissipation structure reduces the problem of thermal expansion coefficient mismatch between the package and the heat sink by modifying the geometric characteristics of the heat sink to produce the desired warpage deformation, thereby reducing the stress in the sintered layer and improving the reliability of the power module.
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Claims

1. A heat dissipation structure, comprising: A heat sink has a first surface facing a package and a second surface facing away from the package, at least one of the first surface and the second surface being arc-shaped, and the first surface and the second surface having curvatures that are not exactly the same as each other, the difference in curvature including at least differences in curvature magnitude, curvature distribution or bending direction.

2. The heat dissipation structure as described in claim 1, wherein the first surface is a plane and the second surface is an arc surface.

3. The heat dissipation structure as described in claim 2, wherein the second surface is convex.

4. The heat dissipation structure as described in claim 3, wherein a plurality of blind holes are provided in a middle region of the first surface.

5. The heat dissipation structure as described in claim 2, wherein the second surface is concave.

6. The heat dissipation structure as described in claim 5, wherein a plurality of blind holes are provided in an edge region of the first surface.

7. The heat dissipation structure as described in claim 1, wherein the first surface is an arc surface and the second surface is a plane.

8. The heat dissipation structure as described in claim 7, wherein the first surface is convex.

9. The heat dissipation structure as described in claim 7, wherein the first surface is concave.

10. The heat dissipation structure as described in claim 1, wherein both the first surface and the second surface are curved surfaces.

11. The heat dissipation structure as described in claim 10, wherein the first surface and the second surface are convex surfaces with the same curvature magnitude but different curvature directions.

12. The heat dissipation structure as described in claim 10, wherein the first surface and the second surface are concave surfaces with the same curvature magnitude but different curvature directions.

13. The heat dissipation structure as described in claim 1 further includes a plurality of heat dissipation fins disposed on the second surface.

14. The heat dissipation structure as described in claim 1 further includes an active heat dissipation element disposed on the second surface.

15. The heat dissipation structure as described in claim 1 further includes a sintered layer and the package, the sintered layer connecting the package and the first surface.