Glass substrate alignment and mounting mechanism with sealing ring solder crawling detection function

Abstract

This invention provides a glass substrate alignment and mounting mechanism with a solder creep detection function for sealing rings. It includes a vacuum adsorption platform, an alignment mechanism, a lifting mechanism, and a mounting base plate. Multiple sealing ring image capture heads are mounted in parallel on the side of the alignment base plate near the bottom edge of the glass substrate holder. This invention fully utilizes the lateral structural space of the alignment mechanism to house the sealing ring image capture heads. These heads are positioned only on the bottom edge of the first loop-shaped sealing ring, which is more prone to solder creep, thus saving costs. The sealing ring image capture heads can capture image information of the bottom edge of the first loop-shaped sealing ring on the glass substrate holder as the lifting mechanism raises the vacuum adsorption platform. This allows for timely detection of any solder creep abnormalities in the first loop-shaped sealing ring after previous electroplating, enabling timely alarm and maintenance to prevent solder creep from causing fragmentation and affecting the sealing performance of the holder.

Claims

1. A glass substrate alignment and mounting mechanism with a sealing ring solder crawling detection function, comprising a vacuum adsorption platform, an alignment mechanism, a lifting mechanism, and a mounting base plate. The base of the lifting mechanism is fixedly mounted on the lower surface of the mounting base plate, and the lifting rod of the lifting mechanism passes upward through the mounting base plate. The alignment mechanism includes an alignment base plate, an alignment offset mechanism, and an alignment top plate. The alignment base plate is fixedly mounted on the lifting rod of the lifting mechanism. The alignment offset mechanism is used to drive the alignment top plate to perform X-axis, Y-axis, and planar rotation angle displacement adjustment relative to the alignment base plate. The vacuum adsorption platform is fixedly mounted on the alignment top plate. The vacuum adsorption platform is provided with a plurality of air suction holes. The air suction holes are connected to a control valve and a vacuum generator via a pipeline. A plurality of sealing ring image capturing heads are mounted in parallel on one side of the alignment base plate near the bottom edge of a glass substrate hanger. The sealing ring image capturing heads face the bottom edge of a first loop-shaped sealing ring on the glass substrate hanger.

2. As in claim 1, a glass substrate alignment and mounting mechanism with a sealing ring solder crawling detection function, wherein, The offset correction mechanism includes an X-axis shift mechanism, a Y-axis shift mechanism, and a rotation mechanism, which are stacked sequentially from bottom to top.

3. As in Request 1, a glass substrate alignment and mounting mechanism with a sealing ring solder crawling detection function, wherein, The offset correction mechanism is a UVW alignment platform.

4. As in Request 1, a glass substrate alignment and mounting mechanism with a sealing ring solder crawling detection function, wherein, The number of sealing ring image capturing heads is 2-6.

5. A glass substrate alignment and mounting mechanism with sealing ring solder creep detection function, as described in claim 1, wherein, A lower guide sleeve is fixedly installed on the mounting base plate, and a lower guide post extending downwards is fixedly installed on the lower surface of the correction base plate. The lower guide post and the lower guide sleeve are matched.

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