Cleaning robot for semiconductor device loading ports

TWM686389UActive Publication Date: 2026-08-11CASTEC INT
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Patent Information

Application Number
TW115203542
Authority / Receiving Office
TW · TW
Patent Type
Utility models
Current Assignee / Owner
Filing Date
2026-04-22
Publication Date
2026-08-11
Estimated Expiration
2036-04-21

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Abstract

This invention relates to a cleaning robot for semiconductor device loading ports, which mainly includes a mobile carrier, a robotic arm mounted on the mobile carrier, and a cleaning module assembled on the robotic arm. The cleaning module further includes a sensing module, a 3D image acquisition unit, and a control module. The sensing module scans and detects the location information of the semiconductor device loading ports, and the 3D image acquisition unit scans the semiconductor device loading port information, allowing the control module to construct an environmental map and plan a cleaning route. This enables the cleaning robot to autonomously and flexibly navigate narrow passages using "teach-free" technology and accurately reach each semiconductor device loading port (such as a wafer cassette placement area) to be cleaned. The cleaning module on the robotic arm performs thorough cleaning without blind spots, thereby achieving automated cleaning, improving wafer fab process yield, and eliminating the problem of human-caused particulate contamination.
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Claims

1. A cleaning robot for a semiconductor device loading port, comprising: a mobile vehicle, which is a powered and autonomously movable vehicle body; a robotic arm mounted on the mobile vehicle; a cleaning module mounted on the robotic arm for cleaning contaminants from the semiconductor device loading port; a sensing module mounted on the cleaning robot, consisting of a plurality of sensors that detect the position information of the semiconductor device loading port; and a 3D image capturing unit mounted on the robotic arm for scanning information about the semiconductor device loading port. A control module is connected to the mobile vehicle, the robotic arm, the cleaning module, the sensing module, and the 3D image capturing unit. The control module receives the location information of the semiconductor device loading port detected by the sensing module in the environment, analyzes and constructs an environmental map and plans a cleaning route, and drives the mobile vehicle to autonomously move to the location of each semiconductor device loading port to be cleaned. The control module receives the information of the semiconductor device loading port scanned by the 3D image capturing unit and drives the robotic arm and the cleaning module to clean the semiconductor device loading port.

2. The cleaning robot for a semiconductor device loading port as described in claim 1, wherein the robotic arm is provided with an anti-collision sensor to protect the semiconductor device.

3. The cleaning robot for a semiconductor device loading port as described in claim 1 or 2, wherein the cleaning module further includes a vacuum suction unit and a filter unit.

4. A cleaning robot for a semiconductor device loading port as described in claim 1 or 2, wherein the cleaning module uses a laser cleaning gun, and is a long-nozzle laser cleaning gun.

5. A cleaning robot for a semiconductor device loading port as described in claim 1 or 2, wherein the cleaning module may further employ a plasma cleaning device.